Abstract: The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying out an electroless gold plating. The present invention provides an electroless gold plating solution comprising a gold salt, a phenyl compound based reducing agent and a water-soluble amine and a method for plating using the gold plating solution.

Abstract: A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.

Abstract: The prior art cannot sufficiently solve the problem wherein food dough penetrates seal members arranged between a rotating or swinging member provided with a stirring stick or a stirring feather and an external cylinder or an external nozzle.

Abstract: A semiconductor device includes a semiconductor substrate which has a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface. The semiconductor device also includes a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements. The second main surface has a central area and a peripheral area surrounding the central area, and a first steplike section formed in the peripheral area.

Abstract: A semiconductor device includes a first surface faced to a mounting board when the semiconductor device is placed over the mounting board and a second surface opposed to the first surface. The semiconductor device also includes a position reference portion which is provided in an area including sides of the second surface and which has an optical reflection factor different from that of the mounting board.

Abstract: A semiconductor chip mounting tape on which external connecting terminals are formed in accordance with a layout pattern has post portions which are to be connected to a semiconductor chip and external connecting terminals. Post portions are formed on the first surface of an insulation tape used as a base of the semiconductor chip mounting tape. External connecting terminals are formed on the second surface of the insulation tape. The post portions and the external connecting terminals are integrally formed by same solder balls via through holes formed in the insulation tape.

Abstract: A cylindrical surface (3) is roughed to be prepared for a spray film (11) to be formed thereon, by cutting therein rough undulations (21) in a threaded form, using a cut chip (20) leaving a groove part (21a) of a respective undulation (21) in a preset direction or cut form, for breaking or partially tearing off a ridge part (21b) of the rough undulation (21) to have a remainder of the ridge part (21b) formed with finer undulations (22).

Abstract: The present invention is intended to achieve an X-ray irradiation region of arbitrary size without enlarging the area of a collimator section. An X-ray analyzer comprises an X-ray generating section for generating primary X-rays, an X-ray detection section for detecting secondary X-rays from a sample, and a collimator section for restricting primary X-rays irradiated to the sample, the collimator section being provided with two X-ray shields having at least one L-shaped edge, the two X-ray shields being aligned so as to form a rectangular or square opening. Mechanisms are provided for moving the two X-ray shields so that the shape and size of the X-ray irradiation region can be changed.

Abstract: In order to acquire typical X-ray spectra by dividing automatically dividing contained matter and regions where the density thereof differs into groups in X-ray mapping analysis, measurement starts with the spectra database empty, a designated location within the sample is irradiated with a primary beam by the primary beam control means, the sample is irradiated with the primary beam for a fixed period of time in order to acquire a measurement spectrum, the X-ray spectrum obtained through measurement and X-ray spectra in the spectra database are compared by the X-ray comparison means, the X-ray spectrum obtained through measurement is added to the database when no matching X-ray spectra exists in the database, and measurement is repeated at a designated measurement point.

Abstract: A semiconductor device includes a semiconductor substrate which has a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface. The semiconductor device also includes a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements. The second main surface has a central area and a peripheral area surrounding the central area, and a first steplike section formed in the peripheral area.

Abstract: A clock signal generating circuit supplies a clock signal output in a short time of 2-3 clock periods after operation starts. As a result, the clock signal generating circuit can be stopped simultaneously when the operation of an internal circuit is put in a stop state, the clock signal generating circuit can output a clock signal when the internal circuit returns to the operating state, and power consumption when the internal circuit is in the stop state is reduced.

Abstract: A semiconductor device includes a semiconductor substrate which has a first main surface having circuit elements formed thereon, a second main surface substantially opposite to the first main surface, and a plurality of side faces provided between the first main surface and the second main surface. The semiconductor device also includes a plurality of external terminals formed over the first main surface and respectively electrically connected to the circuit elements. The second main surface has a central area and a peripheral area surrounding the central area, and a first steplike section formed in the peripheral area.

Abstract: A multi-chip package type semiconductor device includes a first insulating substrate having a hollow on its main surface, a second insulating substrate having on its main surface an opening, which is larger than the hollow, and being on the first substrate wherein the opening encompasses the hollow, a first semiconductor chip being formed in the hollow, a second first semiconductor chip whose size is approximately the same as that of the first semiconductor chip, being supported by the first insulating substrate in an area, which encompasses the hollow.

Abstract: A signal from a crystal resonator or an external clock signal are input from terminals xta1 or exta1, and the signal from the crystal resonator or external clock signal are selected by mode terminal mod8 and input to an oscillator OSC. An input clock signal ckl1 is frequency-divided to desired values by a divider DIV1. A divided clock signal clk2 is input as the reference clock of a phase-locked loop PLL1 or delay-locked loop DLL1, and a clock signal output by a circuit selected by a selector SEL3 passes via a divider DIV2 to be distributed to an LSI. The phase-locked loop PLL1 has a clock settling time of at least 40 clock periods, whereas the clock settling time of the delay-locked loop DLL1 is 2-3 periods.

Abstract: An agitator comprises a main body for supporting rotatably a rotary shaft, a chuck for connecting detachably an agitating rod with the rotary shaft, starting means for starting the rotation of the rotary shaft when the chuck is covered with a chuck cover, and locking means for locking rotary shaft when the chuck is not covered with the chuck cover. The chuck cover is removed from the main body when an external force larger than a predetermined value is applied to the chuck cover. The starting means comprises a permanent magnet provided on the outer periphery of a disk hub and a magnetic sensor provided on the main body so that an output is generated to start the driving source only when the chuck cover is moved to cover the chuck. The locking means comprises a hole formed in the rotary shaft, an eccentric cam to be rotated by the chuck cover, and a lock pin which is moved by the eccentric cam so as to be inserted into the hole of the rotary shaft when the chuck is not covered with the chuck cover.

Abstract: A cylindrical surface (3) is roughed to be prepared for a spray film (11) to be formed thereon, by cutting therein rough undulations (21) in a threaded form, using a cut chip (20) leaving a groove part (21a) of a respective undulation (21) in a preset direction or cut form, for breaking or partially tearing off a ridge part (21b) of the rough undulation (21) to have a remainder of the ridge part (21b) formed with finer undulations (22).

Abstract: In order to acquire typical X-ray spectra by dividing automatically dividing contained matter and regions where the density thereof differs into groups in X-ray mapping analysis, measurement starts with the spectra database empty, a designated location within the sample is irradiated with a primary beam by the primary beam control means, the sample is irradiated with the primary beam for a fixed period of time in order to acquire a measurement spectrum, the X-ray spectrum obtained through measurement and X-ray spectra in the spectra database are compared by the X-ray comparison means, the X-ray spectrum obtained through measurement is added to the database when no matching X-ray spectra exists in the database, and measurement is repeated at a designated measurement point.

Abstract: A timing-control circuit device, which uses a synchronous mirror delay circuit, for keeping the synchronization between clock signals in phase even at a load change. A reference clock signal (clkin 11) is entered to a timing-control circuit (SMDF 14) and used to generate an internal clock (dclk 12), then generates an external clock (clkout 13) through a buffer (BUF 15). The external clock signal is fed back to the timing-control circuit (SMDF 14) and used to generate an internal clock signal so as to synchronize the external clock signal in phase with the reference clock signal. The timing-control circuit is provided with a circuit (FDA 21, MCC 22) for detecting a phase difference between the internal clock signal and the external clock signal, as well as a delay circuit (DCL 24) for controlling a delay time, so that the delay circuit (DCL 24) can change the delay time according to the detected phase difference.

Abstract: An agitator comprises a main body for supporting rotatably a rotary shaft, a chuck for connecting detachably an agitating rod with the rotary shaft, starting means for starting the rotation of the rotary shaft when the chuck is covered with a chuck cover, and locking means for locking rotary shaft when the chuck is not covered with the chuck cover. The chuck cover is removed from the main body when an external force larger than a predetermined value is applied to the chuck cover. The starting means comprises a permanent magnet provided on the outer periphery of a disk hub and a magnetic sensor provided on the main body so that an output is generated to start the driving source only when the chuck cover is moved to cover the chuck. The locking means comprises a hole formed in the rotary shaft, an eccentric cam to be rotated by the chuck cover, and a lock pin which is moved by the eccentric cam so as to be inserted into the hole of the rotary shaft when the chuck is not covered with the chuck cover.

Abstract: An electronic circuit device of a three-dimensional mounting mode capable of being produced by a simple method while suppressing the production costs and of a structure resistant to external stress, including first-mounting-board wiring portions formed on a first mounting board, first mounting parts mounted on the first mounting board, bumps formed on the first mounting board connecting to the first-mounting-board wiring portion, a protective layer formed covering the first mounting parts so that at least the portions near the tops of the bumps are exposed, a second mounting board stacked as an upper layer of the protective layer, second-mounting-board wiring portions formed on the second mounting board in order to connect to the bumps, and second mounting parts mounted connecting to the second-mounting-board wiring portions on the second mounting board at the surface of the second mounting board opposite to the protective layer side, and a method of production of the same.