Abstract: An approach is provided for applying a release agent to a substrate having a first surface and a second surface. The approach involves determining a presence of at least one ink image applied to at least one portion of one of the first surface and the second surface of the substrate by way of one or more steps of a printing process. The approach also involves determining the substrate is to be made ready for printing one or more other images on the other of the first surface and the second surface by one or more steps of another printing process. The approach further comprising causing, at least in part, the release agent to be applied to the substrate so as to cover the at least one portion of the first surface and the second surface of the substrate upon which the at least one ink image is applied at a time before the substrate is subjected to the one or more steps of the another printing process.

Abstract: Hardmask films having high hardness and low stress are provided. In some embodiments a film has a stress of between about ?600 MPa and 600 MPa and hardness of at least about 12 GPa. In some embodiments, a hardmask film is prepared by depositing multiple sub-layers of doped or undoped silicon carbide using multiple densifying plasma post-treatments in a PECVD process chamber. In some embodiments, a hardmask film includes a high-hardness boron-containing film selected from the group consisting of SixByCz, SixByNz, SixByCzNw, BxCy, and BxNy. In some embodiments, a hardmask film includes a germanium-rich GeNx material comprising at least about 60 atomic % of germanium. These hardmasks can be used in a number of back-end and front-end processing schemes in integrated circuit fabrication.

Abstract: An electronic spraycoating control device for implementing spraycoating methods includes at least one manually driven program selecting element for selecting programs from two different groups of programs. The electronic spraycoating control device further includes a plurality of manually driven parameter setting elements and display units to automatically display the adjusted parameter references values.

Abstract: A gas supply system includes a main gas supply line; a vent gas supply line; a plurality of gas supply mechanisms disposed in middle of both gas supply lines; a pressure type flow-rate control system disposed on an inlet side of the main gas supply line so a flow of carrier gas is supplied to the main gas supply line; a pressure control system disposed on an inlet side of the vent gas supply line, a carrier gas having a predetermined pressure is supplied to the vent gas supply line while the pressure control system performs a pressure adjustment, a gas pressure of the main gas supply line detected downstream from an orifice of the pressure type flow-rate control system and a gas pressure of the vent gas supply line are compared, and the gas pressure of the vent gas supply line is adjusted so a difference therebetween becomes zero.

Abstract: An apparatus (100, 200) for coating specimens comprises a vacuum chamber (105, 205); at least one source, associated with the vacuum chamber, of a coating material; at least one sample holder (120) for positioning at least one sample within the vacuum chamber; an electronic control system; an operating console (103, 203) for inputting instructions for the electronic control system; and a housing (101, 201) surrounding at least the vacuum chamber and the electronic control system. The housing has a width (b, b?) that substantially corresponds to the width (b?) of the vacuum chamber. The vacuum chamber comprises a door (106, 206) on a front side of the chamber. The operating console is located in or in front of a base region (102, 202) of the housing. The at least one source is installable on an upper side of the vacuum chamber.

Abstract: In resin coating, carrying a light-passing member test-coated with a resin on a light-passing member carrying unit; making a light source placed above the light-passing member carrying unit emit excitation light exciting the fluorescent substance; measuring light emission characteristics of the light by irradiating the excitation light emitted from the light source unit from above to the resin coated onto the light-passing member and receiving the light that the resin emits from below the light-passing member by a light emission characteristic measurement unit; obtaining a deviation between a measurement result of the light emission characteristic measurement unit and a prescribed light emission characteristic; and deriving the appropriate resin coating quantity of the resin to be coated onto the LED element as what is used for practical production based on the deviation.

Abstract: A substrate processing apparatus which can securely show the status of recipe transition is provided. In a substrate processing apparatus 100 including a main control unit 312 which sends a control instruction to process a substrate, and a sub control unit 314 which carries out control of the apparatus in accordance with the control instruction from main control unit 312, the main control unit 312 has a memory unit 317 which stores plural recipes, a display control unit 336 which accepts an execution instruction to cause an arbitrary recipe of the plural recipes to be executed, and a display unit 334 which displays the arbitrary recipe designated by the display control unit 336, on an operation screen 308.

Abstract: Technologies are presented for growing graphene by chemical vapor deposition (CVD) on a high purity copper surface. The surface may be prepared by deposition of a high purity copper layer on a lower purity copper substrate using deposition processes such as sputtering, evaporation, electroplating, or CVD. The deposition of the high purity copper layer may be followed by a thermal treatment to facilitate grain growth. Use of the high purity copper layer in combination with the lower purity copper substrate may provide thermal expansion matching, compatibility with copper etch removal, or reduction of contamination, producing fewer graphene defects compared to direct deposition on a lower purity substrate at substantially less expense than deposition approaches using a high purity copper foil substrate.

Abstract: Provided is a semiconductor device manufacturing method and a substrate processing apparatus. The method comprise: a first process of forming a film containing a predetermined element on a substrate by supplying a source gas containing the predetermined element to a substrate processing chamber in which the substrate is accommodated; a second process of removing the source gas remaining in the substrate processing chamber by supplying an inert gas to the substrate processing chamber; a third process of modifying the predetermined element-containing film formed in the first process by supplying a modification gas that reacts with the predetermined element to the substrate processing chamber; a fourth process of removing the modification gas remaining in the substrate processing chamber by supplying an inert gas to the substrate processing chamber; and a filling process of filling an inert gas in a gas tank connected to the substrate processing chamber.

Abstract: The heat treating furnace for the gas reaction includes an outer body, an inner body, a heating mechanism, gas supplying mechanism, and a controller. Using the controller to control the amount of gas supply effectively keeps the first pressure (P1) in the gas circulation chamber outside the inner body greater than the second pressure (P2) in the reaction chamber inside the inner body all the time. In this way, the flow rate of gas inlet, reaction rate, cooling rate can be facilitated, and the uniformity of the thin film and the operational safety can be improved.

Abstract: Systems and methods for processing a substrate include a) arranging a substrate on a pedestal in a processing chamber; b) supplying precursor to the processing chamber; c) purging the processing chamber; d) performing radio frequency (RF) plasma activation; e) purging the processing chamber; and f) prior to purging the processing chamber in at least one of (c) or (e), setting a vacuum pressure of the processing chamber to a first predetermined pressure that is less than a vacuum pressure during at least one of (b) or (d) for a first predetermined period.

Abstract: A moveable dispenser assembly including is shown. The dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier. An opening at an end of said dispenser dispenses the bonding adhesive onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. A one controller for sends a control signal that triggers moving of said moveable dispenser assembly for mixing said bonding adhesive before dispensing said volume of bonding adhesive onto said surface of said workpiece. The controller includes logic to control of movements such as oscillations to keep the bonding adhesive well mixed based on a comparing a parameter to be in a predetermined limit or range.

Abstract: A robot coating system (1) includes a robot moving unit (21) which makes a robot (11) having a coating gun (12) successively move to a plurality of planned coating positions, a readying pressure imparting unit (22) which drives a pump (13) of the coating gun before reaching the planned coating positions and imparts to the viscous material a predetermined readying pressure without coating the viscous material, a coating executing unit (23) which executes coating work of the viscous material by a predetermined flow rate over a predetermined coating time when the coating gun has reached a planned coating position, and a post-coating stopping unit (24) which continues the coating work to make the pump stop after the end of the work when executing the coating work and a stop command of the robot is issued.

Abstract: In at least some examples, a three-dimensional (3D) printing system comprises a coarse 3D printing interface to form a 3D object core. The 3D printing system also comprises a fine 3D printing interface to form a 3D object shell around at least some of the 3D object core. The 3D printing system also comprises a controller to receive a dataset corresponding to a 3D object model and to direct the coarse 3D printing interface to form the 3D object core based on the dataset.

Abstract: The invention relates to a device for the internal treatment of pipes, in particular for coolant tubes of steam condensers and heat exchangers, comprising a supply unit (V) for feeding and conveying treatment media, an application unit (A) to apply the treatment media fed in by the supply unit, as well as a control unit to monitor and control the supplied treatment media and the application of treatment media to the inner wall of the pipes, wherein the application unit (A) is provided with a guiding hose (21) through which an application hose (18) extends designed so as to be inserted into the pipe to be treated, said application hose (18) terminating in a nozzle, wherein the application hose (18) can be wound up in a single layer on a driven reel (17) and secured on the reel (17) by means of tensioning belts, the application hose (18) is capable of moving forward and back via guide rollers (27) arranged on a traversing carriage (55), the guide rollers (27) are powered by a drive operating synchronously with

Abstract: A dynamically tunable process kit, a processing chamber having a dynamically tunable process kit, and a method for processing a substrate using a dynamically tunable process kit are provided. The dynamically tunable process kit allows one or both of the electrical and thermal state of the process kit to be changed without changing the phyisical construction of the process kit, thereby allowing plasma properties, and hence processing results, to be easily changed without replacing the process kit. The processing chamber having a dynamically tunable process kit includes a chamber body that includes a portion of a conductive side wall configured to be electrically controlled, and a process kit. The processing chamber includes a first control system operable to control one or both of an electrical and thermal state of the process kit and a second control system operable to control an electrical state of the portion of the side wall.

Abstract: In manufacturing light emitting element packages by coating the top surfaces of LED elements with the resin containing the fluorescent substance, in a resin supplying operation of discharging to supply the resin onto the LED elements in a wafer state, the light emission characteristics of the light that the resin emits when excitation light from a light source part is irradiated onto a light-passing member on which the resin is test supplied for light emission characteristic measurement are measured, and the appropriate resin supply quantity is revised based on the result of the measurement and light emission characteristics prescribed beforehand, to derive an appropriate resin supply quantity of the resin which should be supplied to the LED elements for practical production.

Abstract: Apparatus (1, 26) for depositing a layer (37, 38, 39) on a substrate (2) in a process gas comprises a chuck (3) comprising a first surface (4) for supporting the substrate (2), a clamp (4) for securing the substrate (2) to the first surface (14) of the chuck (3), an evacuatable enclosure (5) enclosing the chuck (3) and the clamp (4) and comprising an inlet, through which the processing gas is insertable into the enclosure (5), and control apparatus (19). The control apparatus (19) is adapted to move at least one of the chuck (3) and the clamp (4) relative to, and independently of, one another to adjust a spacing between the chuck (3) and the clamp (4) during a single deposition process whilst maintaining a flow of the processing gas and a pressure within the enclosure (5) that is less than atmospheric pressure.

Abstract: Embodiments of the invention provide systems and methods for insulating a component of a home or building. An insulated component may include a generally planar surface and a frame positioned atop one side of the generally planar surface. The frame may include a plurality of outer studs coupled together to form an outer periphery and inner studs that divide the frame into one or more sections. One or more of the sections may include a cavity or hollow space. The insulated component may also include a first layer of insulation within one or more of the cavities. The first layer of insulation may include a pour insulation material that transitions from a liquid state or phase to a solid state or phase.

Abstract: In a plasma reactor having a driven electrode and a counter electrode, an impedance controller connected between the counter electrode and ground includes both series sand parallel variable impedance elements that facilitate two-dimensional movement of a ground path input impedance in a complex impedance space to control spatial distribution of a plasma process parameter.

Abstract: A surface wave plasma (SWP) source couples pulsed microwave (MW) energy into a processing chamber through, for example, a radial line slot antenna, to result in a low mean electron energy (Te). To prevent impingement of the microwave energy onto the surface of a substrate when plasma density is low between pulses, an ICP source, such as a helical inductive source, a planar RF coil, or other inductively coupled source, is provided between the SWP source and the substrate to produce plasma that is opaque to microwave energy. The ICP source can also be pulsed in synchronism with the pulsing of the MW plasma in phase with the ramping up of the MW pulses. The ICP also adds an edge dense distribution of plasma to a generally chamber centric MW plasma to improve plasma uniformity.

Abstract: An apparatus and method for liquid treatment of wafer-shaped articles comprises a process unit comprising a chuck for holding a wafer-shaped article in a predetermined orientation, and a liquid recovery system that receives used process liquid recovered from the process unit. The liquid recovery system supplies process liquid to a dispenser in the process unit. A supply of fresh process liquid supplies fresh process liquid to the liquid recovery system and also supplies fresh process liquid to a dispenser in the process unit while bypassing the liquid recovery system.

Abstract: In a continuous processing system, a controller of a heat treatment apparatus calculates a weight of each layer from input target film thicknesses of a phosphorous-doped polysilicon film (D-poly film) and an amorphous silicon film (a-Si film), and calculates activation energy of stacked films based on the calculated weight and activation energy. The controller prepares a stacked film model based on the calculated activation energy and a relationship of a temperature of each zone and film thicknesses of the D-poly film and the a-Si film, and calculates an optimum temperature of each zone by using the prepared stacked film model. The controller controls power controllers of heaters to set a temperature in a reaction tube to be the calculated temperature of each zone and forms stacked films on a semiconductor wafer by controlling a pressure adjusting unit, flow rate adjusting units, etc.

Abstract: A device for adjusting components of a printing material processing machine, in particular a folding-box gluing machine, includes at least one group of processing stations which have an associated operating element and a remote control as well as a safety-path computer and an operating-path computer. A first step for initiating an adjustment process of the components is carried out by a common signal transmitter both when operating a switch on the machine and when operating the remote control.

Abstract: According to an embodiment of the present invention, a heat treatment system is provided. The heat treatment system includes a heating unit, a heat treatment condition memory unit, a power change model memory unit, a heat treatment change model memory unit, a heat treatment result reception unit, and an optimal temperature calculation unit. In the heat treatment system, the optimal temperature calculation unit calculates the power of the heating unit at a corresponding temperature based on the model stored in the power change model memory unit and the calculated temperature, and an optimal temperature is a temperature at which a heat treatment result is closest to the targeted heat treatment result within a range in which the calculated power of the heating unit is not saturated.

Abstract: According to an embodiment, a non-transitory computer readable recording medium that records a dropping position setting program is provided. The dropping position setting program causes a computer to execute extracting a large pattern region whose pattern size is larger than a preset reference value from a template pattern used for imprinting and setting a first dropping position within a predetermined range from a position of the large pattern region and a second dropping position in a region other than the first dropping position as a dropping position of resist to be dropped in an imprint shot on a processing target substrate.

Abstract: A portable device and a method for the decorative design of fields and grass surfaces with graphics, texts, logos, reliefs, engraved designs, or patterns is presented, where the transfer of the design to the surface is carried out by means of a principle analogous to that used in a plotter or printer. The device is so conceived that at least one guiding element with at least one treatment actuator for applying a design to a surface is guided in a circular motion around a reference point by means of a drive unit. A circular treatment area results from this rotational movement. Within this treatment area, each point can be reached by the treatment actuator (realized e.g. as a spraying device having at least one nozzle) for the application of the design. The control mechanism of the device ensures that the treatment actuator undertakes the application of the design to the surface either while passing over the point to be treated or after positioning is complete.

Abstract: A film forming apparatus includes a processing chamber, and a mounting table disposed in the processing chamber to mount a substrate thereon. The film forming apparatus further includes a gas shower head having gas supply holes and including a central region facing a central portion of the substrate and a peripheral region facing a peripheral portion of the substrate, a first processing gas supply unit for supplying a first processing gas to the central region, a second processing gas supply unit for supplying a second processing gas to the central region, an energy supply unit for supplying energy to react the first processing gas with the second processing gas on the substrate, and a purge gas supply unit for supplying a purge gas to the central region and the peripheral region when one of the first and the second processing gas is switched by the other.

Abstract: A split-pumping system and method for semiconductor fabrication process chambers is provided. The split pumping method may provide two separate exhaust paths, each configured to evacuate a different process gas. The exhaust paths may be configured to not evacuate process gases other than the process gas that the exhaust path is configured to evacuate.

Abstract: Apparatus and systems may operate to provide a first reactant as a gas that flows under reduced atmospheric pressure to interact with a surface, such as a tool body surface, the interaction confined to a passage within the tool body, wherein the passage includes the surface and extends without interruption from an entrance end of the passage to an exit end of the passage. Additional activity may include providing a second reactant as a gas under the reduced atmospheric pressure, subsequent to the first reactant, to interact with the surface of the tool body; and repeated provision of the first and second reactants until a selected coating thickness on the surface is formed. Additional apparatus, systems, and methods are disclosed.

Abstract: The present application relates to methods for depositing a smooth, germanium rich epitaxial film by introducing silylgermane as a source gas into a reactor at low temperatures. The epitaxial film can be strained and serve as an active layer, or relaxed and serve as a buffer layer. In addition to the silylgermane gas, a diluent is provided to modulate the percentage of germanium in a deposited germanium-containing film by varying the ratio of the silylgermane gas and the diluent. The ratios can be controlled by way of dilution levels in silylgermane storage containers and/or separate flow, and are selected to result in germanium concentration greater than 55 atomic % in deposited epitaxial silicon germanium films. The diluent can include a reducing gas such as hydrogen gas or an inert gas such as nitrogen gas. Reaction chambers are configured to introduce silylgermane and the diluent to deposit the silicon germanium epitaxial films.

Abstract: In a resin coating which is used in the manufacture of an LED package which is made by covering an LED element with resin that includes fluorescent substance, a light-passing member (43) on which the resin (8) is test coated for light emission characteristic measurement is carried on a light-passing member carrying unit (41), a deviation between a measurement result obtained after the light emission characteristic of the light that the resin (8) emits, when an light source unit (45), which is placed above, emits excitation light which excites the fluorescent substance, and irradiates the excitation light from above to the resin (8) which is coated on the light-passing member (43), is measured and the light emission characteristic prescribed beforehand is obtained, and an appropriate resin coating quantity with which the resin should be coated on the LED element is derived for practical production based on the deviation.

Abstract: A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating material 43 is located by a clamp unit 63, a trial coating of resin applied to the trial coating material 43 is irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit 39. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.

Abstract: A method and apparatus for galvanizing an elongated object, such as, but not limited to, a metal strip, wire, or rod, using gaseous nitrogen, a mixture of gaseous and liquid nitrogen, and combinations thereof is described herein.

Abstract: The present invention is a method of developing a resist film on a substrate using a developing solution at a predetermined temperature lower than room temperature, including a first cooling step of mounting and cooling the substrate on a cooling plate at a temperature lower than room temperature and higher than the predetermined temperature in a cooling apparatus; a second cooling step of then carrying the substrate into a developing apparatus and supplying a rinse solution at the predetermined temperature or lower onto the substrate to cool the substrate in the developing apparatus; a developing step of then supplying the developing solution onto the substrate and developing the resist film on the substrate to form a resist pattern in the resist film; and a cleaning step of then supplying a rinse solution at the predetermined temperature onto the substrate to clean a front surface of the substrate.

Abstract: A method of manufacturing a solar cell according to an aspect includes detecting a positioning pattern that includes at least a part of an ion implantation pattern in which an ion is implanted into a predetermined region of a solar cell substrate, and performing relative positioning between a process unit and the solar cell substrate, wherein the process unit executes a predetermined process based on the detected positioning pattern when the predetermined process is executed to the solar cell substrate.

Abstract: Systems and methods for state-based adjustment of power and frequency are described. A primary generator of a system includes a primary power supply for supplying a primary radio frequency (RF) signal to an electrode. The primary generator further includes an automatic frequency control (AFC) to provide a first frequency input to the primary power supply when a pulsed signal is in a first state. A secondary generator of the system includes a secondary power supply for supplying a secondary RF signal to the electrode. The secondary generator also includes an AFC to provide a second frequency input to the secondary power supply when the pulsed signal is in the first state. The secondary generator includes an AFC to provide a third frequency input to the secondary power supply when the pulsed signal is in a second state. The system includes a digital pulsing source for generating the pulsed signal.

Abstract: The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

Abstract: In a resin coating used for manufacturing an LED package including an LED element coated with resin containing phosphor, a light-transmitting member test-coated with resin for an emission characteristic measurement on a light-transmitting member placing section including a light source unit, a deviation between a measurement result of an emission characteristic of light emitted from the resin coated on the light-transmitting member measured by an emission characteristic measurement unit by irradiating the resin with excitation light emitted from the light source unit and a prescribed emission characteristic is obtained, and an appropriate resin coating amount of the resin to be coated on the LED element for an actual production is derived based on the deviation.

Abstract: Developed is high-efficiency synthesis method and apparatus capable of promoting the initial growth of carbon nanostructure by eliminating the initial fluctuation time and rising time in raw gas flow quantity.-A high-efficiency synthesis method of carbon nanostructure according to the present invention is a high-efficiency synthesis method of carbon nanostructure, the method comprising: bringing raw material gas and a catalyst into contact with each other under reactive conditions so as to produce a carbon nanostructure, wherein: the initiation of contact of the raw material gas with the catalyst is carried out instantaneously. Reaction conditions such as temperature and raw material gas concentration are set so as to meet those for catalyst growth, and under the reaction conditions, the initiation of contact of raw material gas G with catalyst 6 is carried out instantaneously.

Abstract: A resist coating apparatus supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then decelerates the rotation of the substrate to a second rotational speed lower than the first rotational speed, or until rotational halt, makes the deceleration smaller in the deceleration step as the rotational speed becomes closer to the second rotational speed or the rotational halt, and accelerates the rotation of the substrate to a third rotational speed higher than the second rotational speed to spin off a residue of the resist solution.

Abstract: Disclosed is a substrate processing system, including: a processing chamber to process a substrate; a vaporizing unit to vaporize a material of liquid; a supply system to supply the processing chamber with gas of the material vaporized by the vaporizing unit; an exhaust system to exhaust an atmosphere in the processing chamber; and a cleaning liquid supply system to supply the vaporizing unit with cleaning liquid for cleaning a product deposited in the vaporizing unit, wherein the cleaning liquid supply system supplies at least two kinds of cleaning liquids into the vaporizing unit so that the product can be removed from the vaporizing unit by action of the two kinds of cleaning liquids on the product.

Abstract: A vapor deposition method and apparatus including at least two vessels containing a same first source chemical. A controller is programmed to simultaneously pulse to the reaction space doses or pulses of a gas from the vessels, each of the doses having a substantially consistent concentration of the first source chemical. The apparatus may also include at least two vessels containing a same second source chemical. The controller can be programmed to simultaneously pulse to the reaction space doses or pulses of a gas from the vessels containing the second source chemical, each of the doses having a substantially consistent concentration of the second source chemical. The second source chemical can be pulsed to the reaction space after the reaction space is purged of an excess of the first source chemical.

Abstract: Described are apparatus and methods for forming films comprise indium and arsenic. In particular, these films may be formed in a configuration of two or more chambers under “load lock” conditions. These films may include additional components as dopants, such as aluminum and/or gallium. Such films can be used in metal/silicon contacts having low contact resistances. Also disclosed are devices including the films comprising indium arsenide.

Abstract: Technologies are generally described for a system and process effective to coat a substance with graphene. A system may include a first container including graphene oxide and water and a second container including a reducing agent and the substance. A third container may be operative relationship with the first container and the second container. A processor may be in communication with the first, second and third containers. The processor may be configured to control the third container to receive the graphene oxide and water from the first container and to control the third container to receive the reducing agent and the substance from the second container. The processor may be configured to control the third container to mix the graphene oxide, water, reducing agent, and substance under sufficient reaction conditions to produce sufficient graphene to coat the substance with graphene to produce a graphene coated substance.

Abstract: The present invention discloses systems and methods for printing functional blocks from a plurality of printheads to a target substrate. In exemplary embodiments, the printing system comprises a main printhead for the majority of printing process, and a secondary printhead for supplemental printing. The system further comprises a controller, utilizing a positioning intelligence system to distribute the printing of the functional blocks between the main printhead and the secondary printhead, to minimize the motions of the printheads while maximize the printing speed.

Abstract: A system of pointillist painting comprises an automated 3-D positioning system disposed proximate a painting surface, a colorant dispenser coupled to the gantry structure and having a dispensing tip in fluid communication with a colorant chamber, the gantry structure operable to move the colorant dispensing tip to a specified position of the painting surface, where the colorant dispenser is operable to apply a specified amount of a colorant to the painting surface and creating a dot having a two-dimensional coverage and three-dimensional profile at the specified position.

Abstract: A 3-D printer system moves a printed tool over a print surface with a mechanism controlling a rotational angle of an arm holding the print tool and a revolutionary angle of axis of rotation of the printable area to eliminate the disadvantages of conventionally used linear motion mechanisms

Abstract: A substrate transfer device includes a pick which has positioning pins to position a substrate and holds a positioned substrate; a drive unit which drives the pick such that the substrate is loaded/unloaded to/from a vacuum processing unit by using a pick; and a transfer control unit which controls a transfer operation of the substrate using the pick. The transfer control unit obtains in advance information on a reference position of the substrate at room temperature when the substrate is loaded into the vacuum processing unit, calculates a positional deviation from the reference position of the substrate when the substrate is loaded into the vacuum processing unit in actual processing, and controls a drive unit such that the substrate is loaded into the vacuum processing unit by correcting the positional deviation.

Abstract: An apparatus (100) for applying product to the skin of a person in a booth (10), comprising: an applicator (57) configured to apply the product to the person; a first guide (40) configured to guide movement of an applicator in a first dimension, in order to enable the applicator to apply the product to the person at a plurality of different heights; and a second guide (20) configured to guide movement of the applicator in a second dimension, in order to enable the applicator to apply the product across the width of the person. The apparatus may comprise control circuitry for controlling the applicator in dependence upon the weight of the person.