Abstract: A semiconductor device of the present invention is a semiconductor device applicable in a cooling system including an ECU functioning as a setting part that sets target temperature of a refrigerant used to cool the semiconductor device, and a sensor functioning as a detector that detects the temperature of the refrigerant as refrigerant's temperature. The semiconductor device generates variable heating loss. The semiconductor device includes a heating controller that controls the heating loss in the semiconductor device such that the target temperature and the refrigerant's temperature become the same.

Abstract: A partition in lattice form forms a plurality of housing sections. A plurality of circuit blocks including a semiconductor block and a terminal base block are electrically connected one to another in a state of being housed in the housing sections to form a power semiconductor circuit. The semiconductor block is formed by covering an IGBT with an insulating material. A collector of the IGBT is connected to an electrode through a metal plate. The electrode is led out from an inner portion of the insulating material to a side surface of the insulating material. A terminal base block includes a power terminal to which an external power wiring for supplying electric power to the IGBT is electrically connected, and a screw hole into which a screw for fixing the power wiring is inserted.

Abstract: A transformation restricting mechanism is configured to change a resisting force between a first connecting member, a second connecting member, and a caliper that are configured to be displaced relative to each other. The first connecting member includes a turn supporting portion supported by a first shock absorbing device. The second connecting member includes a turn supporting portion supported by a second shock absorbing device. The turn supporting portion is supported by the first shock absorbing device closer to a first center axis than an intermediate axis which is coincident with a turning axis of a steering shaft when the vehicle body frame is in an upright state. The turn supporting portion is supported by the second shock absorbing device closer to a second center axis than the intermediate axis when the vehicle body frame is in an upright state.

Abstract: A vehicle includes a stop element supported on a first support portion which is provided on any one of a link mechanism, a body frame, a right shock absorbing device, and a left shock absorbing device at a first end portion thereof so as to turn about a support axis of the first support portion, a lock caliper supported on a second support portion which is displaced relative to the first support portion and which is provided on any one of the link mechanism, the body frame, the right shock absorbing device, and the left shock absorbing device and which is configured to change a frictional force with the stop element, and a guide member which guides a middle portion or a second end portion of the extended member to the lock caliper.

Abstract: A semiconductor element is sandwiched between a lower and upper surface of a cooling body. A connection circuit and a communication device are provided on the lower surface of the cooling body. A drive circuit and a communication device are provided on the upper surface of the cooling body. These components are encapsulated by a resin. The connection circuit generates a control signal in response to a signal from outside. The communication device transmits the control signal. The communication device receives the control signal and supplies the control signal to the drive circuit, which drives the semiconductor element in response to the control signal. The resin electrically insulates the connection circuit and the communication device from the communication device and the drive circuit enabling prevention of breakdown of the connection circuit caused by an application of a high voltage from the drive circuit to the connection circuit.

Abstract: A semiconductor device includes a semiconductor module having a heat conductive portion formed of metal and also having a molded resin having a surface at which the heat conductive portion is exposed, a cooling body secured to the semiconductor module by means of bonding material, and heat conductive material formed between and thermally coupling the heat conductive portion and the cooling body.

Abstract: A vehicle includes a stop element supported on a first support portion which is provided on any one of a link mechanism, a body frame, a right shock absorbing device, and a left shock absorbing device at a first end portion thereof so as to turn about a support axis of the first support portion, a lock caliper supported on a second support portion which is displaced relative to the first support portion and which is provided on any one of the link mechanism, the body frame, the right shock absorbing device, and the left shock absorbing device and which is configured to change a frictional force with the stop element, and a guide member which guides a middle portion or a second end portion of the extended member to the lock caliper.

Abstract: A transformation restricting mechanism is configured to change a resisting force between a first connecting member, a second connecting member, and a caliper that are configured to be displaced relative to each other. The first connecting member includes a turn supporting portion supported by a first shock absorbing device. The second connecting member includes a turn supporting portion supported by a second shock absorbing device. The turn supporting portion is supported by the first shock absorbing device closer to a first center axis than an intermediate axis which is coincident with a turning axis of a steering shaft when the vehicle body frame is in an upright state. The turn supporting portion is supported by the second shock absorbing device closer to a second center axis than the intermediate axis when the vehicle body frame is in an upright state.

Abstract: At least a portion of a tie rod of a steering force transmitting mechanism overlaps with a portion of a first support member or a second support member when viewed from a front of a vehicle in a fully-tilted condition in which the vehicle body frame is fully tilted in the left-right direction. At least a portion of the tie rod is disposed below a second cross member, above a first front wheel and a second front wheel, behind a front end of the first front wheel and a front end of the second front wheel, and ahead of a first axis of a first side member and a second axis of a second side member when viewed from the left or right of the vehicle when the vehicle body frame is in an upright state.

Abstract: A vehicle includes a center transmission plate, a first center turnable portion configured to turn about a first center turning axis extending in an up-down direction, a second center turnable portion configured to turn about a second center turning axis extending in a front-rear direction, a left transmission plate, a first left turnable portion configured to turn about a first left turning axis extending in the up-down direction, a second left turnable portion configured to turn about a second left turning axis extending in the front-rear direction, a right transmission plate, a first right turnable portion configured to turn about a first right turning axis extending in the up-down direction, and a second right turnable portion configured to turn about a second right turning axis extending in the front-rear direction. A tie rod is supported on the second center turnable portion, the second left turnable portion, and the second right turnable portion.

Abstract: A semiconductor device of the present invention includes a transistor having a drain and a source, a voltage being applied between the drain and the source from a high-voltage power supply, a drive device that generates a source voltage and a gate voltage for the transistor from a voltage of a low-voltage power supply lower than that of the high-voltage power supply, and a voltage dividing circuit connected to the low-voltage power supply, wherein when the source voltage is lower than a certain value, an output voltage from the voltage dividing circuit is applied to the source.

Abstract: A semiconductor element is sandwiched between a lower and upper surface of a cooling body. A connection circuit and a communication device are provided on the lower surface of the cooling body. A drive circuit and a communication device are provided on the upper surface of the cooling body. These components are encapsulated by a resin. The connection circuit generates a control signal in response to a signal from outside. The communication device transmits the control signal. The communication device receives the control signal and supplies the control signal to the drive circuit, which drives the semiconductor element in response to the control signal. The resin electrically insulates the connection circuit and the communication device from the communication device and the drive circuit enabling prevention of breakdown of the connection circuit caused by an application of a high voltage from the drive circuit to the connection circuit.

Abstract: A wireless device (1) searches a database that stores positional information of the wireless device (1), a device (2-4) and control identifiers for controlling the devices (2-4) in an associated manner, acquires a device (2-4) located near the wireless device (1) and a control identifier for controlling the device (2-4) based on the positional information of the wireless device (1), and, based on the device (2-4) and the control identifier for controlling the device (2-4) that have been acquired, determines a controlled device (at least one of the devices (2-4)) and generates a control identifier for the controlled device. The wireless device (1) transmits, by wireless communication, the generated controlled identifier to a receiver mounted on the controlled device to control the controlled device.

Abstract: A cooling fin 9 is joined to a semiconductor element 1. A resin 10 encapsulates the semiconductor element 1. A portion of the cooling fin 9 projects from a lower surface of the resin 10. A cooler 11 has an opening 12. The cooling fin 9 projecting from the resin 10 is inserted in the opening 12 of the cooler 11. The lower surface of the resin 10 and the cooler 11 are joined to each other by a joining material 13 such as an adhesive. Therefore, a reduction in the number of component parts and a reduction in weight can be achieved, and compatibility between the heat conductivity and the strength of joining can be ensured.

Abstract: A partition in lattice form forms a plurality of housing sections. A plurality of circuit blocks including a semiconductor block and a terminal base block are electrically connected one to another in a state of being housed in the housing sections to form a power semiconductor circuit. The semiconductor block is formed by covering an IGBT with an insulating material. A collector of the IGBT is connected to an electrode through a metal plate. The electrode is led out from an inner portion of the insulating material to a side surface of the insulating material. A terminal base block includes a power terminal to which an external power wiring for supplying electric power to the IGBT is electrically connected, and a screw hole into which a screw for fixing the power wiring is inserted.

Abstract: A circuit pattern is bonded to a top surface of a ceramic substrate. A cooling body is bonded to an undersurface of the ceramic substrate. An IGBT and a FWD are provided on the circuit pattern. A coating film covers a junction between the ceramic substrate and the circuit pattern, and a junction between the ceramic substrate and the cooling body. A mold resin seals the ceramic substrate, the circuit pattern, the IGBT, the FWD, the cooling body, and the coating film etc. The ceramic substrate has higher thermal conductivity than the coating film. The coating film has lower hardness than the mold resin and alleviates stress applied from the mold resin to the ceramic substrate. The circuit pattern and the cooling body includes a groove contacting the mold resin without being covered with the coating film.

Abstract: It is an object of the present invention to provide a semiconductor device which is easily replaceable and a semiconductor system using the semiconductor device. The semiconductor device of the present invention includes a semiconductor chip, a cooler that cools the semiconductor chip, a housing that houses the semiconductor chip and the cooler, a transfer resin that seals the semiconductor chip and the cooler inside the housing, electrodes connected to the semiconductor chip, and a joining pipe attached to the cooler, the joining pipe letting in and out a flow of a refrigerant from and to the cooler. The electrodes and the joining pipe are formed to protrude from the same surface of the housing in substantially the same direction.

Abstract: A power semiconductor element, a high-voltage electrode electrically connected to the power semiconductor element, a heat radiating plate connected to the power semiconductor element and having heat radiation property, a cooling element connected to the heat radiating plate with an insulating film being interposed, and a seal covering the power semiconductor element, a part of the high-voltage electrode, the heat radiating plate, the insulating film, and a part of the cooling element are included. The cooling element includes a base portion of which part is embedded in the seal and a cooling member connected to the base portion. The base portion and the cooling member are separate from each other, and the cooling member is fixed to the base portion exposed through the seal.

Abstract: A semiconductor device includes a first electrode electrically connected to an upper surface of a semiconductor element, a first internal electrode electrically connected to a lower surface of the semiconductor element and having a plurality of first comb finger portions and a first connection portion connecting the plurality of first comb finger portions together, a second electrode electrically connected to the first internal electrode, a second internal electrode electrically connected to a lower surface of the first electrode and having a plurality of second comb finger portions and a second connection portion connecting the plurality of second comb finger portions together, the plurality of second comb finger portions being interdigitated with but not in contact with the plurality of first comb finger portions, and a lower dielectric filling the space between the plurality of first comb finger portions and the plurality of second comb finger portions.