Abstract: An interconnection structure, along with methods of forming such, are described. The structure includes a first conductive feature having a first thickness, a first dielectric material disposed adjacent the first conductive feature, and the first dielectric material has a second thickness greater than the first thickness. The structure further includes a second conductive feature disposed adjacent the first dielectric material, a first etch stop layer disposed on the first conductive feature, a second etch stop layer disposed on the first dielectric material, and a second dielectric material disposed on the first etch stop layer and the second etch stop layer. The second dielectric material is in contact with the first dielectric material.

Abstract: An ESD circuit includes a first P-type transistor, a second P-type transistor, a third P-type transistor, a first ESD current path, a second ESD current path, a biasing circuit and a control circuit. The control circuit is connected between the pad and a first node. The first P-type transistor is connected with the pad, the control circuit and a second node. The first ESD current path is connected between the second node and the first node. The second ESD current path is connected between the second node and the first node. The second P-type transistor is connected with the pad, the control circuit and a third node. The biasing circuit is connected between the third node and the first node. The third P-type transistor is connected with the pad, the third node, and a fourth node. The internal circuit is connected between the fourth node and the first node.

Abstract: Provided are a flexible circuit mother board and a detection method. The flexible circuit mother board includes flexible circuit daughter boards, at least one detection terminal group and external pad groups corresponding to the flexible circuit daughter boards in one-to-one correspondence. Each flexible circuit daughter board has a bonding pad area adjacent to a corresponding one of the plurality of external pad groups. Each detection terminal group detects at least one flexible circuit daughter board, and each of the at least one detection terminal group comprises a plurality of detection terminals. Each flexible circuit daughter board includes a plurality of capacitors including a first electrode plate and a second electrode plate. Each of the first electrode plate and the second electrode plate is electrically connected to one detection terminal.

Abstract: There is provided a detection chip including a charging circuit, a discharging circuit, a counter and a processor. The charging circuit provides a first charging current within a first charging interval, and provides a second charging current, smaller than the first charging current, within a second charging interval. The discharging circuit provides a first discharging current within a first discharging interval, and provides a second discharging current, smaller than the first discharging current, within a second discharging interval. The counter counts the second charging interval and the second discharging interval. The processor identifies a touch event according to the second charging interval and the second discharging interval.

Abstract: Bid values submitted for various keywords can take into account the recovery propensity between paid search and organic search. When submitting a bid to a search engine provider for a keyword, an entity may get a certain level of performance in return. If not submitting a bid, however, the entity will likely still get some level of performance, although likely less than for paid search. In order to optimize for a parameter such as impressions, purchases, or profit, the recovery propensity can be taken into account in order to adjust the bid price, taking into account the relative performance of paid and organic search and then optimizing for the determined goal. Organic search data in some embodiments can be obtained through testing or modeling, or a combination thereof.

Abstract: The present disclosure provides a method for manufacturing a terahertz (THz) device. The method includes a step of forming a light-absorbing structure on a substrate by using a chemical vapor deposition (CVD) process. The substrate includes a semiconductor structure, a sapphire substrate, a quartz substrate, or a combination thereof. The light-absorbing structure includes a semiconductor material, a two-dimensional material, a low-dimensional material, a magnetic material, a topological material, or a combination thereof.

Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

Abstract: A laser processing device for processing a workpiece is provided, including a laser emitter, a lens module, a driving module, a camera module, and a processing unit. The lens module has a first lens and a second lens, wherein the laser emitter emits a laser beam through the first and second lenses to the workpiece. The driving module drives the first lens to move relative to the second lens. The camera module captures an image of the workpiece. The processing unit is electrically connected to the camera module and the driving module, wherein the camera module transmits an image signal to the processing unit according to the image of the workpiece, and the processing unit transmits a driving signal to the driving module according to the image signal, driving the first lens to move relative to the second lens. A method for processing a workpiece is also provided.

Abstract: A connection terminal includes a body part and an installation part. The body part is insertable into a mating terminal for electrical contact with the mating terminal. The installation part is insertable into a finger protective cap for installing the finger protective cap. The installation part is formed on and protrudes from an end face of an end of the body part. A root of the installation part connected to the end face of the body part is formed into an arc-shaped connection part, preventing stress concentration at the root.

Abstract: A charging base lead frame includes a frame body having a receiving slot and a plurality of leads fixed to the frame body. The leads include a first lead for electrical connection to a terminal of a charging base. The first lead includes a lead body fixed to the frame body, a pair of elastic cantilevers connected to the lead body and suspended in the receiving slot for clamping the terminal, and a pair of bridging arms respectively connecting a pair of fixed ends of the pair of elastic cantilevers to the lead body. At least a portion of the fixed ends of each of the elastic cantilevers is wrapped in the frame body.

Abstract: A finger protective cap for fitting on an installation part at an end of a connection terminal includes a peripheral wall, an end wall connected to an end of the peripheral wall, and an insertion post located in the inner cavity and connected to the end wall. The peripheral wall and end wall define an inner cavity accommodating the installation part. The insertion post is insertable into an insertion hole on the installation part and interference fit with a hole wall of the insertion hole. The inner cavity has an opening opposite to the end wall to allow the installation part to be inserted into the finger protective cap through the opening.

Abstract: A method of supplying a chemical solution to a photolithography system. The chemical solution is pumped from a variable-volume buffer tank. The pumped chemical solution is dispensed in a spin-coater. The variable-volume buffer tank is refilled by emptying a storage container filled with the chemical solution into the variable-volume buffer tank.

Abstract: The present disclosure provides to a semiconductor memory device. The semiconductor memory device includes a substrate having a cell area and a peripheral area; and a first bit line structure disposed on and protruding from a surface of the cell area. The first bit line structure is sandwiched by a pair of air gaps and a barrier layer is conformally overlaying the air gaps adjacent to the sidewalls of the first bit line structure and the cell area. The first bit line structure has a sidewall and an ascending top portion, and a landing pad is disposed over the ascending top portion and the sidewalls of the first bit line structure. The landing pad has an inclined surface corresponding to the ascending top portion of the first bit line structure.

Abstract: A method for manufacturing a semiconductor structure includes forming a trench in a dielectric structure; forming a spacer layer on a lateral surface of the dielectric structure exposed by the trench; after forming the spacer layer, forming a first electrically conductive feature in the trench; removing at least portion of the dielectric structure to form a recess; forming an etch stop layer in the recess and over the first electrically conductive feature; and after forming the etch stop layer, depositing a dielectric layer in the recess and over the first electrically conductive feature.

Abstract: A method for manufacturing a semiconductor structure includes forming a trench in a dielectric structure; forming a spacer layer on a lateral surface of the dielectric structure exposed by the trench; after forming the spacer layer, forming a first electrically conductive feature in the trench; removing at least portion of the dielectric structure to form a recess; forming an etch stop layer in the recess and over the first electrically conductive feature; and after forming the etch stop layer, depositing a dielectric layer in the recess and over the first electrically conductive feature.

Abstract: A camera module includes a housing with an opening and a portion that surrounds the opening, wherein the portion of the housing is transparent to near infrared (NIR) light. A fisheye lens is disposed within the opening such that a portion of the fisheye lens protrudes through the opening. An image sensor is disposed within the housing and optically coupled to the fisheye lens. The image sensor is sensitive to visible light and NIR light. A plurality of NIR light emitters is disposed within the housing. The NIR light emitters are configured to emit NIR light through the NIR-transparent portion of the housing. The NIR-transparent portion of the housing may include a light-diffusing structure, such as a pattern of microlenses formed on an inner surface of the NIR-transparent portion of the housing, to spread out the NIR light emitted by the NIR light emitters.

Abstract: A lithography includes a storage tank that stores process chemical fluid, an anti-collision frame, and an integrated sensor assembly. The storage tank includes a dispensing port positioned at a lowest part of the storage tank in a gravity direction. The anti-collision frame is coupled to the storage tank. An integrated sensor assembly is disposed on at least one of the anti-collision frame and the storage tank to measure a variation in fluid quality in response to fluid quality measurement of fluid.

Abstract: There is provided a smart control system including a host, at least one sensor and an informing device. The host identifies the activity of a specific member according to the detection result of the at least one sensor, and informs the specific member to take medicine on time or avoid eating specific ingredients using the informing device.

Abstract: A needle output mechanism which can be connected to a pharmaceutical agent container and a drive module. The base of the needle output mechanism is equipped with a movable connecting member, a needle set, a needle output operation assembly, and a needle retraction operation member. The connecting member is connected to an adapter mechanism. During injection, the needle set in the connecting member can be driven by the needle output operation assembly, and using a hard needle disposed passing through a soft needle and out from the base, outputs a needle which can directly puncture the human body, successively driving the hard needle (133) to disengage from the soft needle and inject the pharmaceutical agent solution by way of the drive module. After injection, the needle retraction operation member can retract the connecting member and the soft needle thereby facilitating operation.

Abstract: There is provided a capacitive touch control system adapted to detect low frequency signals, including a touch panel and an analog front end. The analog front end includes a frequency booster, which boosts a low frequency signal outputted by the touch panel using a variable reference frequency corresponding to different function symbols of the low frequency signal such that resistance of a resistor of an amplifier in the analog front end needs not to be increased thereby reducing the manufacturing cost and a leakage voltage drop on the resistor.