Abstract: Systems and methods are provided that enable a first bank, or array, of multi-optical fiber connector modules disposed in a plug that is mounted on a first structure to be simultaneously blind mated with a second bank of multi-optical fiber connector modules disposed on a receptacle that is mounted on a second structure. As the first and second structures are brought into engagement with one another, passive coarse alignment features on the plug and on the receptacle coarsely align the respective connector modules with one another. Then, as the respective connector modules begin to come into contact with one another, passive fine alignment features on the respective connector modules engage one another to finely align the respective connector modules such that their optical pathways are brought into precise optical alignment with one another.

Abstract: An optical cross-connect assembly and method are provided that are suitable for use in both small-scale and large-scale applications. The optical cross-connect assembly comprises first and second stacks of multi-optical fiber connector modules that are configured to orthogonally mechanically couple with one another such that the optical ports of each of the connector modules of the first stack are optically aligned with respective optical ports of all of the connector modules of the second stack, and such that the optical ports of each of the connector modules of the second stack are optically aligned with respective optical ports of all of the connector modules of the first stack.

Abstract: A stamped metal optic is provided that is a unitary, or integrally formed, part that includes at least a bench for holding at least one optoelectronic component and a reflector for folding an optical pathway. The stamped metal optic is formed of a piece of metal that is shaped using known metal stamping techniques. The stamped metal optic preferably has at least one fiducial mark formed therein that is used for placement of the optoelectronic device on the bench to ensure that the optoelectronic device is precisely aligned with the reflector. Because metal objects can be formed relatively inexpensively with high precision using known stamping techniques, the stamped metal optics can be manufactured with high precision at relatively low cost.

Abstract: An optical connector includes a connector housing and an optics device. A plurality of optical fibers are retained in a fiber port of the connector. The fiber port has two fiber guide arrays oriented at an angle with respect to each other. Portions of the fibers between the two fiber guide arrays flex as the optics device and connector housing are assembled together. The resilient force of the flexed fibers maintains the fiber ends seated within the fiber guide arrays to facilitate further handling, such as applying an adhesive to further secure the fiber ends in the connector.

Abstract: An optical cross-connect assembly and method are provided that are suitable for use in both small-scale and large-scale applications. The optical cross-connect assembly comprises first and second stacks of multi-optical fiber connector modules that are configured to orthogonally mechanically couple with one another such that the optical ports of each of the connector modules of the first stack are optically aligned with respective optical ports of all of the connector modules of the second stack, and such that the optical ports of each of the connector modules of the second stack are optically aligned with respective optical ports of all of the connector modules of the first stack.

Abstract: A cleave holder is provided that allows the ends of optical fibers to be precisely stripped and cleaved and then secured at precise locations in a multi-optical fiber connector module. The cleave holder is secured to length-wise portions of optical fibers that extend through the cleave holder. The cleave holder has reference holes formed in its lower surface that allow it to be mounted on a fixture having pins on it that mate with the reference holes. Once the ends of the fibers have been stripped and cleaved, the cleaved ends are secured to precise locations within a connector module. The cleave holder and the connector module form an assembly that can be used together, with the cleave holder acting as a mounting structure for the assembly and as a strain relief mechanism.

Abstract: A multi-optical fiber connector module is provided with an unfilled plastic cover that is used to secure the ends of a plurality of optical fibers at precise locations within the connector modules. The cover has deformable features that permanently deform when the cover is secured to a housing of the connector module. The permanent deformations are caused by forces that are exerted on the deformable features by respective unjacketed optical fibers when the cover is secured to the module housing. When the features deform, they partially wrap about the respective unjacketed optical fibers such that the respective fibers are pinned between the respective deformed features and the respective V-shaped grooves of the module housing. This contact between the deformed features, the respective unjacketed optical fibers and the respective V-shaped grooves maintains the respective unjacketed optical fibers in precise locations along respective optical pathways of the connector module.

Abstract: An optical connector includes a connector housing and an optics device. A plurality of optical fibers are retained in a fiber port of the connector. The fiber port has two fiber guide arrays oriented at an angle with respect to each other. Portions of the fibers between the two fiber guide arrays flex as the optics device and connector housing are assembled together. The resilient force of the flexed fibers maintains the fiber ends seated within the fiber guide arrays to facilitate further handling, such as applying an adhesive to further secure the fiber ends in the connector.

Abstract: In a parallel optical communication module, an array of opto-electronic devices secured with respect to a mount and an array of optical elements of an optical device that is also secured with respect to the mount are unconstrained against relative movement due to thermal expansion of the mount and optical device. The mount and optical device can be made of materials having similar coefficients of thermal expansion. As thermal expansion in the mount causes the opto-electronic devices to move, similar thermal expansion in the optical device causes the optical elements to move to a similar extent. This co-movement of the opto-electronic devices and optical elements to similar extents promotes continued maintenance of optical alignment between opto-electronic elements and corresponding optical elements.

Abstract: In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.

Abstract: Systems and methods are provided that enable a first bank, or array, of multi-optical fiber connector modules disposed in a plug that is mounted on a first structure to be simultaneously blind mated with a second bank of multi-optical fiber connector modules disposed on a receptacle that is mounted on a second structure. As the first and second structures are brought into engagement with one another, passive coarse alignment features on the plug and on the receptacle coarsely align the respective connector modules with one another. Then, as the respective connector modules begin to come into contact with one another, passive fine alignment features on the respective connector modules engage one another to finely align the respective connector modules such that their optical pathways are brought into precise optical alignment with one another.

Abstract: A Z-pluggable optical communications module (OCM) is provided that contains multiple parallel OCMs (POCMs) and that is configured to be removably plugged into an opening formed in a front panel of an optical communications system. When the Z-pluggable OCM is plugged in a forward Z-direction into the opening formed in the front panel, an actuator mechanism is actuated to impart motion to the Z-pluggable OCM in the downward Y-direction to cause the Z-pluggable OCM to be mounted on an upper surface of a motherboard PCB. In order to unplug the Z-pluggable OCM, the actuator mechanism is actuated to impart motion to the Z-pluggable OCM in the upward Y-direction to cause it to be dismounted from the motherboard PCB.

Abstract: An optical communications card is provided that has multiple parallel optical communications modules mounted on one or both sides of the card. A plurality of the optical communications cards can be edge-mounted and/or mid-plane mounted in an optical communications system such that the cards are electrically connected to a motherboard PCB. Because the spacing, or pitch, between the edge-mounted or mid-plane mounted cards can be very small, the cards can be mounted with very high density to provide the optical communications system with very high bandwidth.

Abstract: A connector assembly is provided that mates on one side with an optical transceiver module holder and that electrically connects on the opposite side with an external system circuit board. When the connector assembly is mated with an optical transceiver module holder, a base of a parallel optical transceiver module held in the holder mates with a socket of the connector assembly such that respective arrays of electrical contacts disposed on the base and in the socket come into contact with one another. At least one gearbox IC for performing data rate conversion is mounted on the assembly circuit board. A lower surface of the assembly circuit board has an array of electrical contacts on it that are in contact with an array of electrical contacts disposed on the surface of the external system circuit board on which the connector assembly is mounted.

Abstract: A parallel transceiver includes a constructed array of dice. The constructed array comprises an integer number of dies that each have an integer number of optoelectronic devices arranged on the die. Each die forming the constructed array is attached to a respective tab of a shim that is fixed to a first lead frame. Each tab includes a bridge region and a mounting region. Each die is attached to a respective mounting region of a corresponding tab. When necessary, a laser hammering technique is performed whereby laser generated energy is applied along an axis in the bridge region of the shim to adjust the position of the optoelectronic devices on the die attached to the tab in one or more directions relative to the axis.

Abstract: A parallel optical transceiver module is provided that has a balanced laser driver arrangement. The balanced laser driver arrangement of the invention includes at least two laser diode driver ICs, which preferably are located on opposite sides of a laser diode IC. Each laser diode driver IC drives a subset (e.g., half) of the total number of laser diodes of the laser diode IC. Because each laser diode driver IC drives a subset of the total number of laser diodes of the laser diode IC, the pitch (i.e., distance) between the high-speed signal pathways within the laser diode driver ICs can be increased. Increasing the pitch between the high-speed signal pathways provides several advantages, including, for example, reducing the potential for electrical cross-talk and inductive coupling between adjacent wire bonds that connect the output driver pads on the driver IC to the respective input pads on the laser diode IC.

Abstract: A leadframe of a parallel optical communications module has tapered protrusions disposed on an upper surface thereof that are positioned and shaped to mate with respective tapered openings formed in a lower surface of an optics module of the parallel optical communications module. The tapered protrusions are used as fiducial marks during a mounting process during which an array of optoelectronic devices is positioned, oriented and secured to the upper surface of the leadframe. Subsequently, during a passive alignment process, the lower surface of the optics module is placed in contact with the upper surface of the leadframe such that the tapered protrusions of the leadframe mate with respective tapered openings formed in the optics module, which causes the optoelectronic devices to come into precise optical alignment with the respective lenses.

Abstract: An optical transceiver module is provided that has an EMI absorbing assembly that comprises an EMI absorbing device that is electrically grounded rather than standing in free space in the transceiver module so that the assembly absorbs both the magnetic and electrical components of the EMI. In accordance with an embodiment, the EMI absorbing assembly includes a leadframe about which an EMI absorbing material is cast. The leadframe preferably is shaped in a way that prevents or lessens the occurrence of resonant EMI modes in the transceiver module housing.

Abstract: An optical beam splitter for use in an optoelectronic module and method are provided. The optical beam splitter is configured to split a main beam produced by a laser into at least first and second light portions that have different optical power levels. The first light portion, which is to be coupled into an end of a transmit optical fiber of an optical communications link, has an optical power level that is within eye safety limits and yet has sufficient optical power to avoid signal degradation problems. The optical power level of the first light portion is less than the optical power level of the second light portion. The optical beam splitter is capable of being implemented in a unidirectional or a bidirectional optical link.

Abstract: A modified TO-can assembly is provided that has greater versatility with respect to spatial constraints than known TO-can assemblies and that is suitable for use in a wider range of applications than known TO-can assemblies. The modified TO-can assembly has a receptacle that has been modified to receive an optical fiber through its side instead of through its end. Within the TO-can assembly, the optical path is folded in order to couple the light between the optoelectronic component of the TOSA or ROSA and the end of the optical fiber. The combination of these features provides the modified TO-can assembly with a compact profile that makes it more versatile with respect to spatial constraints and therefore suitable for use in a wider range of applications.