Abstract: An improved enhancer formulation for use in forming precision molded articles from a furnace process is disclosed wherein an organometallic zirconia coupling agent is used in conjunction with a polymer in solvent to inhibit the bleed-through of infiltrant metal in a finished part formed in a single-step furnace process.

Abstract: The present invention relates to terminal electrode compositions for multilayer ceramic capacitors. More specifically, it relates to terminal electrode compositions for multilayer ceramic capacitors which have a metal oxide component selected from SnO2, V2O5 and MoO3. The compositions can be fired at a low temperature in a nitrogen atmosphere.

Abstract: An effective method for cleaning flux residues produced in process of fabricating semiconductor devices, and a method of fabricating the semiconductor devices including this cleaning method are provided. The flux cleaning method for cleaning the solder bump electrodes formed using a flux comprises the steps of: applying a pretreatment process including coating of the solder bump electrode with the flux and applying a heat treatment thereto, and carrying out the flux cleaning to clean the heat-treated flux.

Abstract: The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

Abstract: In a method for partial or complete coating of surfaces of components of aluminum and its alloys with a uniform layer of homogeneously distributed solder, fluxing agent and binder for brazing of the components to one another, the solder, fluxing agent and binder are applied in powder form at high speeds up to 180 m/min onto the surfaces provided for brazing by electrostatic powder coating. The powder particles have a particle size of 5 to 30 &mgr;m. The proportion of binder relative to the total quantity of powder is smaller than 35% by weight. The uniform layer of homogeneously distributed solder, fluxing agent and binder has only a thickness of less than 50 &mgr;m. Heat is used melting this layer.

Abstract: A refractory braze composition and process for assembling alumina-containing parts to another alumina-based material, metal or a metal alloy by reactive or non-reactive refractory brazing using a braze composition provide assemblies entirely of alumina or containing alumina and a metal or metal alloy. The braze composition is non-reactive with alumina or a reactive composition, whose reactivity with alumina is controlled, and it is formed of aluminium, of titanium, and of a matrix made up either of palladium, or of nickel, or of a nickel and palladium alloy.

Abstract: A method for reducing blow holes existing in a light alloy cast by using the hot isostatic process (HIP), comprising the steps of heating the light alloy cast at a temperature that is 5-100° C. lower than a temperature at which the liquid phase of the light alloy cast appears, and pressing the heated light alloy cast by a liquid pressure media, thereby reducing the blow holes existing in it.

Abstract: A coating composition produces a protective coating to a substrate, which coating has an improved surface smoothness. The coating composition comprises a mixture of at least a first type of particles and a second type of particles that are dispersed in a liquid medium. The particles form a total population of particles having a median ESD in a range from about 1 to about 7 micrometers. The different types of particles have different median ESDs. The first type of particles has a maximum ESD of about 40 micrometers, and the second type of particles has a maximum ESD of about 20 micrometers. A method for producing a coating having an improved surface smoothness comprises applying such a coating composition on a substrate and curing the coating composition to produce a protective coating. The coating may be further densified by a burnishing process or further improved by applying another coating comprising particles having ESDs less than about 4 micrometers.

Abstract: Soldering paste for bonding an electronic component to electrodes on a ceramic substrate includes alcohol having at least two OH groups, organic acid, and metallic powder. The electronic component disposed on the electrodes through the soldering paste undergoes a reflow performed in a nitrogen atmosphere. Accordingly, an ester film is formed around the electrodes as a reaction product of the organic acid and the alcohol. The ester film incorporates therein the remaining organic acid and metal salt as its reaction product. As a result, high insulation reliability is provided.

Abstract: Solder spheres which can avoid blackening during transportation have a substantially uniform coating of a lubricant on the surfaces thereof. They are produced by dipping freshly prepared solder spheres in a lubricant solution with a concentration of from 10 ppm to 1000 ppm followed by collection of the spheres and drying. The lubricant is preferably selected from an aliphatic hydrocarbon lubricant, a higher fatty alcohol or acid lubricant, a fatty acid amide lubricant, a metal soap lubricant, a fatty acid ester lubricant, a fluoroplastic lubricant, a silicone lubricant, and a combination thereof.

Abstract: Disclosed herein is a surface treatment agent for steel, characterized in that, said agent contains 0.1-15% by mass of chromium sulfate and 10-40% by mass of a binder resin containing butyral resin or a mixture of butyral resin with another resin which is compatible with butyral resin.

Abstract: This invention provides a lead-free high temperature solder material comprising 0.005-3.0 wt % of palladium (Pd) and 97.0-99.995 wt % of tin (Sn) whose liquidus temperature is 200-350° C. The solder material is environmentally-friendly, improved in thermal fatigue property, and it can improve the reliability of electronic apparatuses. A predetermined amount of Sn material and Pd is mixed, vacuum-melted and cast to prepare an ingot. The ingot is rolled to be a tape that is later pressed to obtain a solder pellet. In a preferable composition, at least 95 wt % of Sn and 0.005-3.0 wt 5 of Pd are contained, and 0.1-5.0 wt % of metallic (e.g. Cu, Ni) or alloy particles are added. The average particle diameter is about 40 &mgr;m. A substrate and an IC chip (electronic element) are die-bonded substantially in parallel by a solder material provided between an Ni plating on the lower side of an IC chip (semiconductor) and an Ni plating on a die.

Abstract: A brazing material comprising a mixture of aluminum brazing powder (i.e. Si, Zn, Cu or Ge), flux, binder, and alcohol for diluting the binder is coated on a surface of an extruded flat tubed strip of aluminum type and this and aluminum type fins are brazed together.

Abstract: A flux-cored wire for welding shielded by a flow of gas, in particular of the rutile or slag-free type, composed of an outer metal sheath and a central core comprising filling elements, and an MAG gas-shielded welding process using such a flux-cored wire for producing a welded joint on a steel construction, such as an offshore platform or a storage tank. The welded joint obtained has improved impact strength and improved toughness, and contains less than 65 ppm nitrogen, from 300 ppm to 0.12% carbon, from 0.01% to 0.6% silicon, from 0.9% to 1.9% manganese, from 20 ppm to 0.08% titanium, from 1 ppm to 80 ppm boron, from 5 ppm to 150 ppm aluminum, from 10 ppm to 0.02% niobium and from 10 ppm to 0.02% vanadium.

Abstract: Described is a solid wire for MAG welding which has no copper plating on the wire surface and which has good welding workabilities such as a reduced amount of generated spatters and good arc stability in the MAG welding of steel sheets.A solid wire for MAG welding comprises, as chemical components for the wire, 0.01 to 0.15 wt % of C, 0.20 to 1.00 wt % of Si, 0.70 to 1.70 wt % of Mn, 0.30 wt % or below of Ti, 0.025 wt % or below of S, 0.020 wt % or below of O, and the balance being Fe and inevitable impurities, wherein said wire is applied on the surface thereof with at least one compound serving as an arc stabilizer and selected from the group consisting of a K compound and a Cs compound in such a way that when an amount of the K compound to be applied to (calculated as K) is taken as Appm relative to the weight of said wire and an amount of the Cs compound (calculated as Cs) is taken as Bppm, a value of (A+3B) is in the range of 2 to 15 ppm.

Abstract: There is described a method of securing against lateral motion two bodies held in face to face asperity contact to make a joint between the two bodies. Inserted into the interface between the two bodes is a material known as a galling agent, gall promoter, gall enhancer or anti-lubricant. This material is a composition of a crosslinked siloxane having dispersed therein a gall promoting silicone. The crosslinked siloxane is formed, for instance, from the reaction between an amino siloxane and a dicarboxylic anhydride siloxane.

Abstract: Thermal stresses normally associated with brazing are alleviated by a low temperature brazing technique of the present invention. A low-temperature brazing paste, preferably suitable to be melted at temperatures of no greater than 200.degree. C. (e.g., 100-200.degree. C.), containing nanoscale (.ltoreq.100 nanometer) size particles of gold, cadmium, copper, zinc, tin, lead, silver, silicon, chromium, cobalt, antimony, bismuth, aluminum, iron, magnesium, nitrogen, carbon, boron, and alloys and composites of these materials, is applied as a bead or as a powder spray at the junction of two components desired to be joined together. Energy from a source such as a laser beam (for example a CO.sub.2 laser, an Nd-Yag laser or an excimer laser), flame, arc, plasma, or the like, is "walked" along the brazing material. The energy beam is sufficient to cause melting and re-crystallization of the nanoscale-particle-containing brazing paste.

Abstract: The present invention provides a soldering alloy which does not include harmful Pb or Cd and which has an excellent tensile strength, elongation value, and melting point property. The soldering alloy according to the present invention can thus solve the conventional environmental problems, set the soldering temperature at a low level to thereby restrict the thermal damage to a soldered portion, and prevent breaking of the soldering alloy due to a heat cycle, with an excellent tensile strength and elongation value. A tin-silver-based soldering alloy according to the present invention consist essentially of 3 to 4% by weight of Ag, 2 to 6% by weight of Bi, 2 to 6% by weight of In, and the balance being Sn.

Abstract: A flux composition for use together with solder preforms, which comprises rosin, N-unsubstituted or N-substituted 2-pyrrolidone, and optionally a high boiling point ester solvent with a content of N-unsubstituted or N-substituted 2-pyrrolidone being 3-50% by weight and a content of the ester solvent being not greater than 30% by weight.

Abstract: A method of forming a solder film on a metallic surface such as a pad of a metallic circuit of a printed circuit board and a lead frame of electronic parts, which is capable of forming a precise and fine pattern and which comprises selectively imparting tackiness to only a predetermined part of the metallic surface by means of a tacky layer-forming solution, adhering a powdered solder to the resulting tacky part, and then melting the solder by heating to thereby form a solder film.

Abstract: Provided are a soldering flux or paste containing an organic substance which has at least two hydroxyl (--OH) groups in a molecule and of which the temperature at which the mass % becomes approximately 0% is not lower than approximately 170.degree. C. and not lower than the solid phase linear temperature of the solder, as measured by thermal gravimetry in which a flow rate of an air or nitrogen (N.sub.2) gas atmosphere is 200 ml/min and a rate of temperature rise is 10.degree. C./min, and a soldering method using the same. The soldering flux or paste of the present invention gives good wettability to a matrix to be bonded in a normal temperature profile and in a non-reductive atmosphere without leaving any residue.

Abstract: A method of fabricating a package for housing a semiconductor element, comprising applying solder paste within plural depressions which are formed on at least one principal surface of an insulating substrate and have electrical connection pads, protruding the surface of the solder paste from the principal surface of the insulating substrate, mounting solder balls on the surface of the solder paste, and fusing the solder paste and the solder balls to produce unitary structures in order to form connection terminals with spherical protrusions.

Abstract: A nonionic surfactant having cyclic 1,3-dioxane and/or 1,3-dioxolane functionality which is irreversibly splittable by lowering the pH of its aqueous solution is useful in various processes requiring the removal of emulsified hydrophobic contaminants or other hydrophobic materials from an aqueous stream. After splitting of the surfactant into its component ketone and polyol, the hydrophobic components phase-separate and can be removed from the aqueous stream by routine means.

Abstract: A lead-free soldering material for soldering wires of electronic parts is disclosed. The lead-free soldering material is composed of in weight %: 3-4% of Ag, 2-5% of In, 6-14% of Bi and a balance of Sn, and the soldering material shows a superior solderability.

Abstract: A composition which is effective in the making of a galled joint between two metal members in which there are gaps in the joint prior to and during its formation and which comprises a multiplicity of small metal particles and a gall-enhancing material, for example, a polydimethylsiloxane, and the use of the composition in a method of securing against lateral motion two bodies held in face to face asperity contact, thereby to make a joint between the two bodies, in which method there is inserted into the gap or interface between the two bodies said composition, which on minimal initial lateral relative motion of the two surfaces promotes rapid but controllable "galling" between the two surfaces, this galling binding the surfaces against further such motion.

Abstract: A tin base soldering/brazing material contains 0.05 to 1.5 wt. % of P, 0.5 to 5.0 wt. % of Ni, if necessary, 30 wt. % or less of Cu, and/or 10 wt. % or less of Ag, and the balance of Sn and unavoidable impurities, wherein the total amount of Ni, Cu and Ag is 35 wt. % or less. This tin base soldering/brazing material is used as a tin base low melting point brazing material. Further, this tin base soldering/brazing material is used as a tin base lead-free solder wire having a diameter less than 100 .mu.m and pulling strength of the wire higher than a lead-tin solder wire, and a tin base lead-free solder ball having a diameter less than 1,000 .mu.m and a hardness higher than a tin base lead-free solder ball.

Abstract: Brazing fluxes comprising a combination of a fluoroaluminate complex and selected metal fluorosilicates, including their method of manufacture and use, are disclosed.

Abstract: A nonionic surfactant having cyclic 1,3-dioxane and/or 1,3-dioxolane functionality which is irreversibly splittable by lowering the pH of its aqueous solution is useful in various processes requiring the removal of emulsified hydrophobic contaminants or other hydrophobic materials from an aqueous stream. After splitting of the surfactant into its component aldehyde and polyol, the hydrophobic components phase-separate and can be removed from the aqueous stream by routine means.

Abstract: A lead-free solder consisting of 1 to 4 wt % of Ag, at least one of Bi and In in respective amounts meeting the conditions that the value of expression (1), A, is equal to or greater than 5.00 and that the value of expression (2), B, is equal to or less than 6.90, and Sn for the balance:A=[Ag wt %]+1.23 [Bi wt %]+0.52 [In wt %] (1)B=[Ag wt %]+1.19 [Bi wt %]+0.50 [In wt %] (2)This solder has a tensile strength and an elongation as high as those of conventional Pb--Sn solder without containing neither lead nor cadmium, which can cause environmental contamination.

Abstract: Aminoquinones and their use as additives in fluid media for providing corrosion resistance to metals in contact with the fluid medium and their use in preparing copolymers to provide corrosion resistant binder compositions for magnetic information storage media, the copolymers formed, the magnetic information storage media and a method for improving corrosion resistance in magnetic particles are provided.

Abstract: A repair coating for superalloy articles, such as gas turbine engine components, includes a volatile organic carrier or water-based carrier, a fluxing agent, a thickening agent, balance a filler mix. The filler mix consists of at least two distinct particulate components. The mix includes a first particulate component having a composition which approximates that of the article being repaired. The mix also includes a second particulate component having a composition approximating that of the article and a melting point depressant, such as boron. This melting point depressant is substantially in excess of that in the article and sufficient to provide melting of a portion of the mix at a processing temperature below the melting temperature of the article. The above filler mix is blended with the other constituents to form the repair coating which is applied to an article.

Abstract: To produce an active brazing paste suitable for brazing leads in insulating parts, e.g., ceramic parts, and containing an active brazing powder and an organic material acting as a vehicle, coarse pieces of the active brazing alloy are prehydrogenated. These pieces are ground in a mill with the addition of hydrogen to form a hydrogenated active brazing powder. The latter is then processed with the liquid vehicle openly, under normal atmospheric and temperature conditions, to form the active brazing paste.

Abstract: A solder paste composition containing (a) 4-96% by weight finely divided particles of eutectic or pseudo-eutectic metal alloy or mixtures; (b) 96-4% by weight finely divided particles of a metal additive consisting of pure metal, mixtures or alloys thereof having a melting point of at least 30.degree. C. greater than the metal alloy in (a); and (c) an organic medium. The paste is particularly useful for surface mounting metallized components to metallized substrates in microelectronic packaging.

Abstract: A coating composition comprises a slurry consisting essentially of an aluminum neutralized phosphate bonding solution and aluminum powder. The bonding solution advantageously contains a relatively small but essential amount of vanadium pentoxide and, preferably, magnesium. A process for forming the bonding solution component of the coating slurry includes equilibrating an aqueous phosphate solution with a small but controlled and necessary amount of solute aluminum prior to adding aluminum powder to form the slurry. The present invention overcomes the problem of bonding solutions which require environmentally disadvantageous chromates or molybdates.

Abstract: A seal coat composition comprises a slurry consisting essentially of an aluminum neutralized phosphate bonding solution and iron oxide (Fe.sub.2 O.sub.3) powder. The bonding solution advantageously contains a relatively small but essential amount of vanadium pentoxide and, preferably, magnesium. A process for forming the bonding solution component of the coating slurry includes equilibrating an aqueous phosphate solution with a small but controlled and necessary amount of solute aluminum prior to adding iron oxide powder to form the slurry. The present invention overcomes the problem of bonding solutions which require environmentally disadvantageous chromates or molybdates to neutralize the bonding solution prior to formation of the slurry.

Abstract: A rheologically controlled glass lubricant for hot metal working comprises a glass powder, a binder, a rheological agent, and a wetting and viscosity modifier. These materials may be dispersed in a carrier. The lubricant is made by mixing the constituent elements, milling the mixture, and stabilizing the milled mixture. The lubricant can be used in a forging operation by coating a metal part with the lubricant, heating the coated part, placing the coated heated part in a forge, and rapidly applying sufficient pressure to deform the coated metal part into a desired shape.

Abstract: This invention is a residue-free vapor-phase process for etching metallic layers during the manufacturing of integrated circuits. The process comprises contacting a portion of the metallic surface to be etched with an effective amount of an etching agent comprising a .beta.-diketone or .beta.-ketoimine dispersed in an atmosphere capable of oxidizing the metal to be removed at a temperature sufficient to form a volatile metal-ligand complex. The volatile metal-ligand complex is sublimed from the surface thereby etching successive layers of the metal.

Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal.A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

Abstract: A chromium weld material comprising chromium as a main component and either one of or an appropriate combination of elements selected from the group IVb metals of the periodic table, Al, metals belonging to the groups VIIb, VIII, and Ib of the periodic table, Nb, and Ta and, if desired, at least one of rare earth elements, a chromium rolled article comprising chromium as a main component and either one of or an appropriate combination of elements selected from Al, Ti, Zr, Hf, Y, rare earth elements, and elements belonging to the groups Vb, VIb, and VIIb of the periodic table, and a process for producing said rolled article by cross-rolling under specific temperature and output rate conditions are disclosed. The weld material provides a weld free from deterioration of mechanical characteristics. The rolled article exhibits excellent tensile characteristics. The process provides a rolled sheet of small thickness without causing craking.

Abstract: III-V films are grown on large automatically perfect terraces of III-V substrates which have a different lattice constant, with temperature and Group II and V arrival rates chosen to give a Group III element stable surface. The growth is pulsed to inhibit Group III metal accumulation to low temperature, and to permit the film to relax to equilibrium. The method of the invention 1) minimizes starting step density on sample surface; 2) deposits InAs and GaAs using an interrupted growth mode (0.25 to 2 mono-layers at a time); 3) maintains the instantaneous surface stoichiometry during growth (As-stable for GaAs, In-stable for InAs); and 4) uses time-resolved RHEED to achieve aspects (1)-14 (3).

Abstract: Improved soldering paste for surface mounting of electronic components comprises a novel fluxing agent selected from formylated polyhydric compounds. The paste enables circuit boards to be washed with water to remove flux residues.

Abstract: Improved soldering paste for the surface mounting of electronic components comprises a novel fluxing agent selected from quaternary ammonium hydroxides and mixtures thereof. Use of these agents as fluxes eliminates the problem of ionic residues on circuit boards and permits the boards to be washed with water to remove any non-ionic residues.

Abstract: A no clean thermally dissipated soldering flux is shown which includes camphor as a flux base, an organic activator and an organic diluent. The camphor provides a tacky yet fluid medium which is thermally dissipated during the flux operation and leaves no undesirable residue which would require a postcleaning step.

Abstract: A low residue soldering flux contains a non-subliming dibasic acid mixture of by weight about 15-30% succinic acid, 40-63% glutaric acid and 10-30% adipic acid, e.g., in a volatilizable organic solvent, formed as a rosin-containing or rosin-free flux. The dibasic acid mixture is capable of volatilizing during heat soldering to leave a soldered product (e.g., an electronic circuit board) essentially free from corrosion-promoting ionic residue. This eliminates the need for a residue-removing washing step.

Abstract: Solder paste vehicles using blends of monofunctional and polyfunctional alcohols are described. The blend may have a major portion of a low viscosity, monofunctional alcohol solvent and a minor portion of a high viscosity polyfunctional alcohol thickener. The monohydric solvent has a room temperature viscosity of at least 3 centipoise and from about 3 to 18 carbon atoms and may include such materials as 2-butanol, 1-hexanol, 1-heptanol, 1-octanol, 1-nonanol, 1-dodecanol, 2-ethoxyethanol, 2-(2-ethoxyethoxy)ethanol, 2-(2-butoxyethoxy)ethanol, n-hexadecanol, n-octadecanol, benzyl alcohol and mixtures thereof. The polyalcohol has a room temperature viscosity of between about 26 to about 1500 cp and includes compounds such as 1,2-ethanediol; 1,2-propanediol; 1,3-propanediol; 1,2-butanediol; 1,3-butanediol; 1,4-butanediol; 1,2-pentanediol; 1,5-pentanediol; 2,4-pentanediol; 2,5-hexane-diol; glycerol; 1,2,4-butanetriol; 2,2'-(ethylenedioxy)diethanol; 1,12-dodecane-diol; 1,16-hexanedecanediol and mixtures thereof.

Abstract: A composition for brazing aluminum or aluminum alloy characterized in that said composition contains aluminum alloy powder for brazing and thermoplastic acryl-based resin binder which is so volatile as to volatilize before being carbonized at a brazing temperature and said resin binder of 0.1 to 50 parts is used for aluminum alloy powder of 100 parts. When this technological idea was applied to brazing with a brazing material of aluminum alloy powder such as, for example, Al-Si, a preferable result of brazing could be obtained.

Abstract: A compound containing a tall oil fatty acid, oleic diethanol amide, aluminum oxide abrasive material, and organo-treated bentonite provides a polish for metals, such as aluminum, having a uniform viscosity and the abrasive particles uniformly dispersed throughout the carrier. Water may be added to form a scratch removing compound. Mineral spirits may be substituted for the fatty acid in the scratch remover to form a prepolish compound.

Abstract: A vacuum switch having two main electrodes encased in a vacuum vessel to be operable in opening and closing the main electrodes, is provided with a contact piece made of a copper-chromium alloy secured or formed on at least one of the main electrodes. The operational property of the main electrodes is substantially improved by flowing and interrupting an electric current of a predetermined current density for a number of times through the two main electrodes for improving surface condition of the contact piece by forming a recrystallized layer over the outer surface of the contact piece.

Abstract: A filler containing easily oxidizable elements such as aluminum, titanium, zirconium, rare earth metals as well as a powder combination containing fluorides and carbonates is used for fusion welding steel, nickel and cobalt alloys and corresponding castings containing easily oxidizable elements. The ratio of the dry weight of all fluorides to the dry weight of the alkaline earth carbonates in the powder combination is at least 2.2:1.

Abstract: There is provided a nonaqueous powdered metal paste composition and a vehicle therefor, characterized by resistance to slumping upon heating to the fusion point of the metal, fusion point being above 500.degree. C., including the powdered metal, and an organic material having a surface tension of from 43 to 65 or higher dynes/cm. at 20.degree. C.