Abstract: An optical communications card is provided that has multiple parallel optical communications modules mounted on one or both sides of the card. A plurality of the optical communications cards can be edge-mounted and/or mid-plane mounted in an optical communications system such that the cards are electrically connected to a motherboard PCB. Because the spacing, or pitch, between the edge-mounted or mid-plane mounted cards can be very small, the cards can be mounted with very high density to provide the optical communications system with very high bandwidth.

Abstract: Apparatuses, systems and methods are provided that enable N female multi-optical fiber connector modules disposed on a first structure to be simultaneously blind mated with N male multi-optical fiber connector modules disposed on a second structure, where N is a positive integer that is equal to or greater than one. Enabling the male and female multi-optical fiber connector modules to blind mate with one another obviates the need to individually interconnect the modules with optical cables. Each module is mounted on either a male or female socket, which, in turn, is mounted on the first or second structure. The first structure may be, for example, a rack having at least one slot configured to receive a server box, in which case the second structure is the server box itself.

Abstract: An optical connector has guide pins with stepped profiles. The connector includes a connector body, two or more optical ports, and two or more cylindrical guide pins. Each guide pin has a first portion with a first length, a second portion with a second length, and a transitional portion between the first and second portions. The first portion has a first diameter. The second portion has a second diameter. The second diameter is less than the first diameter.

Abstract: An optical transceiver system is provided that comprises multiple parallel transceiver modules that are mounted on a card. The transceiver card is small in terms of spatial dimensions, has very good heat dissipation characteristics, and is capable of simultaneously transmitting and receiving data at a rate equal to or greater than approximately one Tb per second (1 Tb/s). A plurality of the transceiver systems may be interconnected to achieve a communications hub system having even higher bandwidths. In addition, the transceiver system may be configured such that each card has a routing controller mounted thereon for performing router functions.

Abstract: Apparatuses, systems and methods are provided that enable a first array of multi-optical fiber connector modules disposed on a first structure to be blindly mated with a second array of multi-optical fiber connector modules disposed on a second structure. The arrays of modules are mounted on respective holders. One of the holders is mounted on the first structure and the other holder is mounted on the second structure. Engagement of the first and second structures with one another results in mating features of the holders being brought within a predetermined allowable misalignment tolerance of one another to ensure that the holders fully mate with one another. Mating of the holders with one another brings mating features of the connector modules of the arrays into a predetermined allowable misalignment tolerance of one another to ensure that full mating of the respective connector modules of the arrays occurs.

Abstract: Apparatuses, systems and methods are provided that enable N female multi-optical fiber connector modules disposed on a first structure to be simultaneously blind mated with N male multi-optical fiber connector modules disposed on a second structure, where N is a positive integer that is equal to or greater than one. Enabling the male and female multi-optical fiber connector modules to blind mate with one another obviates the need to individually interconnect the modules with optical cables. Each module is mounted on either a male or female socket, which, in turn, is mounted on the first or second structure. The first structure may be, for example, a rack having at least one slot configured to receive a server box, in which case the second structure is the server box itself.

Abstract: A multi-optical fiber connector module is provided with an unfilled plastic cover that is used to secure the ends of a plurality of optical fibers at precise locations within the connector modules. The cover has deformable features that permanently deform when the cover is secured to a housing of the connector module. The permanent deformations are caused by forces that are exerted on the deformable features by respective unjacketed optical fibers when the cover is secured to the module housing. When the features deform, they partially wrap about the respective unjacketed optical fibers such that the respective fibers are pinned between the respective deformed features and the respective V-shaped grooves of the module housing. This contact between the deformed features, the respective unjacketed optical fibers and the respective V-shaped grooves maintains the respective unjacketed optical fibers in precise locations along respective optical pathways of the connector module.

Abstract: A modified TO-can assembly is provided that has greater versatility with respect to spatial constraints than known TO-can assemblies and that is suitable for use in a wider range of applications than known TO-can assemblies. The modified TO-can assembly has a receptacle that has been modified to receive an optical fiber through its side instead of through its end. Within the TO-can assembly, the optical path is folded in order to couple the light between the optoelectronic component of the TOSA or ROSA and the end of the optical fiber. The combination of these features provides the modified TO-can assembly with a compact profile that makes it more versatile with respect to spatial constraints and therefore suitable for use in a wider range of applications.

Abstract: A heat dissipation solution is provided that is suitable for use in, but not limited to use in, CXP modules. The heat dissipation solution allows the performance of a CXP module to be significantly improved without having to increase the size of the heat dissipation device that is currently used with known CXP modules. The heat dissipation solution thermally decouples the heat dissipation path associated with the laser diodes from the heat dissipation path associated with other heat-generating components of the module, such as the laser diode driver IC and the receiver IC. Decoupling these heat dissipation paths allows the temperature of the laser diodes to be kept cooler as they are operated at higher speeds while allowing the temperatures of the other components to run hotter, if desired or necessary.

Abstract: A connector assembly is provided that mates on one side with an optical transceiver module holder and that electrically connects on the opposite side with an external system circuit board. When the connector assembly is mated with an optical transceiver module holder, a base of a parallel optical transceiver module held in the holder mates with a socket of the connector assembly such that respective arrays of electrical contacts disposed on the base and in the socket come into contact with one another. At least one gearbox IC for performing data rate conversion is mounted on the assembly circuit board. A lower surface of the assembly circuit board has an array of electrical contacts on it that are in contact with an array of electrical contacts disposed on the surface of the external system circuit board on which the connector assembly is mounted.

Abstract: An electromagnetic interference (EMI) shielding device and method are provided for use with an optical communications module (OCM) that is configured to be plugged into a front panel of a box or housing of an optical communications system. The EMI shielding device is mechanically coupled to an end of a housing of the OCM such that when the OCM is fully inserted through an opening formed in the front panel, the EMI shielding device comes into abutment with the front panel to form an EMI seal around the opening that prevents, or at least helps prevent, EMI from escaping from the system housing through the opening formed in the front panel.

Abstract: A modified TO-can assembly is provided that has greater versatility with respect to spatial constraints than known TO-can assemblies and that is suitable for use in a wider range of applications than known TO-can assemblies. The modified TO-can assembly has a receptacle that has been modified to receive an optical fiber through its side instead of through its end. Within the TO-can assembly, the optical path is folded in order to couple the light between the optoelectronic component of the TOSA or ROSA and the end of the optical fiber. The combination of these features provides the modified TO-can assembly with a compact profile that makes it more versatile with respect to spatial constraints and therefore suitable for use in a wider range of applications.

Abstract: A cleave holder is provided that allows the ends of optical fibers to be precisely stripped and cleaved and then secured at precise locations in a multi-optical fiber connector module. The cleave holder is secured to length-wise portions of optical fibers that extend through the cleave holder. The cleave holder has reference holes formed in its lower surface that allow it to be mounted on a fixture having pins on it that mate with the reference holes. Once the ends of the fibers have been stripped and cleaved, the cleaved ends are secured to precise locations within a connector module. The cleave holder and the connector module form an assembly that can be used together, with the cleave holder acting as a mounting structure for the assembly and as a strain relief mechanism.

Abstract: In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.

Abstract: An optical communications system is provided in which module locating pins of the system mate with inwardly-shaped corners formed on parallel optical transceiver modules of the system when the parallel optical transceiver modules are mounted on a mid-plane mounting structure of the system. The inwardly-shaped corners of the parallel optical transceiver modules are complementary in shape to portions of the module locating pins. The mating of the module locating pins with the inwardly-shaped corners of the modules operates to passively position the modules at intended spatial locations relative to each other and relative to the mid-plane mounting structure. The inwardly-shaped corners consume very little space in the modules and the pins consume very little space in the optical communications system. Consequently, the pitch between adjacent parallel optical transceiver modules can be kept very small and the mounting density of the modules on the mid-plane mounting structure can be very high.

Abstract: A Z-pluggable optical communications module (OCM) is provided that contains multiple parallel OCMs (POCMs) and that is configured to be removably plugged into an opening formed in a front panel of an optical communications system. When the Z-pluggable OCM is plugged in a forward Z-direction into the opening formed in the front panel, an actuator mechanism is actuated to impart motion to the Z-pluggable OCM in the downward Y-direction to cause the Z-pluggable OCM to be mounted on an upper surface of a motherboard PCB. In order to unplug the Z-pluggable OCM, the actuator mechanism is actuated to impart motion to the Z-pluggable OCM in the upward Y-direction to cause it to be dismounted from the motherboard PCB.

Abstract: An AOC connector is provided that has a molded plastic leadframe that obviates the need to use an optical connector in the AOC and that is capable of operating over a wide temperature range and a large number of temperature cycles. The AOC connector includes a plastic optical port that is adapted to be connected via an optically-transparent adhesive material to an end of an optical fiber cable.

Abstract: An optical communications module is provided with an EMI shielding system that comprises a resistive coating disposed on one or more inner surfaces of the module housing. The resistive coating has a thickness that is greater than or equal to one skin depth and has a resistivity that is low enough to support electrical current flow, but high enough to absorb EMI radiation of a particular wavelength or wavelength range. The combination of these features causes EMI radiation to propagate in the resistive coating due to skin effect. The resistive coating absorbs at least a portion of the EMI radiation propagating therein.

Abstract: In a parallel optical communication module, an array of opto-electronic devices secured with respect to a mount and an array of optical elements of an optical device that is also secured with respect to the mount are unconstrained against relative movement due to thermal expansion of the mount and optical device. The mount and optical device can be made of materials having similar coefficients of thermal expansion. As thermal expansion in the mount causes the opto-electronic devices to move, similar thermal expansion in the optical device causes the optical elements to move to a similar extent. This co-movement of the opto-electronic devices and optical elements to similar extents promotes continued maintenance of optical alignment between opto-electronic elements and corresponding optical elements.

Abstract: An optical connector has guide pins with stepped profiles. The connector includes a connector body, two or more optical ports, and two or more cylindrical guide pins. Each guide pin has a first portion with a first length, a second portion with a second length, and a transitional portion between the first and second portions. The first portion has a first diameter. The second portion has a second diameter. The second diameter is less than the first diameter.