Abstract: The instant invention is directed to a slurry for use in coating silicon steel prior to high temperature annealing, comprising magnesium oxide, water and at least one inorganic compound selected from the group consisting of barium oxide, barium nitrate, chromium nitrate, and their hydrates.The instant invention is also directed to a process for coating silicon steel, comprising coating the steel with a magnesium oxide slurry prior to high temperature annealing, the improvement wherein at least one inorganic compound selected from the group consisting of barium oxide, barium nitrate, chromium nitrate, and their hydrates is pre-mixed in said slurry, thereby minimizing the formation of "tight magnesia" on the steel.

Abstract: A stable, mechanically formed brazing shape comprising a polymer matrix which may be composed of thermosetting and thermoplastic resins in various combinations and braze alloys or compounds which when formed by extrusion, dried, and cured is able to replace brazing pastes, loose powders and tapes in many brazing applications especially those requiring the deposition of a uniform amount of alloy in the brazed or bonded joint. The fabrication of shapes of various cross sections by extrusion is also described.

Abstract: A flexible brazing alloy tape with a binder having less than 3% by weight total organic content and no more than about 1% by weight residual ash after melting is provided by use of a polyacrylic acid polymer, glycerol and water as a vehicle in which the powdered alloy is dissolved to form a slurry prior to casting. The polyacrylic acid polymer has a relatively low viscosity defined by a molecular weight of about 450,000. The slurry is deposited on a substrate and is dried and the resulting flexible low organic self-supporting tape is removed from the substrate to be formed into desired shapes as preforms for brazing. Alternatively a brazing alloy tape comprising a binder having a similarly low total organic content is produced by mixing the powdered alloy with polyvinyl alcohol, glycerol and water and thereafter casting the tape as described above.

Abstract: Disclosed are thermally crystallizable glass compositions, glass ceramics and dopant hosts made therefrom, wherein said dopant hosts in thin wafer form have improved resistance to warpage, said compositions containing SiO.sub.2, Al.sub.2 O.sub.3, MgO, BaO, and B.sub.2 O.sub.3.

Abstract: A composition for compressing and sintering to produce high-wear resistant articles essentially includes between 2% and 10% by weight, preferably 5% by weight, basalt powder and the remainder being metallurgical powder. The metallurgical powder is preferably comprised of austenite steel powder of high commercial quality and the basalt powder is a commercial quality basalt. The article of manufacture is for an internal combustion engine supplied with lead-free fuel wherein the article is comprised of compressed and sintered metal powder having the entire resulting pore space filled with basalt. The article takes the form of a cylinder liner, a valve seat and/or a valve-seat ring.

Abstract: A coating composition useful for forming a high concentration phosphoro-silica spin-on dopant is disclosed. The coating composition is formed by the steps of heating a solution of mono-aluminum phosphate, adding a methyl alcohol to the hot solution so as to decrease the viscosity to a predetermined level, permitting the now diluted mono-aluminum phosphate solution to cool and mixing the cooled solution with an alcoholic solution of tetraethylorthosilicate. The present invention is also directed to semiconductor devices coated with the coating composition described hereinabove.

Abstract: This invention relates to a plating-inhibitor used in partially plating a steel plate with a molten metal, characterized by comprising (a) one or more water-soluble phosphate type bases selected from the group consisting of metal phosphates, metal condensed phosphates and their modified metal phosphates, a part of the water-soluble phosphate type bases being optionally replaced by one or more of the group of alkali metal silicates, quaternary ammonium silicate, silica sol and alumina sol; and (b) one or more inorganic inert powdery materials which are heat-resistant and substantially non-reactive with the molten metal.

Abstract: Disclosed are new polycrystalline ceramic bodies formed from melts containing as essential components P.sub.2 O.sub.5, Ta.sub.2 O.sub.3 and Al.sub.2 O.sub.3 and sometimes containing small amounts of SiO.sub.2. Also disclosed are such bodies in the form of planar dopant hosts for doping silicon or germanium with phosphorus. Methods of making both products are disclosed as well as how to use the dopant hosts in a doping process.

Abstract: Disclosed are B.sub.2 O.sub.3 -containing glass-ceramic bodies made by in situ thermal crystallization of glasses and useful as a host for diffusion doping of semiconductors by the vapor phase transport of B.sub.2 O.sub.3 to the semiconductor from the glass-ceramic which in mole percent consists essentially of SiO.sub.2 15-40, Al.sub.2 O.sub.3 15-30, B.sub.2 O.sub.3 20-60, RO 5-25, La.sub.2 O.sub.3 0-5, Nb.sub.2 O.sub.5 0-5 and Ta.sub.2 O.sub.5 0-5 wherein RO is selected from MgO, CaO, SrO and BaO in specified percentages, and mixtures thereof and wherein the ratio Al.sub.2 O.sub.3 to RO is 1.5-4.

Abstract: New reactants for catastrophically embrittling steel having a hardness of ckwell C40 or greater comprising an amalgam of 98 to 99 weight percent mercury, the balance being lithium and indium; and an aqueous solution of vanadium pentoxide, and methods for applying said reactants to the steel.

Abstract: A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the melted polysulfone in place during the solder dipping operation.

Abstract: New reactants for catastrophically embrittling steel having a hardness of ckwell C40 or greater comprising an amalgam of 98 to 99 weight percent mercury, the balance being lithium and indium; and sulfuric acid, and methods for applying said reactants to the steel.

Abstract: Wax-flux compositions for use in soldering processes comprising: (a) a major amount of a wax; and (b) an effective amount to cause fluxing, at or below the temperature of the piece to be soldered, of a wax-soluble, phosphorus-containing acid.

Abstract: Wax-flux compositions for use in soldering processes comprising: (a) a major amount of a wax; and (b) an effective amount to cause fluxing, at or below the temperature of the piece to be soldered, of a wax-dispersible C.sub.12 to C.sub.28 aliphatic carboxylic acid.

Abstract: Disclosed is a solid diffusion source for the phosphorus doping of semiconductors, which comprises a substance composed of at least one kind of compound R.sub.2 O.sub.3 selected from the group consisting of Y.sub.2 O.sub.3, La.sub.2 O.sub.3 and Ce.sub.2 O.sub.3 and P.sub.2 O.sub.5 and containing mainly a compound with a chemical formula R.sub.2 O.sub.3.5P.sub.2 O.sub.5.

Abstract: A solid source consisting essentially of high purity aluminum metaphosphate, Al(PO.sub.3).sub.3 is used for introducing elemental phosphorus into P-type silicon chips or wafers of semi-conductor grade. The aluminum metaphosphate functions as a source for the controlled release of P.sub.2 O.sub.5 vapors which are directed to the desired face of the silicon wafer. The reverse side of the silicon wafer receives little or no phosphorus and consequently retains its character as P-type silicon.

Abstract: Disclosed are B.sub.2 O.sub.3 -containing glass-ceramic bodies made by in situ thermal crystallization of glasses and useful as a host for diffusion doping of semiconductors by the vapor phase transport of B.sub.2 O.sub.3 to the semiconductor from the glass-ceramic which in mole percent consists essentially of over 40 and up to 60 SiO.sub.2, 10 to 30 Al.sub.2 O.sub.3, 20 to 40 B.sub.2 O.sub.3 and 3 to 20 alkaline earth oxides including 1 to 15 BaO wherein the ratio of Al.sub.2 O.sub.3 to alkaline earth oxides is from 1.5 to 4.

Abstract: A stop-weld composition for forming a corrosion inhibiting layer on the internal surface of aluminium tube in sheet comprises 2.0 to 50.0% of boron nitride, 0.2 to 10.0% of bentonite, 5.0 to 50.0% of finely divided zinc and the balance solvent.

Abstract: Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of a wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble alkylaryl sulfonic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the component leads, and (D) soldering the components to the printed circuit board.

Abstract: Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of a wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble diester of sulfomalic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the components leads, and (D) soldering the components to the printed circuit board.

Abstract: Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of a wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble amine salt of an alpha-bromo aliphatic carboxylic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the components leads, and (D) soldering the components to the printed circuit board.

Abstract: Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble diester of sulfomaleic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the components leads, and (D) soldering the components to the printed circuit board.

Abstract: Disclosed is a composition and method for its use to improve the corrosion resistance of conversion-coated metal surfaces. The composition contains a myo-inositol phosphate ester or soluble salt thereof and is applied as a rinse of the conversion coating.