Patents by Inventor Kiyoshi Hasegawa

Kiyoshi Hasegawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140286474
    Abstract: An X-ray fluorescence analyzer includes a sample stage having an opening at an X-ray irradiation position, an X-ray source which irradiates a sample placed on the opening with a primary X-ray from below, a detector which detects an X-ray fluorescence generated from the sample, a transparent drop prevention plate supported to be advanced and retracted immediately below the opening, a drive mechanism which advances and retracts the drop prevention plate, an observation camera which observes the drop prevention plate positioned immediately below the opening, and an operation unit which processes an image of the drop prevention plate which is captured by the observation camera. The operation unit detects a foreign matter on the drop prevention plate based on an image difference between images before and after the drive mechanism moves or vibrates the drop prevention plate within an observation range of the observation camera.
    Type: Application
    Filed: March 24, 2014
    Publication date: September 25, 2014
    Applicant: HITACHI HIGH-TECH SCIENCE CORPORATION
    Inventors: Masahiro Sakuta, Kiyoshi Hasegawa, Yoshiki Matoba
  • Patent number: 8815334
    Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
    Type: Grant
    Filed: February 9, 2009
    Date of Patent: August 26, 2014
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa, Koji Morita, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Publication number: 20140231483
    Abstract: A field-pole magnet manufacturing apparatus fractures a magnet fixed on a die serving as a lower tool by causing a punch of an upper tool to press the magnet while in contact with the magnet. At least one projection is formed in the punch of the upper tool symmetrically with respect to the central position of the magnet in the width direction of the magnet.
    Type: Application
    Filed: September 20, 2012
    Publication date: August 21, 2014
    Inventors: Kazuhiro Takaichi, Kimio Nishimura, Hiroharu Takeuchi, Kunitomo Ishiguro, Kiyoshi Hasegawa, Yasuhisa Koike
  • Publication number: 20140144337
    Abstract: A field-pole magnet manufacturing apparatus manufactures magnet pieces that constitute a field-pole magnet arranged in a rotary electric machine by fracturing the magnet. This manufacturing apparatus includes: a support unit on which the magnet is placed; a fracture unit that is arranged opposite to the support unit across the magnet and is configured to fracture the magnet by pressing the magnet while in contact with the magnet; and a powder removal unit that is configured to remove crush powder produced by fracture of the magnet.
    Type: Application
    Filed: June 20, 2012
    Publication date: May 29, 2014
    Inventors: Yasuhisa Koike, Kimio Nishimura, Hiroharu Takeuchi, Kunitomo Ishiguro, Kiyoshi Hasegawa, Yoshinori Izawa
  • Publication number: 20140117919
    Abstract: A servo control device includes a follow-up control unit that controls a control target that drives a mechanical system by a motor, a command function unit that has input therein a phase signal ? indicating a phase of a cyclic operation performed by the control target, and that calculates a machine motion command according to the phase signal ? by a preset first function, a second derivative unit that uses a second function obtained by second-order differentiating the first function with respect to the phase signal to calculate a value of the second function according to the phase signal as a second-order differential base signal, a correction-value computation unit that computes a first command correction value for correcting the motor motion command by using a product of a square value of the phase velocity, the second-order differential base signal, and a first constant, and a correction-value addition unit that calculates the motor motion command based on an added value of the first command correction val
    Type: Application
    Filed: October 25, 2012
    Publication date: May 1, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hidetoshi Ikeda, Yoshihiro Marushita, Koji Mahara, Kiyoshi Hasegawa, Hidemasa Ogi
  • Patent number: 8705698
    Abstract: Provided are an X-ray analyzer and a mapping method for an X-ray analysis which, in a inspection for a harmful substance contained in, for example, a material or a composite electronic component, enable determination as to whether a sample is normal or abnormal to be performed visually based on an image obtained by the X-ray mapping analysis. In the X-ray analyzer, an X-ray mapping image of a sample which is confirmed to be normal in advance is obtained as a reference mapping image. A mapping analysis is performed on a inspection sample. A difference from the reference mapping image is obtained for each pixel, to thereby display a difference mapping image. A region in which the amount of specific element is larger than a reference amount is displayed with high brightness, and hence an abnormal portion may be easily found.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: April 22, 2014
    Assignee: SII Nanotechnology Inc.
    Inventors: Hiroshi Matsumura, Kiyoshi Hasegawa
  • Patent number: 8611493
    Abstract: The X-ray fluorescence analyzer (100) includes: an enclosure (10); a door (20) for putting the sample into and out of the enclosure; a height measurement mechanism (7) capable of measuring a height at the irradiation point; a moving mechanism control unit (9) for adjusting a distance between the sample and the radiation source as well as the X-ray detector based on the measured height at the irradiation point; a laser unit (7) for irradiating the irradiation point with a visible light laser beam; a laser start control unit (9) for irradiating the visible light laser beam by the laser unit (7) when the door is open state; and a height measurement mechanism start control unit (9) for starting the height measurement mechanism to measure the height at the irradiation point when the door is opened.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: December 17, 2013
    Assignee: SII Nanotechnology Inc.
    Inventors: Kiyoshi Hasegawa, Yutaka Ikku, Hideki Takiguchi
  • Patent number: 8426742
    Abstract: The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer.
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: April 23, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yoshinori Ejiri, Shuichi Hatakeyama, Shigeharu Arike, Kiyoshi Hasegawa
  • Publication number: 20130071540
    Abstract: A method for producing frozen fresh cream to be whipped, the method including: cooling fresh cream, wherein in the cooling, the fresh cream is cooled to a temperature of ?5° C. or lower and is changed from 0° C. to ?5° C. for 8 minutes or shorter.
    Type: Application
    Filed: July 23, 2012
    Publication date: March 21, 2013
    Applicant: ORIENTAL YEAST CO., LTD.
    Inventors: Satoru WAKANA, Kiyoshi HASEGAWA, Takayasu TAKAHASHI
  • Publication number: 20130032961
    Abstract: To execute a stable pressure control, in a control device for an injection molding machine, a filling/pressure-keeping determining unit determines whether the injection molding machine is performing a pressure keeping operation, an elastic constant identifier acquires, when the filling/pressure-keeping determining unit determines that the pressure keeping operation is in progress, a pressure detection value and a position detection value as operation information of a motor and identifies an elastic constant K based on the acquired pressure detection value and the position detection value, and a pressure-control control-parameter setting unit calculates a proportional gain Ka of a pressure controller such that a product of the proportional gain Ka of the pressure controller and the elastic constant K is smaller than a speed control bandwidth ?sc of a speed controller, and sets the calculated proportional gain Ka to the pressure controller.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 7, 2013
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koichiro Ueda, Kiyoshi Hasegawa, Hidemasa Ogi, Yukihiko Kobayashi
  • Patent number: 8362236
    Abstract: The present invention provides a novel class of compounds that have the activity of inhibiting HSP90 enzyme and are useful as anti-cancer agents or such, and compounds that are useful as synthetic intermediates thereof. Specifically, the present invention provides compounds represented by the following formula (1), and pharmaceutically acceptable salts thereof: wherein X, R1, R2, R3, R4, R5, R6, R7, L1, L2, and L3 are as defined in the specification.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: January 29, 2013
    Assignee: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Nobuo Shimma, Takuo Tsukuda, Hiroshi Koyano, Atsushi Suda, Tadakatsu Hayase, Kihito Hada, Ken-Ichi Kawasaki, Susumu Komiyama, Naomi Ono, Toshikazu Yamazaki, Ryoichi Saitoh, Masami Kohchi, Kiyoshi Hasegawa
  • Publication number: 20120234584
    Abstract: It is an object of the invention to provide a method for producing a substrate for mounting a semiconductor chip, that can reduce bridging and allows excellent wire bondability and solder connection reliability to be obtained, even when forming fine-pitch wirings.
    Type: Application
    Filed: September 6, 2010
    Publication date: September 20, 2012
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yoshinori Ejiri, Kiyoshi Hasegawa, Takehisa Sakurai, Yoshiaki Tsubomatsu
  • Patent number: 8193351
    Abstract: Compounds represented by formula (1) shown below, pharmaceutically acceptable salts thereof, and pharmaceutical compositions comprising such compounds are provided.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: June 5, 2012
    Assignee: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Takuo Tsukuda, Ken-Ichi Kawasaki, Susumu Komiyama, Yoshiaki Isshiki, Yasuhiko Shiratori, Kiyoshi Hasegawa, Takaaki Fukami, Takaaki Miura, Naomi Ono, Toshikazu Yamazaki, Young-Jun Na, Dong-Oh Yoon, Sung-Jin Kim
  • Patent number: 8172625
    Abstract: In a pair of mutually connectable terminals, one terminal is provided with a joint having a spherical surface formed on the outer circumferential surface, and the other terminal is provided with a hole into which the joint can be fitted. At least one of the joint and the hole is formed in a plate member which can be displaced elastically in the fitting direction of the joint and the hole. When the pair of terminals are connected, the joint touches the circumferential edge of the hole to displace the plate member elastically. When the joint is fitted in the hole, the plate member is reset elastically and holds the spherical surface of the joint under such a state as the spherical surface is pressed against the edge of the hole.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: May 8, 2012
    Assignees: Autonetworks Technologies, Ltd, Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tomokazu Kashiwada, Sho Miyazaki, Shiro Nishida, Masaharu Suetani, Kiyoshi Hasegawa
  • Patent number: 8167653
    Abstract: A shield shell is composed of a tubular shell body made of a conductive resin and a metallic conductive body mounted in the shell body. The conductive body is capable of, in the base end part, connecting with a shielding member by being exposed on the surface of the shell body, while in the tip part, connecting with a shield case by being exposed on the surface of the shell body. The shielding member and the shield case are connected via the metallic conductive body of a low electric resistance, and thereby achieving excellent shielding performance in a low-frequency region in the shield shell.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: May 1, 2012
    Assignees: Autonetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Kiyoshi Hasegawa, Sho Miyazaki, Fujio Sonoda
  • Publication number: 20120094063
    Abstract: A boring cutter body (5) is inserted into a circular hole (3) and is rotated and moved in an axial direction, whereby screw-shaped groove parts (11) are formed by using a tool bit (9) provided on a tip end of an outer peripheral portion, and broken surfaces (15) are formed by breaking tips of ridge parts generated by formation of the groove parts (11). Moreover, the groove parts (11) are processed through electric discharge machining using a wire electrode (17) provided to the boring cutter body (5) behind the tool bit (9) in the rotating direction, thereby forming finely roughened portions (41) having more finely roughened shapes than the broken surfaces (15).
    Type: Application
    Filed: May 26, 2010
    Publication date: April 19, 2012
    Inventors: Kiyoshi Hasegawa, Shuuji Adachi, Mitsuo Uchiyama, Yoshirou Noguchi, Takahiro Iwasaki, Kimio Nishimura
  • Publication number: 20120051507
    Abstract: The X-ray fluorescence analyzer (100) includes: an enclosure (10); a door (20) for putting the sample into and out of the enclosure; a height measurement mechanism (7) capable of measuring a height at the irradiation point; a moving mechanism control unit (9) for adjusting a distance between the sample and the radiation source as well as the X-ray detector based on the measured height at the irradiation point; a laser unit (7) for irradiating the irradiation point with a visible light laser beam; a laser start control unit (9) for irradiating the visible light laser beam by the laser unit (7) when the door is open state; and a height measurement mechanism start control unit (9) for starting the height measurement mechanism to measure the height at the irradiation point when the door is opened.
    Type: Application
    Filed: June 30, 2011
    Publication date: March 1, 2012
    Inventors: Kiyoshi Hasegawa, Yutaka Ikku, Hideki Takiguchi
  • Publication number: 20110206186
    Abstract: Provided are an X-ray analyzer and a mapping method for an X-ray analysis which, in a inspection for a harmful substance contained in, for example, a material or a composite electronic component, enable determination as to whether a sample is normal or abnormal to be performed visually based on an image obtained by the X-ray mapping analysis. In the X-ray analyzer, an X-ray mapping image of a sample which is confirmed to be normal in advance is obtained as a reference mapping image. A mapping analysis is performed on a inspection sample. A difference from the reference mapping image is obtained for each pixel, to thereby display a difference mapping image. A region in which the amount of specific element is larger than a reference amount is displayed with high brightness, and hence an abnormal portion may be easily found.
    Type: Application
    Filed: February 15, 2011
    Publication date: August 25, 2011
    Inventors: Hiroshi Matsumura, Kiyoshi Hasegawa
  • Patent number: 7964289
    Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: June 21, 2011
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kenji Takai, Norio Moriike, Kenichi Kamiyama, Katsuyuki Masuda, Kiyoshi Hasegawa
  • Publication number: 20110000085
    Abstract: A cylindrical internal surface processing method comprises forming a cylinder bore, roughening an upper section of the bore, depositing coating onto the bore, and machining a lower section of the bore and the coating. The forming of the cylinder bore includes forming the upper and lower sections with the lower section being axially spaced from the upper section and having an axial length greater than zero. The roughening creates a roughened surface such that a radially innermost edge of the roughened surface has an internal diameter smaller than an internal diameter of the lower section. The coating is deposited to cover the upper section and at least a portion of the lower section. The machining forms a tapered portion and a cylindrical portion, a radially outermost edge of the cylindrical portion having an internal diameter larger than that of a radially outermost edge of the roughened surface.
    Type: Application
    Filed: September 17, 2010
    Publication date: January 6, 2011
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Koichi KANAI, Kiyokazu SUGIYAMA, Eiji SHIOTANI, Kimio NISHIMURA, Junichi UCHIYAMA, Kiyohisa SUZUKI, Jun INOMATA, Daisuke TERADA, Akira SHIMIZU, Hidenobu MATSUYAMA, Kiyoshi HASEGAWA, Takashi IIYA