Synthetic Resin Containing Patents (Class 156/327)
  • Publication number: 20110318586
    Abstract: The invention relates to innovative flexible packaging forms comprising at least 2 different layers of material joined by means of one or more adhesive layers, at least one of these adhesive layers comprising a carbodiimide or a mixture of two or more carbodiimides, to a method for producing them and to the use thereof.
    Type: Application
    Filed: May 25, 2011
    Publication date: December 29, 2011
    Applicant: RHEIN CHEMIE RHEINAU GMBH
    Inventors: Ana Maria Cano Sierra, Christian Scheffner, Andrea Fruth, Bruce Ernst
  • Patent number: 8079470
    Abstract: A themolaminating film for receiving a blister portion in the construction of a reusable package is described. A base blister portion configured to receive some form of media or material is molded from a formable heat sealable polymer such as PETG. A film consisting of a first layer of an amorphous polyester such as APET for heat sealing to the PETG, a second layer of a polyester such as PET, and an adhesive layer is used to laminate a graphical paper based cover thereby allowing the laminated cover to be heat sealed to the blister portion. In a preferred embodiment, the PET and APET are preferably coextruded.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: December 20, 2011
    Inventor: Anthony Trajkovich
  • Publication number: 20110305914
    Abstract: Described is a process for preparing an aqueous polymer dispersion from ethylenically unsaturated, free-radically polymerizable monomers. In a first stage, a first polymer is prepared by free-radical emulsion polymerization. In a second stage, an aqueous polymer dispersion is prepared in the presence of the first polymer. The monomers of the first stage comprise monomers with acid groups. The polymerization of the first stage takes place at a low pH of less than 5. The acid groups of the first polymer are neutralized during the polymerization of the second stage to an extent such that the pH of the polymer dispersion at the end of the second stage is greater than 5. The aqueous polymer dispersions can be used as adhesives for producing composite films.
    Type: Application
    Filed: June 9, 2011
    Publication date: December 15, 2011
    Applicant: BASF SE
    Inventors: Daniel WILMS, Karl-Heinz Schumacher, Michael Groß, Georg Langhauser
  • Publication number: 20110293922
    Abstract: A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or pitch-derived fine carbon pieces is used to electrically bond two conductive elements. The conductive resin composition is supplied to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas.
    Type: Application
    Filed: August 10, 2011
    Publication date: December 1, 2011
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Tomoaki Onoue, Masaaki Hirayama, Yoshiki Aburatani
  • Patent number: 8067504
    Abstract: A pre-adhesive composition is described comprising an acid-functional (meth)acrylate copolymer and an acylaziridine crosslinking agent, which when crosslinked provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: November 29, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Belma Erdogan, Timothy D. Filiatrault, Maureen A. Kavanagh, Larry R. Krepski, Babu N. Gaddam
  • Publication number: 20110284914
    Abstract: A substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, comprising:an insulating layer which is composed of a resin containing heat conductive fillers under the mounting position of said light emitting element and has a heat conductivity of 1.0 W/mK or more; and a metal layer disposed inside said insulating layer and having the thick metal section, wherein a heat conductive mask section is disposed at the top of said thick metal section.
    Type: Application
    Filed: November 25, 2008
    Publication date: November 24, 2011
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Motohiro Suzuki, Naomi Yonemura, Yoshihiko Okajima, Tetsuro Maeda, Eiji Yoshimura
  • Patent number: 8062469
    Abstract: The present invention relates to an inexpensive adhesive resin composition which is applicable even to a base material having a poor bonding property. The adhesive resin composition comprises (A) a polymer having no radical-polymerizable double bond and (B) a radical generating agent in which the radical generating agent (B) is present in an amount of 0.1 to 10 parts by weight on the basis of 100 parts by weight of the polymer (A). In the preferred embodiment of the present invention, the adhesive resin composition further comprises (C) a radical-polymerizable monomer wherein the monomer (C) is present in an amount of 0.1 to 10 parts by weight on the basis of 100 parts by weight of the polymer (A). The radical-polymerizable monomer (C) is a glycidyl group-containing monomer, and the glycidyl group-containing monomer is 4-hydroxybutyl acrylate glycidyl ether.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: November 22, 2011
    Assignee: Nippon Kasei Chemical Company Limited
    Inventors: Satoshi Yamauchi, Yoshiko Kaneko, Katsufumi Kujira, Shouji Sakamoto
  • Publication number: 20110277931
    Abstract: Certain small molecule amino acid phosphate compounds such as phosphoserine and certain multivalent metal compounds such as calcium phosphate containing cements have been found to have improved properties and form an interpenetrating network in the presence of a polymer that contain either an electronegative carbonyl oxygen atom of the ester group or an electronegative nitrogen atom of the amine group as the bonding sites of the polymer surfaces to the available multivalent metal ions.
    Type: Application
    Filed: May 10, 2011
    Publication date: November 17, 2011
    Inventors: Venkat R. Garigapati, Brian J. Hess, Cassandra L. Kimsey, Matthew E. Murphy
  • Publication number: 20110274888
    Abstract: The invention relates to a composite material made up of at least one ceramic layer or at least one ceramic substrate and at least one metallization formed by a metallic layer on a surface side of the at least one ceramic substrate.
    Type: Application
    Filed: October 20, 2009
    Publication date: November 10, 2011
    Inventors: Xinhe Tang, Helmut Hartl
  • Publication number: 20110266788
    Abstract: A method for interlaminating a transparent embossed hologram, the transparent embossed hologram comprising a support having two sides, at least one of the two sides either itself being embossed or having a layer thereon which is embossed and a layer of a HRI-material contiguous with the embossed side or embossed layer, comprising the steps of: a) providing the outermost surface of the layer of inorganic HRI-material with a layer of an adhesive composition containing a solution or dispersion of at least one polymer in an organic solvent medium; b) drying the layer of the adhesive composition on the outermost surface of the HRI-material thereby providing a conditioned outermost surface of the layer of inorganic HRI-material with a transparent continuous adhesive layer; and c) laminating the transparent continuous laminatable layer to a foil, wherein the organic solvent medium is selected from the group consisting of ketones, ethers, heterocyclic ethers, lactams, amides, halo-aliphatic compounds, nitriles and es
    Type: Application
    Filed: September 19, 2008
    Publication date: November 3, 2011
    Applicant: AGFA-GEVAERT N.V.
    Inventor: Ingrid Geuens
  • Publication number: 20110259354
    Abstract: Method for manufacturing bonding systems for hair prostheses which makes it possible to produce self-adhesive prostheses. The process comprises preparing a thin membrane, from 20 to 80 microns, in a single-spreading operation and from 100 to 400 microns in successive spreading operations, comprising a preformed adhesive to which silver ions having an antibacterial action are added, into which microbubbles of air are blown during the mixing process. This adhesive composition is spread onto readily-removable silicone sheets which have the characteristic of being thermoformable to form caps having the shape of the user's head. The hair prosthesis is made separately by inserting hairs into a polyurethane membrane which is then attached to the adhesive membrane.
    Type: Application
    Filed: December 1, 2009
    Publication date: October 27, 2011
    Inventor: Massimiliano Delli
  • Publication number: 20110254779
    Abstract: Disclosed herein are a touch screen device and a method of manufacturing the same. The touch screen device includes: a touch screen; a display formed on one side of the touch screen; and an adhesive layer formed between the touch screen and the display, in which an adhesive portion is formed on the entire surface where the adhesive layer is in contact with the touch screen and on the edge portions of the surface where the adhesive layer is in contact with the display. Further, the touch screen device has improved transmittance by removing an air layer between the touch screen and the display and can be easily corrected when the touch screen is incorrectly bonded with the display.
    Type: Application
    Filed: June 11, 2010
    Publication date: October 20, 2011
    Inventor: Jong Young LEE
  • Publication number: 20110247757
    Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.
    Type: Application
    Filed: June 17, 2011
    Publication date: October 13, 2011
    Inventors: Motohiro ARIFUKU, Itsuo Watanabe, Yasushi Gotou, Kouji Kobayashi, Kazuyoshi Kojima
  • Publication number: 20110242657
    Abstract: A method for laminating a film on to an optical article and a bi-layer adhesive for use in the method. The bi-layer adhesive includes a latex adhesive layer or a specific silane adhesive and an HMA layer sequentially disposed on the film and dried to form a solid layer of uniform thinness throughout to provide optical quality. Various types of films may be employed to provide an optical function. Following optional pre-treatment steps, the adhesives are coated on to the film. An optical hot press technique is used to deliver heat and pressure over a short period of time to form a functionally-enhanced optical article with high adhesive strength.
    Type: Application
    Filed: November 2, 2009
    Publication date: October 6, 2011
    Inventors: Arnaud Glacet, Peiqi Jiang, Bruce Keegan
  • Patent number: 8028353
    Abstract: A foam interlining device for swimming pools with pressure activated adhesive is shown. The device is disposed between the pool liner and the swimming pool backup wall. The interlining is also constructed with both a mounting adhesive and a self-sealing coating. The self-sealing coating seals minor punctures and tears of the pool liner. In one embodiment, the edge of the interlining also functions as an expansion joint between a deck and the swimming pool coping and as an underlayment or sill seal for the coping. The interlining device is also shown premounted on the backup-wall-side of the pool liner.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: October 4, 2011
    Assignee: Mitek Holdings, Inc.
    Inventor: Ronald P. Hohmann, Jr.
  • Publication number: 20110228378
    Abstract: A method of manufacturing is disclosed for an electrophoretic display apparatus that includes an array substrate and an electrophoretic film laminated to the array substrate. A thermally activated adhesive is used to adhesively attach the electrophoretic film to the array substrate. The electrophoretic film is first aligned to and flattened against the array substrate and then a substantially stronger than original adhesion property of the adhesive is activated by annealing at a high temperature that is substantially greater than room temperature. Rework prior to annealing is therefore possible when alignment errors occur between the electrophoretic film and the array substrate.
    Type: Application
    Filed: December 16, 2010
    Publication date: September 22, 2011
    Inventors: Wang-Su Hong, Seung-Jin Baek, Jang-Kyum Kim
  • Publication number: 20110229721
    Abstract: New hotmelt adhesives are provided that are based on specific ethylene-vinyl acetate copolymers, styrene block copolymers, and a tackifying resin. These hotmelt adhesives are outstandingly suitable for bonding substrates, more particularly for bonding films to substrates.
    Type: Application
    Filed: September 11, 2008
    Publication date: September 22, 2011
    Applicant: LANXESS DEUTSCHLAND GMBH
    Inventors: Martin Hoch, Michael Herrmann
  • Publication number: 20110228492
    Abstract: Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.
    Type: Application
    Filed: May 27, 2011
    Publication date: September 22, 2011
    Applicant: Arizona Board of Regents, for and on behalf of Arizona State University
    Inventors: Jesmin Haq, Scott Ageno, Douglas E. Loy, Shawn O'Rourke, Robert Naujokaitis
  • Publication number: 20110209822
    Abstract: A powder primer composition particularly useful as a primer intended to be used in conjunction with an adhesive topcoat in rubber to metal bonding. And a method for bonding an elastomeric substrate to a metallic substrate comprising, applying a powder primer composition onto one of said substrates, wherein the powder primer composition comprises a rubbery polymer and at least one of a phenolic resin and a phenoxy resin, applying an adhesive covercoat to form a coated substrate, contacting the coated substrate with the other of said substrates, and heating the contacted substrates to effect bonding of the metallic substrate to the elastomer.
    Type: Application
    Filed: November 9, 2009
    Publication date: September 1, 2011
    Inventor: James R. Halladay
  • Publication number: 20110200765
    Abstract: A security laminate for securing a security document comprising: a) a biaxially stretched polyethylene terephthalate support; and b) a thermosensitive layer coated on the support; wherein the thermosensitive layer contains a binder, a substantially light-insensitive organic silver salt, an organic reducing agent and a toning agent selected from the group consisting of phthalimides, phthalazinones, benzoxazine diones and naphthoxazine diones. Methods for manufacturing security documents are also disclosed.
    Type: Application
    Filed: November 26, 2009
    Publication date: August 18, 2011
    Applicant: AGFA-GEVAERT
    Inventors: Carlo Uyttendaele, Ingrid Geuens
  • Patent number: 7994233
    Abstract: A thermoplastic composition that includes from about 1% by weight to 25% by weight block copolymer having the formula (A-B)x or A-B-A, where the A block includes polyvinylarene, the B block includes poly(monoalkenyl) and x is an integer of at least one, spherical superabsorbent particles comprising polyacrylate, and plasticizing oil, the composition exhibiting water gel time of no greater than 2 minutes, a viscosity of no greater than 100,000 centipoise and a wet tensile strength of at least 15 g/in2.
    Type: Grant
    Filed: December 8, 2004
    Date of Patent: August 9, 2011
    Assignee: H.B. Fuller Company
    Inventors: Fouad D. Mehawej, Eugene R. Simmons
  • Publication number: 20110186221
    Abstract: A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
    Type: Application
    Filed: February 1, 2010
    Publication date: August 4, 2011
    Inventors: Ming De Wang, Steven A. Castaldi, Kesheng Feng
  • Patent number: 7989525
    Abstract: An object of the present invention is to provide a pressure-sensitive adhesive composition which is excellent in antistatic property of a non-electrification-prevented adherend (subject to be protected) upon peeling, and has reduced stainability in an adherend and is excellent in adhesion reliance, and electrification preventing pressure-sensitive adhesive sheets using the same. There is provided a pressure-sensitive composition comprising an ionic liquid, and a (meth)acryl-based polymer containing, as a monomer component, 0.1 to 100% by weight of a (meth)acrylic acid alkylene oxide. There is provided a pressure-sensitive composition comprising an ionic liquid, and a polymer containing, as a monomer component, 0.5 to 30% by weight of a nitrogen-containing monomer and having a glass transition temperature Tg of no higher than 0° C. There is provided a pressure-sensitive composition comprising an ionic liquid, and a (meth)acryl-based polymer containing, as a monomer component, 0.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: August 2, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Tatsumi Amano, Natsuki Kobayashi, Masahiko Ando
  • Publication number: 20110183561
    Abstract: A mixture comprising an expandable graphite and a polymer resin is described wherein the polymer resin-expandable graphite mixture has a volume increase and structural integrity after exposure to heat. Methods are described for increasing the thermal protective performance (TPP) of textiles and laminates while optionally maintaining comfort, flexibility, and liquid protective properties.
    Type: Application
    Filed: April 4, 2011
    Publication date: July 28, 2011
    Inventors: Dattatreya Panse, Klaus Meindl
  • Publication number: 20110183100
    Abstract: Provided are a solvent-free adhesive for a waterproof sheet, a waterproof sheet and a manufacturing method of the waterproof sheet using the solvent-free adhesive, and a construction method using the waterproof sheet. The solvent-free adhesive is manufactured by mixing rubber and tackifier with heated oil in a heat liquefying mixer to form a mixture and thereafter mixing at least one additive with the mixture, wherein the oil is at least one of mineral oil, vegetable oil, and synthetic oil. The solvent-free adhesive is coated on a polymeric synthetic film sheet (e.g., PP, PE, PVC, EVA, and urethane) not having adhesive property.
    Type: Application
    Filed: May 8, 2009
    Publication date: July 28, 2011
    Inventors: Dae-Woo Lee, Sang-Yun Lee, Young-Geun Kim
  • Patent number: 7976669
    Abstract: A pressure-sensitive adhesive and retardation layer-attached polarizing plate (4) comprises a retardation layer-attached polarizing plate (3) comprising a polarizing plate (2) that comprises an iodine-based polarizer (1) and a transparent protective film laminated on both sides of the polarizer and a method for manufacturing the pressure-sensitive adhesive and retardation layer attached polarizing plate (4).
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: July 12, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Minoru Miyatake, Hiroaki Mizushima, Yuusuke Toyama, Yuuji Saiki, Naoyuki Nitta
  • Publication number: 20110159307
    Abstract: A method glues two plastic surfaces together via an adhesion produced by a heat-activatable adhesive. An adhesive, which is used as a heat-activatable adhesive, is based on i) at least one thermoplastic having a softening temperature or melting temperature in the region of between 90 and 120° C.
    Type: Application
    Filed: August 26, 2009
    Publication date: June 30, 2011
    Applicant: TEASA SE
    Inventors: Marc Husemann, Markus Brodbeck
  • Patent number: 7967943
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atushi Kuwano
  • Patent number: 7968196
    Abstract: A circuit-connecting material interposed between mutually-facing circuit electrodes, and electrically connecting the electrodes, either by direct contact, or via conductive particles present in the material. The circuit-connecting material features: (1) a curing agent capable of generating free radicals upon heating; (2) a radical-polymerizable substance, and two or more microscopically separated phases. The two or more microscopically separated phases include an elastomer phase of carboxyl-group-containing elastomer and a phenoxy resin phase of a phenoxy resin having a weight average molecular weight of 10,000 or more.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Publication number: 20110152809
    Abstract: An absorbent core comprising super absorbent polymer particles and a pattern of adhesive for use in disposable absorbent articles, for example for the absorption of menses or blood.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 23, 2011
    Inventors: Giovanni Carlucci, Maurizio Tamburro, Evelina Sura Toro
  • Publication number: 20110134617
    Abstract: The present invention relates to polymer moldings with conductive, especially electrically conductive, structures on the surface, and to a process for production of these polymer moldings. A further aspect of the invention relates to the use of a device for production of the conductive, especially of the electrically conductive, structures on the surface of the polymer molding. The invention additionally relates to the use of an adhesive comprising carbon nanotubes (CNTs) for electrically conductive bonding of an electronic component to another electrically conductive component or molding. The invention additionally relates to a circuit board arrangement comprising at least one circuit board with at least one electrically conductive track. The at least one electrically conductive track preferably comprises a metal layer and/or at least one electronic component. The invention also relates to processes for production of the inventive circuit board arrangements.
    Type: Application
    Filed: August 7, 2009
    Publication date: June 9, 2011
    Applicant: PP-MID GMBH
    Inventor: Peter Putsch
  • Publication number: 20110128624
    Abstract: The present invention is related to a reflective object, which comprises the structure with the following layers sequentially: an adhesive layer embedded with optical components; a color layer; and a reflective layer; wherein the reflective object is characterized that the color layer is not contacted with the optical components. The present invention is also disclosed a method of producing the reflective object.
    Type: Application
    Filed: March 2, 2010
    Publication date: June 2, 2011
    Applicant: SHIH HSIN-AN
    Inventor: Hsin-An Shih
  • Patent number: 7951260
    Abstract: Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: May 31, 2011
    Assignee: Evonik Degussa GmbH
    Inventors: Martin Risthaus, Hans-Joachim Wönicker
  • Publication number: 20110123817
    Abstract: The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.
    Type: Application
    Filed: November 20, 2009
    Publication date: May 26, 2011
    Applicant: HENKEL CORPORATION
    Inventors: Dwight Heinrich, Tina Nataniel
  • Publication number: 20110104508
    Abstract: This invention relates to stabilized polymerizable compositions comprising compounds containing moieties capable of free radical polymerization and organoborane initiators capable of initiating free radical polymerization and adhesives based on such compositions. In another embodiment the invention relates to a method of polymerizing compounds containing moieties capable of free radical polymerization and to methods of bonding substrates (including flexible substrates) using such compositions. The invention also relates to coatings, laminates, and components including these compositions.
    Type: Application
    Filed: August 21, 2009
    Publication date: May 5, 2011
    Inventors: Yee Yang Wang, Arthur Francis Cawley, Barbara Jean Walter
  • Publication number: 20110096555
    Abstract: The subject of the invention is laminated glazing comprising at least two glass sheets (1, 4) and at least one polymeric interlayer (2) made of polyvinyl butyral and binding said glass sheets together. The glazing is characterized in that at least one lacquer layer (3) is placed between the at least two glass sheets (1, 4).
    Type: Application
    Filed: December 22, 2008
    Publication date: April 28, 2011
    Applicant: SAINT-GOBAIN GLASS FRANCE
    Inventors: Isabelle Pires, Aurelien Gouy, Isabelle Bernheim
  • Publication number: 20110092101
    Abstract: Disclosed is a method for joining two or several plastic parts of an electrical or electronic component, preferably a particularly multipole connector. According to said method, the plastic parts that are to be joined are joined together in a gluing process by means of an adhesive. The adhesive is selected so as to be compatible with the synthetic material of which the plastic parts that are to be joined are made, thus ensuring high-quality adhesion while reducing the number of materials used for making electrical and electronic parts and simplifying dismounting and recycling.
    Type: Application
    Filed: August 15, 2007
    Publication date: April 21, 2011
    Inventors: Stefan Sick, Tobias Kochjohann, Christian Helmig
  • Patent number: 7927703
    Abstract: Described are adhesive compositions containing a mixture of a pressure sensitive adhesive, a high Tg polymer, and a crosslinker to form a compatibilized blend that is optically clear. Methods of using the adhesive compositions, and multilayer assemblies such as optical elements prepared using the adhesives, are also provided.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: April 19, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Jianhui Xia, Ying-Yuh Lu, Zhiming Zhou
  • Publication number: 20110083804
    Abstract: The invention relates to a composition for a structural acrylic adhesive that comprises an adhesion promoter including a phosphate ester and a high molecular-weight polyamine as a polymerisation accelerator.
    Type: Application
    Filed: March 20, 2009
    Publication date: April 14, 2011
    Applicant: Jacret
    Inventor: Arnaud Curet
  • Publication number: 20110084118
    Abstract: After a wiring substrate having, on its lower surface, an opening and terminals arranged therearound is provided, a sealing material is supplied to the lower surface of the wiring substrate, and a sensor chip is flip-chip mounted on the lower surface of the wiring substrate. The sensor chip has, on its front surface, a sensor surface and bump electrodes, and each bump electrode is thermocompression-bonded onto each terminal of the wiring substrate and the sensor surface is exposed from the opening. The sensor chip has, in its outer peripheral portion of the front surface, a first region where the bump electrodes are arranged and a second region where no bump electrode is arranged. The sealing material is supplied to a region planarly overlapped with the first region when the sensor chip is mounted later, and no sealing material is supplied to a region planarly overlapped with the second region.
    Type: Application
    Filed: December 30, 2009
    Publication date: April 14, 2011
    Inventors: Eiji WADA, Nobuyuki Kamata
  • Patent number: 7919565
    Abstract: A composition having a sulfonated block copolymer which is solid and non-dispersible in water having at least two polymer end blocks A, at least one polymer interior block B, and at least one polymer block D. Each A block is a segment of one or more polymerized para-substituted styrene monomers, each B block contains segments of one or more vinyl aromatic monomers selected from polymerized (i) unsubstituted styrene monomers, (ii) ortho-substituted styrene monomers, (iii) meta-substituted styrene monomers, (iv) alpha-methylstyrene, (v) 1,1-diphenylethylene, (vi) 1,2-diphenylethylene and (vii) mixtures thereof, and each D block having a glass transition temperature of less than 20° C. and a number average molecular weight of between 1,000 and 50,000 Adhesives, coatings and membranes are formed from the composition. Various articles are formed with the composition including films, fibers, fabrics, laminates, and absorbent cores.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: April 5, 2011
    Assignee: Kraton Polymers U.S. LLC
    Inventors: Carl Lesley Willis, Dale Lee Handlin, Jr., Scott Russell Trenor, Brian Douglas Mather
  • Publication number: 20110074279
    Abstract: Self-adhesive polymer having a relative permittivity of more than 4.5 useful as a matrix of a self-adhesive electroluminescence mass.
    Type: Application
    Filed: December 3, 2009
    Publication date: March 31, 2011
    Applicant: Tesa SE
    Inventors: Daniel KLIER, Berit Guse
  • Publication number: 20110064953
    Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.
    Type: Application
    Filed: April 6, 2009
    Publication date: March 17, 2011
    Applicant: Arizona Board of Regents, a body Corporate of the State of Arizona acting for and on the behalf of A
    Inventors: Shawn O'Rourke, Douglas Loy, Hanqing Jiang
  • Patent number: 7906581
    Abstract: Methods, apparatuses, and systems for manufacturing a hot melt adhesive containing an adhesion promoter in a continuous mode include supplying a melted, hot melt adhesive to a mixing device at a first predetermined rate while simultaneously supplying an adhesion promoter to the same mixing device at a second predetermined rate to form a homogeneous admixture containing the hot melt adhesive and adhesion promoter. The hot melt adhesive/adhesion promoter mixture is subsequently reacted in at least one tubular reactor at a predetermined temperature for a predetermined residence time to allow the adhesion promoter to chemically bond with the hot melt adhesive and form an adhesive-promoter-treated hot melt adhesive. The adhesion-promoter-treated hot melt adhesive is collected in a product receiver and may be further processed.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: March 15, 2011
    Assignee: Xerox Corporation
    Inventors: Frank Ping-Hay Lee, Tie Hwee Ng, Sheau Van Kao, Guiqin Song
  • Patent number: 7905981
    Abstract: This disclosed invention relates to a method of making a dry paint transfer laminate, comprising: applying a paint film layer over one side of a release liner and drying or curing the paint film layer, the paint film layer comprising a binder and a pigment, the paint film layer having an upper surface and a lower surface, the release liner having a release surface, the lower surface of the paint film layer overlying the release surface of the release liner; and applying an adhesive layer over the upper surface of the paint film layer.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: March 15, 2011
    Assignee: The Procter & Gamble Company
    Inventors: Keith L. Truog, Roger A. Fahlsing, Frank Y. Shih
  • Patent number: 7903230
    Abstract: A method for producing a liquid crystal display cell comprising processes of applying a sealing agent on a sealing portion of at least one liquid crystal display cell substrate, dropping liquid crystal on the substrate, and bonding substrates to each other under vacuum, wherein the sealing agent comprising a material to be cured and a curing agent is applied to the sealing portion without mixing the material to be cured and the curing agent, and then the substrates are bonded to each other under vacuum at room temperature to cure the sealing agent, is disclosed. A sealing agent for a liquid crystal display cell wherein the above material to be cured comprise a radically polymerizable resin and an organic peroxide, and the above curing agent comprises a radically polymerizable resin and a decomposition accelerator, is also disclosed.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: March 8, 2011
    Assignee: Mitsui Chemicals, Inc.
    Inventor: Tadashi Kitamura
  • Publication number: 20110052130
    Abstract: An organic device has a substrate made of polymer, and a polymer layer adhered on the substrate. A crystallization degree of an adhesive surface with the polymer layer in the substrate is smaller than a crystallization degree of an interior of the substrate. In a manufacturing method for manufacturing an organic device including a substrate made of polymer; and having a polymer layer adhered on the substrate, the manufacturing method includes performing a low crystallization process on an adhesive surface with the polymer layer in the substrate to have a crystallization degree lower than a crystallization degree of an interior of the substrate.
    Type: Application
    Filed: August 27, 2008
    Publication date: March 3, 2011
    Applicant: OMRON CORPORATION
    Inventors: Naoki Yoshitake, Yoshitaka Tatara, Naru Yasuda, Hayami Hosokawa
  • Publication number: 20110048638
    Abstract: The present invention relates to a composite material using titanium or a titanium alloy, and concerns such a composite material obtained through processes in which after an imidazole compound has been applied to the surface of titanium or a titanium alloy, an adhered is adhered thereto. The composite material of the present invention is obtained by adhering the adhere thereto by using an adhesive resin composition containing a thermoplastic resin having a fracture energy release rate G1C of 4500 J/m2 or more. The present invention makes it possible to provide a composite material using titanium or a titanium alloy, which exerts a superior adhesive strength stably at room temperature as well as even after exposure to a high-temperature, high humidity condition.
    Type: Application
    Filed: November 8, 2010
    Publication date: March 3, 2011
    Inventors: Tomoyuki SHINODA, Kenichi Yoshioka
  • Publication number: 20110052911
    Abstract: The invention relates to an adhesive tape with a viscoelastic backing consisting of an olefin polymer with a density of between 0.86 and 0.89 g/cc and a crystallite melting point of at least 105° C., and also consisting of an adhesive resin.
    Type: Application
    Filed: May 29, 2009
    Publication date: March 3, 2011
    Applicant: tesa SE
    Inventors: Sven Hansen, Bernhard Müssig, Dennis Seitzer
  • Patent number: 7896997
    Abstract: A composite sheet used for artificial leather with low elongation and excellent softness which includes a non-woven fabric layer, a woven or knitted fabric layer and a polyurethane resin, wherein the non-woven fabric layer and the woven or knitted fabric layer are entangled with each other.
    Type: Grant
    Filed: March 6, 2007
    Date of Patent: March 1, 2011
    Assignee: Kolon Industries Inc.
    Inventors: Young-Nam Hwang, Won-Jun Kim, Jae-Hoon Chung