Abstract: In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

Abstract: Provided is a system for parts washing that includes a fluid that performs a cleaning function and maintains the viability of microorganisms in the fluid that biodegrade the organic matter removed from the parts. “Parts” include objects such as automotive parts befouled with organic matter and particulate matter. The cleaning fluid includes a surfactant that functions to separate organic waste from the parts being washed. The cleaning fluid is both in a cleaning area and in a housing for microorganisms. A heater, thermostat, and a level control assembly function to maintain the cleaning fluid within a certain temperature range so as to maintain a proper environment for the microorganisms. The fluid recirculates from the microorganism housing to the parts cleaning area.

Abstract: An industrial parts cleaning system including immersion and spraying which provides epicyclic parts movement (a plurality of revolutions per rotation, wherein the revolution is supersposed the rotation), rotating spray which synchronously follows the parts rotation, and a purge system for evacuating from the common plumbing the respective wash or rinse solution of a current cycle before commencement of the next cycle.

Abstract: A machine for cleaning containers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor. Used cleaning solution is diverted to a reclaim tank for reuse, thereby allowing low-cost cleaning with concentrated chemicals, and with the creation of less liquid waste requiring disposal. In a method for removing contaminants from flat media or silicon wafer containers or carriers, a mixture of surfactant and de-ionized water is sprayed onto containers on a spinning rotor. The used cleaning solution is collected, filtered and reused.

Abstract: A method and a system for transporting and cleaning slaughter equipment especially knives (3), gloves and aprons at slaughterhouses, the system comprising knife holding members for receiving and releasably holding one or more knives (3), glove holding members for receiving and releasably holding the gloves, apron holding members for receiving and releasably holding the aprons and a cleaning installation for cleaning the knives and/or gloves and/or aprons and/or the holding members. The holding members may be transported on trolleys, and the knife holding members may comprise a basked (4), wherein the knives are positioned so that the blunt knives have a different orientation than the other knives. The basket (4) may be positioned on the trolley on projections (26′) through the handgrips (13).

Abstract: A pod for storing and carrying substrates consists of a pod body and a cover. An inlet and an outlet are formed on one of the pod body and cover. The cover is tightly fitted to the pod body to close the inside of the pod body. A washing liquid is introduced into the pod through the inlet and is discharged from the pod through the outlet, thereby easily washing the inside of the pod with the pod itself serving as a washing tank. A washing cover has an inlet, an outlet, and a heater. The washing cover is attached to the pod body when washing the inside of the pod body. Further provided is a cleaning apparatus having pipes and a pump that are connected to the washing cover. The cleaning apparatus may have a table serving as the washing cover. The table is connected to pipes and a pump.

Abstract: /The present invention provides in one embodiment a method of manufacturing an integrated circuit including cleaning a semiconductor wafer using a cleaning apparatus, wherein the cleaning apparatus includes a roller brush frame and roller brushes cooperatively supported within the roller brush frame and aligned to form a cleaning gradient that is configured to remove particles of different sizes from an object to be cleaned.

Abstract: An apparatus for cleaning dried photoresist from a photoresist dispensing nozzle. The tip of the photoresist dispensing nozzle is inserted through an opening in a nozzle base. A catch pan is positioned beneath the nozzle base. A solvent dispensing needle is inserted through an opening in the catch pan to face the photoresist dispensing nozzle tip and sprays solvent onto the photoresist dispensing nozzle tip. The catch pan collects the solvent and dissolved photoresist particles. The catch pan includes a drain for draining the solvent and the dissolved photoresist particles.

Abstract: An apparatus for separating contaminants from small parts comprises a separation chamber having an upper end and a lower end, and a separation-fluid source in fluid communication with the separation chamber. The separation-fluid source is adapted to direct a pressurized separation-fluid current toward the upper end of the separation chamber. The upper end of the separation chamber has an opening for receiving the small parts, so that the small parts, upon passing through the opening, will fall toward the lower end of the separation chamber against the separation-fluid current while the separation-fluid current removes the contaminants from the small parts and carries the contaminants out of the separation chamber via the upper end of the separation chamber.

Abstract: A sonic tank for cleaning substrates is provided. The tank has two or more upwardly angled walls. Arrays of one or more transducers are positioned along at least two of the two or more angled walls. The transducer arrays are alternately energized maintaining nearly 100% substrate surface cleaning at any given time, and 50% duty cycle (or less) for each transducer array. The substrate supports are positioned such that nearly every point along the substrate's surface is contacted by energy from at least one transducer, and transducer opposing walls are positioned to avoid interfering reflections therefrom.

Abstract: Provided is a parts washer that includes a multi-tiered basin, a cleaning fluid and a biological component, living within the fluid, that breaks down organic waste. The multi-tiered basin includes a sink member with a false bottom, and a support grid and filter are interposed between the false bottom and a bottom panel of the sink member. The false bottom, support grid, and filter are readily removable from the sink member. The tank is partially filled with the cleaning fluid and a pump and conduit assembly direct a flow of the cleaning fluid to the basin. The cleaning fluid discharged into the basin flows through a drain hole in the false bottom, through the filter and support grid, and then through a drain hole in the bottom panel of the sink member back into the tank for reuse. The cleaning fluid includes, at least, a surfactant that functions to remove organic waste from the parts being washed.

Abstract: A method for the cleaning of SiO2 grain is known whereby SiO2 grain comprising contaminations is heated to a temperature at which the contaminations soften or form melting agglomerates with the SiO2 grain, thus separating the contaminations and the SiO2 grain. On this basis and to specify a method which achieves high grain purity at comparatively little expenditure of time, material and costs, and to provide a simple device suitable for the implementation of the method, it is proposed according to the invention that the SiO2 grain is fed to and heated in a gas stream which is directed towards an impingement plate, the SiO2 grain being accelerated in the direction of the impingement plate such that softened contaminations or melting agglomerates adhere to the impingement plate and cleaned SiO2 grain is removed from the impingement plate.

Abstract: A parts washing method which utilizes a centrifugal filter to substantially reduce the need to replace its solvent. Solvent in a washing basin flows down a drain in the parts washing basin, through a screen to a centrifugal filter assembly, with a disposable filter in the filter receptacle of the centrifugal filter assembly. Thus the contaminated solvent flows from the drain, into a disposable filter element located in a spinning filter receptacle, where centrifugal force draws the solvent back into the solvent container while the materials washed from the part remain in the disposable filter element. The clean solvent is collected in a reservoir and recirculated back to the wash basin.

Abstract: In a method of processing or drying a semiconductor wafer, the wafer is withdrawn from a fluid bath at an inclined angle, and at a selected withdrawal speed. A solvent vapor is provided at the surface of the bath, to create a surface tension gradient and promote drying, or removal of the fluid from the wafer surface. After the wafer is entirely withdrawn from the rinsing liquid, the wafer is rotated briefly, to remove any remaining fluid via centrifugal force, without the fluid drying on the wafer. The wafer is held onto a rotor assembly which rotates the wafer within an enclosed chamber, and which is also pivoted within the chamber, to position the wafer at the incline angle.

Abstract: A method for rinsing and drying semiconductor wafers. The method includes placing a semiconductor wafer into a chamber of a rinse/dry apparatus, directing rinse liquid over the semiconductor wafer, and moving a portion of the chamber, such as a portion of a wall of the chamber, substantially vertically relative to the remainder of the chamber to remove rinse liquid therefrom. The method may also include directing a drying fluid onto a surface of the rinse liquid to facilitate drying of the rinsed semiconductor wafers as rinse liquid is being removed from the chamber.

Abstract: An apparatus for spraying a liquid on the surface of assemblies that are moving through wash and rinse stations.

Abstract: Magnetic disk substrates are produced by subjecting glass substrates to at least steps of degreasing, etching, sensitization with tin chloride, activation and sensitivity-enhancing treatment in that order, then plating the pretreated substrates with a nickel/phosphorus film, and thereafter polishing the plated substrates. In the process, the substrates being processed are washed with hot pure water at a temperature of not lower than 50° C. for a period of from 20 to 90 seconds, after the sensitization step but before the activation step, and heated at a temperature of not lower than 70° C. for a period of from 5 to 100 minutes, after the sensitization step but before the nickel/phosphorus-plating step.

Abstract: Semiconductor wafers are positioned in a cleaning tank and subjected to sequential flows of one or more highly diluted cleaning solutions that are injected into the lower end of the tank and allowed to overflow at the upper end. One solution has one part ammonium hydroxide, two parts hydrogen peroxide, and 300-600 parts deionized water together with a trace of high purity surfactant. Rinsing water is flowed through the tank after the first solution is dumped. A second solution has highly dilute hydrofluoric acid. A third solution is more dilute than the first solution. A fourth solution contains hydrochloric acid greatly diluted with deionized water. The solutions are initiated either by injecting the chemicals into an incoming DI water line or directly into the tank. The cleaning tank is provided with a megasonic generator in its lower portion for selective application of megasonic energy.

Abstract: The improved rinse tank includes an external shell and an internal shell. For one embodiment, the external shell preferably defines a five sided open-top tank with a top open to the atmosphere. The internal shell is preferably disposed within the external shell and has a configuration that will accommodate at least two semiconductor wafer boats filled with six inch semiconductor wafers. The external shell is preferably sized large enough to completely immerse the wafer boat and wafers in water when the rinse tank is filled. A chamber may be formed between the external shell and the internal shell within the lower portion of the rinse tank. Two or more deionized water inlets may be provided at the bottom of the rinse tank at opposite corners. Three or more compressed air nozzles may also be provided at the lower portion of the rinse tank. Multiple deionized water jet ports are provided at the internal shell.

Abstract: An apparatus for processing a substrate in which the substrate is successively processed with different kinds of process solution. A spin chuck supports the substrate. A driving source rotates the spin chuck A nozzle member supplies a first process solution prepared by mixing sulfuric acid and a hydrogen peroxide solution at a predetermined mixing ratio to the substrate. A switching mechanism selects the sulfuric acid, the hydrogen peroxide solution and the second process solution supplied to the nozzle member A concentration adjusting mechanism adjusts the ratio of sulfuric acid to the hydrogen peroxide solution, which collectively form the first process solution, supplied to the nozzle member. A control device controls the supply of sulfuric acid, the hydrogen peroxide solution and the second process solution, which is switched by the switching mechanism.

Abstract: A method for dry cleaning a wafer container such as a SMIF pod that is equipped with a bottom mounting plate covered with contaminating particles. In the method, the wafer containers are mounted in openings of the enclosure such that the bottom mounting plates with the contaminating particles are exposed to an air-tight cavity of the enclosure. A purge gas flow is then directed to the bottom of the plate to dislodge the contaminating particles which are then picked up by a vacuum conduit positioned juxtaposed to the purge gas conduit and connected to a factory vacuum source such that contaminating particles dislodged are immediately removed. The present invention novel method can be carried out without using wet bench cleaning while achieving desirable and efficient cleaning results.

Abstract: A method for drying one or more workpieces. The method includes the use of a chemically reactive additive to remove contaminants from the wafer surface during processing. In particular, during processing, a wafer is rinsed in a liquid bath and subsequently exposed to a chemically reactive additive. The chemically reactive additive creates a surface tension gradient that physically and chemically alters the properties of the film of the rise liquid so that the liquid and any contaminants contained therein are removed from the wafer surface.

Abstract: A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Abstract: An ultrasonic vibration plate 33 is disposed in a washing tank 23 filled with a washing fluid 31, and ultrasonic waves generated by the ultrasonic vibration plate 33 are applied to ring-shaped parts 27 disposed in the washing tank 23 to thereby remove foreign substances stick to the ring-shaped parts 27 therefrom. The ring-shaped parts 27 are disposed inclinedly with respect to the ultrasonic vibration plate 33 in such a manner that the axes 27a of the ring-shaped parts 27 intersect with the plate surface 33a of the ultrasonic vibration plate 33 at an angle &thgr; other than a right angle.

Abstract: An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include deionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.

Abstract: Disclosed is a process of recycling and reusing an aqueous degreasing solution for further use as a component of a coolant solution which is itself recycled and reused in metal cutting machines. Also disclosed is a method of degreasing parts, and a degreasing apparatus which is controlled such that an appropriate amount of the aqueous degreasing solution is introduced into the coolant solution. Finally, disclosed herein is a method and system for preparing a coolant in which an aqueous degreasing solution is further utilized as a feeder solution for a coolant solution, with the resulting solution being able to be separated into its component parts and reused in the cutting and cleaning of metals to form metal parts.

Abstract: A method for performing electrochemical processes using an array of dedicated cells is disclosed. Various construction details and steps of the method are developed which promote, in one embodiment, automating the method of performing the processes and cleaning the articles between electrochemical processes. In one embodiment, the array of dedicated cells includes rinsing cells which have a rinse chamber adapted to receive an article and flow rinse fluid such that the fluid impinges against the article at predetermined locations.

Abstract: Disclosed is a process of recycling and reusing an aqueous degreasing solution for further use as a component of a coolant solution which is itself recycled and reused in metal cutting machines. Also disclosed is a method of degreasing parts, and a degreasing apparatus which is controlled such that an appropriate amount of the aqueous degreasing solution is introduced into the coolant solution. Finally, disclosed herein is a method and system for preparing a coolant in which an aqueous degreasing solution is further utilized as a feeder solution for a coolant solution, with the resulting solution being able to be separated into its component parts and reused in the cutting and cleaning of metals to form metal parts.

Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.

Abstract: A method of cleaning a surface of an article using cleaning liquids in combination with acoustic energy. Preferably, an ultradilute concentration of a cleaning enhancement substance, such as ammonia gas, is dissolved in a liquid solvent, such as filtered deionized water, to form a cleaning liquid. The cleaning liquid is caused to contact the surface to be cleaned. Acoustic energy is applied to the liquid during such contact. Optionally, the surface to be cleaned can be oxidized, e.g., by ozonated water, prior to cleaning.

Abstract: A cleaning apparatus and a cleaning method for cleaning an object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: A wet spray cleaning process for removing thick organic layers including hardened photoresist from the surface of silicon wafers yields low residual particle counts for photoresist thicknesses up to 3 microns, and maintains low residual particle density for oxide-covered wafer regions. The cleaning process uses multiple cycles of SPM/DI/APM/DI, without an intervening drying step therebetween.

Abstract: A substrate is processed with a first process solution prepared by mixing sulfuric acid with a hydrogen peroxide solution, followed by processing the substrate with a second process solution. After the substrate is processed with the first process solution, the supply of sulfuric acid is stopped, with the hydrogen peroxide alone being supplied to the substrate. Then, the supply of the hydrogen peroxide solution is stopped, and the substrate is rinsed with a second process solution. The particular processing makes it possible to prevent the second process solution from reacting with sulfuric acid.

Abstract: A device for cleaning and sanitizing a food reservoir. The device includes two parts. The first part contains at least one or more enzymes and the second part contains one or more antimicrobial agents. The second part is isolated from the first part by a degradable barrier that is solid and stable under storage conditions but is adapted to decompose upon exposure to the aqueous conditions used for cleaning.

Abstract: A machine for cleaning containers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor. Used cleaning solution is diverted to a reclaim tank for reuse, thereby allowing low-cost cleaning with concentrated chemicals, and with the creation of less liquid waste requiring disposal. In a method for removing contaminants from flat media or silicon wafer containers or carriers, a mixture of surfactant and de-ionized water is sprayed onto containers on a spinning rotor. The used cleaning solution is collected, filtered and reused.

Abstract: A method for treating substrates in a container containing a treatment fluid includes the step of inserting the substrates into the empty container and introducing a first treatment fluid at the bottom of the container to fill the container. The first treatment fluid is displaced by introducing a second treatment fluid at the bottom of the container, wherein the first treatment fluid flows out of the container across the upper edge of the container.

Abstract: A semiconductor wafer cleaning apparatus and method uses only one inner bath for chemical solution and de-ionized water cleaning, and includes a marangoni dryer for cleaning and drying semiconductor wafers. The apparatus includes a loading unit loaded with a cassette holding wafers; a moving mechanism for extracting the wafers from the cassette and moving the wafers into a loader; an inner bath for cleaning the wafers with a chemical solution or de-ionized water; a marangoni dryer including a hood, for moving the wafers from the loader into the bath, to be sealed to the bath; and a knife for supporting the wafers loaded into the bath at a lower portion thereof and moving the wafers up and down. Since the marangoni dryer is adhered to the bath during drying, the wafers are not affected by laminar flow or exhaustion and water marks do not occur thereon.

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract: A method for cleaning an object to be processed in which the atmosphere in a drying chamber is replaced by an inert gas prior to placing an object to be cleaned from an external environment into the chamber. The object is then transported by an elongated retaining member from the drying chamber through a lower opening in the chamber into a processing bath disposed below the chamber. The object is then cleaned in the processing bath. The object is then transported from the processing bath to the drying chamber where it is dried by filling the atmosphere of the drying chamber with organic solvent. The cleaning process in the cleaning bath is carried out while the bath is screened by a nitrogen-gas curtain. The method also includes opening a lid of the chamber prior to insertion of the object into the chamber and closing the lid after insertion of the object, as well as the opening and closing of the lower opening in the chamber.

Abstract: Provided is a method for cleaning hydrophobic surfaces, such as low K dielectric organic or inorganic surfaces as well as metallization surfaces of a semiconductor wafer. The method includes: (a) applying a surfactant solution to the surface; (b) scrubbing the surface; and (c) spin-rinsing the surface of the substrate using de-ionized water to complete a removal of any contaminants from the surface. If needed, the surfactant solution can be mixed with a chemical enhancer, and the scrubbing can be performed in a brush system. The brush system may be configured to apply DI water using a through the brush (TTB) technique. The surfactant solution can be applied either using a drip technique or using the TTB technique.

Abstract: The present invention provides a method of polishing and/or cleaning a substrate using a multi-component polishing and/or cleaning composition, wherein the components of the polishing and/or cleaning composition are mixed at the point-of-use or immediately before delivery to the point-of-use. The present invention also provides a method of polishing and/or cleaning more than one substrate simultaneously using a single apparatus, wherein a different polishing or cleaning composition is delivered to each substrate.

Abstract: A transducer is coupled either directly in a linear relationship, or remotely in an angular relationship, to a focusing element. The transducer and focusing element preferably extend a length at least equal to the diameter of a substrate to be cleaned thereby. The transducer and focusing assembly impart focused megasonic energy to a fluid in contact therewith. Three embodiments of a cleaning system which advantageously employ the transducer/focuser assembly are disclosed. The transducer/focuser assemblies preferably focus megasonic energy in a line across the substrate's surface, the substrate is then scanned past the lines of energy such that the substrate's entire surface is cleaned.

Abstract: A pre-clean deluge system for cleaning automobile white bodies including a cleaning solution filtration and distribution system. The filtration system includes a series of filters specially adapted to remove metal particles from the cleaning solution. The distribution system includes deluge cannons that are position so as to deliver cleaning solution to the interior of the white body in a location during the white body travel so that the particles flushed therefrom are introduced into a small tank prior to a main tank in which the white body is subsequently immersed. The distribution system also provides regulated flow of cleaning solution to the deluge cannons, as well as a bypass to facilitate cycling of cleaning solution for end-of-shift filtration purposes.

Abstract: In a method for rinsing and drying a semiconductor workpiece in a micro-environment, the workpiece is placed into a rinser/dryer housing. The rinser/dryer housing is rotated by a rotor motor. The rinser/dryer housing defines a substantially closed rinser/dryer chamber. Rinsing and drying fluids are distributed across at least one face of the semiconductor workpiece by the action of centrifugal force generated during rotation of the housing. A fluid supply system is connected to sequentially supply a rinsing fluid followed by a drying fluid to the chamber as the housing is rotated.

Abstract: A portable parts washing machine using a washing solvent to wash motor parts or the like. The apparatus has a stowed configuration and an operating configuration. In the operating configuration, a solvent container/wash basin is positioned on a base section which also functions as a solvent reservoir. Solvent is recirculated by a pup and recirculating line fro the reservoir to the wash basin, with the solvent washing the parts and then flowing through a drain in the wash basin into a centrifugal filter. The centrifugal filter removes the contaminates, with the solvent returning to the reservoir. In the stowed configuration, the base section, centrifugal filter and solvent recirculating assembly are stowed in the container.

Abstract: The present invention relates to a process for removing fatty substances. According to this process, the following steps are carried out:1) at least a first degreasing operation is carried out on the article to be treated, in the presence of a solvent mixture comprising at least one compound (a) chosen from C1-C4 dialkyl esters of at least one C4-C6 aliphatic diacid, and at least one compound (b) which is miscible in the compound (a) and which at least partially dissolves the fatty substance contaminating the article, 2) at least a second degreasing operation is optionally carried out, in the presence of a solvent mixture comprising at least one compound (a) and at least one compound (b) as defined above, with a compound (a)/compound (b) volume ratio of greater than or equal to 1, 3) a third degreasing operation is carried out in the presence of compound (a), 4) the article thus treated is rinsed with water.

Abstract: A high pressure pump (14) supplies cleaning fluid from a reservoir (12) to spray nozzles (20) inside a washing chamber (10). The spray nozzles (20) spray the cleaning fluid over a load to be cleaned. Used cleaning fluid is collected in a sump (30). A sump pump (32) drains the sump. The combination of the high pressure pump and sump pump provides more efficient cleaning of the load and eliminates the requirement for a deep sump beneath the washer. A vertical traveler (22), having a pair of counterbalanced spray arms (24), raises and lowers the spray nozzles counter cyclically; a detergent injection system (50) accurately meters a correct amount of detergent is added to the cleaning fluid; and a filtration device (34) filters suspended material from the used cleaning fluid and uses a portion of the cleaning fluid to clean itself.

Abstract: Method and apparatus for cleaning semiconductor devices and other workpieces using an aqueous rinse solution which is de-oxygenated by passing the aqueous rinse solution and a carrier gas through an osmotic membrane degasifier. A cleaning chamber is also disclosed for carrying out the cleaning method.

Abstract: An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay. A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

Abstract: An apparatus and a method for locking a wire basket or a pod carrier basket in a support base for cleaning in an ultrasonic cleaning bath are provided. In the apparatus, a support base is constructed of an open bottom panel and four vertical posts emanating upwardly from four corners of the bottom panel adapted for moving upwardly and downwardly in the cleaning bath. At last two locking means each mounted on a diagonally opposing vertical post are provided and each equipped with a hook or catch for locking onto one of the two horizontal handle bars provided on a wire basket that is positioned in the support base. The present invention novel locking means for locking a wire basket in a support base allows a wire basket that has lightened load to be positioned in the support base without causing bodily injury to a machine operator, and allows the wire basket to be securely locked in the support base during an ultrasonic cleaning procedure without the basket floating problem.