Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Abstract: An apparatus and method for surface finishing a workpiece is disclosed as including a workpiece supporting mechanism supporting a workpiece having a target shaped periphery with a given width to be surface finished and a tool holder holding a surface finish tool in abutting contact with the target shaped periphery of the workpiece. A pressure applying mechanism is operative to apply a pressure force to the surface finish tool through the tool holder to cause the surface finish tool to be held in pressured contact with the target shaped periphery, with the pressure force exhibiting a given distribution pattern depending upon an axial direction of the workpiece. A drive mechanism rotates the workpiece to allow the surface finish tool to surface finish the target shaped periphery into a given geometrical profile, variably contoured along an axis of the workpiece depending on the given pressure distribution pattern.

Abstract: In a pair of mutually connectable terminals, one terminal is provided with a joint having a spherical surface formed on the outer circumferential surface, and the other terminal is provided with a hole into which the joint can be fitted. At least one of the joint and the hole is formed in a plate member which can be displaced elastically in the fitting direction of the joint and the hole. When the pair of terminals and are connected, the joint touches the circumferential edge of the hole to displace the plate member elastically. When the joint is fitted in the hole, the plate member is reset elastically and holds the spherical surface of the joint under such a state as the spherical surface is pressed against the edge of the hole.

Abstract: The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer.

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract: The present invention provides a novel class of compounds that have the activity of inhibiting HSP90 enzyme and are useful as anti-cancer agents or such, and compounds that are useful as synthetic intermediates thereof. Specifically, the present invention provides compounds represented by the following formula (1), and pharmaceutically acceptable salts thereof: wherein X, R1, R2, R3, R4, R5, R6, R7, L1, L2, and L3 are as defined in the specification.

Abstract: A shield shell 40 is composed of a tubular shell body 41 made of a conductive resin and a metallic conductive body 46 mounted in the shell body 41. The conductive body 46 is capable of, in the base end part, connecting with a shielding member 22 by being exposed on the surface of the shell body 41, while in the tip part, connecting with a shield case 11 by being exposed on the surface of the shell body 41. The shielding member 22 and the shield case 11 are connected via the metallic conductive body 46 of a low electric resistance, and thereby achieving excellent shielding performance in a low-frequency region in the shield shell 40.

Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Abstract: An electronic apparatus includes a display portion, a plurality of first buttons, a second button, and a display controller. The display portion displays a screen. The plurality of first buttons are disposed along an outer circumference of the screen. The display controller displays icons representing functions of the plurality of first buttons at positions respectively corresponding to the plurality of first buttons along an inner circumference of the screen, and changes the functions allocated to the plurality of first buttons and the displayed icons in accordance with a press of the second button.

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Abstract: Compounds represented by formula (1) shown below, pharmaceutically acceptable salts thereof, and pharmaceutical compositions comprising such compounds are provided.

Abstract: In an X-ray analysis apparatus and an X-ray analysis method, a quantitative analysis is stably performed by stably behaving an X-ray source. There are possessed an X-ray tubular bulb irradiating a primary X-ray to a sample, a primary X-ray adjustment mechanism capable of adjusting an intensity of the primary X-ray, an X-ray detector detecting a characteristic X-ray radiated from the sample, thereby outputting a signal including energy informations of the characteristic X-ray and a scattered X-ray, an analyzer analyzing the above signal, and an incident X-ray adjustment mechanism disposed between the sample and the X-ray detector, and capable of adjusting a total intensity of the characteristic X-ray and the scattered x-ray, which are entered to the X-ray detector.

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract: To provide an energy dispersion type radiation detecting system and a method of measuring a content of an object element capable of carrying out a measurement by determining an intensity of an incidence radiation to constitute an optimum minimum limit of detection by restraining an influence of a pile up, the energy dispersion type radiation detecting system includes an incidence system of irradiating the incidence radiation to a sample by a predetermined intensity, a detection system of detecting a radiation emitted from the sample by irradiating the incidence radiation for specifying a content of an object element of the sample based on a spectrum of the detected radiation, and the energy dispersion type radiation detecting system includes a control portion capable of irradiating the incidence radiation by an optimum intensity by determining the optimum intensity of the incidence radiation minimizing a minimum limit of detection of the object element based on the spectrum of the detected radiation.

Abstract: A semiconductor device includes a first surface faced to a mounting board when the semiconductor device is placed over the mounting board and a second surface opposed to the first surface. The semiconductor device also includes a position reference portion which is provided in an area including sides of the second surface and which has an optical reflection factor different from that of the mounting board.

Abstract: In an X-ray analysis apparatus and an X-ray analysis method, a quantitative analysis is stably performed by stably behaving an X-ray source. There are possessed an X-ray tubular bulb irradiating a primary X-ray to a sample, a primary X-ray adjustment mechanism capable of adjusting an intensity of the primary X-ray, an X-ray detector detecting a characteristic X-ray radiated from the sample, thereby outputting a signal including energy informations of the characteristic X-ray and a scattered X-ray, an analyzer analyzing the above signal, and an incident X-ray adjustment mechanism disposed between the sample and the X-ray detector, and capable of adjusting a total intensity of the characteristic X-ray and the scattered x-ray, which are entered to the X-ray detector.

Abstract: A film feeder (FF1) feeds a film (1), a first drive (20) rotates a work (W), a second drive (30) moves the work (W) relative to the film (1), a shoe set handler (40) handles the shoe set (2) to press the film (1) against the work (W), and a deterioration delayer (C) is configured to delay an abrasivity deterioration of the film (1).

Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.