Abstract: An electrified vehicle includes a first electrical component, a second electrical component, and a terminal block assembly adapted to electrically couple the first electric component to the second electrical component. The terminal block assembly includes a housing, a bus bar, and a first seal adapted to seal the second electrical component from a wet environment of the first electrical component.

Abstract: In one embodiment, a heat sink includes a lower base, an upper base, a set of fins interposed between the lower base and the upper base, and a plurality of heat pipes running between the lower base and the upper base on opposite sides of the heat sink and in-line with an airflow direction through the set of fins. An apparatus comprising a plurality of the heat sinks is also disclosed herein.

Abstract: A transducer (140) having a mechanical impedance over an operative frequency range and having a desired power coupling (145) to a load over the operative frequency range comprises a piezoelectric device (141) having a frequency distribution of modes in the operative frequency range; and an overmould (143). The overmould (143) is arranged to surround at least part of the piezoelectric device (141); and the parameters of the overmould (143) are selected to provide a required impedance matching between the mechanical impedance of the transducer (140) and the mechanical impedance of the load. An alternative transducer comprises a mounting means for holding a discrete portion of at least a part of the periphery of the piezoelectric device wherein the parameters of the mounting means are selected to provide a required boundary condition for the periphery of the piezoelectric device whereby the desired power coupling between the transducer and the load is provided.

Abstract: An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.

Abstract: An apparatus includes: a getter material disposed within a vacuum chamber to absorb stray molecules within the vacuum chamber; a thermal mass disposed adjacent the getter material and in thermal communication with the getter material; a cold station disposed within the vacuum chamber above the thermal mass; and a convective cooling loop connected between the thermal mass and the cold station and configured to convectively cool the thermal mass when the cold station is at a lower temperature than the thermal mass, and to thermally isolate the thermal mass from the cold station when the cold station is at a higher temperature than the thermal mass. The thermal mass may be water ice and may be thermally isolated from the walls of vacuum chamber by low loss support links and/or thermal reflective shielding.

Abstract: A clamshell electronic device is disclosed. The clamshell electronic device includes a first cover, a second cover and a pivoting element. The second cover system is provided to dispose a first input module or a second input module, wherein the first input module and the second input module have different heights. The pivoting element connects the first cover and the second cover to allow the first cover and the second cover to rotate with each other. When the second cover is disposed with the first input module or the second input module, the pivoting element can be adjusted to a first use state and a second use state.

Abstract: A multi-layer cooling structure comprising a first substrate layer comprising an array of cooling channels, a second substrate layer comprising a nozzle structure that includes one or more nozzles, an outlet, and an outlet manifold, a third substrate layer comprising an inlet manifold and an inlet, and one or more TSVs disposed through the first substrate layer, second substrate layer, and third substrate layer. At least one of the one or more TSVs is metallized. The first substrate layer and the second substrate layer are directly bonded, and the second substrate layer and the third substrate layer are directly bonded.

Abstract: An evaporator includes multiple cold storage mechanisms for lowering a temperature of a cold storage material housed inside a cold storage container by heat exchange with a refrigerant. The multiple cold storage mechanisms include a first cold storage mechanism and a second cold storage mechanism higher in heat storage-and-radiation performance than the first cold storage mechanism.

Abstract: A water-cooling heat dissipation device suitable for computer includes a pump housing, an upper cover, a motor module and a heat exchange member. The pump housing forms a pump chamber. A side of the upper cover has at least one positioning portion. A side of the motor module has at least one assembly portion that is correspondingly disposed with respect to the positioning portion. A stator set is received in the interior of the motor module. The heat exchange member is correspondingly combined with the pump housing. The heat exchange member forms a heat exchange chamber, and the heat exchange chamber is in communication with the pump chamber.

Abstract: A drive device of the present invention includes: an electric motor including a cooling channel; a power conversion unit that converts electric power from a power supply and outputs electric power to be supplied to the electric motor; and a supporting member fixed to the electric motor with the power conversion unit mounted on the supporting member. The supporting member includes a cooling channel connected to the cooling channel of the electric motor.

Abstract: A heat radiation unit is disclosed. The heat radiation unit includes a heat radiation member thermally connected to a heat source, to radiate heat generated from the heat source, a refrigerant pipe thermally connected to the heat radiation member while being formed therein with a channel, through which refrigerant flows, a pipe jacket coupled to the heat radiation member, and formed with a receiving groove to receive a portion of the refrigerant pipe, and a cover bracket to press the portion of the refrigerant pipe received in the receiving groove of the pipe jacket in a downward direction of the receiving groove. An outdoor unit of an air conditioner is also disclosed. The outdoor unit includes a case to form an appearance of the outdoor unit, a heat source disposed in the case, and the heat radiation unit connected to the heat source, to radiate heat from the heat source.

Abstract: New cooling assembly suitable for use in the testing of devices is disclosed. The new cooling assembly transfers heat that is in close proximity to, within vicinity of, and/or in surrounding area adjacent to a DUT (device under test) undergoing testing to a target location that is away from the DUT. Consequently, the DUT is cooled. By employing heat pipes coupled to plates in contact with the DUT, the new cooling assembly augments cooling capacity at the DUT's location and surrounding area. Yet, the use of an ambient air flow generated by a fan is sufficient to manage and dissipate the heat transferred to the target location. Also, the new cooling assembly is readily installable in DUT testing equipment because its design is quite flexible to adapt to various requirements and space constraints of DUT testing equipment for different DUT footprints or form factors.

Abstract: This cooling module comprises a housing, which has an external support face comprising means for fastening power conversion modules on the external support face, and a heat transfer fluid network comprising branches extending in the housing in a network plane occupying an individual zone. Each branch comprises a supply collector, a discharge collector and several individual sub-branches. Each sub-branch is connected to the supply collector via an inlet end of the sub-branch in question, is connected to the discharge collector via an outlet end of the sub-branch in question, occupies an individual sub-zone comprised in the zone of the branch in question, and is deviated relative to the other sub-branches between the supply collector and the discharge collector. Each sub-branch forms a single channel that has an undulation with a regular pitch.

Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.

Abstract: A cooling arrangement for a dry-type transformer. The arrangement includes blowing equipment configured to blow a gas flow, and an opening positionable in a clamping structure of the transformer. The opening is configured to allow the gas flow to pass from the blowing equipment towards a winding of the transformer, so that the winding is properly cooled. The opening comprises an electric protecting means for dielectric protection of the clamping structure. A transformer including such cooling arrangement is also disclosed.

Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a plurality of information handling resources and a controller communicatively coupled to the plurality of information handling resources. The controller may be configured to monitor for the presence of a thermal escape event of the information handling system. The controller may also be configured to, responsive to detecting the presence of the thermal escape event, determine one or more affected information handling resources of the plurality of information handling resources, wherein the one or more affected information handling resources comprise information handling resources thermally affected by the thermal escape event. The controller may further be configured to determine for each of the one or more affected information handling resources a respective thermal excursion timeout period.

Abstract: The present invention provides a replaceable water-cooled radiating device, comprising a water-cooling module and a light-emitting module, the water-cooling module is provided with a control circuit, and the control circuit is provided with at least one electrical connector. The light-emitting module is disposed on a top of the water-cooling module and is provided with a driving circuit, the driving circuit is provided with at least one light-emitting component and at least one electrical conductive component, and the electrical conductive component is electrically connected to the electrical connector. Thereby the light-emitting module is electrically connected to the electrical connector and the control circuit via the electrical conductive component to conductibly emit light, and the light-emitting module can be directly detachably mounted on the water-cooling module to achieve the efficacy of the water-cooling module mounted with the replaceable light-emitting module.

Abstract: An electric device has a housing and an active part in the housing that can be supplied with a high voltage and that generates heat when operated. The housing is filled with an insulating liquid for cooling. A cooling system for cooling the insulating liquid has at least one cooling element which is connected to the external atmosphere in a heat-conductive manner and via which the insulating liquid is conducted. Temperature fluctuations of the electric device are limited or even prevented in an inexpensive manner. The cooling system has a rising section which is connected to the housing, is provided with rising branches, and is connected to a cooling element at each rising branch. The volume of the rising section is selected on the basis of a thermal expansion coefficient of the insulating liquid such that the fill state reaches a different number of rising branches at specific temperatures.

Abstract: Cabinet (10) for accommodating electronic equipment (46). The cabinet comprises a casing (12) with an access opening (24) at a access side (23), and a second side (17) opposite to the access side, an electronic equipment rack (40a), a first plenum space (35) between the access side and the rack, and a channel (36) in fluid communication with the second side and the first plenum space. The cabinet encloses a first cooling medium (27) that is in thermal communication with the electronic equipment. A cooling arrangement (29) is provided at the second side, which comprises a flow generator (30) for generating a flow (?f) of the first cooling medium from the first plenum space across the electronic equipment toward the second side, and a heat exchanger (31) for extracting heat from the first cooling medium. The first cooling medium is subsequently recirculated through the channel to the first plenum space.

Abstract: A rotatable-type liquid-cooled heat sink and a disposition method for the same are provided. The liquid-cooled heat sink is disposed in a three-dimensional space and includes a pump, a liquid storage tank, a liquid-cooled head, a cooling module, and a plurality of pipes. The pipes communicatively couple the pump, the liquid storage tank, the liquid-cooled head, and the cooling module. Any of the liquid storage tank, the liquid-cooled head, the cooling module, and the pipes exceeds the pump in any of an X axis, a Y axis, a Z axis of a three-dimensional space.

Abstract: A thermosyphon having an evaporator, a condenser having a condenser liquid pool accumulated at the bottom thereof creating a condenser liquid pool surface, a vapor tube fluidly coupling the evaporator to the condenser, and a liquid tube fluidly coupling the condenser to the evaporator, wherein the liquid tube apex is above the condenser liquid pool surface, thereby trapping vapor and preventing liquid from passing from the condenser to the evaporator. The application of heat to the evaporator increases the total system internal temperature and pressure causing condensation of the vapor in the liquid tube. As the liquid level in the liquid tube increases above the lower interior surface of the apex of the liquid tube, the liquid tube is primed thereby creating the pressure head needed to overcome the hydrodynamic losses inside the thermosyphon. Various embodiments allow passive start-up, regardless of the initial distribution of liquid inside the thermosyphon.

Abstract: Compact integrated device packages are disclosed. The package comprises a package substrate, a first integrated device die, and a second integrated device die. The first die and the second die are mounted and electrically connected to a first segment and a second segment of the package substrate respectively. The substrate comprises a bendable segment disposed between the first and second segment and can bend so as to angle the first die relative to the second die.

Abstract: A heat sink assembly, includes: a first heat sink; an adhesive thermal interface material applied to the first heat sink to mate the first heat sink to a first heat-generating component; a second heat sink; one or more support members connecting the first heat sink and the second heat sink; and a non-adhesive thermal interface material applied to the second heat sink to mate the second heat sink to a second heat-generating component.

Abstract: A controller, capable of maintaining proper humidity for a machine, and including a housing; a sensor in the housing; a fan that blows air in the housing; a window openable and closable relative to an opening in the housing; a tank with an opening part at a neighboring position of the opening and storing a liquid containing water; a pipe having a part extending in the housing, and connected to the tank to pass the liquid; and a humidity controller that controls humidity in the housing. If humidity sensed by the sensor is lower than a predetermined value, the humidity controller opens the window, and operates the fan to take moisture from the tank into the housing. If the humidity is higher than the predetermined value, the humidity controller closes the window, and operates the fan to feed an atmosphere in the housing toward the part of the pipe.

Abstract: A cooler grows in size and its structure becomes complicated in a phase-change cooler if it is intended to cool a plurality of heating elements; therefore, a phase-change cooler according to an exemplary aspect of the present invention includes a heat-conducting board configured to be thermally connected to a cooling object; heat receiving means for storing a refrigerant and receiving heat of the cooling object through the heat-conducting board; radiation means for radiating heat, condensing and devolatilizing a vapor-phase refrigerant arising from vaporization of the refrigerant in the heat receiving means; and connection means for connecting the heat receiving means and the radiation means.

Abstract: A heat spreading module for a portable electronic device includes a metal plate to which a heat generation body contacts, a first heat pipe that is attached along the metal plate, transfers heat of a heating region of the metal plate, to which the heat generation body contacts, to a region that is away from the heating region of the metal plate, comprises a first end portion and a second end portion, has a predetermined length, and a portion of the first end portion is arranged in the heating region, and a second heat pipe that is arranged away from the heating region and is longer in length than the first heat pipe.

Abstract: A heat sink includes a base plate thermally connectable to a heat generating element and having a flat plate shape, a first heat radiating fin thermally connected to the base plate, and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin and thermally connected to the base plate. A surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin.

Abstract: A bus bar module includes a plurality of first bus bars, a plurality of second bus bars, a resin-made case, a resin-made case, and a resin-made bridging member. The first bus bars electrically connect electrode terminals to each other in a first electrode row arranged in the same direction included in a battery assembly that is a plurality of batteries superimposed in the same direction, and electrically connect the electrode terminals of the two adjacent batteries to each other in the one electrode row. The second bus bars electrically connect electrode terminals of the two adjacent batteries to each other in a second electrode row in the battery assembly. The case holds the first bus bars. The case holds the second bus bars. The bridging member bridges these cases.

Abstract: A monolithic vapor chamber heat dissipating device uses a phase change liquid and one or more wicks to dissipate heat from a heat-generating system. The phase change liquid and one or more wicks may be directly coupled to the heat-generating system, or may be coupled to an intermediate evaporator substrate. The phase change liquid vaporizes as it absorbs heat from the heat-generating system. When the vapor rises and encounters a condenser substrate, the vapor condenses and transfers the heat to the condenser substrate. The condensed vapor is drawn by gravity and the one or more wicks to the phase change liquid coupled to the heat-generating system.

Abstract: An apparatus has a mother board with external connectors on a first side and flash memory connectors on a second side. Flash memory cards are connected to the flash memory connectors. Each flash memory card has flash memory and a flash memory controller. A thermal dissipation assembly is provided for each flash memory card. The thermal dissipation assembly includes a heat plate with a first end adjacent to the flash memory controller and a second end adjacent to the flash memory. A heat sink is attached to the flash memory cards at the second end. A polymer surrounds the external connectors and fully encloses remaining portions of the first side of the mother board, and fully encloses the flash memory cards, the thermal dissipation assembly and the heat sink.

Abstract: A temperature-regulated cabinet (10) includes a cabinet body (1) and a temperature regulating module (2). The cabinet body (1) has a containing space (11) formed inside the cabinet body (1) and an opening (12) communicated with the containing space (11). The temperature regulating module (2) is detachably installed to the cabinet body (1) and covered onto the opening (12) and includes a temperature regulator (21), a first hood (22), a second hood (23) and an exhaust fan (24). The temperature regulator (21) has a casing (211). The first hood (22) is detachably installed to the top of the casing (211), and the second hood (23) is detachably installed to the bottom of the casing (211). The exhaust fan (24) is installed inside the first hood (22) or the second hood (23). The cabinet has the advantages of simplifying the production line and lowering the construction and operation costs.

Abstract: Systems, apparatuses and methods may provide for a thermal protection apparatus comprising a substrate including surfaces defining one or more channels and an array of openings adjacent to the one or more channels and an outer layer coupled to the substrate. The outer layer may include a plurality of opaque elastic regions positioned adjacent to the array of openings. Additionally, a fluid may be positioned within the one or more channels. In one example, the plurality of opaque elastic regions are expandable to become protrusions including one or more of a rectangular shape, a donut shape or a dome shape.

Abstract: Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.

Abstract: Various embodiments for heat management around a phase delay coil in a probe are described. A guided surface waveguide probe may be at least partially housed or enclosed in a structure and configured to generate electrical energy in the form of a guided surface wave traveling along a terrestrial medium, where the guided surface waveguide probe comprises at least one electromagnetic coil encapsulated by an exterior of the structure. A cooling device may be provided and configured to manage heat in the structure by providing cold air between the at least one electromagnetic coil and the exterior of the structure.

Abstract: A cooling system for use with a power electronics assembly comprising an array of line-replaceable units is provided. The cooling system includes a first manifold coupled in flow communication with the array of line-replaceable units, and a fluid supply coupled in flow communication with the first manifold. The fluid supply is configured to channel cooling fluid towards the first manifold such that the cooling fluid is discharged towards the line-replaceable units in the array substantially simultaneously.

Abstract: A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion through a graphite torsion spring formed from a graphite sheet by cutting arms to extend out of opposing corners of a central portion and rolling the central portion about a central axis. The graphite torsion spring passes thermal energy between the housing portions with the spring releasing tension as the housing portions rotate from a closed to an open position and the central axis disposed about a hinge pin that couples the housing portions to each other.

Abstract: A fan control module configured to control the speed of a fan receives a signal that indicates the power used by a graphics processing unit (GPU) and a signal that indicates the GPU temperature. Whenever the GPU power exceeds a power threshold level, but the GPU temperature is below a temperature threshold level, the control module turns the fan on and causes the fan to operate at a minimum speed. Whenever the GPU temperature is above the temperature threshold, the control module causes the fan speed to increase with increasing temperature, regardless of power. The control module turns the fan off only when both the GPU temperature is below the temperature threshold and the GPU power is below the power threshold. Although the algorithm is discussed in conjunction with a GPU, the algorithm can be implemented with any type of processor or subsystem that needs to be fan-cooled.

Abstract: An electronic apparatus includes a housing, a heating component arranged inside the housing, a plurality of heat sinks arranged inside the housing, a heat transport member coupled such that heat is transferred from the heating component to the heat sinks, air intake regions positioned in the housing, corresponding to the respective heat sinks, and arranged below and close to the respective heat sinks, and an air exhaust region positioned in the housing and arranged above the heat sinks.

Abstract: A heat spreader apparatus, testing system, method may be used to test an electronic device. The heat spreader may include a hollow housing. The hollow housing may define an interior chamber. The hollow housing may include a contact surface. The heat spreader may include a working fluid. The working fluid may be included in the interior chamber. The hollow housing may be configured to be physically compliant. The hollow housing may be physically compliant such that the hollow housing conforms to the shape of a testing surface in response to an applied pressure. The testing surface may be a top surface of a semiconductor. The testing surface may be curved or otherwise lack uniformity. The hollow housing may conform to the curvature or lack of uniformity of the testing surface such that minimal gaps exist between the hollow housing and the surface.

Abstract: A server structure having a tray, a mother board, a computing device, a computing device, a plurality of slot connectors and an air shroud is provided. The mother board is stacked on the tray, and a top surface of the mother board is exposed. The computing device is arranged on the top surface of the mother board and electrically connected to the mother board. The slot connectors are arranged on the top surface of the mother board and arranged in parallel and at intervals, and the slot connectors is arranged adjacent to the computing device. The air shroud covers on the slot connectors and an external surface of the air shroud is extended toward the computing device to guide air to flow toward the computing device. Therefore, air flows through a primary heat source, the computing device namely.

Abstract: A cooling system may include a housing including an inlet; an outlet; a duct assembly between the inlet and the outlet; and at least one fan located to direct airflow from the inlet, through the duct assembly, and out the outlet; the duct assembly including: a first duct having an entrance facing the at least one fan and an exit normal to the entrance; a second duct having an entrance facing the at least one fan and an exit normal to the entrance; a central passage for receiving airflow from the first duct exit and the second duct exit; a third duct having an entrance fluidly coupled to the central passage; a fourth duct having an entrance fluidly coupled to the central passage; and a plurality of heat sinks located in the third and fourth ducts.

Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.

Abstract: A data center includes two or more rack computing systems and an air handling system. The rack computing systems may each include racks and computing devices mounted in the rack. The air handling system includes one or more air moving devices external to the one or more racks. The air moving devices create a negative pressure relative to ambient air at air inlets to the racks to draw air from the inlets and through computing devices in the racks.

Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

Abstract: The exemplary embodiments disclosed herein are directed to a heat exchanger assembly for cooling power module bricks, the heat exchanger assembly having a plurality of spaced apart heat exchanger layers between which external air and a closed loop gas are separately circulated. A series of metallic plates may be located within the spaces between some or all of the heat exchanger layers to conduct heat from the power modules. Circulating fans may be employed to circulate external air and circulating gas through the heat exchanger. Pass through junctions may be positioned near edges of the heat exchanger to permit the circulating gas to cross paths with the external air without allowing the two gas flows to mix with one another.

Abstract: An electronic equipment rack has a support structure made up of post members configured to form a cage having a front, a back, a top, a bottom, a first lateral side, and a second lateral side and defining a space therebetween. A first plenum is arranged along the first lateral side of the support structure. A second plenum is arranged along the second lateral side of the support structure. A sealing panel defining a first wall of the first plenum has a length extending substantially from the top of the support structure to the bottom of the support structure. A portion of the first sealing member is selectively removable to define an intake port in the first plenum.

Abstract: A luminaire includes a housing, a heat sink, and a light assembly. The housing includes a pair of elongated, parallel legs and a cross-member extending between the legs. The cross-member defines a first surface and a second surface opposite the first surface, and the first surface includes an opening. The heat sink is coupled to the housing proximate the second surface of the cross-member. The heat sink is positioned between the legs and the heat sink includes a plate and a fin array. The plate defines a first surface and a second surface opposite the first surface, and the fin array including a plurality of fins protruding from the first surface. The light assembly is coupled to the second surface of the heat sink and includes at least one light-emitting element (e.g., a light-emitting diode or LED).

Abstract: An electronic device includes a first body, a hinge structure, a second body, a cover plate, a fulcrum, a lever element, a stand and a second gear. The first body has a convection groove and an accommodation groove. The hinge structure includes a driving element and a first gear arranged at the first body. The second body is pivoted to the first body through the hinge structure. The cover plate is movably disposed at the first body. The fulcrum is disposed at the first body. The lever element is pivoted to the fulcrum, wherein the lever element includes a first end and a second end. The driving element abuts against the first end, and the second end is movably coupled to the cover plate. The stand is movably disposed at the first body. The second gear is connected to the stand and coupled to the first gear.