Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

Abstract: Described herein are example riser modules for holding electrical components such as PCIe cards. The riser modules include a riser bracket and an opening to an interior space of the riser bracket. The riser modules also include an air duct movably coupled to the riser bracket. The air duct is movable between a plurality of positions relative to the riser bracket. The plurality of positions including at least an open position and a closed position.

Abstract: A system having a rack, an input manifold, an output manifold, and a drain manifold is installed. The rack is configured to support a computing device. The input manifold, the output manifold, and the drain manifold are each configured to be fluidly coupled to the housing. When the computing device is in a first position relative to the rack, the input manifold and the output manifold are fluidly coupled to the housing and the drain manifold is disconnected from the housing. When the computing device is in a second position relative to the rack, the input manifold and the output manifold are disconnected from the housing and the drain manifold is fluidly coupled to the housing. When the computing device is in a third position relative to the rack, the input manifold, the output manifold, and the drain manifold are disconnected from the housing.

Abstract: The present embodiment comprises: a container, having a hollow part formed at the top part thereof and an inner space, in which the main ingredients of beer are filled, formed in the side thereof; and a cap assembly which opens and closes the hollow part and is locked by means of a multistage lock, and which accommodates therein an additive bag in which an additive is filled. Therein, the container may comprise a perforation part that perforates the additive bag, and a through-hole part through which pass water, and additive and beer, the embodiment having the benefit of enabling the multistage fermentation of beer by means of a simple structure.

Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

Abstract: An electronic system includes a chassis, a liquid coolant supply line assembly, a first electronic subassembly, a second electronic subassembly, and a liquid coolant return line assembly. The liquid coolant supply line assembly includes a coolant supply line configured to receive and convey liquid coolant. The first electronic subassembly includes a first electronic component and a first cooling loop to transfer heat from the first electronic component into the liquid coolant. The second electronic subassembly includes a second electronic component and a second cooling loop to transfer heat from the second electronic component into the liquid coolant The liquid coolant return line assembly includes a coolant return line to receive liquid coolant from the first and second cooling loops.

Abstract: An electromagnetic coil assembly for a control rod driving mechanism, comprising coils and a yoke for embedding the coils, wherein damascene holes are disposed on the yoke, the coils are installed in the damascene holes, the yoke comprises first yokes and second yokes, and the damascene holes are disposed on the first yokes; the first yokes are connected with the second yokes, and a through hole for cooperating with a sealing shell assembly is disposed on the second yokes; and a thermal conductivity of the first yokes is stronger than a thermal conductivity of the second yokes. The method is the processing method of the assembly. The coil assembly provided in technical solution or the coil assembly obtained by the method can remarkably reduce the temperature inside the coil, thereby improving the reliability of the CRDM electromagnetic coil assembly and prolonging the service life of the CRDM electromagnetic coil assembly.

Abstract: A pump tray has a liquid pump with an inlet and outlet. A blindly matable liquid coupler fluidicly couples with the pump inlet and a blindly matable liquid coupler fluidicly couples with the pump outlet. A chassis of the pump tray has an alignment member configured to removably engage with another device and to restrict, to a limited number of degrees-of-freedom, movement of the chassis relative to the other device (e.g., a liquid pumping unit). The blindly matable liquid couplers are so physically coupled with the chassis as to inhibit movement of them relative to the chassis. A liquid pumping unit also has a chassis defining a bay configured to receive a pump tray, a liquid inlet coupler and a liquid outlet coupler, and a reservoir fluidicly coupled with the liquid inlet coupler. A blindly-matable liquid coupler fluidicly couples with the reservoir outlet and a blindly-matable liquid coupler fluidicly couples with the liquid outlet coupler.

Abstract: An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing.

Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. The independent flow channels communicate with each other. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A substation for medium or high voltage includes: switchgear or controlgear with unmanned operation and maintenance; an inner room in which the switchgear or controlgear is located, the inner room being hermetically enclosed by an outer housing, the inner room being locked against the outer housing by an inner, automatically operated door; and a robot system, the robot system being implemented such that an acting area of the robot system is extended from the inner room, partly in an area outside the inner room, but within the substation internal space, where spare parts are stored in a spare parts hand over area, for maintenance.

Abstract: An embodiment of the present disclosure provides a device for cooling a battery pack, the device including: a housing including flow passages extending in a first direction; a first sub-housing provided on the housing in the first direction; and a second sub-housing arranged opposite the first sub-housing in the first direction and provided on the housing, wherein the first sub-housing includes a first coupling hole communicating with one of the flow passages and a first guide hole communicating with at least one of the flow passages, the second sub-housing includes a second coupling hole communicating with one of the flow passages and a second guide hole communicating with at least one of the flow passages, and a path of a fluid flowing in the flow passages varies according to installation positions of coupling members inserted into the first and second coupling holes.

Abstract: A cold plate apparatus includes a top wall and a bottom wall that enclose a plenum for fluid flow; an inlet and an outlet each formed in one of the top wall or the bottom wall; a first active area within the plenum; a second active area within the plenum; and a partition that extends between the top wall and the bottom wall within the plenum and that separates the first active area from the second active area so that a portion of fluid flowing from the inlet to the outlet through the plenum flows through either the first active area or the second active area but not through both active areas.

Abstract: A cooling system for cooling a set of components on a circuit board includes a vapor chamber for distributing heat over a larger surface area, a fan in a housing configured to direct a first airflow in a first direction to a first heatsink and direct a second airflow in a second direction opposite the first direction to a second heatsink. The heatsinks can have different sizes and the fan can be located relative to a midpoint of the vapor chamber or the circuit board or positioned relative to a component on the circuit board.

Abstract: A cooling system for power modules is provided. The cooling system includes two covers, a plurality of power modules and a plurality of first spaces. The power modules are disposed between the two covers. Each power module includes a housing, a circuit board and heat dissipation elements disposed on the two sides of the circuit board. There is a through hole on the housing. Each first space is formed between two neighboring power modules or is formed between the cover and the neighboring power module. The heat dissipation elements of each power module are located in the neighboring first spaces, and the through hole of each power module is in communication with the neighboring first spaces. The first spaces and the through holes of the power modules are communicated with each other to form a coolant passageway collaboratively for allowing a coolant to pass through.

Abstract: An electronic load device includes a main board and a load module. The main board has a plurality of first connecting ports. The load module includes a sub board and a heat-dissipating unit. The sub board has a second connecting port and a pin-hole port. The second connecting port is used for detachably connecting one of the plurality of first connecting ports. The pin-hole port is used for connecting a power component. The heat-dissipating unit has a cylindrical body and a plurality of heat-dissipating fins. The cylindrical body is defined with an outer surface and an inner surface opposite to the outer surface. The plurality of heat-dissipating fins is connected with the outer surface. When the power component is connected to the pin-hole port, the power component contacts the inner surface.

Abstract: A system includes an enclosure with an air inlet end, an air outlet end, an upper wall, and a lower wall. The system also includes air movers positioned near the air outlet end, a first memory module positioned near the air inlet end at a first orientation, and a second memory module positioned near the air inlet end at a second orientation that is opposite the first orientation.

Abstract: Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being less than the first height. The second set of fins being adjacent the first airflow exit. A second heatsink defines a second airflow exit. The second heatsink is spaced from the first heatsink to form a gap therebetween. The second heatsink is thermally coupled to the first heatsink via a heat pipe.

Abstract: A heat dissipating module includes a heat dissipating assembly, a centrifugal fan, an airflow guiding hood and an auxiliary fan. The heat dissipating assembly includes a heat dissipating board and fins disposed thereon. Heat dissipating channels are formed between the fins. The centrifugal fan is disposed at a side of the heat dissipating channels. The airflow guiding hood covers the heat dissipating assembly and the centrifugal fan and is provided with a first airflow opening over the centrifugal fan, a second airflow opening over the fins and a third airflow opening at another side of the heat dissipating channels. The auxiliary fan is disposed between the fins and the second airflow opening.

Abstract: A flexible display device is provided, which includes a first housing, a second housing, a hinge structure that connects the first housing and the second housing and supports a hinge motion of the first housing or the second housing, a heat source disposed in the first housing, a heat sink disposed in the second housing, and a heat-dissipation path structure disposed across the first housing, the hinge structure, and the second housing. The heat-dissipation path structure transfers heat generated by the heat source to the heat sink.

Abstract: A blower includes a moving blade, a motor, and a housing. The housing includes a holding portion located below the moving blade to hold the motor, and a peripheral wall portion having a cylindrical shape centered on the central axis and extending upward from a radially outer end portion of the holding portion. The peripheral wall portion includes a peripheral wall recess that is recessed downward from an upper end portion of the peripheral wall portion and connects a space radially inside of the peripheral wall portion and a space radially outside of the peripheral wall portion, and includes a first peripheral surface facing one circumferential direction that is opposite to a rotation direction of the moving blade. The first peripheral surface extends in one circumferential direction from the upper end of the peripheral wall recess toward the lower side.

Abstract: Disclosed are layouts, arrangements, and configurations of room airflow, server racks and cooling delivery subsystems that support data centers having system architectures with segregated compute and storage point of deliveries (PoDs). A cooling row is arranged in the rear side of racks housing a PoD to supply the PoD with the cooling delivery subsystem, which includes a recirculating loop supplying cooling fluid to the PoD and returning warm fluid to the cooling source. Modular cooling units of the cooling row includes cooling coils used to cool the airflow leaving the racks. The cooling capacity of the cooling liquid supplied to the cooling delivery subsystem for a PoD may be independently adjusted and controlled in a feedback loop based on the temperature of the air of the PoD after it has been cooled by the cooling coils, such as the outlet air temperature from the cooling row housing the PoD.

Abstract: A two-dimensional liquid cooling system for data centers. A horizontal assembly is positioned above the IT cluster and serves as the main cooling unit. A vertical unit is positioned besides several IT clusters and is connected to several horizontal units and can be used as a backup or for enhanced cooling performance for any of the clusters. The horizontal assembly includes a cooling module that has a cooling unit, a coolant module that receives chilled liquid from the cooling unit and provides cooling liquid to a distribution layer which includes a supply loop and a return loop. The vertical unit is coupled to a plurality of supply and return loops so as to provide cooling liquid to several clusters. The cooling system and entire data center are modularized in different configurations.

Abstract: A cooling module includes an electroosmotic pump. The electroosmotic pump includes a first electrode which is permeable to a cooling fluid, a second electrode which is located with an interval from the first electrode and is permeable to the fluid, and a dielectric layer which is located between the first electrode and the second electrode and includes a microchannel which is permeable to the fluid. The first electrode and the second electrode have different polarities.

Abstract: A lithographic apparatus with a cover plate formed separately from a substrate table and means for stabilizing a temperature of the substrate table by controlling the temperature of the cover plate is disclosed. A lithographic apparatus with thermal insulation provided between a cover plate and a substrate table so that the cover plate acts as a thermal shield for the substrate table is disclosed. A lithographic apparatus comprising means to determine a substrate table distortion and improve position control of a substrate by reference to the substrate table distortion is disclosed.

Abstract: A fluid-cooled re-entrant cold plate for thermal management of heat dissipating electronic devices or assemblies. The fluid leaves the cold plate's outer perimeter, fills a sealed cavity between the cold plate outer perimeter and the mating component/assembly, provides direct cooling of the electronic component, then re-enters the cold plate.

Abstract: A waterproof stage lamp structure easy to disassemble and maintain and a waterproof stage lamp include an upper shell, a lower shell, a waterproof heat-conducting plate, an anti-loosening connecting piece, a main functional module, a front-end functional module, a heat dissipation module and guide positioning rods disposed on the waterproof heat-conducting plate. The main functional module and the heat dissipation module are matched with the guide positioning rods respectively, so that center axes of the center light holes of each module are concentric. A power supply of each module is closely connected to a signal interface and the lamp is internally quickly installed and maintained, and the power supply is automatically docked with or separated from the signal interface during installation or disassembly.

Abstract: A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.

Abstract: A street lighting pole including at least one upright outer wall portion defining an enclosed space of the street lighting pole; a substantially vertically arranged divider (11) dividing at least part of the enclosed space into at least two substantially vertically arranged bays, the at least two bays including a first bay and a second bay; a space air inlet into the enclosed space arranged at a bottom of the upright outer wall portion; a space air outlet from the enclosed space arranged at a top of the upright outer wall portion; a respective individual air inlet for each of the at least two bays arranged at the bottom of the divider; and a respective individual air outlet for each of the at least two bays arranged at the top of the divider.

Abstract: An apparatus for treating a substrate includes a chamber having a treatment space in which the substrate is treated, a substrate support unit that supports the substrate in the treatment space, a gas supply unit that supplies a gas into the treatment space, an exhaust line connected to the chamber, and a pressure-reducing member that reduces pressure in the exhaust line and releases process by-products generated in the treatment space. The exhaust line includes a first line connected to the chamber, a second line equipped with the pressure-reducing member, and a filter tube that connects the first line and the second line, and the filter tube has a corrugated side surface.

Abstract: A foldable electronic device is provided, which includes a flexible display; a hinge assembly configured to fold and unfold a first area and a second area of the flexible display onto and away from each other; and a heat diffusion member. The hinge assembly includes a first hinge frame attached to a bottom face of the first area via a first adhesive member; a second hinge frame attached to a bottom face of the second area via a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing including a space, which accommodates the hinge, and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of the heat diffusion member may be disposed between the flexible display and the hinge housing, in the space or at a position communicating with the space.

Abstract: A cooling apparatus includes a cold plate including a lower surface to be in contact with a heat-radiating component, and a first coolant passage in which a coolant flows, a radiator including fins to perform cooling, and a second coolant passage in which the coolant flows, and a pump connected to each of the first coolant passage and the second coolant passage to circulate the coolant. The radiator is provided on the cold plate. The pump is adjacent to the radiator.

Abstract: A heat transfer device, a mobile device, and a manufacturing method for manufacturing a heat transfer device. The heat transfer device includes a first plate having a first inner surface and a first outer surface. A second plate has a second inner surface and a second outer surface. The first plate and the second plate are at least partially bonded such that an internal reservoir is defined between the first inner surface and the second inner surface. A thermal transfer fluid is contained within the internal reservoir and is in fluid contact with both the first inner surface and the second inner surface. A first wing extends from the first plate. The first wing is adapted to be coupled to a first electronic component that requires cooling. The first wing provides heat transfer from the first electronic component to the thermal transfer fluid via the first plate.

Abstract: The present application pertains to testing methods and apparatus useful in two-phase liquid immersion cooling systems. Such systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of two phase liquid immersion cooling so actual servers are not required to test various aspects of the two phase liquid immersion cooling units.

Abstract: The present invention relates to a battery pack. The present invention includes: a plurality of battery cells disposed in one direction; a heat transfer oil configured to contact surfaces of the battery cells; a frame configured to accommodate the battery cells and the heat transfer oil; a cooling plate configured to contact bottom surfaces of the battery cells through the frame and having cooling water flowing therein; and a battery management unit configured to manage heat generated from the battery cells by using at least one of a cell temperature of the battery cells, a temperature of the heat transfer oil, and a temperature of the cooling water.

Abstract: An equipment assembly that allows easier replacement of heat-generating electrical components is disclosed. The assembly includes a rack for containing a heat-generating electrical component. The component includes a coolant inlet, a coolant outlet, and a drain connector. A cold manifold supplies coolant to the heat-generating electrical component through the coolant inlet. A hot manifold collects coolant from the heat-generating electrical component through the coolant outlet. A drain manifold includes a coupler. The coolant inlet and the coolant outlet are disconnected from the cold and hot manifolds. The drain connector is fluidly connected to the drain manifold to drain coolant from the heat-generating electrical component before the heat-generating electrical component is removed from the rack.

Abstract: A vehicle includes an electrical apparatus comprising an electric circuit unit, a cooling unit that cools the electric circuit unit, a housing that accommodates the electric circuit unit and the cooling unit, a refrigerant introduction unit that supplies a refrigerant to the cooling unit; and a refrigerant discharge unit that discharges the refrigerant from the cooling unit. The refrigerant introduction unit and the refrigerant discharge unit are provided on opposite sides with the electric circuit unit being interposed therebetween in a horizontal direction. The housing is provided, on an inner side of an outer edge of the housing, with a connector connecting portion that is connected to a connector, and the connector connecting portion is provided below the cooling unit and closer to the refrigerant introduction unit or to the refrigerant discharge unit than the electric circuit unit in the horizontal direction.

Abstract: A battery module includes a cooling plate including a housing, a first manifold coupled to one end of the housing, and a second manifold coupled to another end of the housing; and at least one battery pack arranged on the cooling plate, wherein the housing includes therein a plurality of flow paths and a plurality of hollows passing through the housing from the one end to the other end, and the plurality of flow paths and the plurality of hollows are arranged alternately and in parallel to each other.

Abstract: This invention concerns a transformer radiator. The radiator includes an inlet manifold, an outlet manifold and a heat exchange fin. The find extends between and is connected to the inlet and outlet manifolds. The heat exchange fin defines at least one oil flow passage to convey transformer oil, which, in use, enters the radiator through the inlet manifold, to the outlet manifold. The heat exchange fin is further provided by a single component having a continuously undulating profile and the manifolds extend transversely to the turns of the undulating profile.

Abstract: Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.

Abstract: A foldable electronic device is provided, which includes a flexible display; a hinge assembly configured to fold and unfold a first area and a second area of the flexible display onto and away from each other; and a heat diffusion member. The hinge assembly includes a first hinge frame attached to a bottom face of the first area via a first adhesive member; a second hinge frame attached to a bottom face of the second area via a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing including a space, which accommodates the hinge, and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of the heat diffusion member may be disposed between the flexible display and the hinge housing, in the space or at a position communicating with the space.

Abstract: The device includes a container (10) having a top (12) and a bottom (14). A receptacle (15) is formed in the container and joined to an orifice (22) at the bottom (14). A cooling medium (26) is contained within the receptacle and able to retain a cooling environment to cool the beverage. In one embodiment, a beverage container has an opening (72) that permits the emptying of the beverage from the container and a coolant capsule (73) within said container. The cooling capsule (73) contains a cooling medium and the capsule is dimensioned such that the capsule is larger than the opening (72) but has surface characteristics (77,78) which permit the beverage within the container to bypass the capsule (73) and to exit the opening.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.

Abstract: Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. For example, a memory module may have a printed circuit board (PCB) having an edge connector, a plurality of memory devices disposed on a surface of the PCB, and a tubular heat spreader disposed along an edge of the PCB opposite the edge connector. The tubular heat spreader may comprise a tubular portion open at both ends thereof to permit the through flow of a cooling gas; and two planar elements extending in parallel away from the tubular portion and configured to provide a friction fit with the memory module. Each of the planar elements may be configured to convey thermal energy from the memory module to the tubular portion.

Abstract: A heat dissipating structure is for conducting heat generated by a detachable module to a case module. The heat dissipating structure includes a driving component disposed on a side of the detachable module, a driven component pivotally disposed on the case module and a heat dissipating component connected to the driven component. The driving component is slidable relative to the case module along with the detachable module. The heat dissipating component is for abutting against the detachable module and the case module. When the detachable module slides relative to the case module along an installing direction, the driving component drives the driven component to pivot relative to the case module in a first pivoting direction to drive the heat dissipating component to abut against the detachable module and the case module for conducting the heat generated by the detachable module to the case module by the heat dissipating component.

Abstract: A modular cooling system includes a fluid pump in fluid communication with one or more cooling elements to cool electronics components; a heat exchanger in fluid communication with the fluid pump; a heat exchanger valve upstream of the heat exchanger; and a fluid supply valve positioned between a cooling fluid supply and the one or more cooling elements. When the heat exchanger valve and the fluid supply valve are in a first position, fluid is directed from the cooling fluid supply to the one or more cooling elements, bypassing the heat exchanger and the fluid pump. When the heat exchanger valve and the fluid supply valve are in a second position, fluid is cut off from the cooling fluid supply and a cooling fluid return and circulated through the heat exchanger and the fluid pump.

Abstract: A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.

Abstract: A method for assembling a modular cooling system includes attaching a support manifold to a first rail of an equipment rack, the support manifold defining a coolant supply channel and a coolant return channel; and mounting a first cold plate to the support manifold including engaging a manifold supply connector with a plate supply connector in fluid communication, the manifold supply connector being connected in fluid communication with the coolant supply channel of the support manifold, the plate supply connector being connected in fluid communication with a cooling system disposed within the first cold plate.

Abstract: A cooling unit positioned between a first and a second gas stream, the first and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger. A housing surrounds a fan and the second fins.

Abstract: A motor vehicle high-voltage energy accumulator having a housing with battery modules mounted inside, wherein the housing has a bottom wall, a top wall, a front end wall, a rear end wall, a left side wall, and a right side wall. In each case, two oppositely arranged walls of the housing which are oriented in the longitudinal direction have load-path-forming supporting structure plates and cooling ducts through which cooling liquid flows. Here, the cooling ducts are either integrated directly into the supporting structure plate in the form of cavities or formed by the connection of a separate cooling structure plate to the supporting structure plate. The supporting structure plate and, where appropriate, the cooling structure plate increase the structural stability or the formation of cooling ducts.