Patents by Inventor Hsin-An Hsu
Hsin-An Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11990494Abstract: A package structure including a first die, a second die, an encapsulant, a dam structure, a light-transmitting sheet, a conductive connector, a circuit layer, and a conductive terminal is provided. The first die includes a first active surface. The first active surface has a sensing area. The second die is arranged such that a second back surface thereof faces the first die. The encapsulant covers the second die. The encapsulant has a first encapsulating surface and a second encapsulating surface. The dam structure is located on the first encapsulating surface and exposes the sensing area. The light-transmitting sheet is located on the dam structure. The conductive connector penetrates the encapsulant. The circuit layer is located on the second encapsulating surface. The first die is electrically connected to the second die through the conductive connector and the circuit layer. The conductive terminal is disposed on the circuit layer.Type: GrantFiled: July 22, 2021Date of Patent: May 21, 2024Assignee: Powertech Technology Inc.Inventors: Shang-Yu Chang Chien, Hung-Hsin Hsu
-
Patent number: 11988876Abstract: A fiber optic connector includes: a front casing that includes a front stopping portion defining a receiving space, and two side stopping portions extending respectively from opposite sides of the front stopping portion, and each being formed with an engaging slot; and a rear casing that is provided for the front casing to be detachably connected thereto, and includes a main body portion defining two through slots which are in spatial communication with the receiving space, and two engaging portions protruding respectively from opposite sides of the main body portion, and each engaging the engaging slot of a respective one of the side stopping portions and disengagable from the same through manual operation.Type: GrantFiled: October 22, 2021Date of Patent: May 21, 2024Assignee: GLORIOLE ELECTROPTIC TECHNOLOGY CORP.Inventor: Hsien-Hsin Hsu
-
Patent number: 11982866Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.Type: GrantFiled: December 15, 2022Date of Patent: May 14, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
-
Patent number: 11985435Abstract: A compact camera includes an image sensor, a transparent layer, and a microlens (ML) layer, between the image sensor and the transparent layer. The ML layer forms (a) a first ML array having a plurality of first MLs, and (b) a second ML array with a plurality of second MLs interleaved with the plurality of first MLs. The compact camera also includes a baffle layer, between the ML layer and the image sensor, that forms a plurality of first aperture stops each aligned with a different one of the first MLs and a plurality of second aperture stops each aligned with a different one of the second MLs. The first MLs each have a first set of optical characteristics and the second MLs each have a second set of optical characteristics that are different from the first set of optical characteristics.Type: GrantFiled: June 8, 2022Date of Patent: May 14, 2024Assignee: OmniVision Technologies, Inc.Inventor: Shih-Hsin Hsu
-
Patent number: 11983680Abstract: An intelligent monitoring system for waste disposal and the method thereof are provided, which include a plurality of operational devices and stages. First, a transportation stage is performed to loading a transport vehicle with a waste so as to transport the waste to a disposal station for further treatment. A camera and a sensor for detecting abnormal conditions are installed any one of the operational devices or installed in the operational path of any one of the operational devices. The camera records the videos of the operational stages, captures the images from the videos and recognizes the images in order to determine whether the abnormal conditions occur in any one of the operational stages. Alternatively, the camera is triggered to capture the images and recognize the images after the abnormal conditions are detected by the sensor in order to determine whether the abnormal conditions actually occur.Type: GrantFiled: June 12, 2021Date of Patent: May 14, 2024Assignee: CHASE SUSTAINABILITY TECHNOLOGY CO., LTD.Inventors: Yung-Fa Yang, Tsung-Tien Chen, Shao-Hsin Hsu, Bo-Wei Chen, Chia-Ching Chen, Ming-Hua Tang
-
Publication number: 20240154015Abstract: A method includes forming a first fin and a second fin protruding from a frontside of a substrate, forming a gate stack over the first and second fins, forming a dielectric feature dividing the gate stack into a first segment engaging the first fin and a second segment engaging the second fin, and growing a first epitaxial feature on the first fin and a second epitaxial feature on the second fin. The dielectric feature is disposed between the first and second epitaxial features. The method also includes performing an etching process on a backside of the substrate to form a backside trench, and forming a backside via in the backside trench. The backside trench exposes the dielectric feature and the first and second epitaxial features. The backside via straddles the dielectric feature and is in electrical connection with the first and second epitaxial features.Type: ApplicationFiled: March 22, 2023Publication date: May 9, 2024Inventors: Jui-Lin CHEN, Hsin-Wen SU, Chih-Ching WANG, Chen-Ming LEE, Chung-I YANG, Yi-Feng TING, Jon-Hsu HO, Lien-Jung HUNG, Ping-Wei WANG
-
Patent number: 11977367Abstract: A command script editing method, a command script editor and a graphic user interface are provided. The command script editing method includes the following steps. The command node is edited according to at least one inputting action or at least one image identifying action performed on the operation frame when the command script editor is at an image editing mode. The command node is edited according to a setting content of at least one process action when the command script editor is at a process editing mode.Type: GrantFiled: May 12, 2021Date of Patent: May 7, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Yu-Chi Lin, Li-Hsin Yang, Yu-Shan Hsu
-
Publication number: 20240147606Abstract: An electronic device includes a first substrate structure, multiple electronic elements and a second substrate structure. The first substrate structure includes a first substrate. The electronic elements are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure includes a second substrate, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is disposed on the second substrate and configured to drive at least a part of the electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device may reduce the damage caused by electrostatic discharge or reduce the impact of the bonding process of the bonding pad on signal conduction.Type: ApplicationFiled: September 14, 2023Publication date: May 2, 2024Applicant: Innolux CorporationInventors: Mu-Fan Chang, Yi-Hua Hsu, Hung-Sheng Liao, Min-Hsin Lo, Ming-Chun Tseng, Ker-Yih Kao
-
Patent number: 11973037Abstract: A package structure including a first die, a second die, a dielectric body, a conductive terminal, a circuit layer and a patterned insulating layer is provided. The second die is disposed on the first die. A second active surface of the second die faces a first active surface of the first die. The dielectric body covers the first die. The conductive terminal is disposed on the dielectric body and opposite to the second die. The circuit layer includes a first circuit portion and a second circuit portion. The first circuit portion penetrates the dielectric body. The first die is electrically connected to the conductive terminal through the first circuit portion. The second circuit portion is embedded in the dielectric body. The second die is electrically connected to the first die through the second circuit portion. The patterned insulating layer covers the circuit layer and is embedded in the dielectric body.Type: GrantFiled: May 26, 2021Date of Patent: April 30, 2024Assignee: Powertech Technology Inc.Inventors: Shang-Yu Chang Chien, Nan-Chun Lin, Hung-Hsin Hsu
-
Publication number: 20240136546Abstract: A vacuum battery structural assembly and a vacuum multi-cell battery module composed thereof are provided and include a first repeating unit including a first frame plate and a second frame plate with respect to the first frame plate; and an electrolyte channel defined within the first frame plate and the second frame plate to accommodate a liquid electrolyte, wherein both a surface of the first frame plate and a surface of the second frame plate include a vacuum suction area, the vacuum suction area includes a vacuum aperture and a vacuum channel, wherein the vacuum aperture is formed on at least one surface of the first frame plate and the second frame plate, the vacuum channel is positioned inside the first frame plate and the second frame plate, and is configured to generate a longitudinal pressing suction force and seal the first frame plate and the second frame plate.Type: ApplicationFiled: November 23, 2022Publication date: April 25, 2024Inventors: Hung-Hsien Ku, Shang-Qing Zhuang, Ning-Yih Hsu, Chien-Hong Lin, Han-Jou Lin, Yi-Hsin Hu, Po-Yen Chiu, Yao-Ming Wang
-
Publication number: 20240126023Abstract: An optical fiber connector includes a connecting unit, an adapter unit, and an attenuation unit. The adapter unit includes an insertion seat connected removably to a main housing of the connecting unit, and two guide frame bodies located respectively at two opposite sides of the insertion seat in a transverse direction. The insertion seat has two insertion holes spaced apart in the transverse direction and extending in a front-rear direction. Each guide frame body extends in the front-rear direction away from the connecting unit. The attenuation unit includes two attenuation components, two rear ferrules, and two front ferrules. The attenuation components are arranged in the transverse direction and disposed within the main housing. The rear ferrules respectively extend rearwardly from rear ends of the attenuation components into the insertion holes. The front ferrules respectively extend forwardly from front ends of the attenuation components through and outwardly of the main housing.Type: ApplicationFiled: January 19, 2023Publication date: April 18, 2024Inventors: Hsien-Hsin HSU, Yu Cheng CHEN, Ke Xue NING, Shu Bin LI
-
Publication number: 20240120325Abstract: A stacked package structure and a manufacturing method thereof are provided. The stacked package structure includes an upper redistribution layer, a first chip, and an upper molding layer. The first chip is disposed on the upper redistribution layer and is electrically connected to the upper redistribution layer. The upper molding layer is disposed on the first chip and the upper redistribution layer, and is configured to package the first chip. The upper molding layer includes a recess, the recess is recessed relative to a surface of the upper molding layer away from the upper redistribution layer, and the recess is circumferentially formed around a periphery of the upper molding layer.Type: ApplicationFiled: May 31, 2023Publication date: April 11, 2024Applicant: POWERTECH TECHNOLOGY INC.Inventors: Pei-chun TSAI, Hung-hsin HSU, Shang-yu CHANG CHIEN, Chia-ling LEE
-
Publication number: 20240118522Abstract: A photographing lens assembly includes, in order from an object side to an image side: a first, a second, a third, a fourth, a fifth and a sixth lens elements. The first lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof, wherein the object-side surface has at least one convex critical point in an off-axis region thereof. The third lens element has an image-side surface being convex in a paraxial region thereof. The fourth lens element has positive refractive power. The fifth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof, and an image-side surface being convex in a paraxial region thereof. The sixth lens element has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface has at least one convex critical point in an off-axis region thereof.Type: ApplicationFiled: December 7, 2023Publication date: April 11, 2024Applicant: LARGAN PRECISION CO., LTD.Inventors: Po-Lun HSU, Wei-Yu CHEN, Kuan-Ting YEH, Ssu-Hsin LIU
-
Patent number: 11953734Abstract: A fiber optic adapter includes a shell body defining an inner space, a dividing wall dividing the inner space into two receptacles, an installation seat, and a securing seat. The installation seat and the securing seat are respectively located in the receptacles. The securing seat includes a plurality of base walls connected in pairs, a plurality of pairs of clamping walls, and a plurality of clenching walls. Each base wall cooperates with a respective pair of the clamping walls and a respective clenching wall to form a ring-shaped structure, with each adjacent two of the base wall, the pair of clamping walls and the clenching wall defining a gap therebetween.Type: GrantFiled: January 5, 2022Date of Patent: April 9, 2024Assignee: GLORIOLE ELECTROPTIC TECHNOLOGY CORP.Inventor: Hsien-Hsin Hsu
-
Patent number: 11931187Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.Type: GrantFiled: March 16, 2018Date of Patent: March 19, 2024Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung UniversityInventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
-
Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
-
Publication number: 20240084845Abstract: A hinge structure includes two hinge arms, two shaft gears, at least one first elastic piece, and at least one second elastic piece. Each hinge arm includes a central shaft. Each of the two shaft gears is connected to the central shaft, each shaft gear includes an extending portion, the groove is defined on the extending portion. Each first elastic piece includes two elastic arms, a first connecting portion, and two protrusions. The elastic arms are disposed on opposite sides of the first connecting portion, the elastic arms and the first connecting portion cooperatively form a first opening, the extending portion passes through the first opening, each protrusion is disposed on each elastic arm. Each second elastic piece is sleeved on the extending portion. The protrusions are configured to be accommodated in the groove. A terminal device is provided according to the present disclosure.Type: ApplicationFiled: August 30, 2023Publication date: March 14, 2024Inventors: WEI-HUA HSU, CHIA-HSIN CHANG
-
Publication number: 20240089356Abstract: A hinge structure is configured to be disposed between a first body and a second body. The hinge structure includes a first shaft assembly, at least two guiding members, a second shaft assembly, and two supporting plates. Each guiding member includes a first end and a second end, the first end is bent to form a sliding groove. The second shaft assembly is disposed in the sliding groove. The two supporting plates are connected to the first body and the second body, respectively, one end of each supporting plate is sleeved on the first shaft assembly, and another end of each supporting plate is fixed to the second end of, when the first body and the second body are closed to or opened with each other, the second shaft assembly is displaced relative to the guiding member. An electronic device is provided according to the present disclosure.Type: ApplicationFiled: August 30, 2023Publication date: March 14, 2024Inventors: WEI-HUA HSU, CHIA-HSIN CHANG
-
Publication number: 20240086612Abstract: An IC device includes first through third rows of fin field-effect transistors (FinFETs), wherein the second row is between and adjacent to each of the first and third rows, the FinFETs of the first row are one of an n-type or p-type, the FinFETs of the second and third rows are the other of the n-type or p-type, the FinFETs of the first and third rows include a first total number of fins, and the FinFETs of the second row include a second total number of fins one greater or fewer than the first total number of fins.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Po-Hsiang HUANG, Fong-Yuan CHANG, Clement Hsingjen WANN, Chih-Hsin KO, Sheng-Hsiung CHEN, Li-Chun TIEN, Chia-Ming HSU
-
Patent number: 11924984Abstract: A display including a screen, a bracket, a hanging element and a fixing element is provided. The support is connected to the screen and has a top end and a bottom end. The hanging element is disposed on the top end. The fixing element is disposed at the bottom end. When the hanging element is hung on an upper edge of a plate, the fixing element is fixed on a surface of the plate.Type: GrantFiled: February 10, 2022Date of Patent: March 5, 2024Assignee: Qisda CorporationInventors: Jen-Feng Chen, Yien-Bo Chen, Kuan-Hsu Lin, Hsin-Hung Lin, Nien-Tsung Hsu