Abstract: An electrostatic chuck includes a base of a sintered body containing alumina, an electrode as a power-supplied member embedded in the base and supplied with electric power, a bonding member embedded in the base and bonded to the electrode, in which a difference in coefficient of thermal expansion from the sintered body is 2×10?6/K or less, and a melting point is higher than baking temperature of the sintered body, and a terminal bonded to the electrode through the bonding member.

Abstract: A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3. The resin board 4 located at the bottom out of the resin boards 3 is thicker than the other resin boards 3.

Abstract: At least two switching devices each including a substrate formed of a wide bandgap semiconductor, source and gate electrodes formed in a principal surface side of the substrate, and a drain electrode formed on the back surface of the substrate are stacked so that respective upper surface sides of the switching face each other.

Abstract: A ceramic member comprises a base including an alumina sintered body, and an yttria sintered body formed on the alumina sintered body and exposed to a corrosive gas; and a metallic member buried in the base.

Abstract: At least two switching devices each including a substrate formed of a wide bandgap semiconductor, source and gate electrodes formed in a principal surface side of the substrate, and a drain electrode formed on the back surface of the substrate are stacked so that respective upper surface sides of the switching face each other.

Abstract: A manufacturing method for a sintered body with a buried metallic member comprises forming an alumina sintered body or an alumina presintered body, forming a metallic member by printing a printing paste including a refractory metal on the alumina sintered body or the alumina presintered body, forming an alumina compact on the metallic member, and sintering the alumina compact, the metallic member, and the alumina sintered body or the alumina presintered body.

Abstract: An object of the present invention is to provide a ceramic heater so that hot spots around the end portions of a heat resistor may be prevented. A ceramic heater has a ceramic substrate having a mounting face for an object to be heated, a heat resistor 3B embedded in the substrate and having end portions 3a, and a connecting member 6 electrically connected with the end portion 3a. At least one connecting member 6 substantially has an outer shape of a sphere, an ellipsoid of revolution, or a cylinder. The connecting member 6 has a fixing portion 3a of the heat resistor by means of caulking.

Abstract: Bumps are formed on electrodes of semiconductor elements, and moreover, the semiconductor elements with the bumps are electrically connected to metallic members having installation members, whereby wiring lines are eliminated. Stray inductance and conduction resistance resulting from wiring lines can be reduced. A conventional dented connector and a projecting connector are eliminated by connecting the installation members to a second circuit board, thereby enabling an electronic circuit device of a power control system to be made compact.

Abstract: An electrostatic chuck comprises a dielectric ceramic layer made of an alumina sintered body having a volume resistivity equal to or greater than about 1×1017?·cm at room temperature and a volume resistivity equal to or greater than about 1×1014?·cm at 300° C., and an electrode formed on one surface of the dielectric ceramic layer.

Abstract: An electronic circuit device comprises: a semiconductor element having a first surface and a second surface, with the first and second surfaces being on first and second sides of the semiconductor element, respectively, and facing in opposite directions; a first electrode on the first surface; a second electrode on the second surface; a first circuit board electrically connected to the first electrode via a metallic plate such that the metallic plate and the semiconductor element are on the first circuit board; a second circuit board on the second side of the semiconductor element, the second circuit board having a control circuit for the semiconductor element; and a metallic wire for directly electrically interconnecting the second electrode and the second circuit board.

Abstract: A method of manufacturing an electrical-resistance heating element includes forming sintered ceramics or calcined ceramics, forming an electrode on the sintered ceramics or the calcined ceramics, and forming a ceramic base material having mainly a high melting point metal on the electrode embedded therein, thereby forming a heating element with built-in electrode.

Abstract: Electrodes of one face of a semiconductor, which has electrodes formed on both faces, and a heat radiating plate are directly joined to quickly absorb and diffuse heat of the semiconductor, thereby improving a heat radiation effect. At the same time, electrodes on an opposite face of the semiconductor are connected to pillared electrodes that are thicker than a wire for wire bonding and larger in current capacity. These pillared electrodes can accordingly be utilized as connecting terminals to a circuit board. Ceramic is used for the heat radiating plate, so that semiconductors of different functions can be mounted simultaneously.

Abstract: At least two switching devices each including a substrate formed of a wide bandgap semiconductor, source and gate electrodes formed in a principal surface side of the substrate, and a drain electrode formed on the back surface of the substrate are stacked so that respective upper surface sides of the switching face each other.

Abstract: An object of the present invention is to provide a ceramic heater 2 having a ceramic sintered body 4 and a heat resistor embedded in the substrate, in which the change of the uniformity of temperature on the heating face may be reduced. The heat resistor 5A or 5B contains a metal comprising one or more metal element selected from the group consisting of IVa, Va and VIa elements of the Periodic Table and a carbide of the metal. A ratio (Ic/Im) of a total (Ic) of main peak strength of the metal carbide to a total (Im) of main peak strength of the metal being not larger than 0.2, measured by means of an X-ray diffraction method. Alternatively, (Rb−Ra)/Ra is not larger than 30 percent, where “Ra” is a resistance of the heat resistor before a sintering step and “Rb” is a resistance of the heat resistor after the sintering step.

Abstract: An object of the present invention is to provide a ceramic heater so that hot spots around the end portions of a heat resistor may be prevented. A ceramic heater has a ceramic substrate having a mounting face for an object to be heated, a heat resistor 3B embedded in the substrate and having end portions 3a, and a connecting member 6 electrically connected with the end portion 3a. At least one connecting member 6 substantially has an outer shape of a sphere, an ellipsoid of revolution, or a cylinder. The connecting member 6 has a fixing portion 6a fixing the end portion 3a of the heat resistor by means of caulking.

Abstract: A lower electrode of a semiconductor is directly connected to a heat sink, while a first electrode and a second electrode are connected to a plate-shaped second conductor by means of a first conductor. Radiated heat of the semiconductor is directly conducted to the heat sink and absorbed. The heat is radiated by being further conducted to the plate-shaped second conductor via the first conductor, thereby allowing the semiconductor to have a reduced temperature.

Abstract: Bumps (112) are formed to electrodes of semiconductor elements (111), and moreover the semiconductor elements with the bumps are electrically connected to metallic members (114) having installation members (114b), whereby wiring lines are eliminated. A stray inductance and a conduction resistance resulting from the wiring lines can be reduced. A conventional dented connector and a projecting connector are eliminated by connecting the installation members to a second circuit board, enabling the electronic circuit device of the power control system to be made compact.

Abstract: The lower electrode of a semiconductor is directly connected to a heat sink, while a first electrode and a second electrode are connected to a plate-shaped second conductor by means of a first conductor. Radiated heat of the semiconductor is directly conducted to the heat sink and absorbed. The heat is radiated by being further conducted to the plate-shaped second conductor via the first conductor, allowing the semiconductor to have a reduced temperature.

Abstract: Copper electrodes are formed on a circuit board to be bonded with leads of a TAB driving liquid crystal. A pre-deposit solder receiver having solder printed thereon is also provided on the circuit board in alignment with and prior to an electrode to be first bonded with a lead, to form a sufficient solder pool between plural electrodes and a bottom wall of a soldering iron. Solder/bonding is accordingly realized efficiently even from a starting electrode E1. Also, an excessive solder receiver may be provided in alignment with and after an electrode to be last bonded with a lead.

Abstract: A ceramic heater composed of a ceramic substrate and a resistant heating element embedded within the ceramic substrate along a predetermined planar pattern is obtained by holding a convolution of a spiral-coiled high melting metallic filament in the above predetermined planar pattern and heat-treating the convolution at a temperature not higher than a primary recrystallization commencement temperature of the high melting metal under a non-oxidative atmosphere to provide the resistant heating element, embedding the resulting resistant heating element within a ceramic shaped body, and then, sintering the ceramic shaped body.