Light emitting diode package

- Lextar Electronics Corp.
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Description

FIG. 1 is a front perspective view of a light emitting diode package showing the new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims

The ornamental design for a light emitting diode package, as shown and described.

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Patent History
Patent number: D697877
Type: Grant
Filed: May 10, 2013
Date of Patent: Jan 21, 2014
Assignee: Lextar Electronics Corp. (Hsinchu)
Inventors: Hui-Kai Hsu (Taitung), Che-Ming Hsu (Chang Hua County), Shih-Ju Lo (Taoyuan County), Kuan-Hao Chen (New Taipei)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/454,543
Classifications