Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A hinge structure includes two hinge arms, two shaft gears, at least one first elastic piece, and at least one second elastic piece. Each hinge arm includes a central shaft. Each of the two shaft gears is connected to the central shaft, each shaft gear includes an extending portion, the groove is defined on the extending portion. Each first elastic piece includes two elastic arms, a first connecting portion, and two protrusions. The elastic arms are disposed on opposite sides of the first connecting portion, the elastic arms and the first connecting portion cooperatively form a first opening, the extending portion passes through the first opening, each protrusion is disposed on each elastic arm. Each second elastic piece is sleeved on the extending portion. The protrusions are configured to be accommodated in the groove. A terminal device is provided according to the present disclosure.

Abstract: A hinge structure is configured to be disposed between a first body and a second body. The hinge structure includes a first shaft assembly, at least two guiding members, a second shaft assembly, and two supporting plates. Each guiding member includes a first end and a second end, the first end is bent to form a sliding groove. The second shaft assembly is disposed in the sliding groove. The two supporting plates are connected to the first body and the second body, respectively, one end of each supporting plate is sleeved on the first shaft assembly, and another end of each supporting plate is fixed to the second end of, when the first body and the second body are closed to or opened with each other, the second shaft assembly is displaced relative to the guiding member. An electronic device is provided according to the present disclosure.

Abstract: An IC device includes first through third rows of fin field-effect transistors (FinFETs), wherein the second row is between and adjacent to each of the first and third rows, the FinFETs of the first row are one of an n-type or p-type, the FinFETs of the second and third rows are the other of the n-type or p-type, the FinFETs of the first and third rows include a first total number of fins, and the FinFETs of the second row include a second total number of fins one greater or fewer than the first total number of fins.

Abstract: A display including a screen, a bracket, a hanging element and a fixing element is provided. The support is connected to the screen and has a top end and a bottom end. The hanging element is disposed on the top end. The fixing element is disposed at the bottom end. When the hanging element is hung on an upper edge of a plate, the fixing element is fixed on a surface of the plate.

Abstract: A semiconductor device includes a substrate and a gate structure. The gate structure is disposed on the substrate, and the gate structure includes a titanium nitride barrier layer a titanium aluminide layer, and a middle layer. The titanium aluminide layer is disposed on the titanium nitride barrier layer, and the middle layer is disposed between the titanium aluminide layer and the titanium nitride barrier layer. The middle layer is directly connected with the titanium aluminide layer and the titanium nitride barrier layer, and the middle layer includes titanium and nitrogen. A concentration of nitrogen in the middle layer is gradually decreased in a vertical direction towards an interface between the middle layer and the titanium aluminide layer.

Abstract: A battery charging apparatus includes a battery compartment having a receptacle that is configured to receive a battery pack. The battery charging apparatus includes a first heat exchange module and/or a second heat exchange module. The first heat exchange module includes a plenum surrounding the receptacle, where the plenum includes a chamber to receive a fluid. The plenum also includes a plurality of flow guides disposed in the chamber to define a variable flow passage for the fluid. The second heat exchange module includes a battery connector and a heat sink thermally coupled to the battery connector. The heat sink is arranged to dissipate thermal energy from the battery pack.

Abstract: A nozzle flow stirring pipe includes a pipe body and a nozzle. The pipe body is cylindrical and includes an inner pipe member and an outer pipe member. The inner pipe member has a liquid-extracting channel. The outer pipe member fits around the inner pipe member. A reflow channel is defined between an inner wall of the outer pipe member and an outer wall of the inner pipe member. The nozzle is disposed at one end of the pipe body. The inner pipe member is penetratingly disposed at the nozzle and exposed from below. The nozzle has a plurality of liquid-ejecting pores in communication with one end of the reflow channel.

Abstract: Present disclosure provides a semiconductor structure, including a semiconductor fin having a first portion and a second portion over the first portion, a first conductive region abutting a first lateral surface of the first portion and a first lateral surface of the second portion, a metal gate having a bottom portion and an upper portion, the bottom portion being between the first portion and the second portion of the semiconductor fin, and the upper portion being over the second portion of the semiconductor fin, and a first spacer between the bottom portion of the metal gate and the first conductive region. A method for manufacturing the semiconductor structure described herein is also provided.

Abstract: A packaging structure including first, second, and third dies, an encapsulant, a circuit structure, and a filler is provided. The encapsulant covers the first die. The circuit structure is disposed on the encapsulant. The second die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die has an optical signal transmission area. The filler is disposed between the second die and the circuit structure and between the third die and the circuit structure. A groove is present on an upper surface of the circuit structure. The upper surface includes first and second areas located on opposite sides of the groove. The filler directly contacts the first area. The filler is away from the second area. A manufacturing method of a packaging structure is also provided.

Abstract: A passive speckle-suppressing diffuser includes a microlens array for diffusing a light field originating from one or more coherent light beams, and a diffractive optical element mounted in series with the microlens array and having a pixelated thickness distribution, characterized by a spatial variation across the diffractive optical element, to impose a spatially varying phase shift on the light field. The pixelated thickness distribution may be configured such that the spatially varying phase shift suppresses speckle of the light field while minimizing introduction of distinct diffraction structure.

Abstract: A fiber optic adapter includes an outer housing, a receiving seat, and a blocking mechanism. The outer housing defines two connection slots. The receiving seat is connected detachably to the outer housing, and defines two through grooves respectively in spatial communication with the connection slots. The blocking mechanism includes a pivot shaft, a torsion spring sleeved on the pivot shaft, and two cover plates connected pivotally to the pivot shaft and respectively connected to two opposite ends of the torsion spring. When each cover plate is in a blocking position, the cover plate blocks a respective connection slot, and is inclined relative to a central axis of the respective connection slot with a free end thereof being more towards the rear than the pivot shaft, and with an angle that is defines between the cover plate and the central axis being not a right angle.

Abstract: A compact camera includes an image sensor, a transparent layer, and a microlens (ML) layer, between the image sensor and the transparent layer. The ML layer forms (a) a first ML array having a plurality of first MLs, and (b) a second ML array with a plurality of second MLs interleaved with the plurality of first MLs. The compact camera also includes a baffle layer, between the ML layer and the image sensor, that forms a plurality of first aperture stops each aligned with a different one of the first MLs and a plurality of second aperture stops each aligned with a different one of the second MLs. The first MLs each have a first set of optical characteristics and the second MLs each have a second set of optical characteristics that are different from the first set of optical characteristics.

Abstract: An optical fingerprint sensor with spoof detection includes a plurality of lenses, an image sensor including a pixel array that includes a plurality of first photodiodes and a plurality of second photodiodes, and at least one apertured baffle-layer having a plurality of aperture stops, wherein each second photodiode is configured to detect light having passed through a lens and at least one aperture stop not aligned with the lens along an optical axis. A method for detecting spoof fingerprints detected using an optical fingerprint sensor includes detecting large-angle light incident on a plurality of anti-spoof photodiodes, wherein the plurality of anti-spoof photodiodes is interleaved with a plurality of imaging photodiodes, determining an angular distribution of light based at least in part one the large-angle light, and detecting spoof fingerprints based at least in part on the angular distribution of light.

Abstract: A temperature sensing device for a hot stamping die apparatus includes: a processor, wherein when a second die moves toward a first die to press a workpiece, a pushing signal is transmitted to the processor; at least one temperature sensing unit is disposed in the first die and includes: a moving rod, a buffer, and a temperature sensor; a displacement regulator; and a controller, whereby when the processor receives the pushing signal, the processor controls the displacement regulator through the controller, so that the moving rod drives the buffer and the temperature sensor to move a predetermined distance, and further the temperature sensor moves toward the workpiece to touch the workpiece and sense a temperature of the workpiece.

Abstract: An optical fiber connector includes an outer housing, a rear member sleeved on a rear end of the outer housing, a polarity key, and a release pull lever. The polarity key includes a body part extending from the rear member and located on one side of the outer housing, a latching part formed with a cutout and having a first sloping surface, and a locking protrusion extending from the latching part. The release pull lever is disposed on the outer housing and has a driving portion protruding into the cutout and being in sliding contact with the first sloping surface, such that rearward movement of the release pull lever drives the locking protrusion to move close to the outer housing.

Abstract: An under-display optical fingerprint sensors employing microlens arrays (MLAs) and an opaque aperture layer includes high aspect-ratio metal aperture structures for efficient angular signal filtering and stray light control. Instead of relying on one or more opaque aperture baffle-layers, embodiments disclosed herein utilize an image sensor's inherent metal layers for filtering signals originated from unwanted angular ranges and blocking undesired stray light could achieve similar or better performance with simplified process flow and lower cost. Layers from the sensors' inherent metal layers are brought into the sensing area on purpose to form the high aspect-ratio metal aperture structure. The metal layers in the sensing area may include apertures aligned to apertures in the opaque layer, and may also be grounded.

Abstract: A fiber optic connector includes a ferrule, an insert body, a tail sleeve and two core heads. The ferrule includes an outer frame, and an operating handle extending rearwardly from the outer frame. The outer frame is formed with an inserted opening open along a front-rear direction and two limiting slots open along a left-right direction and spaced apart from each other along the left-right direction. The insert body is detachably inserted into the ferrule and includes two protrusion units protruding away from each other along the left-right direction and respectively movable in the limiting slots.

Abstract: A package structure including a first die, an encapsulant, a first circuit structure, a second circuit structure, a conductive connector, a second die, and a filler is provided. The encapsulant covers the first die and has a first surface and a second surface opposite to each other. The first circuit structure is disposed on the first surface. The second circuit structure is disposed on the second surface. The conductive connector penetrates the encapsulant. The second die is disposed on the second circuit structure. The second die has an optical signal transmission area. The filler is disposed between the second die and the second circuit structure. An upper surface of the second circuit structure has a groove. The upper surface includes a first area and a second area disposed on opposite sides of the groove. The filler directly contacts the first area. The filler is disposed away from the second area.