Abstract: A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: In a system for cleaning a workpiece or wafer, a boundary layer of heated liquid is formed on the workpiece surface. Ozone is provided around the workpiece. The ozone diffuses through the boundary layer and chemically reacts with contaminants on the workpiece surface. Preferably, the liquid includes water, and may also include a chemical. Steam may also be used with the steam also physically removing contaminants, and also heating the workpiece to speed up chemical cleaning. Sonic or electromagnetic energy may also be introduced to the workpiece.

Abstract: The invention relates to a method for conveying dishes in a tunnel dishwasher and to a tunnel dishwasher. The tunnel dishwasher (1) comprises at least one washing zone (2, 3, 4) and a first conveyor (5a) arranged to move alternately forwards (F) and backwards (R), during which forward (F) motion the dishes (11) to be washed are arranged to be moved along with the first conveyor (5a) relative to the washing zone (2, 3, 4). The tunnel dishwasher (1) further comprises at least a second conveyor (5b) arranged to move in the opposite direction relative to the first conveyor (5a) in such a way that the first and the second conveyor (5a, 5b) are arranged to convey the dishes (11) to be washed alternately forwards (F).

Abstract: An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay. A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: A system and method for reducing the amount of contaminants that come into contact with wafer substrates during the production of integrated circuit devices. The system allows for uniform overflow of processing liquid from a process tank while preventing contaminants from reentering the process tank and contacting the wafers. The system in one aspect comprises an inner weir with a top surface, and overflow wall with at least one recess having a bottom, and a structure, the structure connecting the overflow wall and the inner weir to form a drainage basin with at least one drain hole; wherein the top surface of the inner weir is below the bottom of the at least one recess.

Abstract: A system and method for cleaning boxes used for handling flat media includes a rotor rotatably mounted within an enclosure, with spray nozzles in the enclosure for spraying fluid toward the rotor. The rotor has at least one box holder assembly for holding a box. At least one retainer bar is located on the rotor for engaging a front section of the box to retain the box in the box holder assembly during rotation of the rotor. The retainer bar is preferably moveable from a first position where the retainer bar restrains the box on the box holder assembly, to a second position where the retainer bar is moved away from the box. The box holder assembly may alternatively include a base with a plurality of grooved elements thereon that are adapted to engage a flange on the box for securing the box to the box holder assembly.

Abstract: Cleaning fluid is sprayed upwards from under a substantially horizontally-held object to be cleaned for cleaning the underside of the object. At this time, an accelerating fluid accelerates the cleaning fluid to change its spraying direction toward a surface of the object, then the cleaning fluid is sprayed onto the surface to be cleaned.

Abstract: A method for removing silicone sealant from glass-ceramic surfaces is provided. The method includes heating the sealant to a temperature greater than 325 degrees Celsius so that it thermally degrades and then, mechanically removing the sealant from the glass-ceramic surface. A method of salvaging a glass-ceramic cooking surface from a cooktop including silicone sealant between a cooktop frame and the glass-ceramic cooking surface is also provided. If a defect is detected in the cooktop during manufacturing or distribution, the entire cooktop is heated to a predetermined temperature to allow the silicone sealant to be easily removed without using a knife or other potentially damaging devices. Once the silicone sealant is removed, the glass-ceramic cooking surface may be reused to produce another cooktop assembly.

Abstract: In order to provide a cleaning apparatus and a cleaning method wherein cleaning and drying can be carried out in the same cleaning apparatus without risk of reverse contamination of the cleaned object after the drying process, a cleaning apparatus comprises a supporting device for supporting an object to be cleaned, and a cleaning cup surrounding said supporting device to prevent splashing of a cleaning liquid, said cleaning apparatus comprising: a cleaning device for cleaning an inner wall of said cleaning cup with a cleaning liquid.

Abstract: A main object of the present invention is to provide a method for cleaning a substrate, in which a substrate surface can be cleaned by an easy and efficient process without causing any undesirable influence on the substrate. The present invention achieves the aforementioned object by providing a method for cleaning a substrate, wherein a substrate to be cleaned and a photocatalyst containing layer containing a photocatalyst, which is formed on a base material, are placed with no clearance or with a clearance between each other, and then, a surface of the substrate is cleaned by irradiating an energy from a predetermined direction.

Abstract: An immersion processing system is provided for cleaning wafers with an increased efficiency of chemical use. Such a system advantageously uses less cleaning enhancement substance that may be provided as gas, vapor or liquid directly to a meniscus or wafer/liquid/gas bath interface so as to effectively modify surface tensions at the meniscus with minimized chemical usage. Such a delivery system design may be applied for single wafer processing or for processing multiple wafers together within a single liquid bath vessel. For single wafer processing, in particular, cleaning enhancement substance can be delivered along one or both major sides of the wafer, preferably at the meniscus that is formed as the wafer and liquid are relatively moved, while a processing vessel usable for such single wafer processing may itself be designed with a minimized size to accommodate a single wafer.

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract: A workpiece processing system for processing semiconductor wafers and other flat media includes a standalone processing unit having two or more modules vertically stacked on top of one another. A first module includes an ozone generator, a DI water supply, a purge gas/drying gas supply, and optionally includes an ammonium hydroxide generator. A second module is preferably stacked on top of the first module and includes a processing chamber in communication with the devices in the first module. The processing chamber preferably includes a rotor for holding and rotating workpieces, one or more spray manifolds, an ozone destructor, an anti-static generator, and/or any other suitable workpiece-processing devices. The rotor is preferably designed to hold two workpiece-carrying cassettes each capable of holding up to 25 workpieces. A third module is preferably stacked on top of the second module and includes the system electronics and controls.

Abstract: A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

Abstract: A method of removing surface-deposited contaminants, comprising bringing an ozone-containing treating solution into contact with the surface of a treating target on which contaminants have deposited. The ozone-containing treating solution comprises an organic solvent having a partition coefficient to ozone in a gas, of 0.6 or more, and ozone having been dissolved in the solvent. Contaminants having deposited on the surfaces of various articles including substrates for electronic devices, such as semiconductor substrates and substrates for liquid crystal display devices can be removed by room-temperature and short-time treatment in a high safety and a good efficiency.

Abstract: A system and method for processing a workpiece, such as a semiconductor wafer, includes a spray mechanism that rotates around the workpiece while the workpiece rests on a stationary workpiece support in a process chamber. The spray mechanism preferably includes one or more spray arms attached to a motorized rotary union via hollow elbow sections. The rotary union is attached to a fluid supply valve and preferably includes a hollow shaft through which process fluid may travel from the fluid supply valve to the spray arms. The process chamber includes a drain through which process fluid may be removed from the process chamber. A process gas and/or vapor manifold, a sonic transducer, and/or a rinsing liquid manifold may be included in the process chamber for delivering a process gas or vapor, sonic energy, and/or a rinsing liquid into the process chamber in order to enhance processing of the workpiece.

Abstract: The invention refers to a method and an arrangement for cleaning of porous materials, in particular textiles, in liquid carbon dioxide which by rapid, intermittent pressure drops is brought into boiling. Various ways of lowering and then again increasing the pressure in the chamber in which the cleaning takes place are described. The arrangement for carrying out the method comprises a pressure chamber (1) in which the goods (2) to be washed is treated, an adjacent container (13, 14) for the control of the carbon dioxide pressure in the pressure chamber (1), suitably a storage tank (7) for liquid carbon dioxide, a compressor (20) for supplying high-pressure gas into the pressure chamber, when necessary, a pump (10) for the transport of liquid carbon dioxide and the required connecting conduits between the volume vessels mentioned and, stop valves in these conduits.

Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.

Abstract: Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe.

Abstract: A method using irradiation of substrates (12) with ultra violet light to remove a surface contaminant is described. The light can be pulsed or continuous. The treated surfaces are more paintable and bondable.

Abstract: A probe cleaning system automatically detects a surface of a probe cleaning device during a cleaning process by providing a predetermined finish on the surface of the probe cleaning device. The predetermined finish can include a textured or machined finish or a marking, such that the predetermined finish provides contrast against the surface. Cameras in the system automatically focus on the surface, with the predetermined finish. This in-focus condition is related to a distance between probes and the surface. Once an in-focus condition is determined, the system performs an automated cleaning process by interacting the probes with the probe cleaning device.

Abstract: A method of cleaning a microelectronic substrate is carried out by providing a cleaning fluid, the cleaning fluid comprising an adduct of hydrogen fluoride with a Lewis base in a carbon dioxide solvent; and then cleaning the substrate by contacting the substrate to the cleaning fluid for a time sufficient to clean the substrate.

Abstract: A method and apparatus are disclosed for improving drying of a module, tooling, and solder stencils via the introduction of acoustic pressure waves and/or vibrational energy to the module, tooling, or solder stencils. The acoustic pressure waves may be created by a transducer where the waves are transferred to the module through air or a vibrational interface medium. The acoustic pressure waves impinge on the water droplets to atomize the droplets on the surface of the module and in the cracks, crevices and hard to reach areas of connectors and other components, without undesirable heat. The acoustic energy may further be used to assist in cleaning solder stencils within an automated screen printer.

Abstract: A method of removing cured silicone polymer deposits from electronic components. The components are immersed in a preheated solution of a quaternary ammonium fluoride in a hydrophobic non-hydroxylic aprotic solvent with agitation. The components are then immersed in a preheated solvent consisting essentially of a hydrophobic aprotic solvent with agitation. This is followed by a rinse and spray of the components with a hydrophilic, essentially water soluble solvent, with agitation. The components are then immersed in a water bath and then rinsed with a pressurized spray of water and then dried with a N2 blow dry.

Abstract: A method of rinsing an electronic substrate recognizes that adding a buffer to a rinsing fluid eliminates fluctuations in the amount of residues on an electronic substrate, and a buffered rinsing fluid is prepared by (a) providing water from a water source; (b) deionizing the water to produce deionized water; (c) adding a buffer to the deionized water at a concentration effective to eliminate fluctuations in the amount of residues on the electronic substrate. The electronic substrate is rinsed with the buffered rinsing fluid.

Abstract: The invention relates to a diffuser for wet processing systems involved in the manufacturing of semiconductor wafers. The diffuser includes a plenum section and a slitted section. Pressurized fluid from the plenum section is forced through the slitted section and across a plurality of wafers mounted in the wet processing system. One advantage is that by “diffusing” pressurized fluid through the slitted section, a generally uniform and/or laminar flow is achieved. Desirably, the diffuser provides a more reliable, and hence more cost-effective, technology for wet processing fabrication of semiconductor wafers.

Abstract: A system and method are disclosed including a vapor dryer chamber (12) with a lid (14). A heater (16) is disposed within the vapor dryer chamber to vaporize liquid drying medium (24), preferably isopropyl alcohol, in the bottom of the vapor dryer chamber (12). Cooling coils (18) disposed within an upper portion of the vapor drying chamber (12) condense the drying medium vapor. A vapor monitor assembly (30) is disposed within the vapor dryer chamber (12) to monitor the vapor concentration within vapor dryer chamber (12). A controller (40) is associated with the vapor monitor assembly (30) and evaluates vapor concentration measurements from the vapor monitor (38).

Abstract: Method and apparatus for cleaning semiconductor devices and other workpieces using an aqueous rinse solution which is de-oxygenated by passing the aqueous rinse solution and a carrier gas through an osmotic membrane degasifier. A cleaning chamber is also disclosed for carrying out the cleaning method.

Abstract: Described are cleaning methods and apparatus that minimize the volume of hazardous materials used and created when cleaning components, and further to minimize the possibility of cross-contamination between components from different deposition chambers. Components to be cleaned are stored within or supported by a dedicated cassette before they are placed in a receptacle of cleaning liquid. The cassette displaces a significant percentage of the receptacle's volume; consequently, only a relatively small volume of cleaning liquid is needed to fully submerge the component. In typical embodiments, the combined cassette and component displace a volume of liquid that is greater than the volume of liquid used to clean the component. One embodiment of the invention reduces the requisite volume of cleaning solution using a number of liquid-displacing elements (e.g., balls) contained within a cleaning receptacle.

Abstract: A semiconductor wafer cleaning apparatus comprises an outer tank, a cleaning tank provided within the outer tank, a wafer carrier provided within the cleaning tank, a plurality of jet nozzles directed toward the wafer carrier, a main pipe connected to the jet nozzles, a circulating pump connected to the main pipe and the outer tank for circulating a cleansing solution from the outer tank, through the main pipe, the jet nozzles, and the cleaning tank, and a filter for filtering the circulated cleansing solution.

Abstract: A method for resist strip and particle removal. Wafers (108) with a patterned resist formed thereon are placed on a wafer chuck (104) in a scrubber tool (100,200). Ozonated deionized water (112) is applied to the surface of wafer (108). The ozonated deionized water (112) strips the resist and removes the resist residue without the use of hazardous chemicals. Particle removal is accomplished in the same tool (100,200). The ozonated deionized water (112) is formed in a closed canister (114). Deionized water is circulated through the canister (114) and ozone is added to the deionized water at a premixer (118).

Abstract: The present invention relates to methods for cleaning, rinsing, and/or antimicrobial treatment of medical carts, medical cages, and other medical instruments, devices or equipment. The method for cleaning employs a solid alkaline, for example a solid carbonate, cleaning composition for cleaning the medical cart, cage, instrument, device, or equipment. The method for rinsing employs a solid neutral or neutralizing rinse composition for rinsing the medical cart, cage, instrument, device, or equipment. The method for antimicrobial treatment employs a solid, for example a solid quaternary ammonium or solid halogen, antimicrobial composition, for antimicrobial treatment of the medical cart, cage, instrument, device, or equipment.

Abstract: The invention provides a method and device for decontaminating a contaminated hollow metal needle having electrical wires attached to the needle which heat cleaning fluid dispensed into the needle.

Abstract: Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization.

Abstract: In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

Abstract: A water soluble glass is used in dishwashing machines as corrosion protection for glassware. The water soluble glass consists of at least one compound which, in the cleaning and/or rinsing cycles, releases an agent that protects glassware against corrosion. Each of the compounds accounts for no more than 85 molar % of the glass and the solubility of the water soluble glass is defined by a mass loss of at least 0.5 mm under the conditions specified in DIN ISO 719.

Abstract: A process cartridge recycling method which includes a water washing step, which washes a used process cartridge using water. In this step, so as not to cause deterioration of a working environment of washing, a casing of members which structure the process cartridge is extracted, and water is sprayed at the casing for washing. Also, a process cartridge recycled by this method, and a process cartridge recycling device which implements this method.

Abstract: To provide an ultrasonic processing device that is capable of effectively carrying out a cleaning operation, a resist-stripping operation, etc. by projecting ultrasonic uniformly over an entirety of the ultrasonic processing target region by means of ultrasonic oscillation elements each having a width smaller than an ultrasonic processing target region of a processing object, as well as to provide an electronic parts fabrication method using the foregoing device, a plurality of ultrasonic oscillation elements are arranged so as to planarly extend in a glass substrate transport direction and in a glass substrate width direction, and projected figures obtained by projecting said ultrasonic oscillation elements to a plane perpendicular to the glass substrate transport direction form a single belt-like region of a width exceeding a width of the ultrasonic processing target region.

Abstract: The wafers W are dipped and rinsed in pure water in the processing bath 60, and then dichloromethane is fed into the processing bath 60, thereby changing the state of the wafer W from being dipped in pure water to being dipped in dichloromethane. Thereafter, the wafers W is raised up to the drying chamber 61, and dichloromethane remained on the surface of each wafer W is evaporated, and the hot N2 gas is discharged onto the wafers W. Thereby, no water marks are produced, and no resist is dissolved, and the substrate can be dried in safety.

Abstract: A container cleaning apparatus comprises a solvent cleaning unit having a solvent cleaning chamber, and a rinsing unit having a rinsing chamber connected to the solvent cleaning chamber. Containers are conveyed by a conveyor through the solvent cleaning chamber and the rinsing chamber. The containers are cleaned by jetting a water-soluble or partially water-soluble solvent against the containers in the solvent cleaning chamber. Shutter devices have shutters disposed at an entrance to the solvent cleaning chamber and an exit from the solvent cleaning chamber, respectively, and capable of being moved between closed positions to close the entrance to and the exit from the solvent cleaning chamber and to isolate the solvent cleaning chamber from the rinsing chamber, and open positions to permit the containers to move from the solvent cleaning chamber to the rinsing chamber.

Abstract: A cleaning apparatus 1 includes a foup loading/unloading part 2 for mounting foups F each accommodating a plurality of wafers W at intervals of a constant pitch (normal pitch), a rotor 34 capable of holding the wafers W at half the normal pitch (half pitch), a wafer transporting device 11 for transporting the wafer E between the foup F and the rotor 34, wafer posture changing devices 20a, 20b, a wafer elevating mechanism 40, a motor 31 for rotating the rotor 34, an outer chamber 71a and an inner chamber 71b both accommodating the rotor 34, and cleaning liquid nozzles 53, 55 for supplying a cleaning liquid to the wafers W. The rotor 34 holds the wafers W at intervals of an optional pitch (every one holding pitch or every plural holding pitches) to carry out a cleaning operation. Consequently, it is possible to process substrates accommodated in two containers at one batch processing.

Abstract: A bowl includes a bottom wall having a generally circular shape. A sidewall extends upwardly from the bottom wall to define a cylindrical chamber. The sidewall has a projection that extends into the cylindrical chamber. The projection has a top surface that defines a step in the cylindrical chamber and a sloped surface that extends between the top surface and an inner surface of the sidewall. The top surface of the projection is sloped slightly downwardly. The sloped surface of the projection is oriented relative to the top surface such that extensions of the top surface and the sloped surface define an angle in a range from about 30 degrees to about 45 degrees. A spin, rinse, and dry module including the bowl and a method for loading a semiconductor wafer into a spin, rinse, and dry module also are described.

Abstract: A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: An apparatus adapted to clean an exposed surface of a microstructure device such as a disc or head for a disc drive. The apparatus includes a fixture with a mounting surface adapted to receive the microstructure device. A cleaning fluid covers the exposed surface. A slider bearing coupled to a resilient mount flies over the exposed surface. A cleaning line on the exposed surface adjacent the slider bearing is subject to flow of the cleaning fluid. The flow can be generated by relative motion between the device and the slider bearing or generated by a nozzle.

Abstract: An apparatus and method for drying substrates. The inventive apparatus comprises: an object support member for supporting at least one substrate in a process tank having one or more support sections comprising capillary material. The inventive method is a method of removing liquid from a wet substrate in a process tank comprising contacting the wet substrate with capillary material. In another aspect, the invention is a method of drying at least one substrate having a surface in a process tank comprising: submerging the substrate in a liquid having a liquid level; supporting the submerged substrates in the process tank; supplying a drying vapor above the liquid level; lowering the liquid level or raising the substrate so that the liquid level is below the substrate, thereby removing a major portion of liquid from the substrate surface; and removing remaining liquid from the substrate surface with capillary material.

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract: This is a method of cassette-to-cassette batch demounting process that includes providing an apparatus having two cassettes for holding and separating semiconductor substrates. A first cassette is placed on top of a second cassette, using the first cassette as the top cassette that holds the semiconductor substrate and the support substrate, and the second cassette at the bottom as a bottom cassette that receives the semiconductor substrate after demounting process. The semiconductor substrate is loaded with its support substrate into a slot in the top cassette. The top cassette will let only the semiconductor substrate to descend to the bottom cassette while blocking the support substrate from exiting the top cassette. The two cassettes are then soaked in a hot solvent that can dissolve or melt an adhesive that adheres the semiconductor substrate to the support substrate in order to weaken the cohesive force between the two substrates.

Abstract: The present invention provides a small, quiet sonic cleaner which can be used to clean jewelry and other small objects. The cleaner includes a tank which is rigidly connected to a vibration generator such as an eccentrically loaded motor, and which is flexibly coupled to a base upon which the cleaner sits. The coupling of the tank to the base is preferably through progressive motion attenuators such as springs, which provide superior vibration isolation for the tank.

Abstract: A cleaning equipment generally comprises: a cleaning bath 30 for storing therein a cleaning solution to allow a semiconductor wafer W to be dipped in the cleaning solution to clean the surface of the wafer W; a cleaning solution supply pipe 33 for connecting the cleaning bath 30 to a pure water supply source 31; a chemical storing container 34 for storing therein a chemical; a chemical supply pipe 36 for connecting the cleaning solution supply pipe 33 to the chemical storing container 34 via an injection shut-off valve 35; and a diaphragm pump 37 for injecting a predetermined amount of chemical from the chemical storing container 34 into pure water flowing through the cleaning solution supply pipe 33. The temperature of the cleaning solution in the cleaning bath 30 is detected by, e.g., a temperature sensor 44.

Abstract: An integrated circuit assembly cleaning apparatus and method allow a cleaning solution to completely fill spaces within an integrated circuit assembly. Such spaces include, for example, the thin space between the die and substrate of a flip-chip integrated circuit. The cleaning solution fills the space while the air initially occupying the space escapes. These actions are accomplished by first tilting the integrated circuit assembly from horizontal. The integrated circuit assembly is then immersed in the bath at a controllable rate to allow the cleaning solution to completely fill the space while the air in the space escapes.