Abstract: To provide an energy dispersion type radiation detecting system and a method of measuring a content of an object element capable of carrying out a measurement by determining an intensity of an incidence radiation to constitute an optimum minimum limit of detection by restraining an influence of a pile up, the energy dispersion type radiation detecting system includes an incidence system of irradiating the incidence radiation to a sample by a predetermined intensity, a detection system of detecting a radiation emitted from the sample by irradiating the incidence radiation for specifying a content of an object element of the sample based on a spectrum of the detected radiation, and the energy dispersion type radiation detecting system includes a control portion capable of irradiating the incidence radiation by an optimum intensity by determining the optimum intensity of the incidence radiation minimizing a minimum limit of detection of the object element based on the spectrum of the detected radiation.

Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Abstract: A thermally sprayed coating is deposited onto a cylindrical internal surface of a base member after a rough surface has been formed on the cylindrical internal surface. The tapered surface is configured such that the internal diameter of the axial end portion is larger than the internal diameter of the remaining portions of the cylinder bore internal surface. After the tapered surface is formed, the thermally sprayed coating is honed. This method prevents exfoliation of a thermally sprayed coating at an end portion of a cylindrical internal surface in a situation where honing or another mechanical finishing process is applied to the thermally sprayed coating after the coating is formed on the cylindrical internal surface.

Abstract: The present invention provides a sealant for automobile doors, which is used to bond an inside screen to the inner panel of an automobile door and which is excellent in hot creep resistance and shear adhesive strength at high temperatures, particularly in consideration of the application thereof in summer. The sealant for automobile doors of the present invention comprises partially crosslinked NBR and/or SBR, a plasticizer and a filler.

Abstract: An extruding apparatus for food materials having a filling material and a wrapping material extrudes and envelops the filling material with the wrapping material. An internal cylinder supplies the filling material while a concentrically arranged external cylinder creates an annular space for extruding and enveloping the material supplied. The wrapping material is fluidized by a fluidizer accommodated in the annular space. A driving mechanism is sealed from the fluidizer and drives the fluidizer in the annular space. The driving mechanism is driven by a transmission mechanism. A storage space section near the seals prevents wrapping material from penetrating the driving mechanism.

Abstract: An object is to reduce the influence of chlorine in plastics when the metal concentrations in the plastics are analyzed. In an X-ray analyzer including an X-ray generating part for irradiating primary X-rays onto a sample and an X-ray detector for detecting an X-ray from the sample, primary X-rays is irradiated onto a plastic sample from the X-ray generating part, the X-ray intensity of chlorine is obtained from the plastic sample by the X-ray detector, and the scattered X-ray intensity where the primary X-ray has been scattered by the plastic sample is obtained by the X-ray detector. A chlorine X-ray intensity ratio calculating means for dividing the X-ray intensity of chlorine by the scattered X-ray intensity to calculate a chlorine X-ray intensity ratio is provided. The calculated chlorine X-ray intensity ratio and the chlorine concentration in the plastic sample have positive correlation each other.

Abstract: A lapping apparatus lapping a work having a pre-machined surface comprises a lapping film which includes a thin substrate having a surface provided with abrasive grains, a shoe disposed at a back surface side of the lapping film, a shoe driving unit which drives the shoe toward the work in order to press the abrasive-grained surface of the lapping film to the pre-machined surface of the work, a rotational driving unit which drives the work rotationally, a detecting unit which detects the position of the rotating work in the rotating direction, and a controlling unit which controls the pressing force of the shoe driving unit so as to drive the shoe correspondingly to the position of the work in the rotating direction during machining.

Abstract: An information processing apparatus is connected to a sound output device for outputting sound based on digital audio data. The information processing apparatus includes the following elements. A first receiver receives setting data for setting a volume of sound output from the sound output device, the volume being set by a function implemented by a first computer executing a first program. A second receiver receives a setting signal for setting a volume of sound output from the sound output device, the volume being supplied from a setting unit provided for the sound output device. A calculator calculates first volume control data that controls the volume of sound output from the sound output device based on the setting data and the setting signal, the volume being controlled by a second computer executing a second program. A first output unit outputs the first volume control data to the sound output device.

Abstract: A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.

Abstract: The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 ?m. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.

Abstract: Based on drug sensitivity data and extensive gene expression data, a model was constructed by multivariate analysis with the partial least squares method type 1. Further, the model was optimized using modeling power and genetic algorithm. Thereby, the degree of contribution of the respective genes to drug sensitivity was determined to select genes with a high degree of contribution. In addition, the levels of gene expression in specimens were analyzed, and then the drug sensitivity was predicted based on the model. The predicted values agreed well with those drug sensitivity values determined experimentally. The drug sensitivity-predicting method provided by the present invention enables assessment of the effectiveness of a drug prior to administration using small quantities of specimens associated with diseases such as cancer. Since this enables the selection of the most suitable drug for each patient, the present invention is very useful in improving a patient's quality of life (QOL).

Abstract: A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 ?m or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

Abstract: A semiconductor integrated circuit device employing two clock signal generating circuits which output clock signals for distribution to an internal circuit of the device, the first and second clock signal generating circuits having different clock-settling times and the selection thereof is effected from outside of the device. A first one of the clock signal generating circuits uses, for example, a phase-locked loop circuit which has a large clock-settling time, and the second clock signal generating circuit is implemented, for example, using a delay-locked loop circuit whose clock-settling time is small, for example, 2-3 periods. Due to the selective actuation of the second clock signal generating circuit, which has a small clock-settling time, the generating of clock signals for the internal circuits can also be halted when the internal circuits of the device are halted thereby to further lower power consumption without compromising clock oscillator responsiveness.

Abstract: An object is to reduce the influence of chlorine in plastics when the metal concentrations in the plastics are analyzed. In an X-ray analyzer including an X-ray generating part for irradiating primary X-rays onto a sample and an X-ray detector for detecting an X-ray from the sample, primary X-rays is irradiated onto a plastic sample from the X-ray generating part, the X-ray intensity of chlorine is obtained from the plastic sample by the X-ray detector, and the scattered X-ray intensity where the primary X-ray has been scattered by the plastic sample is obtained by the X-ray detector. A chlorine X-ray intensity ratio calculating means for dividing the X-ray intensity of chlorine by the scattered X-ray intensity to calculate a chlorine X-ray intensity ratio is provided. The calculated chlorine X-ray intensity ratio and the chlorine concentration in the plastic sample have positive correlation each other.

Abstract: The present invention is aimed to provide an electroless gold plating solution which requires less amount of a reducing agent, retains a sufficient deposition rate for a practical use, and has an excellent stability as a plating solution; and a method for carrying out an electroless gold plating. The present invention provides an electroless gold plating solution comprising a gold salt, a phenyl compound based reducing agent and a water-soluble amine and a method for plating using the gold plating solution.

Abstract: An apparatus and method for surface finishing a workpiece is disclosed as including a workpiece supporting mechanism supporting a workpiece having a target shaped periphery with a given width to be surface finished and a tool holder holding a surface finish tool in abutting contact with the target shaped periphery of the workpiece. A pressure applying mechanism is operative to apply a pressure force to the surface finish tool through the tool holder to cause the surface finish tool to be held in pressured contact with the target shaped periphery, with the pressure force exhibiting a given distribution pattern depending upon an axial direction of the workpiece. A drive mechanism rotates the workpiece to allow the surface finish tool to surface finish the target shaped periphery into a given geometrical profile, variably contoured along an axis of the workpiece depending on the given pressure distribution pattern.

Abstract: A lapping apparatus lapping a work having a pre-machined surface comprises a lapping film which includes a thin substrate having a surface provided with abrasive grains, a shoe disposed at a back surface side of the lapping film, a shoe driving unit which drives the shoe toward the work in order to press the abrasive-grained surface of the lapping film to the pre-machined surface of the work, a rotational driving unit which drives the work rotationally, a detecting unit which detects the position of the rotating work in the rotating direction, and a controlling unit which controls the pressing force of the shoe driving unit so as to drive the shoe correspondingly to the position of the work in the rotating direction during machining.

Abstract: A film feeder (FF1) feeds a film (1), a first drive (20) rotates a work (W), a second drive (30) moves the work (W) relative to the film(1), a shoe set handler (40) handles the shoe set (2) to press the film (1) against the work (W), and a deterioration delayer (C) is configured to delay an abrasivity deterioration of the film (1).

Abstract: A universal joint comprises a cavity formed in a joint case, a planar plate fitted in the cavity, a spherical member arranged in the cavity so that it is held by a spherical surface receiving seat and a portion of the planar plate, and pressure screw for pressing the planar plate toward the spherical surface receiving seat.

Abstract: A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.