Abstract: Organic matter and metal impurities present on the surface of a photomask are removed. Foreign matter still adhering to the surface of the photomask is removed with H2 gas dissolved water. The photomask is dried. Thus provided is a method of washing a photomask in a manner which permits attaining an effect of removing foreign matter equivalent or superior to that of a conventional method with a small amount of chemical solution and reducing the amounts of chemicals and high purity water.

Abstract: Articles, solutions, and methods for enhancing the grasping of and cleaning athletic equipment grips, in particular a golf club grip. These articles, solutions, and methods preferably comprise a water miscible solvent, a cleaning agent, and water to removes dirt, perspiration, water, and dried skin oils that have accumulated on the grip during the normal course of participating in athletic activity, while cleaning, drying, and restoring the natural tackiness of the grip.

Abstract: Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization.

Abstract: The present invention provides a method and process for removing adherent molten metal from a surface by applying a non-wetting agent for the metal to the surface or to the adherent molten metal. The non-wetting agent may be a pressurized fluid or applied by a pressurized fluid.

Abstract: A compound such as Alq3 accumulated on the inner surface of a chamber at the time of organic EL device production and wasted is recovered and recycled, whereby the production cost is reduced. The inner surface of a chamber or the surface of components in the chamber to which a compound such as Alq3 has adhered is cleaned with a fluorinated alcohol such as 2,2,3,3,4,4,5,5-octafluoropentanol to recover Alq3.

Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.

Abstract: The present invention relates to methods and apparatuses for the use of atmospheric pressure non-thermal plasma to clean and sterilize the surfaces of liquid handling devices.

Abstract: A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

Abstract: A photomask provided with a light-shielding coating on a surface of a glass substrate is cleaned with O3 gas solved water to eliminate organic substances adhered on a surface of the photomask (S120). Using an alkaline chemical such as alkaline ionized water or hydrogenated water, the photomask is then cleaned to eliminate contamination (S122). After completion of these cleaning steps, the photomask is dried (S124).

Abstract: A method for preparing a workpiece surface utilizing two more fluids of differing density and miscibility which create one or more fluid interfaces wherein the fluids are chosen such that the solubility or affinity of one of the fluids is high for a material to be removed from the workpiece surface while the other fluid has a low solubility or affinity for the material to be removed. The workpiece surface is treated by passing the workpiece through the fluid interface. The two or more fluids are preferably dispensed into an apparatus and allowed to settle into two or more predominant layers separated by an interface. Surface preparation techniques which may benefit from the present invention include etching, cleaning or drying processes and the like.

Abstract: The invention relates to an aqueous composition comprising in combination an alkyl pyrrolidone, such as a C8-C18 linear alkyl pyrrolidone, and an alkyl polysaccharide such as an alkyl polyglucoside, and a method of .enhancing the efficacy of an enzyme containing composition for use in cleaning medical instruments comprising the step of including in said composition an alkyl pyrrolidone and an alkyl polysaccharide. The methods and compositions of the present invention may further include at least one enzyme such as proteases, lipases, amylases, and cellulases.

Abstract: An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.

Abstract: A method and an apparatus capable of stripping resist efficiently in a short amount of time. A stripping solution under high pressure is jetted from a nozzle to a rotating wafer. The resist layer on the wafer is applied with the jetted stripping solution, and the resist layer can be efficiently stripped in a short amount of time by the multiplied effect by the physical effect caused by the impact of the jetted stripping solution and the chemical effect of the stripping solution.

Abstract: Provided is a process and apparatus characterized by a gas distribution plate in which a gas supply manifold directs gas bubbles from the bottom of a process tank upward and between wafers contained in a cassette and supported therewithin. This improved method and apparatus is used for effectively stripping photoresist from the larger semiconductor wafers having dense top conductive patterns with protuberant sidewalls. The method provides a scrubbing action that is parallel to the device array being formed on the wafer's surface. Broadly stated, the method of a chemical action on large substrates supported adjacent respective edge portions thereof in a carrier includes submerging the carrier and substrates supported thereby in a process tank containing a liquid chemical, and a gas distribution plate disposed on the bottom of the tank for directing gas bubbles upward and parallel to the surfaces of each substrate contained in the carrier to ensure that a uniform chemical action occurs.

Abstract: An apparatus and method for drying substrates. The inventive apparatus comprises: an object support member for supporting at least one substrate in a process tank having one or more support sections comprising capillary material. The inventive method is a method of removing liquid from a wet substrate in a process tank comprising contacting the wet substrate with capillary material. In another aspect, the invention is a method of drying at least one substrate having a surface in a process tank comprising: submerging the substrate in a liquid having a liquid level; supporting the submerged substrates in the process tank; supplying a drying vapor above the liquid level; lowering the liquid level or raising the substrate so that the liquid level is below the substrate, thereby removing a major portion of liquid from the substrate surface; and removing remaining liquid from the substrate surface with capillary material.

Abstract: A method of cleaning the interior of a processing chamber first performs a halogenation treatment by supplying a treatment gas containing a halogenating gas into the processing chamber and heating a support member for a target substrate, thereby halogenating a metal element in a by-product film. A reduction treatment is then performed by supplying a treatment gas containing a reducing gas into the processing chamber, thereby reducing a halide of the metal element and liberating the metal element. An oxidation treatment is then performed by supplying a treatment gas containing an oxidizing gas into the processing chamber and heating the casing walls of the processing chamber, thereby passivating the liberated metal element by oxidation.

Abstract: The present invention provides a method for efficiently and uniformly treating articles with two or more fluids without transferring the articles from one container to another container.

Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.

Abstract: System and method for reducing damage to a semiconductor substrate when using cleaning fluids at elevated pressures to clean the semiconductor substrates. A preferred embodiment comprises applying the cleaning fluid at a first pressure for a first time period, wherein the first pressure is relatively low, and then increasing the pressure of the cleaning fluid to a pressure level that can effectively clean the semiconductor substrate and maintaining the pressure level for a second time period. The application of the cleaning fluid at the relatively low initial pressure acts as a temporary filler and creates a buffer of the cleaning fluid on the semiconductor substrate and helps to dampen the impact of the subsequent high pressure application of the cleaning fluid on the semiconductor substrate.

Abstract: A novel chemistry, system and application technique reduces contamination of semiconductor wafers and similar substrates and enhances and expedites processing. A stream of liquid chemical is applied to the workpiece surface. Ozone is delivered either into the liquid process stream or into the process environment. The ozone is preferably generated by a high capacity ozone generator. The chemical stream is provided in the form of a liquid or vapor. A boundary layer liquid or vapor forms on the workpiece surface. The thickness of the boundary layer is controlled. The chemical stream may include ammonium hydroxide for simultaneous particle and organic removal, another chemical to raise the pH of the solution, or other chemical additives designed to accomplish one or more specific cleaning steps.

Abstract: A washing method has a non aqueous washing process of washing an object to be washed using a non aqueous solution, an intermediate washing process of washing the object to be washed using a solution having solubility relative to both an aqueous solution and the non aqueous solution after said non aqueous washing process; and an aqueous washing process of washing the object to be washed with the aqueous solution after said intermediate washing process. When an intermediate washing process is performed between the non aqueous washing process and the aqueous washing process, the non aqueous solution adhered to the object to be washed in the non aqueous washing process is removed in the intermediate washing process, and replaced by a solution having solubility relative to both the non aqueous solution and the aqueous solution, so as to prevent the non aqueous solution from being introduced into the aqueous solution used in the aqueous washing process.

Abstract: An improved method for removing contaminant particles from a surface of a semiconductor wafer includes forming a sacrificial film on the surface of the wafer and then removing the sacrificial film by supercritical fluid cleaning. The removal of the sacrificial film via the supercritical fluid cleaning process facilitates removing the contaminant particles. The method further includes identifying and characterizing the contaminant particles and creating a record of the contaminant particle data. The composition of the sacrificial film is selected based on the contaminant particles data and the supercritical cleaning recipe is selected based on the composition of the sacrificial film and the contaminant particles data.

Abstract: A microelectronic substrate handling device comprising first and second support structures spaced from each other, the first support structure having a series of upper teeth defining a series of upper notches extending along a length of the first support structure and a series of lower teeth defining a series of lower notches extending along a length of the first support structure, each of the upper and lower notches opening toward the second support structure, wherein the upper and lower notches are offset from each other by a predetermined offset distance so that an edge of a microelectronic device will fit differently within the upper and lower notches of the first support structure when supported between the first and second support structures.

Abstract: Apparatus for and a method of cleaning or processing a wafer anticipates a malfunction of a pump and avoids an abrupt shutting down of the pump during the cleaning or processing of the wafer. The apparatus includes a tank vessel containing a liquid used in the cleaning or processing of the wafer, a pump that pumps the liquid chemical from the vessel, a filter that filters impurities contained in the liquid pumped by the pump, a heater that heats the filtered liquid to a predetermined temperature and supplies the heated liquid back into the tank vessel, and a pump malfunction anticipation unit that operates at the same time as the pump. The pump malfunction anticipation unit calculates the flow rate of the liquid pumped by the pump using a program, and based on the flow rate anticipates when it is time to replace the pump.

Abstract: A cleaner and method for removing excess residual cleaning fluid from an object, particularly a semiconductor wafer, before or as the wafer is removed from a cleaning chamber of a CMP cleaner, for example. Typically, a purge bar is mounted on each side of the cleaning chamber for blowing nitrogen or clean, dry air (CDA) against a corresponding surface of the wafer to remove the excess cleaning fluid from the wafer. The purge bars may be connected to a controller for a wafer transfer device which removes the wafer from the cleaning chamber, such that the purge bars are actuated as the wafer transfer device begins to remove the wafer from the chamber.

Abstract: A composition for removing etching residue and a method using same are disclosed herein. In one aspect, there is provided a method for removing etching residue from a substrate comprising: contacting the substrate with a composition comprising water, an organic dicarboxylic acid, a buffering agent, a fluorine source, and optionally a water miscible organic solvent.

Abstract: A substrate processing apparatus 10 includes a holding table 20 for rotatably holding a wafer W, a nozzle 40 for supplying chemical solutions L1 and L2 to the wafer W, at least one light irradiation units G1 and G2, and a pot 30 placed in the outer radius of the holding table 20 for collecting the processing solutions L1 and L2 that are scattered from the wafer W. The pot 30 also includes a cover 70 that can be moved in the direction of the axis of the holding table 20 so that a plurality of chemical solution collecting chambers M1 and M2 are formed in the pot by changing the position of the cover 70.

Abstract: The present invention relates to process and methods, as well as compositions and systems for use in laundering smoke-damaged garments. In particular, the present invention utilizes ozonated water to treat the smoke-damaged garments.

Abstract: A high-speed object washer may be provided for receiving a plurality of objects at an entrance portion, engaging a retention turntable and progressing into a cover. While traveling in the cover in a rotary direction, various cleaning operations may be performed to the object in order to remove various contaminates. After traveling in the rotary direction under the cover, the object may egress from the object washer at an exit portion. The object egresses from the exit portion clean and contaminate-free.

Abstract: A resist stripping apparatus is provided for cleaning a plurality of semiconductor substrates using a wafer cassette that can hold the plurality of semiconductor substrates. The apparatus includes a stripping bath capable of completely immersing the wafer cassette holding the semiconductor substrates, a unit for feeding a substitute liquid for replacing a resist stripping chemical therewith, a unit for discharging the substitute liquid, and at least one chemical high pressure spray nozzle for jetting the substitute liquid under high pressure to the semiconductor substrates.

Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.

Abstract: A process is presented for cleaning fermentation or storage tanks with an enzyme-containing formulation containing one or more laccases, peroxidases, oxireductases, transferases, isomerases, lyases, and ligases or a mixture thereof. The process provides improved cleaning results, water consumption, and waste water pollution.

Abstract: An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a wafer lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

Abstract: The invention relates to a method of low temperature cleaning and applying an antimicrobial treatment to food and beverage plant equipment. In addition, the method includes carbon dioxide compatible chemistry. The method may be achieved through a multi-step method.

Abstract: The invention utilizes harmonics of certain clamped ultrasound transducers to generate ultrasound within the liquid of an ultrasonic tank and in a frequency range of between about 100 khz to 350 khz (i.e., “microsonic” frequencies). The application of microsonic frequencies to liquid preferably occurs simultaneously with a sweeping of the microsonic frequency within the transducer's harmonic bandwidth to reduce or eliminate (a) standing waves within the liquid, (b) other resonances, (c) high energy cavitation implosion, and (d) non-uniform sound fields, each of which is undesirable for cleaning and/or processing of semiconductor wafers and other delicate parts. The invention can also drive ultrasonic transducers such that the frequency of applied energy has a sweep rate within the ultrasonic bandwidth of the transducers; and that sweep rate is also varied so that the sweep rate is substantially non-constant during operation.

Abstract: A blanket wash head for cleaning the blanket cylinder of a printing press comprises a plurality of bristles arranged on a brush that are sized to contact a flicker bar disposed within the blanket wash head. The bristles are arranged to travel along a path and to collect debris and/or moisture. The bristles comprises a leading bristle and a trailing bristle and, in response to rotation of the brush, an end of the trailing bristle swings along an arc caused by contact with a flicker bar. The bristles are spaced on the brush according to a low density cause the trailing bristle to swing though an arc a sufficient distance sufficient to dislodge the debris without interference with the leading bristle.

Abstract: The present ball/roller bearing cleaning method is a method which, using cleaning liquid 24, cleans a bearing to be cleaned 1 composed of an inner ring 1b, an outer ring 1a, a rolling bodies 1c and a retainer. In the cleaning method, the cleaning liquid 24 is made to flow through the bearing to be cleaned 1 from the axial direction of the present bearing 1 into spaces in which the raceway surfaces of the inner and outer rings 1b and 1a of the bearing to be cleaned 1 surround the rolling bodies 1c and retainer. For example, a cylindrical-shaped rotary die 2 having spiral grooves 2a is interposed into a cleaning liquid supply passage, and the cleaning liquid 4 is supplied to thereby rotate the cylindrical-shaped rotary die 2, whereby the cleaning liquid having high pressure can be supplied to the bearing to be cleaned 1 from the cylindrical-shaped rotary die 2.

Abstract: In a ring shaped part washing method an ultrasonic vibration plate 33 is disposed in a washing tank 23 filled with a washing fluid 31, and ultrasonic waves generated by the ultrasonic vibration plate 33 are applied to ring-shaped parts 27 disposed in the washing tank 23 to thereby remove foreign substances stick to the ring-shaped parts 27 therefrom. The ring-shaped parts 27 are disposed inclinedly with respect to the ultrasonic vibration plate 33 in such a manner that the axes 27a of the ring-shaped parts 27 intersect with the plate surface 33a of the ultrasonic vibration plate 33 at an angle &thgr; other than a right angle.

Abstract: An unnecessary film is removed by cleaning gas flowing in a treatment vessel 8 for depositing a film on an object W to be processed such as a semiconductor wafer. In this case, the cleaning gas is preheated and activated by the gas heating mechanism 52 and the cleaning gas flows in the treatment vessel 8 in this state. By doing this, an unnecessary film in the treatment vessel made of quartz is removed effectively without damaging the treatment vessel.

Abstract: In a method of cleaning metal-containing deposits such as tantalum from a surface of a process chamber component, such as a metal surface, the surface is immersed in a cleaning solution. In one version, the cleaning solution is a solution having HF and HNO3 in a ratio that removes deposits from the surface substantially without eroding the surface. In another version, the cleaning solution is a solution having KOH and H2O2. The solution can be treated after cleaning the surface to recover tantalum-containing materials and one or more of the cleaning solutions.

Abstract: An apparatus for collecting impurities on a semiconductor wafer includes an airtight process chamber, a rotary chuck disposed in the process chamber for rotating and horizontally supporting the semiconductor wafer, a first scanning unit for forming a droplet of a first scanning solution and for scanning an upper surface of the semiconductor wafer rotated by the rotary chuck with the droplet to collect first impurities, a driving unit for tilting the rotary chuck and the semiconductor wafer supported on the rotary chuck, and a second scanning unit for receiving a second scanning solution for collecting second impurities from an edge portion of the semiconductor wafer, the second scanning solution being in contact with the edge portion of the semiconductor wafer tilted by the driving unit and rotated by the rotary chuck so that the second scanning solution scans the edge portion of the semiconductor wafer.

Abstract: In a cleaning apparatus 500, as a pre-cleaning step, cleaning is performed in a first and a second backup cleaning bath 602 and 603 using a hydrocarbon-based cleaning liquid composed of a normal paraffin, such as normal nonane or normal decane, as a primary component and a surfactant such as a fatty acid alkanol amide or a fatty acid N-alkyl alkylene diamine, and as a post-cleaning step, immersion cleaning, shower cleaning, and vapor cleaning are performed in a cleaning bath 601 using a hydrocarbon-based cleaning liquid containing no surfactant.

Abstract: A mobile cleaning workbench that may be used for manually washing equipment components, parts or other articles is provided. The cleaning station provides a source of water or other cleaning liquid for use in the washing of an article in a wash basin. A drain is provided for removal of cleaning liquid from the wash basin. Since some chemicals produce vapors which are emitted as chemical-laden articles are moved about, alternative embodiments of the invention include a ventilation exhaust system that removes the vapors from the washing area and transfers them to a remote location via appropriate ducting.

Abstract: A system and method for improving the efficiency and effectiveness of the transmission of acoustical energy to process fluids during substrate processing, such as cleaning or photoresist stripping. The invention utilizes a layered stack of materials to transmit acoustical energy from a source of acoustical energy to the process fluid. The material of which each layer is constructed is chosen so as to reduce the differences in acoustical impedance between consecutive layers of the stack, providing a more gradual transition, in terms of acoustical impedance, when acoustical energy is being transmitted from the source to the process fluid. In one aspect, the invention is a system comprising: a process chamber for receiving a process fluid; an acoustical energy source; and an acoustical stack having a first transmission layer and a second transmission layer that forms an acoustical energy pathway from the acoustical energy source to the process fluid in the process chamber.

Abstract: Methods of treating a fabric wherein a fabric to be treated is provided, a fabric treatment composition comprising a low molecular weight protein hydrolyzate is provided; and the fabric is contacted with the fabric treatment composition, are described along with methods of reducing the inflammatory and/or skin-irritating effects of a fabric treatment composition by combining a low molecular weight protein hydrolyzate and a fabric treatment composition.

Abstract: A supercritical fluid cleaning system and method comprising mainly a pressure chamber, a closable lid, a substrate support for holding at least one substrate, a rotable shaft extending outward from within the chamber, an external rotary power source coupled magnetically or otherwise to the shaft, and a rotable component or impeller attached to the chamber end of the shaft in close proximity to the substrate holding position, and baffles located close to the rotable component. The rotable component is configured for rotation within the supercritical phase fluid in the chamber close to the surface of the wafer for causing agitation and turbulent fluid flow against the surface of the substrate, and increased intra-chamber fluid circulation.

Abstract: A system for processing wafers is disclosed. In the invention, a tank contains a processing liquid. A movable submersion mechanism is positioned to move in and out of the tank. Wafer holders in the submersion mechanism have an unequal spacing within the submersion mechanism.

Abstract: A germicide and disinfectant composition contains detergent and at least two enzymes adapted to cause lysis in glycoprotein in infectious agents. These germicidal and disinfectant compositions are used in conjunction with prepackaged wipes and kits that allows the user to remove liquid or dried contaminated material without coming into direct contact with the contaminated material.

Abstract: A system for releasing and separating labels from containers has a releaser for mixing the containers with introduced fluids and for providing the containers with a sufficient retention time and agitation to clean the containers and release the labels therefrom. The system further includes a separator for receiving the containers and labels from said releaser. The separator has an inclined base with a plurality of counter-rotating rollers adapted to urge the labels and introduced fluid away from said containers. The rollers are spaced to encourage some of the containers to become wedged therebetween to enhance performance of the separator.

Abstract: A jar fillable with cleaning fluid has a lid with a suspension system for roller bearings hanging from the inside of the lid. On each of two or more suspension systems, bearings are interwoven between two sides of an overlapping plastic tie looped through a securing loop in the lid. Any desired number of bearings of various sizes and shapes are secured, with a synching of the tie at the bottom, in an alternating array with all bearings parallel, no bearings touching, and each bearing positioned to receive a flow of cleaning fluid through it. The container is shaken in a direction perpendicular to each bearing for maximum cleaning. The bearings are installed by screwing on the lid and removed by removal of the lid.