Abstract: The present invention provides a remote maintenance system that eliminates the need for reconfiguring the network environment.

Abstract: A fluorescent X-ray analysis method comprises examining a positional relationship between an image of a sample and an X-ray illuminated region of the sample image, acquiring an image of the sample as a monochromatic image, extracting from the acquired sample image a coincident portion thereof containing the X-ray illuminated region, and examining a luminance change in the extracted image and, where there is a luminance change greater than a reference value, determining whether or not the X-ray illuminated to the sample is partly off the sample.

Abstract: A light, cheap, and high-performance regenerative pump for pumping a methanol-water fuel of a fuel cell, which is adapted to the fuel. At least one of an impeller of the regenerative pump and an inner wall of the pump is made of polyphenylene sulfide or polyphenylene sulfide containing a filler. A thrust clearance formed between the pump chamber inner wall and an impeller peripheral face is set so as to be assured even in a state where the impeller swells.

Abstract: A semiconductor chip mounting tape on which external connecting terminals are formed in accordance with a layout pattern has post portions which are to be connected to a semiconductor chip and external connecting terminals. Post portoins are formed on the first surface of an insulation tape used as a base of the semiconductor chip mounting tape. External connecting terminals are formed on the second surface of the insulation tape. The post portions and the external connecting terminals are integrally formed by same solder balls via through holes formed in the insulation tape.

Abstract: A multi-chip package type semiconductor device includes a first insulating substrate having a hollow on its main surface, a second insulating substrate having on its main surface an opening, which is larger than the hollow, and being on the first substrate wherein the opening encompasses the hollow, a first semiconductor chip being formed in the hollow, a second first semiconductor chip whose size is approximately the same as that of the first semiconductor chip, being supported by the first insulating substrate in an area, which encompasses the hollow.

Abstract: A timing-control circuit device, which uses a synchronous mirror delay circuit, for keeping the synchronization between clock signals in phase even at a load change. A reference clock signal (clkin 11) is entered to a timing-control circuit (SMDF 14) and used to generate an internal clock (dclk 12), then generates an external clock (clkout 13) through a buffer (BUF 15). The external clock signal is fed back to the timing-control circuit (SMDF 14) and used to generate an internal clock signal so as to synchronize the external clock signal in phase with the reference clock signal. The timing-control circuit is provided with a circuit (FDA 21, MCC 22) for detecting a phase difference between the internal clock signal and the external clock signal, as well as a delay circuit (DCL 24) for controlling a delay time, so that the delay circuit (DCL 24) can change the delay time according to the detected phase difference.

Abstract: A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.

Abstract: In a telephone apparatus which is capable of simultaneously making telephone calls of two systems through a single subscriber's line and is under a plurality of dial-in contracts, two recording processing means 23, 24 capable of recording different telephone calls are provided so that, even if an incoming call of one of the above two systems is being recorded, another incoming call of the other system can be recorded.

Abstract: A timing-control circuit device, which uses a synchronous mirror delay circuit, for keeping the synchronization between clock signals in phase even at a load change. A reference clock signal (clkin 11) is entered to a timing-control circuit (SMDF 14) and used to generate an internal clock (dclk 12), then generates an external clock (clkout 13) through a buffer (BUF 15). The external clock signal is fed back to the timing-control circuit (SMDF 14) and used to generate an internal clock signal so as to synchronize the external clock signal in phase with the reference clock signal. The timing-control circuit is provided with a circuit (FDA 21, MCC 22) for detecting a phase difference between the internal clock signal and the external clock signal, as well as a delay circuit (DCL 24) for controlling a delay time, so that the delay circuit (DCL 24) can change the delay time according to the detected phase difference.

Abstract: A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.

Abstract: An agitator comprises a main body for supporting rotatably a rotary shaft, a chuck for connecting detachably an agitating rod with the rotary shaft, starting means for starting the rotation of the rotary shaft when the chuck is covered with a chuck cover, and locking means for locking rotary shaft when the chuck is not covered with the chuck cover. The chuck cover is removed from the main body when an external force larger than a predetermined value is applied to the chuck cover. The starting means comprises a permanent magnet provided on the outer periphery of a disk hub and a magnetic sensor provided on the main body so that an output is generated to start the driving source only when the chuck cover is moved to cover the chuck. The locking means comprises a hole formed in the rotary shaft, an eccentric cam to be rotated by the chuck cover, and a lock pin which is moved by the eccentric cam so as to be inserted into the hole of the rotary shaft when the chuck is not covered with the chuck cover.

Abstract: A magnetic head unit is provided in which the distance between a surface of the gimbal plate put touching the pressing member and a surface of the magnetic head facing the first or second disc-shaped recording medium is set to fall in a range of 0.3 to 0.8 mm and thus the coil winding concavity can be formed in the intermediate portion of the magnetic head in the direction of the head thickness and the magnetic heads can be kept stably in place in relation to the disc-shaped recording medium. Also, a recording and/or reproducing apparatus using the magnetic head unit is provided.

Abstract: A magnetic head device exhibiting optimum floating characteristics without the risk of fracturing a first rail, and a manufacturing method for the magnetic head device. In this magnetic head device, the first rail is formed on a surface of a first head chip facing a disc-shaped recording medium for extending parallel to the running direction of the disc-shaped recording medium, and a second rail is formed for extending parallel to the first rail. The first rail is formed by grooving the center slider side of the first head chip.

Abstract: An x-ray fluorescence analyzer which accomplishes determination of the center of a circular sample in an xy-plance, in which the sample is placed, by performing a first step of determining a provisional center, a second step of carrying out measurements by scanning in the x-axis direction, a third step of calculating the center of the sample in the x-axis direction, a fourth step of carrying out measurements by scanning in the y-axis direction, a fifth step of calculating the center of the sample in the y-axis direction, and a sixth step of determining coordinates of the center of the sample.

Abstract: An adhesive for a vehicular glass is disclosed which comprises urethane as a base material added with 2% to 8% by weight of a thermoplastic resin. The thermoplastic resin may be a polyester-based resin. The adhesive is heated to a temperature of 60.degree. C.-80.degree. C. and then applied to a peripheral edge of a windshield. The windshield is sucked by a suction cup and pressed against a window frame of a vehicle body. Thereafter, the adhesive is cooled by blowing air having a temperature on the order of 20.degree. C. thereat. The adhesive is forcibly cooled down to 50.degree. C. or lower in a short time, thereby exhibiting temporary retention property.

Abstract: A metal film forming method by which a metal film having a desired pattern can be formed with good reproducibility and satisfactory precision. In a metal film forming method for forming a metal film into the desired pattern on a surface of an object by the lift-off method, a resist layer is laminated on the surface of the object, the resist layer is exposed to light with the desired pattern and it is developed. Radio frequency sputtering is then performed against the resist layer so that the opening is deformed into a shape which is suited for the lift-off process. A metal film is then laminated on the surfaces of the resist layer and the metal film forming object. Then the resist layer is subjected to lift-off processing, whereby the metal film can be formed with good precision and satisfactory reproducibility. In this way, such a metal film forming method can be realized that a metal film having the desired pattern can be formed with good reproducibility and satisfactory precision.

Abstract: A method of manufacturing a semiconductor device includes the steps of: patterning a first passivation film on a semiconductor substrate; patterning a ball limiting metal film; patterning a second passivation film; performing a heat-treatment for hardening the second passivation film and annealing the ball limiting metal film; patterning a bump forming metal film; and wet-back processing the bump forming metal film. In this method, the heat-treatment may be performed in an atmosphere having an oxygen concentration of 50 ppm or less at a temperature of from 300.degree. to 400.degree. C. for 10 to 30 minutes. Additionally, at least one of the first and second passivation films may be a polyimide film, and the ball limiting metal film may has a three layer structure of a Ti layer, a Cu layer and an Au layer laminated from the bottom in this order.

Abstract: A microprocessor incorporating a PLL circuit using a clock pulse having a relatively low frequency as an input clock signal of a reference frequency to form an oscillating pulse of a relatively high frequency by multiplying the input clock signal. In the microprocessor, the operation of the PLL circuit is stopped in the low-speed mode to supply the clock pulse of the relatively low frequency to the microprocessor as a system clock signal, and, in the high-speed mode, the PLL circuit is activated upon reception of an event requiring high-speed processing. Until the operation of the PLL circuit is stabilized and the request for high-speed processing comes, the above-mentioned clock pulse having the relatively low frequency is kept supplied continuously to the microprocessor as the system clock signal. This novel setup permits the high-speed switching of the microprocessor from the operating mode to the high-speed operating mode.

Abstract: An inspection apparatus is disclosed which is adapted to accurately detect an irradiated position on a target board which is irradiated with a beam, to thereby inspect deformation of a pipe such as a sewer or the like. A laser beam emitting unit (3) is arranged on one end side of a sewer (1). The laser beam emitting unit (3) is so adjusted that a laser beam (15) is impinged on a target board (11) of a target vehicle (9) traveling from the other end side of the pipe toward the laser beam emitting unit (3). The target board (11) is provided thereon with a plurality of phototransistors (13), whereby the irradiated position is detected depending on electric signals generated by the phototransistors.

Abstract: A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.