Abstract: In a fixing device of the film heating type and the pressure rotary member driving type and an image forming apparatus provided with this fixing device, at the start of printing, the output of a thermistor near a heater is detected, and when the temperature difference &Dgr;T=T2−T1 between the detected temperature T1 and the fixing temperature T2 is smaller than a desired temperature T0, the raising timing of the heater is delayed. Thereby, a pressure roller is not-excessively warmed at hot start and slip can be prevented. Also, in the image forming apparatus having the film heating type fixing device, in the next printing after the lapse of a predetermined time after the termination of a printing operation, the target temperature and heater electrical energization starting timing of the fixing device are changed in conformity with the temperature of the fixing device.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: The present invention relates to an image heating apparatus in which an image on a recording material is heated by heat from a heater via a film, and the film contacts a surface of the heater opposite to a surface thereof on which heat generating members are provided.

Abstract: A semiconductor integrated circuit device includes a semiconductor substrate, a circuit element formed on one major surface of the semiconductor substrate and constituting an integrated circuit having a plurality of functions or a plurality of characteristics, an internal connection terminal, connected to the integrated circuit, for selecting one of the plurality of functions or one of the characteristics in the integrated circuit, an insulating layer covering the internal connection terminal such that the internal connection terminal is selectively exposed, and an external connection terminal arranged on the insulating layer. One of the plurality of functions or one of the plurality of characteristics is selected by a connection state between the internal connection terminal and the external connection terminal.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: The semiconductor wafer is made thin without any cracks and warp under good workability. The semiconductor wafer thinning process includes the first step of preparing a carrier 1 formed of a base 1a and a suction pad 1b provided on one surface of the base 1a or formed of a base film with an adhesive, the second step of bonding a semiconductor wafer to the carrier 1 in such a manner that a rear surface of the semiconductor wafer 2 with no circuit elements formed therein is opposite to the carrier to form a wafer composite 10, and the third step of holding the carrier of the wafer composite 10 with its semiconductor wafer 2 side up and spin-coating an etchant on the rear surface of the semiconductor wafer 2 thereby to make the semiconductor wafer 2 thin.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: The semiconductor wafer is made thin without any cracks and warp under good workability. The semiconductor wafer thinning process includes the first step of preparing a carrier 1 formed of a base 1a and a suction pad 1b provided on one surface of the base 1a or formed of a base film with an adhesive, the second step of bonding a semiconductor wafer to the carrier 1 in such a manner that a rear surface of the semiconductor wafer 2 with no circuit elements formed therein is opposite to the carrier to form a wafer composite 10, and the third step of holding the carrier of the wafer composite 10 with its semiconductor wafer 2 side up and spin-coating an etchant on the rear surface of the semiconductor wafer 2 thereby to make the semiconductor wafer 2 thin.

Abstract: A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode contact area, is cured. As a result, a cured resin part is formed which works as a guide layer and a protection film for protecting the metal wire in which the metal wiring formation area has a hollow shape. Thereafter, the metal wire is formed inside the cured resin part.

Abstract: A semiconductor wafer is made thin without any cracks or warp under good workability. The semiconductor wafer thinning process includes the first step of preparing a carrier formed of a base and a suction pad provided on one surface of the base or formed of a base film with an adhesive, the second step of bonding a semiconductor wafer to the carrier in such a manner that a rear surface of the semiconductor wafer with no circuit elements formed therein is opposite to the carrier to form a wafer composite, and the third step of holding the carrier of the wafer composite with its semiconductor wafer side up and spin-coating an etchant on the rear surface of the semiconductor wafer thereby to make the semiconductor wafer thin.

Abstract: The present invention relates to an image heating apparatus in which a heater being controlled by an output from a temperature detecting element to obtain a predetermined temperature and an image on a recording material being heated by heat from the heater via a film, the heater having a first heating member disposed along a longitudinal direction of a base material and heated by energizing and a second heating member shorter than the first heating member, the first heating member being disposed on an upstream side of the second heating member with respect to a moving direction of the recording material, and when a first size recording material is heated, the first heating member being energized and the second heating member being not energized, when a second size recording material smaller than the first size recording material is heated, the first heating member and the second heating member being energized.

Abstract: Described herein is a stacked package according to the present invention, wherein a plurality of tape carriers which seal semiconductor chips, are multilayered in upward and downward directions. In the stacked package, one ends of leads formed over the whole surfaces of each tape carrier are electrically connected to their corresponding connecting terminals of the semiconductor chip. Other ends of the leads are electrically connected to their corresponding through holes defined in the tape carrier. Connecting terminals common to the plurality of semiconductor chips are formed at the same places of the plurality of tape carriers and withdrawn to the same external connecting terminals through a plurality of mutually-penetrated through holes.

Abstract: An object of the present invention is to provide an image forming apparatus having a fixing device, which can obtain good fixing ability while preventing occurrence of hot offset. The present invention provides an image forming apparatus that has image forming means for forming an image on a recording material, a heating member for heating the image on the recording material, a backup roller forming a nip with the heating member, a temperature detecting element for detecting a temperature of an atmosphere, and control means for controlling a power supply to the heating member, wherein when a print signal is inputted, the control means controls power supply (electrical communication) to the heating member in such a manner that the heating member maintains a set temperature in accordance with a detection temperature of the temperature detecting element, and, thereafter, a fixing operation is effected.

Abstract: An image forming apparatus has an image forming unit for forming an image on a recording material and a fixing unit for fixing the image to the recording material by nipping and conveying the recording material, the fixing unit including a heater which does not generate heat during a standby period in which a printing operation can be started. The heater generates heat for a predetermined period after the start of power supply to the apparatus and then the apparatus is rendered capable of the printing operation.

Abstract: A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode contact area, is cured. As a result, a cured resin part is formed which works as a guide layer and a protection film for protecting the metal wire in which the metal wiring formation area has a hollow shape. Thereafter, the metal wire is formed inside the cured resin part.

Abstract: The present invention relates to an image heating apparatus in which an image on a moving recording material is heated by a heat from a heater, the heater has an elongated substrate extending in a direction perpendicular to a shifting direction of the recording material, and a first heat generating body and a second heat generating body for generating heat by energization and provided on the substrate along a longitudinal direction thereof, the first and second heat generating bodies are disposed side by side in a direction perpendicular to the longitudinal direction of the substrate, and the first heat generating body has a first heat generating portion, and a second heat generating portion provided at a longitudinal end of the first heat generating portion and having a heat generating amount per unit length smaller than that of the first heat generating portion, and, when the width of the recording material is detected to be smaller than a predetermined width by the detecting member, the first heat generati

Abstract: The present invention provides an image fixing apparatus which comprises a heater for generating heat upon receiving electric power supply thereto, a film movable with an unfixed image on a recording material while being in contact with said heater, a backup roller for forming a nip with said heater, with said film being interposed in the nip, and fixing condition setting means for setting an image fixing condition according to a size of the recording material conveyed to the nip in a preceding image fixing operation and a size of the recording material conveyed to the nip in the current image fixing operation.

Abstract: The present invention provides an image forming apparatus having an image bearing member for bearing a toner image, and a transfer rotary member for forming a nip between the transfer rotary member and the image bearing member, the transfer rotary member being provided at its surface with a solid layer and serving to transfer the toner image from the image bearing member onto a transfer material at the nip, and wherein a moving speed of a surface of the transfer rotary member at the nip is greater than a moving speed of a surface of the image bearing member at the nip, and a surface friction force of the transfer rotary member is greater than a surface friction force of the image bearing member by 3 to 20 times.

Abstract: In an image heating apparatus, a film has one face in sliding contact with a heater having a heat generating portion on a substrate. The other face of the film contacts a recording material bearing an image. The film moves with the recording material and the image on the recording material is heated by heat generated by the heater which is transmitted through the film. A temperature detecting element detects the temperature of the heater. The heat generating portion of the heater has a first heat generating portion and a second heat generating portion on the downstream side of the first heat generating portion with respect to the moving direction of the film. The middle of the temperature detecting element is positioned at the upstream side of the middle between the first and second heat generating portions with respect to the moving direction of the film.

Abstract: An image forming apparatus includes an image bearing member; a scanning device for scanning the image bearing member in accordance with image data; driving source for driving the image bearing member; and a gear for transmitting power to the image bearing member from the driving source.The movement pitch of the image bearing member corresponding to a gear pitch of the gear, and a line pitch of a basic matrix for tone gradation printing are sufficiently different to prevent interference fringe of the image.