Abstract: An electronic apparatus installation structure has an adapter with rotatably supporting a rotating shaft, and having a bearing part having elongated holes that cause exposure of screw holes and a pin hole of a rotating shaft and a base part. A pin of the rotating shaft is pressed into the pin hole, thereby restraining thrust-direction movement, and also limiting the swinging range of the rotating shaft. Through holes are provided on a radio apparatus at locations corresponding to the screw holes on the rotating shaft, and mounting screws are used to fix the radio apparatus to the bearing part of the adapter.

Abstract: The present invention relates to a photoelement (11) which is provided with a protective layer consisting of cured material and has a transparent element at a location intended for light to pass through.

Abstract: A mass spectrometry apparatus is provided with an emitter for emitting metal ions, a reaction chamber where the detected gas is introduced and ionized by the metal ions, an aperture for guiding molecules of the ionized detected gas, and a mass spectrometer for measuring the guided molecules. The metal ions emitted from the emitter are caused to fly to the reaction chamber to ionize said detected gas. The detected gas is a halide compound. Further provision is made of a sample gas source for feeding a halide compound to the reaction chamber and an N2 gas source for feeding to the reaction chamber a gas (N2 etc.) to which the metal ions attach less easily than to the halide compound. It is therefore made possible to apply cation attachment of the Fujii system to mass spectrometry of a halide compound and enable precise measurement of fluoride compounds etc. having a large impact on global warming.

Abstract: A radiation source of a radiation system of a lithographic projection apparatus comprises electrodes for creating a discharge in a space between them such that the discharge collapses into a pinch volume. The collapsing discharge creates a highly ionized, high temperature plasma in the pinch volume. A working fluid is ejected from a jet nozzle into the pinching volume and is thereby raised to a high temperature state and emits extreme ultraviolet radiation.

Abstract: In a multi-table lithographic apparatus in which substrate tables may be exchanged between a first working zone where substrates are loaded onto and removed from the table and a second working zones where wafers are exposed, collision prevention means are provided to prevent collisions between tables in the exchange process. The collision prevention means may be formed of a labyrinth or a revolving door. The exchange process may be controlled by shuttles, optionally including drive means, that are interlinked so that the tables can only be exchanged between zones together.

Abstract: A gate valve comprises a valve rod for making displacement in accordance with a driving action of a cylinder mechanism; a guide shaft for guiding the valve rod; a valve disk for opening/closing a passage in accordance with a displacement action of the valve rod; a rack connected to the valve rod, for making displacement integrally with the valve rod; a pinion rotatably supported by a casing, for meshing with the rack; and a pillow member connected to the valve disk and formed with a male thread for making engagement with a female thread formed on an inner circumferential surface of the pinion.

Abstract: The present invention relates to novel charge transfer materials which have both the advantageous properties of amorphous materials such as structural flexibility and uniformity over large areas, and those of crystalline materials such as molecular orientation and which are excellent in charge transferability, thin-film formability, and durability of various types.

Abstract: A reflective type liquid crystal display which has, between a pair of transparent substrates with electrodes thereon, a nematic liquid crystal composition which exhibits a cholesteric phase at room temperature. The liquid crystal composition contains a nematic liquid crystal mixture containing a liquid crystalline difluorostilbene compound, and a chiral agent. The concentration of the liquid crystalline difluorostilbene compound in the liquid crystal composition is preferably in a range from 5 wt % to 60 wt %.

Abstract: A universal lifting device for elevating heavy off-the-road vehicles, e.g. mechanical shovels used in mining operations, is proposed to raise the upper revolving section of the shovel and allow for its lower wheeled base to be removed with a view to attending to the maintenance, for instance, of the rotation mechanism of the shovel. The lifting device comprises front and rear lifting beams to which various type of brackets can be removably mounted to ensure a proper positioning of the front and rear lifting beams with respect to the revolving frame of different models of mechanical shovels. Front and rear lifting points are provided to control the vertical displacement of the front and the rear lifting beams, respectively.

Abstract: To facilitate an operation for feeding a jack part into a desired position. A jack part 2, which extends when pressure oil from an oil pressure supply and discharge part 1 is supplied and contracts when oil is recovered to the oil pressure supply and discharge part 1, is set to a pantograph type, and a wheel 5 is held in front which is one end in a folded state.

Abstract: A rope pulley construction comprising a frame, at least one rope pulley equipped with a rope groove, rope pulley bearing, guard to prevent a lifting rope from coming off the rope pulley, and suspension point for hanging the rope pulley. The frame of the rope pulley construction comprises two plate parts joined together which simultaneously provide suspension for the rope pulley, at least one suspension point for hanging the rope pulley construction and guard to prevent a lifting rope from coming off the rope pulley.

Abstract: There is disclosed a semiconductor light emitting element formed by selective growth and being high in light emitting efficiency, in which at least one GaN-based layer grown by ELO is stacked/formed on a sapphire substrate, and a fluorescent substance for converting an ultraviolet light to a visible light is contained in a selective growth mask material layer for use in this case. Since this fluorescent substance converts the ultraviolet light to the visible light, a binding efficiency of the ultraviolet light to the fluorescent substance is enhanced in either one of a center light emitting type and UV light emitting type of light emitting elements. By further containing the fluorescent substance into a passivation film, the efficiency is further enhanced.

Abstract: An organic electroluminescent (EL) element has a sealed structure improved in humidity resistance. Subsequently deposited on a glass substrate of the organic EL element are components of the organic EL element, that is: a transparent electrode; an organic EL layer; and, a negative electrode. Further, the negative electrode is coated with a protection film on which a dehydrating agent is fixedly mounted using a porous sheet or a like. After that, the organic EL element has all the components sealed using a sealing member in an inert atmosphere to complete the sealed structure thereof.

Abstract: A semiconductor light emitter includes: a first semiconductor layer formed over a substrate; a second semiconductor layer formed over the first layer; and a third semiconductor layer formed over the second layer. Bandgaps of the first and third layers are greater than a bandgap of the second layer. A high-quantum-level region is defined around an edge of the second layer. A first quantum level is higher in the high-quantum-level region than in the other region of the second layer.

Abstract: The present invention relates to a power transistor module for radio frequency applications, particularly for use in an amplifier stage in a radio base station or in a ground transmitter for TV or radio, wherein said power transistor module comprises a support plate, a power transistor chip arranged thereon, outer electrical connections projecting from the module for external connection and inner electrical connections connected between said transistor chip and said outer connections, at least one of said inner electrical connections comprising a first conductor pattern arranged on a flexible foil. The invention further comprises a power amplifier comprising said module, a method in the fabrication of said module, a method in the fabrication of a power amplifier, where said module is electrically connected to a circuit board mounted at a heat sink and to be mounted at said heat sink, and finally to a power amplifier manufactured according to the method.

Abstract: P-type ion implantation is done in N well 15, so as to form a charge drain control layer 17 and form a photodiode N well 16 and OFD drain 5, the result being that, even if there is variation in the potential of the photodiode N well 16 making up the photodiode, because the variation in the potential of the charge drain control layer 17 is in the same direction as the potential of the photodiode N well 16, so that variation does not occur in the maximum amount of electrical charge that can be accumulated, the result being that there is no variation in the signal in the saturation condition.

Abstract: A photodiode includes a semiconductor region (1, 7) having a first conductivity type (p or n type), an embedded layer (2) disposed in the semiconductor region (1, 7) and having a second conductivity type (n or p type) different from the first conductivity type (p or n type), and a leader (9) made of a semiconductor of the second conductivity type (n or p type). The embedded layer extends parallel to a surface (8) of the semiconductor region (1, 7). The leader extends from the surface (8) of the semiconductor region (1, 7) along the depth of the semiconductor region (7, 7) and is joined to a region of the embedded layer (2). The photodiode preferably has a base layer (11) made of a semiconductor of the second conductivity type (n or p type). The base layer (11) is held against the surface (8) of the semiconductor region (1, 7) and extends parallel to the surface (8) of the semiconductor region (1, 7). The base layer is isolated from the embedded layer (2) and electrically connected to the leader (9).

Abstract: An anti-reflective coating having a composite layer of silicon nitride and silicon dioxide may be formed over the entire photosensitive region of the photodetector to minimize the amount of reflection. The composite layer comprises a silicon nitride layer and a dielectric layer contiguous to the silicon nitride layer. The anti-reflective coating may be formed in a CMOS process for fabricating the PN junction in the photodiode and CMOS devices for amplifying the photodetector signal, where the polysilicon gate layer is used as a etch stop. The P+ or N+ material in the PN junction of the photodiode has a distributed design where two portions of the region are separated by a distance in the range of Xd to 2Xd, where Xd is the one-sided junction depletion width, to enhance the electric field and to reduce the distance traveled by the carriers for enhancing bandwidth. A heavily doped region of the opposite type may be added between the two portions to further enhance the electric field.

Abstract: A non-volatile memory device including memory cells each formed as a MOS transistor having source and drain regions and gate structures is described. The source and drain regions and the gate structures are covered by a silicon nitride layer obtained in a standard PECVD chamber at a temperature lower than 480 ° C. and with a suitable gas flow. An insulated layer is placed over the silicon nitride layer.

Abstract: Semiconductor device having on a single substrate (1) at least one memory cell (3) and at least one logic transistor (25);

Abstract: To a provide a method of forming a layered film of a silicon nitride film and a silicon oxide film on a glass substrate in a short time without requiring a plurality of film deposition chambers. In a thin film transistor, a layered film including a silicon nitride oxide film (12) is formed between a semiconductor layer (13) and a substrate (11) using the same chamber. The silicon nitride oxide film has a continuously changing composition ration of nitrogen or oxygen. An electric characteristic of the TFT is thus improved.

Abstract: In a semiconductor device including active areas where transistors are formed and a field area for isolating the active areas from each other, the field area has a plurality of dummy areas where dummy gates are formed.

Abstract: A semiconductor integrated circuit having a diagnosis function includes a scan chain arrangement block 2 in which a plurality of flip-flops are connected so that they can be shift-registered, and designed in a scan-path manner; a shift register 3 for storing required bits of a first random number pattern shifted by the block 2; another shift register 4 for storing required bits of a second random number pattern supplied to the block 2; and a comparator for comparing corresponding bits of the random number patterns stored in the shift registers 3 and 4 to detect whether all the bits of the random number patterns agree or disagree with each other, thereby verifying a normal operation of the block 2. In this configuration, the operating state of the semiconductor integrated circuit can be diagnosed with the number of connecting wires connected to it being minimized.

Abstract: A high-voltage semiconductor device includes: a drain region; a metal electrode electrically connected to the drain region; and electrically floating plate electrodes formed on a field insulating film over a semiconductor region. Parts of the metal electrodes are extended onto the interlevel dielectric film and located over the respective plate electrodes. Each part of the metal electrode is capacitively coupled to associated one of the plate electrodes.

Abstract: Encapsulated piezoelectric resonator including on the one hand a central plate (5) made of a piezoelectric material cut to form a frame (6) and a central resonant element (9) connected to said frame (6), the top and bottom faces having a metal coating, on the other hand bottom (11) and top (16) covers, each being formed by a spacing frame (12, 17) made of metal or a metal alloy and a closing plate (14, 19), characterized in that at least one of the elements (12, 14, 17, 19) forming the covers (11, 16) is electrically connected to the frame (6) of the central plate (5) and has an extension (10, 13, 18, 20) bent into a Z shape to bring its distal portion (10a, 13a, 18a, 20a) in line with a covering plate (14, 19) and to form electrical and mechanical connection means situated in a same plane.

Abstract: A circuit configuration for trimming reference voltages in semiconductor chips. The circuit configuration contains a test logic unit and a trimming circuit for trimming at the chip level the reference voltages. The reference voltages are compared to an externally supplied comparison voltage and the reference voltage is varied by the trimming circuit if it does not match the comparison voltage.

Abstract: A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

Abstract: Embodiments of a semiconductor package and manufacturing methods therefor are disclose. An exemplary package comprises an optical semiconductor chip having input and output pads on an upper surface thereof. A transparent plate is bonded to the chip via a dam located within the input and output pads. The chip is mounted within an aperture through a planar circuit board. Wires electrically connect the input and output pads to circuit patterns of the circuit board. An encapsulant fills the aperture, and supports the chip therein. Interconnects are formed on the lower surface of the circuit board. An alternative embodiment omits the dam and the wires and employs a flip chip style connection between the chip and circuit patterns on the transparent plate. The transparent is supported by and attached to the upper surface of the planar circuit board.

Abstract: The present invention was developed in order to provide a high-frequency package, having an excellent high-frequency characteristic in a band from quasi-millimeter wavelength to 90 GHz frequency and a favorably sealed construction, which can be easily manufactured, leading to a reduction in cost, and is excellent in strength.

Abstract: In a semiconductor device including an insulating core substrate, a plurality of layers of wiring patterns on the core substrate and insulating layers interposed between the wiring patterns, each adjacent pair of the wiring patterns being electrically connected through a conductor portion penetrating through the insulating layer interposed between them, each of the insulating layers is formed integrally, semiconductor chips thinner than one layer of the insulating layer are mounted into at least one of the insulating layers, and the semiconductor chips are electrically connected to one layer of the wiring pattern of one insulating layer adjacent on the side of the core substrate.

Abstract: The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device 2, power source 4, light source or other components used for the electric products, and an electronic component excellent in radiation.

Abstract: The present invention relates to a field that includes methods and arrangements pertaining to chip carriers. The invention addresses mainly the problem of mounting microchips (3) to chip carriers (1) so as to avoid an earth fault between chip (3) and carrier (1). When mounting chips in accordance with the invention, the chip (13) is placed on a chip carrier (1) that includes an electrically and thermally conductive element (13), said element including a surface (17) and a recess (15) arranged relative to said surface. The microwave chip (3) is arranged at the surface (17) of the electrically and thermally conductive element (13) by means of a fixing or bonding substance (19), which is disposed at least partially in the recess (15). When mounting the chip, the chip (3) is positioned so that an earth plane (3d) of the microwave chip (3) will lie level with the surface (17) of the electrically and thermally conductive element (13).

Abstract: An undercut portion is provided in the side surface of a wiring pattern formed over the electrode terminal forming surface of a semiconductor element so that when the top of the electrode terminal forming surface of the semiconductor element is sealed, a semiconductor device can be obtained wherein that sealing layer exhibits high adhesion. The side surface of the wiring pattern having this undercut portion can be obtained by forming the wiring pattern by laminating metal layers of a plurality of metals, in a layered form, in such a way that the side surface of at least a metal layer A of that wiring pattern is formed as recessed inward in comparison with the side surface of a metal layer B formed on or above that metal layer A. More specifically, the undercut portion can be obtained by performing wet etching on this side surface.

Abstract: An electronic device and method of making same wherein the device includes a substrate (e.g., a printed wiring board or semiconductor chip) having a circuit thereon, a first non-photosensitive layer (e.g., polyimide resin) positioned on the substrate and over the substrate's circuit, a second, photosensitive layer (e.g., epoxy resin) positioned on the first layer, and an electrically conductive layer positioned on the first, non-photosensitive layer and electrically coupled to the circuit through a hole in the first layer.

Abstract: A semiconductor chip is mounted on a printed wiring board (PWB), with the pads of the semiconductor chip mounted on the electrodes of the PWB for flip-chip bonding. The density of the pads in the peripheral area is higher or lower compared to the density of the pads in the central area depending on the thermal shrinkage factor of the PWB being higher or lower compared to the thermal shrinkage factor of the semiconductor chip.

Abstract: An IC card, which can be mass-produced at low cost, is composed of a plane coil formed by means of punching or etching.

Abstract: Powder mixture is supplied into a die under a state that a center pin is located lower than the top surface of the die, after which the center pin is lifted up to a given molding position where an annular molding space is defined between the center pin and the die. The powder mixture is then compressed from upper and lower sides with an upper plunger and a lower plunger to form a pellet. The center pin and the lower plunger are simultaneously lifted up to remove the pellet out of the die.

Abstract: The present invention relates to a molding composition based on sinterable materials, comprising

Abstract: Moldable products which conform to the size and shape of a particular object and methods of forming the same are provided. The products are made from a material selected from the group consisting of natural leathers, synthetic leathers, and mixtures thereof. The products and methods of the invention are particularly useful for manufacturing custom-fit footwear at a reasonable price. Methods in accordance with the invention comprise molding the starting material on and around a foot, wetting the material with a mixture comprising a leather stiffening or hardening agent, and drying the wetted material while still on the foot.

Abstract: The present invention relates to a semiconductor manufacturing furnace having a heat blocker mounted to an elevating plate of the furnace. The heat blocker prevents the internal temperature of the furnace from decreasing radically when a wafer boat is lowered from the processing chamber of the furnace by the elevating plate. The heat blocker includes a sealed case, a plurality of horizontally extending heat-reflecting plates disposed in the case, and a plurality of support pins for supporting and fixing the reflecting plates in place. The heat-reflecting plates reflect heat back up into the processing chamber, as the elevating plate lowers the wafer boat, to keep the internal temperature of the heater stable. This not only enhances the productivity of the manufacturing process but also enhances the uniformity of the processed wafers.

Abstract: A vibration isolator includes an upper coupling member to be mounted on a vibrating body, a cup-shaped holder to be mounted on a car body, and a rubber-like insulator which is located between the upper coupling member and the cup-shaped holder to isolate vibrations from the vibrating body. The vibration isolator further includes a main chamber and a subchamber, which are arranged in series with the insulator and in which a liquid, an incompressive fluid, is enclosed, an annular orifice interconnecting the main chamber and the subchamber, a partition member dividing the main chamber and the subchamber, a diaphragm which is made of a rubber membrane-like member and defines a part of the subchamber, and an air chamber formed below the diaphragm. Both the partition member and the diaphragm are entirely formed of rubber-like elastic bodies. This provides a large area for the central flexible portion of the partition member, reducing the manufacturing costs of the parts including the diaphragm.

Abstract: In a method for intermediately storing documents being supplied in a supply cycle by an upstream system to an intermediate storage device, the documents supplied by the upstream system to a downstream system are transferred in a transfer cycle that is independent of the supply cycle. The intermediate storage device for performing the method has an input side and an output side and a transport device for transporting the documents from the input side to the output side in a transport direction through the intermediate storage device. The transport device has a first transport unit and a second transport unit. The first transport unit is arranged at the input side and is configured to be continuously driven. The second transport unit is arranged at the output side and is driven in a cycled operation.

Abstract: A method for separating a respective sheet from a sheet pile and transporting it to a sheet processing machine, wherein the respective sheet is lifted by at least one lifting suction device to a transfer level lying above a suction air intake level, and the respective sheet is taken over by at least one forwarding suction device at the transfer level, includes thereafter transporting the respective sheet by the forwarding suction device on the transfer level in a direction towards the sheet processing machine, and after transferring the sheet from the lifting suction device to the forwarding suction device, lifting the lifting suction device to an elevation level above the transfer level; a device for performing the method; and rotary printing machine and method of operation including the foregoing.

Abstract: A guide apparatus for guiding sheets to a sheet-processing machine, in particular a printing machine, and a method of operating the guide apparatus are described. The guide apparatus has at least one guide element which is disposed above a feed table and whose distance from the feed table can be set with the aid of a height-adjusting device. The guide apparatus is distinguished by the fact that the height-adjusting device has a first drive and a second drive, which can be actuated independently of each other.

Abstract: A brush seal (9) comprising a plurality of bristles packed together in a bristle layer (10). The bristles (10) extend from a first component (4) towards a facing surface of a second component (2). A movable plate (14) is disposed substantially parallel to and adjacent to the bristle layer (10). The plate (14) is movable relative to the bristle layer (10) in a direction parallel to the bristle layer (10). An edge (22) of the movable plate (14) adjacent to and facing the facing surface of the second component (2) is arranged to air ride on the facing surface of the second component (2). To promote the air riding the edge (22) of the movable plate (14) may be accordingly profiled. Alternatively the edge (14) may comprise an enlarged foot member (24) which defines an enlarged surface (26). Furthermore a recess (30) may be defined in the movable plate (14).

Abstract: With the objective of providing a metallic gasket which can realize both sealing performance and cost reduction which can be achieved by the decreased number of constituting plates or the decreased number of materials, the metallic gasket is composed of: a first bead plate which is made of elastic metal and has hot plug beads which are respectively formed opposite hot plugs; and a second bead plate which is made of elastic metal and has folded parts each of which is formed about the periphery of a bore hole and annular bore beads each of which is formed about the periphery of an area including the bore hole and a portion which is opposite to the hot plug.

Abstract: A ride leveler system in vehicles with an adjustable wheel suspension device between a vehicle wheel and the vehicle body, with a height sensor for measuring the actual height between a vehicle wheel, and with an electronic control device which specifies a target height and adjusts the wheel suspension device until the attainment of the target height. If there is a deviation between target and actual height, the electronic control device adjusts the wheel suspension device for a minimum period of time independent of the course of the actual height. Following expiration of the minimum control time, the adjustment is switched off at a point in time at which the measured actual height has attained the value of the target height for the first time.

Abstract: A portable cart, for use in camping, hunting and other outdoors activities carries canoes, small boats, game, injured parties or hauled cargo by hand. The portable cart can be converted to a canoe or boat cart which can be folded down and transported within the canoe or boat, or to a game cart for transporting game over long, rough terrain, or to a cargo hauling gear cart, all of which can broken down into a carrying position, by hand or by back. The portable cart can be carried by hand or as a backpack over rough terrain. Its width can be varied to accommodate watercraft of varying widths. The cart has optional removable clamps for clamping a conventional transportable carrier, such as a stretcher or stokes-type rescue carrier bed, thereto. Another optional bicycle pull clamp includes an ant-tipping attachment resisting centrifugal force urging said cart to tip over during a directional turn of the cart-hauling bicycle.

Abstract: A torsion beam type suspension is provided which includes a U-shaped stabilizer consisting of a stabilizer main body and a pair of laterally opposite stabilizer arms. The stabilizer main body is disposed in front of and along a torsion beam and rotatably supported on the torsion beam by means of brackets. The arms of the stabilizer are disposed along the inboard sides of the trailing arms and have axial ends connected to lower ends of connecting rods, respectively. The connecting rods are disposed so that the axes thereof extend vertically and connected at upper ends thereof to a vehicle body side member.

Abstract: A folding bicycle includes a folding mechanism that permits the folding bicycle in its extended state to be folded at an intermediate region between a front wheel and a rear wheel. The folding bicycle is folded by the folding mechanism such that the front wheel is brought to a position at one side of the rear wheel. An axle shift mechanism permits a axle of the rear wheel to be shifted to a position toward the intermediate region. A chain-holding mechanism holds a sprocket chain at a predetermined position when the axle is shifted to the position toward the intermediate region by the axle shift mechanism, to thereby release engagement between a rear wheel-side sprocket and the sprocket chain.