Abstract: An EMI collar is provided that is configured to be secured about a housing of a pluggable optical transceiver module. The configuration of the EMI collar and the method by which the collar is attached to the housing of the transceiver module ensures that the collar will not be damaged when the transceiver module housing is inserted into a cage. Ensuring that the collar will not be damaged during insertion ensures that electrically conductive contact points on the collar will not be eliminated by insertion of the housing into a cage. In addition, dimples, or indentations, formed on the spring fingers of the EMI collar result in additional electrically conductive contact points on the fingers that result in a reduction in the size of the maximum EMI aperture dimension of the collar. Reducing the maximum EMI aperture dimension of the collar greatly improves the ability of the collar to attenuate EMI signals, even EMI signals having high frequencies.

Abstract: An optical transceiver module is provided that has a pivoting bail latching mechanism that is extremely stiff and locks via a cam locking configuration rather than relying on spring-loading forces to bias the latching mechanism to and maintain the latching mechanism in a desired position. The stiffness of the pivoting bail latching mechanism provided by the cam locking configuration better ensures that forces exerted the transceiver module will not cause the transceiver module to come out of the cage while latched.

Abstract: An EMI system is provided for use with an optical transceiver module. The EMI system comprises an EMI collar that is secured about the housing of the transceiver module. The EMI collar is configured such that when the collar is secured to the module housing and the module is contained within a cage, features on the EMI collar provide electrically conductive pathways between the module housing and the cage.

Abstract: An EMI system is provided for use with an optical transceiver module. The EMI system comprises an EMI collar that is secured about the housing of the transceiver module. The EMI collar is configured such that when the collar is secured to the module housing and the module is contained within a cage, features on the EMI collar provide electrically conductive pathways between the module housing and the cage.

Abstract: An EMI system is provided for use with an optical transceiver module. The EMI system comprises electrically conductive spring fingers that are movably disposed in a slot formed in the transceiver module housing such that a part of each spring finger is in contact with a part of the metallic transceiver module housing and such that a part of each spring finger is in contact with a part of one of the metallic ports. Because the spring fingers are movable within the slot formed in the module housing, the spring fingers maintain contact with the housing and with the ports during movement of the ports, i.e., as the ports float. Because the ports are allowed to float without causing the contact between the ports and the spring fingers or between the spring fingers and the housing to be lost, the ports automatically align with the connectors when the connectors are connected to the ports. Thus, the need for performing an active alignment process to align the ports with the connectors is avoided.

Abstract: An optical transceiver module is provided that has an eccentric latching bail mechanism that includes a latch having a boss pocket formed therein that mates with a boss formed on the transceiver module housing when the latching mechanism is in the locked position. The mating of the boss and boss pocket in the locked position of the latching mechanism provide the latching mechanism with a high degree of stiffness that ensures that forces that are exerted on the latch lock pin by elements other than the latching bail mechanism are transferred to the transceiver module housing rather than through the bail. This, in turn, obviates problems associated with existing spring loading latching mechanisms that are less stiff and that allow forces exerted on the latch lock pin to be transferred through the bail.

Abstract: Disclosed are various embodiments of systems, devices and methods for forming an hermetic seal between a lid and a submount for an electronics module or package. At least one thieving pad is connected to a metallized ring formed about or near the circumference of an upper surface of the submount. A corresponding metallized ring is disposed about the lower perimeter of the lid. Solder paste is placed between the two metallized rings and melted, preferably under a reducing atmosphere. Excess molten solder controllably flows towards the at least one thieving pattern while the lid is being hermetically sealed and soldered, avoiding the formation of undesired wayward solder balls inside the package.

Abstract: Fiber optic connectors and methods of making the same are described. In one aspect, a fiber optic connector includes a support surface and at least one alignment pin. The support surface has at least one optical communication port. Each alignment pin has an elongated distal end and a flanged proximal end with a bottom surface that is fixedly attached to the support surface.

Abstract: Fiber optic connectors and methods of making the same are described. In one aspect, a fiber optic connector includes a support surface and at least one alignment pin. The support surface has at least one optical communication port. Each alignment pin has an elongated distal end and a flanged proximal end with a bottom surface that is fixedly attached to the support surface.

Abstract: Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.