Abstract: An optical fiber connector includes an outer housing, a rear member sleeved on a rear end of the outer housing, a polarity key, and a release pull lever. The polarity key includes a body part extending from the rear member and located on one side of the outer housing, a latching part formed with a cutout and having a first sloping surface, and a locking protrusion extending from the latching part. The release pull lever is disposed on the outer housing and has a driving portion protruding into the cutout and being in sliding contact with the first sloping surface, such that rearward movement of the release pull lever drives the locking protrusion to move close to the outer housing.

Abstract: A fiber optic connector includes: a front casing that includes a front stopping portion defining a receiving space, and two side stopping portions extending respectively from opposite sides of the front stopping portion, and each being formed with an engaging slot; and a rear casing that is provided for the front casing to be detachably connected thereto, and includes a main body portion defining two through slots which are in spatial communication with the receiving space, and two engaging portions protruding respectively from opposite sides of the main body portion, and each engaging the engaging slot of a respective one of the side stopping portions and disengagable from the same through manual operation.

Abstract: A quick connector assembly and a quick connector device are disclosed. The quick connector assembly includes a first base, a first fluid interface assembly and a valve assembly. The valve assembly regulates whether a fluid flows through the quick connector assembly or not, and thereby sealing the flow of the fluid at both sides of the quick connector assembly. The quick connector assembly and the quick connector device in an embodiment of the present disclosure can regulate the flow of the fluid effectively and provide better barriers to keep concurrent flows separated and isolated. Especially, the quick connector device can be used in slurry delivery system which has fluid being abrasive fluid or solid contained liquid.

Abstract: A package structure including a first circuit board, a second circuit board, an encapsulant, a plurality of conductive terminals, and a package device is provided. The first circuit board has a first top surface and a first bottom surface opposite to each other. The second circuit board has a second top surface and a second bottom surface opposite to each other. The encapsulant encapsulates the first and second circuit boards. The conductive terminals are disposed on the first or second bottom surface and electrically connected to the first or second circuit board. The package device is disposed on the first or second top surface and electrically connected to the first and second circuit boards. The package device includes a first chip, a second chip, a chip encapsulant, a circuit layer, and a plurality of conductive package terminals. A manufacturing method of a package structure is also provided.

Abstract: A temperature sensing device for a hot stamping die apparatus includes: a processor, wherein when a second die moves toward a first die to press a workpiece, a pushing signal is transmitted to the processor; at least one temperature sensing unit is disposed in the first die and includes: a moving rod, a buffer, and a temperature sensor; a displacement regulator; and a controller, whereby when the processor receives the pushing signal, the processor controls the displacement regulator through the controller, so that the moving rod drives the buffer and the temperature sensor to move a predetermined distance, and further the temperature sensor moves toward the workpiece to touch the workpiece and sense a temperature of the workpiece.

Abstract: A rotary bucket mixing device is disclosed. The rotary bucket mixing device includes a main body, a rotating disk assembly, a power gear assembly and a first idler assembly. The power gear assembly receives a power to drive the rotating disk assembly to rotate and thereby rotating a mixing bucket disposed on a supporting assembly of the rotating disk assembly and mixing the contents in the mixing bucket. The first idler assembly controls a rotational speed. The rotary bucket mixing device of the present disclosure provides a better support to the mixing bucket and therefore the safety during the mixing process is enhanced.

Abstract: A package structure, including a conductive element, multiple dies, a dielectric body, a circuit layer and a patterned insulating layer, is provided. The multiple dies are disposed on the conductive element. A portion of the conductive element surrounds the multiple dies. The dielectric body covers the multiple dies. The circuit layer is disposed on the dielectric body. The circuit layer is electrically connected to the multiple dies. The patterned insulating layer covers the circuit layer. A portion of the patterned insulating layer is disposed between the dies that are adjacent. A manufacturing method of a package structure is also provided.

Abstract: A package structure including a first die, a second die, a dielectric body, a conductive terminal, a circuit layer and a patterned insulating layer is provided. The second die is disposed on the first die. A second active surface of the second die faces a first active surface of the first die. The dielectric body covers the first die. The conductive terminal is disposed on the dielectric body and opposite to the second die. The circuit layer includes a first circuit portion and a second circuit portion. The first circuit portion penetrates the dielectric body. The first die is electrically connected to the conductive terminal through the first circuit portion. The second circuit portion is embedded in the dielectric body. The second die is electrically connected to the first die through the second circuit portion. The patterned insulating layer covers the circuit layer and is embedded in the dielectric body.

Abstract: A bridge includes a connecting platform, an electrical connector, a wireless communication module, and a processing unit. The electrical connector is disposed on the connecting platform. The wireless communication module is disposed on the connecting platform and configured to receive a wireless signal. The processing unit is configured to: carry out a verification process on information included in the wireless signal; and allow the electrical connector to transmit power when the verification process on the information turned out to be true.

Abstract: A system for determining spraying information used for spraying a 3D object using a spray tool is provided. The system includes a 3D image capturing device and a computing device. The 3D image capturing device is configured to capture a 3D image of the 3D object. The computing device is configured to determine a plurality of border data points of the 3D object based on the 3D image, to determine a plurality of inside points positioned on a surface of the 3D object within a range defined among the border data points according to a spray width with which the spray tool is to spray the 3D object, and to output the border data points and the inside points as the spraying information for spraying the 3D object.

Abstract: A semiconductor package including a plurality of first chips, a plurality of through silicon vias, a least one insulator, a first circuit structure and a first encapsulant is provided. The first chip electrically connected to the through silicon vias includes a sensing area on a first active surface, a first back surface and a plurality of through holes extending from the first back surface towards the first active surface. The insulator is disposed on the first active surfaces of the first chips. The first circuit structure disposed on the first back surfaces of the first chips and electrically connected to the through silicon vias. The first encapsulant, laterally encapsulating the first chips.

Abstract: A packaging structure includes a bridge die, a through silicon via die, a first encapsulant, a first active die, a second active die, a second encapsulant, and a redistribution circuit structure. The first encapsulant covers the through silicon via die and the bridge die. The first active die is electrically connected to the bridge die and the through silicon via die. The second active die is electrically connected to the bridge die. The second encapsulant covers the first active die and the second active die. The redistribution circuit structure is electrically connected to the through silicon via die. The through silicon via die is disposed between the first active die and the redistribution circuit structure. A manufacturing method of a packaging structure is also provided.

Abstract: A method for cleaning is provided. The method includes: removing a pellicle frame from a top surface of a photomask by debonding an adhesive between the photomask and the pellicle frame, wherein a first portion of the adhesive is remained on the top surface of the photomask, and removing the first portion of the adhesive on the top surface of the photomask, including applying an alkaline solution to the top surface of the photomask, and performing a mechanical impact to the photomask.

Abstract: An integrated antenna package structure including a chip package and an antenna device is provided. The antenna device is disposed on the chip package. The chip package includes a chip, an encapsulant, a circuit layer, and a conductive connector. The encapsulant at least directly covers the back side of the chip. The circuit layer is disposed under the encapsulant and electrically connected to the chip. The conductive connector penetrates the encapsulant and is electrically connected to the circuit layer. The antenna device includes a dielectric body, a coupling layer, and an antenna layer. The dielectric body has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface. The coupling layer is disposed on the second dielectric surface of the dielectric body. The antenna layer is disposed on the first dielectric surface of the dielectric body. The antenna layer is electrically connected to the conductive connector.

Abstract: A nozzle flow stirring pipe includes a pipe body and a nozzle. The pipe body is cylindrical and includes an inner pipe member and an outer pipe member. The inner pipe member has a liquid-extracting channel. The outer pipe member fits around the inner pipe member. A reflow channel is defined between an inner wall of the outer pipe member and an outer wall of the inner pipe member. The nozzle is disposed at one end of the pipe body. The inner pipe member is penetratingly disposed at the nozzle and exposed from below. The nozzle has a plurality of liquid-ejecting pores in communication with one end of the reflow channel.

Abstract: An electric vehicle charger with interchangeable AC power plug includes a first charge cord assembly having a first connector, an electrical vehicle charging control box with a first end electrically coupled to the first charge cord assembly and a second end electrically coupled to an electric vehicle, the first end of the electrical vehicle charging control box includes a second connector; wherein the first connector comprises a plurality of conduction terminals and an identification component, the second connector includes at least one active identification device arranged to mating the plurality of conduction terminals and the identification component for establishing electrical connection and for forming identification-sensor pair between the first connector and the second connector.

Abstract: An optical fiber connector includes a casing body formed with upper and lower key slots, a polarity adjusting key detachably mounted in a selected one of the key slots and engaging an adaptor, head and tail sleeves disposed respectively on front and rear ends of the casing body, and two core heads disposed between the head sleeve and the casing body. To adjust the polarity of the optical fiber connector, the optical fiber connector is detached from the adaptor and the optical fiber connector is inverted. Then, the polarity adjusting key is operated to disengage from the selected one of the key slots and engage the other one of the key slots to adjust the polarity without removal of head and tail sleeves.

Abstract: An electronic device is provided, including a first substrate, a second substrate and a blocking component. The second substrate is opposite to the first substrate. The second substrate has a cutting edge extending along a cutting direction. The blocking component is disposed between the first substrate and the second substrate. The blocking component extends along the cutting direction and is disposed corresponding to the cutting edge.

Abstract: A semiconductor package including a semiconductor chip, a conductive element disposed aside the semiconductor chip, a conductive via disposed on and electrically connected to the conductive element, an insulating encapsulation, and a first circuit structure disposed on the semiconductor chip and the conductive via is provided. A height of the conductive element is less than a height of the semiconductor chip. The insulating encapsulation encapsulates the semiconductor chip, the conductive element, and the conductive via. The conductive via is located between the first circuit structure and the conductive element, and the semiconductor chip is electrically coupled to the conductive via through the first circuit structure.

Abstract: A package structure including a frame structure, a die, an encapsulant, a redistribution structure, and a passive component is provided. The frame structure has a cavity. The die is disposed in the cavity. The encapsulant fills the cavity to encapsulate the die. The redistribution structure is disposed on the encapsulant, the die, and the frame structure. The redistribution structure is electrically coupled to the die. The passive component is disposed on the frame structure and electrically coupled to the redistribution structure through the frame structure. A manufacturing method of a package structure is also provided. The frame structure may provide support, reduce warpage, dissipate heat from the die, act as a shield against electromagnetic interference, and/or provide electrical connection for grounding.