Abstract: A solar cell apparatus in which contamination of solar cells is suppressed and a power generation quantity of the solar cells is maintained for a long period of time, even if the solar cell apparatus is disposed outside. The apparatus is provided with: a light transmitting plastic material; a light transmitting back sheet; a plurality of bifacial solar cells that are electrically connected to each other by means of interconnectors; and a transparent filled resin that surrounds the solar cells. The light transmitting plastic material has a curved surface, and is capable of constituting a hermetically closed space by being fixed to a disposition region of a body having the solar cell apparatus disposed thereon. The light transmitting back sheet, the solar cells, and the transparent filled resin are disposed in the hermetically closed space.

Abstract: A method for manufacturing an alumina sintered body, according to the present invention, includes the steps of (a) obtaining a compact by putting a slurry containing an Al2O3 powder, a MgO powder, a MgF2 powder, a solvent, a dispersing agent, and a gelatinizer into a mold, gelatinizing the slurry by a chemical reaction of the gelatinizer in the mold, and causing mold release, (b) obtaining a calcined body by drying the compact, performing degreasing, and further performing calcination, and (c) obtaining a ceramic sintered body by subjecting the calcined body to hot-press firing at 1,150° C. to 1,350° C. In the step (a), the Al2O3 powder having a purity of 99.9 percent by mass or more is used and 0.1 to 0.2 parts by mass of MgO powder and 0.13 parts by mass or less of MgF2 powder relative to 100 parts by mass of Al2O3 powder are used.

Abstract: An electrostatic chuck 10 includes a disc-shaped alumina ceramic base 12, and a heater electrode 14 and an electrostatic electrode 16 that are embedded in the alumina ceramic base 12. An upper surface of the alumina ceramic base 12 functions as a wafer-receiving surface 12a. The heater electrode 14 is formed in a pattern shape, for example, in the manner of a single brush stroke so as to be arranged over the entire surface of the alumina ceramic base 12. When a voltage is applied to the heater electrode 14, the heater electrode 14 generates heat, and heats a wafer W. This heater electrode 14 contains TiSi2 as a main component.

Abstract: In a step (a), a guard ring 60 is disposed on a ceramic substrate 12 (a second member) such that one of openings of a through hole 61 of the guard ring 60 is covered with a joint surface 13 of the ceramic substrate 12. In a step (b), a brazing material 56 made of a metal, a powder 54 made of a material having a smaller thermal expansion coefficient than the brazing material 56, and a feeding terminal 40 are inserted into the through hole 61. In a step (c), the brazing material 56 is fused to impregnate the powder 54 with the brazing material 56 to thereby form a joint layer including the brazing material 56 and the powder 54. In this manner, the joint surface 13 and the joint surface 43 are joined to each other through the joint layer.

Abstract: In a step (a), a ceramic substrate 12, a brazing material 56including a metal having a large thermal expansion coefficient, a porous body 54 having a smaller thermal expansion coefficient than the brazing material 56, and a feeding terminal 40 are placed on a joint surface 13 in such a way that a joint surface 43 of the feeding terminal 40 faces a joint surface 13 of the ceramic substrate 12. In a step (b), the brazing material 56 is fused to allow the brazing material 56 to penetrate into, the pores of the porous body 54. In this manner, a joint layer containing the brazing material 56 and the porous body 54 is formed, and the joint surface 13 of the ceramic substrate 12 and the joint stir face 43 of the feeding terminal 40 are joined to each other through the joint layer.

Abstract: A method for manufacturing an alumina sintered body, according to the present invention, includes the steps of (a) obtaining a compact by putting a slurry containing an Al2O3 powder, a MgO powder, a MgF2 powder, a solvent, a dispersing agent, and a gelatinizer into a mold, gelatinizing the slurry by a chemical reaction of the gelatinizer in the mold, and causing mold release, (b) obtaining a calcined body by drying the compact, performing degreasing, and further performing calcination, and (c) obtaining a ceramic sintered body by subjecting the calcined body to hot-press firing at 1,150° C. to 1,350° C. In the step (a), the Al2O3 powder having a purity of 99.9 percent by mass or more is used and 0.1 to 0.2 parts by mass of MgO powder and 0.13 parts by mass or less of MgF2 powder relative to 100 parts by mass of Al2O3 powder are used.

Abstract: A method for producing an electrostatic chuck includes the steps of (a) placing a ceramic slurry in a molding die, the ceramic slurry containing a ceramic powder, a solvent, a dispersing agent, and a gelling agent, gelatinizing the ceramic slurry in the molding die, and removing the molding die to obtain first and second ceramic molded bodies; (b) drying, debinding, and calcining the first and second molded bodies to obtain first and second ceramic calcined bodies; (c) printing an electrostatic electrode paste on a surface of one of the first and second ceramic calcined bodies to form an electrostatic electrode while assuming the first ceramic calcined body is to form a dielectric layer of an electrostatic chuck; and (d) superposing the first and second ceramic calcined bodies on each other to sandwich the electrostatic electrode and subjecting the first and second calcined bodies to hot-press firing.

Abstract: A solar cell includes: a substrate having heat dissipating characteristics; a solar cell bonded to the substrate such that the solar cell is electrically connected on a first conductive line and a second conductive line, which are disposed on a surface of the substrate; a lens, which is bonded to a transparent electrode of the solar cell; a plurality of projections, which maintain a gap between the substrate and the lens; tapered hole sections in the substrate, each of said tapered hole sections having a tapered section of each of the protruding sections fitted therein; and a sealing resin applied to the gap.

Abstract: Disclosed is a solar cell apparatus wherein contamination of solar cells is suppressed and a power generation quantity of the solar cells is maintained for a long period of time, even if the solar cell apparatus is disposed outside. The apparatus is provided with: a light transmitting plastic material; a light transmitting back sheet; a plurality of bifacial solar cells that are electrically connected to each other by means of interconnectors; and a transparent filled resin that surrounds the solar cells. The light transmitting plastic material has a curved surface, and capable of constituting a hermetically closed space by being fixed to a disposition region of a body having the solar cell apparatus disposed thereon, and the light transmitting back sheet, the solar cells, and the transparent filled resin are disposed in the hermetically closed space.

Abstract: In a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding electrodes (116) is disposed between the row of the protruding electrodes (115) and a display section (111), one end of a flexible printed board (150) is connected to the row of the protruding electrodes (115), one end of a flexible printed board (160) is connected to the row of the protruding electrodes (116), the row of the protruding electrodes (115) is adjacent to the row of the protruding electrodes (116), and the one end of the flexible printed board (150) and the one end of the flexible printed board (160) are opposed to each other.

Abstract: This solar cell has: a substrate having a board-like base, and a first conductive line and a second conductive line, which are disposed on the board-like base; a plurality of multi-junction solar cells, each of which has a lower electrode bonded on and electrically connected to the first conductive line, a cell laminate, which is disposed on the lower electrode, and which includes a bottom cell layer and a top cell layer, a transparent electrode disposed on the upper surface of the top cell layer, and a conductor that connects the transparent electrode to the second conductive line; a glass plate, which has upper portions of the transparent electrodes of the multi-junction solar cells bonded to one surface thereof using an adhesive; and collecting lens, which is disposed on the other glass plate surface with a transparent adhesive therebetween.

Abstract: A solar cell includes: a substrate having heat dissipating characteristics; a solar cell bonded to the substrate such that the solar cell is electrically connected on a first conductive line and a second conductive line, which are disposed on a surface of the substrate; a lens, which is bonded to a transparent electrode of the solar cell; a plurality of projections, which maintain a gap between the substrate and the lens; tapered hole sections in the substrate, each of said tapered hole sections having a tapered section of each of the protruding sections fitted therein; and a sealing resin applied to the gap.

Abstract: An electrostatic chuck 10 includes a disc-shaped alumina ceramic base 12, and a heater electrode 14 and an electrostatic electrode 16 that are embedded in the alumina ceramic base 12. An upper surface of the alumina ceramic base 12 functions as a wafer-receiving surface 12a. The heater electrode 14 is formed in a pattern shape, for example, in the manner of a single brush stroke so as to be arranged over the entire surface of the alumina ceramic base 12. When a voltage is applied to the heater electrode 14, the heater electrode 14 generates heat, and heats a wafer W. This heater electrode 14 contains TiSi2 as a main component.

Abstract: The purposes of the present invention are: to eliminate an electrode on a top cell of a multi-junction compound solar cell, said electrode blocking solar light; to provide a multi-junction compound solar cell having a structure that is not easily broken in manufacture steps; and to shorten a manufacture lead time of a multi-junction compound solar battery. A multi-junction compound solar cell has: a multi-junction cell laminate having the top cell and a bottom cell; a transparent electrode, which is disposed on the light incoming surface of the top cell; a lower electrode having potential of the bottom cell; and a side-surface electrode, which is disposed on the side surface of the solar cell with an insulating layer therebetween, and is electrically connected to the transparent electrode. In the multi-junction compound solar cell, the side-surface electrode is led out to the lower electrode.

Abstract: The electrostatic chuck 10 includes a discoidal alumina ceramic substrate 12 and a heater electrode 14 and an electrostatic electrode 16 embedded in the alumina ceramic substrate 12. The top surface of the alumina ceramic substrate 12 is a wafer-mounting face 12a. The heater electrode 14 has a pattern, for example, of a single continuous line so as to realize electric wiring over the entire surface of the alumina ceramic substrate 12. Upon the application of a voltage, the heater electrode 14 generates heat and heats the wafer W. The heater electrode 14 is made of a complex oxide of titanium, aluminum, and magnesium (Ti—Al—Mg—O) dispersed in molybdenum.

Abstract: A method for producing a ceramic heater includes performing firing at 1,600° C. to 1,750° C. in a state in which front and back surfaces of an inner shaped body composed of low-temperature sinterable raw material powder containing aluminum nitride powder as a main component and 0.03% to 1% by weight of rare earth oxide powder are sandwiched between a pair of outer layers composed of aluminum nitride sintered bodies having a volume resistivity of 1015 ?cm or more through resistive heating elements composed of metal meshes, thereby obtaining a ceramic heater.

Abstract: In a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding electrodes (116) is disposed between the row of the protruding electrodes (115) and a display section (111), one end of a flexible printed board (150) is connected to the row of the protruding electrodes (115), one end of a flexible printed board (160) is connected to the row of the protruding electrodes (116), the row of the protruding electrodes (115) is adjacent to the row of the protruding electrodes (116), and the one end of the flexible printed board (150) and the one end of the flexible printed board (160) are opposed to each other.

Abstract: A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.

Abstract: While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.

Abstract: While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.