Abstract: Treating absorbable sutures that have been sterilized using ethylene oxide with carbon dioxide at or near its supercritical pressure and temperature conditions to remove any residual ethylene oxide.

Abstract: A multi-chambered deposition pin wash station is provided. The wash station includes a lower chamber and an upper drain basin connected by a plurality of wash tubes. Cleaning fluid is provided to the lower chamber and passes through the cleaning tubes into the upper drain basin. The cleaning tubes are adapted to clean a single deposition pin with a single tube per wash cycle.

Abstract: An apparatus for cleaning substrates on a carrier, which has in the interior thereof a plurality of longitudinal passages, which run parallel to one another and are connected to the outside at the underside of the carrier via openings. There is provided a plurality of elongated pipes, which are arranged on a pipe holder and are connected in a fluid-conducting manner to a fluid supply. A centering template is provided, which encompasses the pipes and is displaceable in the longitudinal direction thereof between an attachment position in the end region of the pipes away from the pipe holder and a working position, which lies between the attachment position and the pipe holder. The centering template bears against the carrier, such that the pipes are then aligned exactly with the longitudinal passages.

Abstract: A method includes generating a solvent-containing vapor that contains a solvent. The solvent-containing vapor is conducted to a package assembly to clean the package assembly. The solvent-containing vapor condenses to form a liquid on a surface of the package assembly, and flows off from the surface of the package assembly.

Abstract: A method for cleaning a semiconductor wafer composed of silicon directly after a process of chemical mechanical polishing of the semiconductor wafer includes transferring the semiconductor wafer from a polishing plate to a first cleaning module and spraying both side surfaces of the semiconductor wafer with water at a pressure no greater than 1000 Pa at least once while transferring the semiconductor wafer. The semiconductor wafer is then cleaned between rotating rollers with water. The side surfaces of the semiconductor wafer are sprayed with an aqueous solution containing hydrogen fluoride and a surfactant at a pressure no greater than 70,000 Pa. Subsequently, the side surfaces are sprayed with water at a pressure no greater than 20,000 Pa. The wafer is then dipped into an aqueous alkaline cleaning solution, and then cleaned between rotating rollers with a supply of water. The semiconductor wafer is then sprayed with water and dried.

Abstract: The apparatus and method for sterilising caps/stoppers for pharmaceutical purposes comprises a vessel, pump, heater, circulation line. The sterilising liquid (hot water, steam) is heated and pumped to the vessel where a fluidised bed of caps etc. is generated. After leaving the vessel the liquid is circulated/heated. Optionally an additive (siliconisation in case rubber parts) or cooling liquid is added. Further, the vessel is disconnectably attached to the supply lines for transportation to a production facility.

Abstract: A method of monitoring a surfactant in a microelectronic process is disclosed. Specifically, the monitoring of a surfactant occurs by studying the absorbance of a sample collected from a microelectronic process.

Abstract: A method of perfuming in automatic dishwashing comprising the step of providing a first perfume into an automatic dishwashing machine wherein the first perfume is capable of generating a second perfume comprising from about 0.001% to about 10% by weight thereof of a sulphurous compound.

Abstract: A method of manufacturing a disk drive device including: assembling a subassembly by fixing at least a bearing unit, a drive unit and a hub to a base member in a first clean room; cleaning the subassembly in a second clean room; and sealing the subassembly by a sealing member. The first clean room and the second clean room are communicated with each other by a communicating opening for transferring the subassembly, and an atmospheric pressure in the second clean room is equal to or higher than that in the first clean room.

Abstract: An apparatus and method of supporting a large number of optical lenses having opposed lens surfaces and an outer peripheral area including a rotatable holder for supporting and retaining the lenses and a drive device coupled to the holder for rotatably driving the holder to centrifugally force a liquid from the surface of the lenses. The method includes positioning the lenses within the holder and retaining the rod lenses in a manner allowing all of the surfaces to be cleaned and dried without contacting the opposed lens surfaces to the holder, applying a liquid to the exposed surface of the lenses, and spinning the lenses at a high rate of speed to clean and dry them. To increase the effectiveness of the apparatus, the drive device can include ultrasonic transducers for ultrasonically cleaning the rod lenses while they are held within the holder.

Abstract: Methods for monitoring meniscus processing of a wafer surface to stabilize a meniscus are provided. In one example, the processing is in response to a current recipe that defines a desired gap between the wafer surface and a proximity head. The method includes the operations of monitoring current meniscus processing to determine that a current gap is other than the desired gap, and identifying a calibration recipe that specifies the current gap. The method then continues the meniscus processing of the wafer surface using process parameters specified by the identified calibration recipe.

Abstract: The present invention relates to apparatus and methods for making a peroxycarboxylic acid. The apparatus includes a reaction catalyst and a guard column for pretreating one or more reagents, which can increase the life, activity, and/or safety of the reaction catalyst. The peroxycarboxylic acid compositions made by the method and apparatus can include one or more peroxycarboxylic acids.

Abstract: A method for removing a hardened photoresist from a semiconductor substrate. An example method for removing a hardened photoresist layer from a substrate comprising a low-? dielectric material preserving the characteristics of the low-?dielectric material includes: a)—providing a substrate comprising a hardened photoresist layer and a low-? dielectric material at least partially exposed; b)—forming C?C double bonds in the hardened photoresist by exposing the hardened photoresist to UV radiation having a wavelength between 200 nm and 300 nm in vacuum or in an inert atmosphere; c)—breaking the C?C double bonds formed in step b) by reacting the hardened photoresist with ozone (O3) or a mixture of ozone (O3) and oxygen (O2) thereby fragmenting the hardened photoresist; and d)—removing the fragmented photoresist obtained in step c) by wet processing with cleaning chemistries.

Abstract: A method for processing a photomask for semiconductor devices. The method includes providing a partially completed mask structure, which has a backside and a face. The face includes a substrate material, a light blocking layer overlying the substrate material, and an overlying patterned photoresist layer overlying the light blocking layer. The method includes supporting the backside of the mask structure to maintain the mask structure in place and maintaining the face of the patterned photoresist layer in a direction parallel to a gravitational force and toward the gravitational force. The method includes rotating the mask structure in an annular manner as the patterned photoresist layer of the mask structure is being maintained in the direction parallel to the gravitational force and toward the gravitational force.

Abstract: Cleaning contact lenses by placing each contact lens in a daily use contact lens case with contact lens solution such as sterile saline or lens cleaning/disinfecting solution, placing the case in a liquid in a cleaning tank of an ultrasonic cleaning device operating at a frequency and power level sufficient to clean each lens in a convenient time period.

Abstract: A washing device of a substrate for a magnetic recording medium of the present invention includes an immersion tank; a plurality of screw conveyors that are provided in the immersion tank and that hold the substrates for a magnetic recording medium; and a rotation mechanism that causes synchronous rotation of and supports the plurality of screw conveyors, wherein both ends of main shafts of the screw conveyors are provided outside of the immersion tank, the main shafts of these screw conveyors penetrate the tank walls of the immersion tank in a non-contact manner, and the plurality of substrates for a magnetic recording medium that are held by the plurality of screw conveyors are washed by a wet process using a washing liquid that is contained in the immersion tank.

Abstract: Disclosed is a substrate cleaning method for prevent damage to a pattern formed on a substrate. The substrate cleaning method includes cleaning the substrate by striking cleaning particulates carried in a flow of dry air or inert gas against a surface of the substrate, and removing the cleaning particulates.

Abstract: Methods and apparatuses for cleaning a surface of a substrate are presented. The method comprises positioning a substrate at a controllable distance from a piezoelectric transducer, supplying a cleaning liquid between the substrate and the transducer, applying an oscillating acoustic force to the cleaning liquid by actuating the transducer, and moving the transducer relative to the substrate. The method further comprises, while moving the transducer relative to the substrate, measuring a value that indicates a distance between a surface of the substrate and the transducer, comparing the measured value to a desired value, and adjusting the distance between the surface and the transducer so that the measured value is maintained substantially equal to the desired value. The measured value may be the distance between the surface of the substrate and the transducer or a phase shift between an alternating current and voltage applied to the transducer.

Abstract: Methods are provided for descaling metallic component devices such as stents. The devices or components are cleaned under ultrasound in a cleaning solution of ammonium hydrogen fluoride at a temperature within a range of about 60° to 80° C., then rinsed at that temperature with an aqueous rinse containing a nonionic surfactant and rinsed again with purified water.

Abstract: A resist removing device 1 functions to remove a resist from a substrate while preventing occurrence of popping phenomenon and at the same time attains reduction in cost of energy for the resist removing and has a simplified constitution. The resist removing device 1 is equipped with a chamber 2 for containing therein a substrate 16 (for example, a substrate having a high-doze ion implanted resist), and with a pressure below the atmospheric pressure, the chamber 2 is fed with ozone gas, unsaturated hydrocarbons and water vapor. The ozone gas may be an ultra-high concentrated ozone gas that is produced by subjecting an ozone containing gas to a liquefaction-separation with the aid of a vapor pressure difference and then vaporizing the liquefied ozone. For cleaning the substrate 16 thus treated, it is preferable to use ultra-pure water. The chamber 2 is equipped with a susceptor 15 for holding the substrate 16. The susceptor 15 is heated to a temperature of 100° C. or below.

Abstract: A method for controlling operation of a washing machine is provided. The method may include performing heated washing courses at different temperatures while also selectively controlling an operating rate of a driving motor to enhance sterilizing effects on items being washed while protecting against damage to the items being washed. Performing these heated washing courses may include selecting an infant clothes oriented washing program from a plurality of washing programs, and performing a washing operation in accordance with one of a plurality of operating modes associated with the selected infant clothes oriented washing program, including controlling at least one of a washing course temperature or an operating rate of a driving motor of the washing machine.

Abstract: Provided is a substrate processing method that prevents generation of watermarks on a substrate and can be performed at a low cost. The method controls the ambient humidity around the substrate depending on the kind of the chemical liquid, when the substrate is processed with the chemical liquid. The control of the humidity is performed at least in a drying step that dries the substrate W. In one embodiment, the ambient humidity around the substrate is controlled when a fluid containing IPA as a drying fluid is supplied to the substrate W after processing the substrate W with the chemical liquid.

Abstract: Provided is a lifting and drying device for cleaning substrates by immersing one or more disk-like substrates with a central hole into a cleaning liquid disposed in a cleaning tank and lifting and drying the substrates, the lifting and drying device including: a hanger mechanism that is inserted through the central hole of the substrates and supports a plurality of the substrates while being hung thereon; an elevation mechanism that elevates the hanger mechanism between a position where the substrates are immersed into the cleaning liquid inside the cleaning tank and a position where the substrates are lifted from the cleaning tank; and an ejection mechanism that is disposed in the cleaning tank and ejects the cleaning liquid from the downside of the hanger mechanism toward the substrate.

Abstract: Methods for processing substrates in dual chamber processing systems comprising first and second process chambers that share resources may include performing a first internal chamber clean in each of the first process chamber and the second process chamber; and subsequently processing a substrate in one of the first process chamber or the second process chamber by: providing a substrate to one of the first process chamber or the second process chamber; providing a process gas to the first process chamber and the second process chamber; forming a plasma in only the one of the first process chamber or the second process chamber having the substrate contained therein; and providing an inert gas to the first process chamber and the second process chamber via one or more channels formed in a surface of respective substrate supports disposed in the first process chamber and the second process chamber while processing the substrate.

Abstract: The present invention relates to cleaning compositions comprising conversion agents and methods of using them. The conversion agents of the present invention comprise water insoluble compounds such as metal oxides, metal hydroxides, and combinations thereof. The compositions can be substantially free of a builder, e.g., a chelating agent, sequestrant, and/or threshold agent, while still achieving effective soil removal.

Abstract: Methods are provided for descaling metallic components devices such as stents. The devices or components are cleaned under ultrasound in a cleaning solution of ammonium hydrogen fluoride at a temperature within a range of about 60° to 80° C., then rinsed at that temperature with an aqueous rinse containing a nonionic surfactant and rinsed again with purified water.

Abstract: A substrate cleaning apparatus for cleaning a front-side clean target surface 1a and a back-side clean target surface 1b of a edge portion of a substrate 1 by wiping surfaces 12a, 12b of a cleaning tape 12. The substrate cleaning apparatus includes a presser member 11a for pressing the cleaning tape 12 against the clean target surface 1a, a presser member 11b for pressing the cleaning tape 12 against the clean target surface 1b, a tape path passing through between the presser member 11a and the clean target surface 1a and between the presser member 11b and the clean target surface 1b, a moving device for moving the cleaning tape 12 and the substrate 1 relative to each other in a longitudinal direction of the edge portion.

Abstract: Disclosed herein is a cleaning method useful in removing contaminants from a surface of a coating which comprises an oxide or fluoride of a Group III B metal. Typically the coating overlies an aluminum substrate which is present as part of a semiconductor processing apparatus. The coating typically comprises an oxide or a fluoride of Y, Sc, La, Ce, Eu, Dy, or the like, or yttrium-aluminum-garnet (YAG). The coating may further comprise about 20 volume % or less of Al2O3.

Abstract: A method for manufacturing a semiconductor device includes the step of conducting a cleaning process for a wafer formed with copper wiring lines to remove contaminations produced on a back surface of the wafer. The cleaning process is conducted by injecting onto the back surface of the wafer an etchant for removing contaminations and simultaneously injecting onto a front surface of the wafer a reductant containing hydrogen.

Abstract: An at-home integrated cleaning and disinfection system for dental hardware, for consumer use includes a compact and portable base unit sized for at-home use by a consumer, the base unit including a holding frame and an ultraviolet lamp. The system also includes a cleaning chamber within which dental hardware and a cleaning solution that includes hydrogen peroxide are receivable. The cleaning chamber fits within the holding frame in a manner such that contents of the cleaning chamber are exposed to light emitted by the ultraviolet lamp. A vibration mechanism is positioned so as to cause the cleaning chamber to vibrate while the cleaning chamber is fitted within the holding frame. To clean and disinfect dental hardware, the consumer places dental hardware in the cleaning chamber, fills the cleaning chamber with the cleaning solution, and inserts the cleaning chamber into the holding frame.

Abstract: The liquid composition is based on surfactants and enzymes, and is particularly useful for manual cleaning of instruments. In manual and ultrasonic application the composition in use concentration shows low foaming and gives a cleaning solution which is not cloudy at least at a temperature in the range from 16° C. to 40° C. In addition, the composition has good cleaning efficacy over a broad temperature range (20 to 55° C.) and shows good material compatibility.

Abstract: An article comprising a first pouch made of a water-soluble material containing a first solid and/or liquid composition and a second pouch made of a water-soluble material containing a second solid and/or liquid composition characterized in that at least one of the first and second pouches is made from a material which remains substantially intact when immersed in water under a first set of conditions but will readily dissolve or disintegrate when immersed in water under a second set of conditions.

Abstract: A laundry stain and soil pretreatment sheet including a water soluble or water dispersible carrier layer, preferably polyvinyl alcohol, a removable separator layer, and a layer of cleaning agent composition therebetween. The separator layer is removed, the composition layer is adhered to a stain on clothing, and the clothing is laundered to treat the stain. The carrier layer dissolves or disperses during the laundering. A method of treating a stained or soiled area of a fabric using the sheet is also disclosed.

Abstract: After a water film is formed on a wafer front surface in a chamber, the water film is supplied sequentially with an oxidizing component of an oxidation gas, an organic acid component of an organic acid mist, an HF component of an HF gas, the organic acid mist, and the oxidizing component of the oxidation gas. As a result, the HF component and the organic acid component provide cleaning effect on the wafer surface, and a concentration of the cleaning components in the water film within a wafer surface can be even.

Abstract: Semiconductor processing compositions for use with silicon wafers having an insulating layers and metallization layers on the wafers comprising water and one or more Troika acids which is also referred to as ?,?-disubstituted trifunctional oximes or ?-(Hydroxyimino) Phosphonoacetic acids, their salts, and their derivatives.

Abstract: A device for disinfecting a portion of an implement such as a needleless hub or injection port. The device includes a body shaped to engage the implement with the portion to be disinfected exposed. A disinfectant area is located on the body so as to permit pivotal displacement of the area relative to the body such that in a first orientation the portion to be disinfected is exposed and in a second orientation the portion to be disinfected is covered and the disinfectant area engages the portion to be disinfected.

Abstract: Disclosed is a polycrystalline silicon washing apparatus that sequentially immerses polycrystalline silicon into a plurality of acid baths each of which is filled with an acid to wash the polycrystalline silicon. The temperatures of the acids in the acid baths are set such that the temperature of the acid in a later acid bath of adjacent acid baths is equal to or lower than that of a former acid bath and the temperature of the acid in the last acid bath is lower than that of the acid in the first acid bath. Each of the acid baths is provided with a temperature adjusting unit that controls the temperature of the acid at a constant value.

Abstract: The liquid composition is based on surfactants and enzymes, and is particularly useful for manual cleaning of instruments. In manual and ultrasonic application the composition in use concentration shows low foaming and gives a cleaning solution which is not cloudy at least at a temperature in the range from 16° C. to 40° C. In addition, the composition has good cleaning efficacy over a broad temperature range (20 to 55° C.) and shows good material compatibility.

Abstract: A parts washing apparatus comprising a basin having a drain, a reservoir located below the drain, and a solvent filtering and recirculating system. This system comprises a centrifuge filter assembly and a solvent recirculating system. The centrifuge filter assembly in turn comprises a centrifugal filter comprising a receptacle and a replaceable filter element, and also a turbine to drive the centrifugal filter. The centrifuge filter and the turbine are positioned in an enclosing structure to enclose the turbulent flow of the solvent from the centrifuge filter and also enclose the fumes associated with the turbulent flow. Thus, there is a discharge of solvent as less turbulent flow while substantially enclosing the associated fumes.

Abstract: The substrate processing apparatus includes a plurality of processing chambers. A given processing chamber is cleaned by first executing first processing during which voltage application control is executed to control a voltage applied to an electrostatic chuck based upon first processing voltage application information provided for the particular processing chamber while drawing an inert gas into the processing chamber and evacuating the processing chamber sustaining therein low pressure conditions therein and then executing second processing during which voltage application control is executed to control the voltage application to the electrostatic chuck based upon second processing voltage application information for the processing chamber while drawing in the inert gas and evacuating the processing chamber, the internal pressure of which is set to a high level.

Abstract: Several methods of removing contaminant particles from a surface of a substrate are disclosed herein. In one embodiment, the method includes directing an incompressible fluid spray onto a surface of a substrate to remove contaminant particles from the surface. In an embodiment, the surface of the substrate and the nozzle are both immersed in an incompressible fluid. The fluid can flow across the surface of the substrate to remove the contaminant particles from the area. The fluid spray can be positioned normal to the substrate surface, or can be positioned at an angle relative to the substrate surface.

Abstract: In a dry process after a cleaning process using a cleaning-liquid nozzle and a rinse process using a side rinse nozzle are performed on a wafer W, the wafer W is turned, feeding of pure water to a center point of the wafer W from a pure-water nozzle is started, and substantially at the same, injection of a nitrogen gas from a gas nozzle to a center portion of the wafer W at a point at an adequate distance apart from the center of the wafer W is started. Next, while the pure-water nozzle is caused to scan toward the periphery of the wafer W, the gas nozzle is caused to scan toward the periphery of the wafer W in an area radially inward of the position of the pure-water nozzle after the gas nozzle passes the center of the wafer W.

Abstract: A chute type sterilizing and washing device for a cap, in which deformation of a cap is prevented by relaxing integral pressure acting on a synthetic resin cap in the chute, and sterilization and washing can be carried out efficiently by reducing the impact of hot water on germ-free water jetted at the upstream side on the hot water or germ-free water at the downstream side. The chute (5) has ascending chute portions (7, 9), a hot water pipe having a plurality of nozzles for jetting out hot water as a sterilizing and washing medium is arranged along the ascending chute portion, hot water is jetted to a cap fed to the ascending chute portion, the cap (35) receives a thrust for ascending the ascending shoot portion by the jet pressure of the hot water thus sterilizing and washing the cap with the sterilizing and washing medium and conveying.

Abstract: A fixture for optical elements includes a washing bar, a holder and a vacuum pump. The washing bar includes an inner channel and a connecting portion in communication with the inner channel. A hole is formed in the washing bar for communicating with the inner channel. The holder connects with the washing bar. The holder has a holding surface communicating with the hole. The holding surface has a shape corresponding to a peripheral surface of the optical elements to be held. The vacuum pump is connected with the connecting portion. The vacuum pump is configured for vacuum the washing bar so as to effectively suck the one of the optical elements on the holding surface. The present fixture can hold optical elements firmly and does not damage the optical elements.

Abstract: The present invention relates to a method for cleaning polycrystalline silicon fragments to a metal content of <100 ppbw, wherein a polysilicon fraction is added to an aqueous cleaning solution containing HF and H2O2, this aqueous cleaning solution is removed and the polycrystalline fraction thereby obtained is washed with highly pure water and subsequently dried.

Abstract: Improved dry stripper solutions for removing one, two or more photoresist layers from substrates are provided. The stripper solutions comprise dimethyl sulfoxide, a quaternary ammonium hydroxide, and an alkanolamine, an optional secondary solvent and less than about 3 wt. % water and/or a dryness coefficient of at least about 1. Methods for the preparation and use of the improved dry stripping solutions are additionally provided. Advantageous solution methods are provided for the use of the novel stripper solutions to prepare an electronic interconnect structure by removing a plurality of resist layers to expose an underlying dielectric and related substrate without imparting damage to any of the underlying structure.

Abstract: Drying a microelectronic topography. At least some of the illustrative embodiments are methods that include placing a microelectronic topography inside a process chamber, providing a non-aqueous liquid to the process chamber until at least 90% of the volume of the process chamber contains the non-aqueous liquid, pressurizing the process chamber by way of a fluid different than the non-aqueous liquid, ceasing activity with respect to the process chamber until the non-aqueous liquid and fluid form a mixture that is substantially homogenous, venting the process chamber while simultaneously providing the fluid to the process chamber, and venting the process chamber in a manner which prevents formation of liquid in the process chamber.

Abstract: A method is provided for reducing the amount of film fragments discharged into a processing liquid circulation system during removal of films from wafers, thereby reducing the frequency of filter cleaning or filter replacement. The method includes exposing a wafer containing a film formed thereon in a process chamber of a substrate processing system to a processing liquid, where the wafer is not rotated or is rotated at a first speed and the processing liquid is discharged from the process chamber to a processing liquid circulation system. Subsequently, exposure of the wafer to the processing liquid is discontinued and the wafer is rotated at a second speed greater than the first speed to centrifugally remove fragments of the film from the wafer. Next, the wafer is exposed to the same or a different processing liquid and the processing liquid is discharged from the process chamber to a processing liquid drain.

Abstract: The liquid composition is based on surfactants and enzymes, and is particularly useful for manual cleaning of instruments. In manual and ultrasonic application the composition in use concentration shows low foaming and gives a cleaning solution which is not cloudy at least at a temperature in the range from 16° C. to 40° C. In addition, the composition has good cleaning efficacy over a broad temperature range (20 to 55° C.) and shows good material compatibility.

Abstract: A spray head for use with or in combination with a beverage making apparatus. The spray head receives liquid from a liquid dispensing path of the beverage making apparatus and distributes liquid over a beverage making substance retained in close proximity to the spray head. The spray head includes a body portion (14) having a lip (15) extending generally from a periphery of the body portion. A plurality of holes (20) are formed extending through at least the lip portion. A connector (49) is provided for removably attaching the spray head to the beverage making apparatus. The spray head is removable from the beverage making apparatus for facilitating direct contact cleaning of the surfaces of at least the body of the spray head to remove particles and mineral deposits therefrom.