Abstract: A wall plate is provided having a built-in modem on the backside of the wall plate that performs O/E, E/O and protocol conversions. The backside of the wall plate has an optical port for connecting an end of an optical fiber cable to the wall plate. A printed circuit board (PCB) disposed on the backside of the wall plate has electrical circuitry mounted thereon that performs protocol conversion and communicates with an optical transceiver module also mounted on the PCB. The optical transceiver module receives optical signals transmitted to the customer premises and transmits optical signals from the customer premises and performs O/E and E/O conversion. A front face of the wall plate has at least one socket therein for connection with an electrical connector disposed on an end of an electrical cable. The wall plate does not require a separate power supply.

Abstract: A stamped metal optic includes at least a bench for holding at least one optoelectronic component and a reflector for folding an optical pathway. The stamped metal optic is formed of a piece of metal that is shaped using known metal stamping techniques. The stamped metal optic preferably has at least one fiducial mark used to ensure that the optoelectronic device is precisely aligned with the reflector.

Abstract: A compact bidirectional optical transceiver module is provided that has a bidirectional optical subassembly (BOSA) that includes a stamped metal optic that folds the optical pathway, alignment features that enable the optoelectronic components of the electrical subassembly (ESA) to be precisely aligned with the BOSA in all dimensions, and features that reduce the capacitance of the driver circuitry to improve signal integrity and widen the eye opening.

Abstract: A socketless land grid array (LGA) is provided that uses an adhesive material rather than a socket to secure the optical communications module to the LGA and to provide the clamping force that is needed to maintain contact between the module and the LGA and to maintain a flat profile for the module and the LGA. Eliminating the LGA socket eliminates the need to drill holes in the host circuit board and the need for additional hardware (e.g., backing plates, screws, etc.) to secure a socket to the host circuit board. This allows the area of the host circuit board underneath the array of electrical contacts of the LGA to be used for routing electrically-conductive pathways of the host circuit board (e.g., vias and traces) and reduces the amount of time and effort that are needed to secure modules to the respective LGAs.

Abstract: An alignment feature formed in a lens block during manufacturing has a precise spatial relationship to an optical surface of the lens block such that precise alignment of the alignment feature within the lens block ensures precise alignment of the optical surface within the lens block. Precise alignment of the alignment feature within the lens block is readily assessable whereas precise alignment of the optical surface within the lens block is not. A determination is made as to whether the optical surface is aligned within the lens block by determining whether the alignment feature is aligned within the lens block, and if not, the extent of any misalignment. The extent of misalignment may then be used to adjust the manufacturing process to eliminate the alignment error.

Abstract: A wall plate is provided having a built-in modem on the backside of the wall plate that performs O/E, E/O and protocol conversions. The backside of the wall plate has an optical port for connecting an end of an optical fiber cable to the wall plate. A printed circuit board (PCB) disposed on the backside of the wall plate has electrical circuitry mounted thereon that performs protocol conversion and communicates with an optical transceiver module also mounted on the PCB. The optical transceiver module receives optical signals transmitted to the customer premises and transmits optical signals from the customer premises and performs O/E and E/O conversion. A front face of the wall plate has at least one socket therein for connection with an electrical connector disposed on an end of an electrical cable. The wall plate does not require a separate power supply.

Abstract: A heat dissipation system for an optical communications module is provided that includes a heat dissipation clamp having a plurality of force-application devices for applying respective, precisely-controlled forces to respective optical communications modules of an array to maintain electrical interconnectivity between the modules of the array and respective electrical sockets. The force-application devices are independent of one another such that the respective electrical interconnectivity forces applied to the respective modules are independent of one another. This independence ensures that the proper amount of electrical interconnectivity force is applied to each module of the array, which ensures that the planarity of the system PCB is maintained without the need for a backing, or bolstering, plate. Inner walls of the heat dissipation clamp are in contact with the modules so that heat generated by the modules is transferred into the heat dissipation clamp where some or all of the heat is dissipated.

Abstract: A heat dissipation system for an optical communications module is provided that includes a heat dissipation clamp having a plurality of force-application devices for applying respective, precisely-controlled forces to respective optical communications modules of an array to maintain electrical interconnectivity between the modules of the array and respective electrical sockets. The force-application devices are independent of one another such that the respective electrical interconnectivity forces applied to the respective modules are independent of one another. This independence ensures that the proper amount of electrical interconnectivity force is applied to each module of the array, which ensures that the planarity of the system PCB is maintained without the need for a backing, or bolstering, plate. Inner walls of the heat dissipation clamp are in contact with the modules so that heat generated by the modules is transferred into the heat dissipation clamp where some or all of the heat is dissipated.

Abstract: A compact bidirectional optical transceiver module is provided that has a bidirectional optical subassembly (BOSA) that includes a stamped metal optic that folds the optical pathway, alignment features that enable the optoelectronic components of the electrical subassembly (ESA) to be precisely aligned with the BOSA in all dimensions, and features that reduce the capacitance of the driver circuitry to improve signal integrity and widen the eye opening.

Abstract: An alignment feature formed in a lens block during manufacturing has a precise spatial relationship to an optical surface of the lens block such that precise alignment of the alignment feature within the lens block ensures precise alignment of the optical surface within the lens block. Precise alignment of the alignment feature within the lens block is readily assessable whereas precise alignment of the optical surface within the lens block is not. A determination is made as to whether the optical surface is aligned within the lens block by determining whether the alignment feature is aligned within the lens block, and if not, the extent of any misalignment. The extent of misalignment may then be used to adjust the manufacturing process to eliminate the alignment error.

Abstract: An optical communications module is provided that has improved heat dissipation, signal integrity and/or EMI shielding solutions. The heat dissipation solution thermally decouples the light source driver circuitry from the light source such that heat generated by the light source driver circuitry does not increase the temperature of the light source to the point that its performance is degraded. The heat dissipation solution may also include convective heat transfer features for further improving heat dissipation. The EMI solution includes features that increase the number of contact points between the outer surface of the module housing and EMI fingers of a cage that receives the module. The signal integrity solution includes features that reduce inductive coupling to improve impedance matching between electrical interconnections, thereby improving signal integrity.

Abstract: An optical communications module is provided that has improved heat dissipation, signal integrity and/or EMI shielding solutions. The heat dissipation solution thermally decouples the light source driver circuitry from the light source such that heat generated by the light source driver circuitry does not increase the temperature of the light source to the point that its performance is degraded. The heat dissipation solution may also include convective heat transfer features for further improving heat dissipation. The EMI solution includes features that increase the number of contact points between the outer surface of the module housing and EMI fingers of a cage that receives the module. The signal integrity solution includes features that reduce inductive coupling to improve impedance matching between electrical interconnections, thereby improving signal integrity.

Abstract: A modified TO-can assembly is provided that has greater versatility with respect to spatial constraints than known TO-can assemblies and that is suitable for use in a wider range of applications than known TO-can assemblies. The modified TO-can assembly has a receptacle that has been modified to receive an optical fiber through its side instead of through its end. Within the TO-can assembly, the optical path is folded in order to couple the light between the optoelectronic component of the TOSA or ROSA and the end of the optical fiber. The combination of these features provides the modified TO-can assembly with a compact profile that makes it more versatile with respect to spatial constraints and therefore suitable for use in a wider range of applications.

Abstract: An optical communications module includes first and second opto-electronic devices and an optics device, in which a common beam path axis is oriented in a rotated direction about the axis at which a fiber is coupleable to the optics device barrel. The optics device includes a TIR lens aligned with the barrel axis. The TIR lens reflects optical signals between the barrel axis and a common beam path axis oriented in a direction having X-axis and Y-axis components offset by non-zero amounts from the barrel axis. The common beam path axis intersects first and second reflective interfaces of the device. The first opto-electronic device is aligned along a first beam path axis that intersects the first reflective interface and the common beam path axis. The second opto-electronic device is aligned along a second beam path axis that intersects the second reflective interface and the common beam path.

Abstract: A socketless land grid array (LGA) is provided that uses an adhesive material rather than a socket to secure the optical communications module to the LGA and to provide the clamping force that is needed to maintain contact between the module and the LGA and to maintain a flat profile for the module and the LGA. Eliminating the LGA socket eliminates the need to drill holes in the host circuit board and the need for additional hardware (e.g., backing plates, screws, etc.) to secure a socket to the host circuit board. This allows the area of the host circuit board underneath the array of electrical contacts of the LGA to be used for routing electrically-conductive pathways of the host circuit board (e.g., vias and traces) and reduces the amount of time and effort that are needed to secure modules to the respective LGAs.

Abstract: An optical communications module includes first and second opto-electronic devices and an optics device, in which a common beam path axis is oriented in a rotated direction about the axis at which a fiber is coupleable to the optics device barrel. The optics device includes a TIR lens aligned with the barrel axis. The TIR lens reflects optical signals between the barrel axis and a common beam path axis oriented in a direction having X-axis and Y-axis components offset by non-zero amounts from the barrel axis. The common beam path axis intersects first and second reflective interfaces of the device. The first opto-electronic device is aligned along a first beam path axis that intersects the first reflective interface and the common beam path axis. The second opto-electronic device is aligned along a second beam path axis that intersects the second reflective interface and the common beam path.

Abstract: A strain relief device and method are provided for use with an optical fiber cable of an optical communications system. The strain relief device comprises a plurality of metal wires, or rods, grouped into a bundle of parallel metal wires and a clamping mechanism for clamping first and second ends of the metal wires to an optical fiber cable. The clamped bundle of metal wires forms a spring having a spring constant that provides it with a desired stiffness and a desired flexibility.

Abstract: An MF connector module is provided that positions the fiber end portions relative to respective V-grooves of the module in such a way that the fiber end portions can be bent, and thereby loaded, by a predetermined amount when the fiber end portions are being installed in the respective V-grooves. The bending of the fiber end portions ensures that the optical axes of at least the tips of the fiber end portions are parallel to the optical axes of the respective V-grooves. The loading of the fiber end portions caused by the bending ensures that significant lengths of the fiber end portions are tangent to and in contact with the inner walls of the respective V-grooves. This tangential contact between the fiber end portions and the inner walls of the V-grooves causes the fiber end faces to be precisely aligned with the respective optical axes of the MF connector module.

Abstract: An MF connector module is provided that positions the fiber end portions relative to respective V-grooves of the module in such a way that the fiber end portions can be bent, and thereby loaded, by a predetermined amount when the fiber end portions are being installed in the respective V-grooves. The bending of the fiber end portions ensures that the optical axes of at least the tips of the fiber end portions are parallel to the optical axes of the respective V-grooves. The loading of the fiber end portions caused by the bending ensures that significant lengths of the fiber end portions are tangent to and in contact with the inner walls of the respective V-grooves. This tangential contact between the fiber end portions and the inner walls of the V-grooves causes the fiber end faces to be precisely aligned with the respective optical axes of the MF connector module.

Abstract: Apparatuses, systems and methods are provided that enable a first array of multi-optical fiber connector modules disposed on a first structure to be blindly mated with a second array of multi-optical fiber connector modules disposed on a second structure. The arrays of modules are mounted on respective holders. One of the holders is mounted on the first structure and the other holder is mounted on the second structure. Engagement of the first and second structures with one another results in mating features of the holders being brought within a predetermined allowable misalignment tolerance of one another to ensure that the holders fully mate with one another. Mating of the holders with one another brings mating features of the connector modules of the arrays into a predetermined allowable misalignment tolerance of one another to ensure that full mating of the respective connector modules of the arrays occurs.