Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.

Abstract: A power conversion device includes: a casing including a housing portion; a circuit board housed in the housing portion, the circuit board including an inverter circuit or an inverter control circuit configured to control the inverter circuit; a cooling fan configured to generate air flowing through the housing portion to cool the circuit board; a temperature sensor configured to sense a temperature inside or outside the casing; and a cooling fan control circuit configured to drive the cooling fan. The cooling fan control circuit is configured to, if the temperature sensed by the temperature sensor is higher than a predetermined temperature, turn on the cooling fan, and if the sensed temperature is equal to or below the predetermined temperature, control the cooling fan to turn off the cooling fan or make a speed of the flowing air lower than a speed when the cooling fan is in the on state.

Abstract: A laptop with active door including a first body, a second body, a hinge connected between the first body and the second body, a linking assembly pivoted to the hinge and slidably disposed on the first body, a door movably disposed on the first body, a first linking rod, and a second linking rod is provided. The first linking rod has a first end and a second end opposite to each other, the first end is pivoted to the linking assembly, and the second end is pivoted the door. The second linking rod has a third end and a fourth end opposite to each other, the third end is pivoted to the first body, and the fourth end is pivoted to the first linking rod.

Abstract: Example implementations relate to a method and system for cooling a compute node tray including a board, a plurality of first and second devices, a cooling assembly, and a support structure assembly. The cooling assembly includes a supply section, a return section, and an intermediate section coupled to the supply and return sections. The supply section includes a first conduit extending along a perimeter of the board and forming a thermal contact with the first devices. The intermediate section includes a plurality of cold plates and a plurality of second conduits forming the thermal contact with the second devices. The second conduits extends parallel to one another. The return section includes a third conduit extending parallel to a portion of the first conduit. The support structure encompasses the board and forms the thermal contact with a portion of the board, a plurality of third devices, and the cooling assembly.

Abstract: A cooling device includes first heat pipes thermally connected to a first heat-generating element at one end and thermally connected to the superimposed first and second heat-radiating fin groups at another end; and second heat pipes thermally connected to a second heat-generating element at one end and thermally connected to the superimposed second and third heat-radiating fin groups at another end, wherein the respective another ends of the first heat pipes altogether span a substantially entirety of a planar area between the first and second heat-radiating fin groups, and the respective another ends of the second heat pipes altogether span a substantially entirety of a planar area between the second and third heat-radiating fin groups.

Abstract: A heat sink includes a plurality of fins arrayed in a first direction, and a heat pipe having a first extension extending in the first direction. A second direction extends perpendicularly to the first direction, a third direction extends perpendicularly to the first direction and the second direction, and when the heat pipe is viewed in the third direction, the heat pipe has a second extension spaced from the first extension in the second direction and extending in the first direction, and a joint which interconnects the first extension and the second extension and which is curved. The fins include a plurality of first fins arrayed along the first extension and the second extension and a second fin disposed around a position of the joint.

Abstract: An electronic device and method are disclosed herein. The electronic device includes a processor, a temperature sensor, a main board on which the processor and the temperature sensor are mounted, a main body including a first surface and a second surface, an input device disposed on the first surface and the main board disposed on the second surface, wherein the first surface and second surface define a hollow in which the main board is disposed, a display, height adjuster disposed between the first and second surfaces and including a connection terminal connected to the processor, an extendable bar connected to the connection terminal, and a spacer connected to the extension bar. The processor implements the method, including in response to receiving a detection signal from the temperature sensor, control actuation of the height adjuster to cause expansion or contraction of the hollow by movement of the first and second surfaces.

Abstract: A closed loop liquid cooler and an electronic device using the same. The closed loop liquid cooler includes: a first liquid cooling module and a second liquid cooling module, where a cooling reflux at an output end of the first liquid cooling module is outputted to a cooling liquid input end of the second liquid cooling module; and a cooling reflux at an output end of the second liquid cooling module is outputted to a cooling liquid input end of the first liquid cooling module.

Abstract: A plurality of thermal electric cooler (TEC) elements are formed in a TEC grid structure. Control logic dynamically varies a supply current supplied to each TEC element (or group of TEC elements) in the TEC grid based on changes in power density respectively associated with areas cooled by each of the TEC elements or group of TEC elements.

Abstract: An electric device, comprising: a power module having a circuit carrier on which a circuit component is disposed; a cooling structure; and an intermediate structure disposed between the circuit carrier and the cooling structure, wherein the cooling structure is made of a first metal material, and the intermediate structure is made of a second metal material having a higher thermal conductivity than that of the first metal material.

Abstract: A power module includes a power source module and a metallic bottom heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a top surface and a bottom surface. At least a heat-generating component is disposed on the bottom surface. The metallic bottom heat-dissipation substrate has an upper surface and a lower surface opposite to each other. The upper surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the bottom surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The lower surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced.

Abstract: A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. The multiple sides form a cavity. The top side includes one or more ports. Each of the one or more ports includes a top side open area that exposes the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy to and from an electrical device exposed via the cavity. The top side open area of the one or more ports has a corresponding bottom side open area of the bottom side located below the top side open area. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.

Abstract: The invention relates to an evaporator (V) comprising an evaporator body (3) surrounded by an evaporator housing (5) having an inlet (1) for supply of liquid into the evaporator housing (5) and an outlet (6) for discharge of vapour generated, wherein the evaporator body (3) comprises a multitude of plates (7) arranged flat one on top of another, wherein there is a liquid distributor (2) for distributing the liquid between the multitude of plates (7) arranged between the inlet (1) and the evaporator body (3), wherein each of the plates (7) comprises, on a first surface, a liquid distributor structure (10) with distributor conduits (20, 21, 22), an evaporator area (11) and a gas collection structure (12). The invention further relates to a corresponding fuel cell arrangement.

Abstract: The present invention relates to a cubesat space deployer, and more particularly, to a cubesat space deployer for separating an ultra-small satellite (cubesat) from a launch vehicle in a space orbit while protecting the ultra-small satellite from a launch environment.

Abstract: A liquid-cooled server chassis includes: a case; one or more liquid-cooling modules, each liquid-cooling module including a housing, a gas outlet valve, and a liquid return valve, wherein the gas outlet valve and the liquid return valve are opened during operation of the liquid-cooling module, and the liquid-cooling module accommodates a single server and is filled with coolant during operation; a connector configured to connect the liquid-cooling module to a power source; and a circulation portion including an gas outlet pipe, a liquid return pipe, a vapor processing part, and a liquid collecting part.

Abstract: An integrated heatsink for a co-packaged optical-electrical module includes a base plate attached on top of a co-packaged optical-electrical module. The integrated heatsink further includes a plurality of fin structures extended upward from the base plate except a central cavity region with missing sections of fins, each fin extended along an axial direction from a front edge to a back edge of the base plate except some trenches shallow in depth across some fin structures and some other trenches deep in depth down to the base plate either along or across some fin structures. Additionally, the integrated heatsink includes multiple heat pipes including shaped portions embedded in the trenches in the plurality of fin structures. At least one bottom horizontal portion per heat pipe is brazed to the base plate in a corresponding region that is superimposed on hot spots of the co-packaged optical-electrical module under the base plate.

Abstract: Disclosed is a liquid cooling module for computer servers, including: a pump, a fan, a heat exchanger, at least two ventilation grilles, an open central longitudinal space between the pump and the heat exchanger that is arranged to facilitate airflow therein from a grille of one short side wall to a grille of the other short side wall, this airflow being driven by the fan, a portion of secondary hydraulic circuit located in the liquid cooling module, for circulating a fluid coolant, including no bypass that would allow the pump to operate as a closed circuit and likely to clutter this open longitudinal space, a circuit control board positioned in the longitudinal extension of the open central longitudinal space so as to be directly swept by the airflow.

Abstract: In one example, a housing is described, which may include an outer cover and an electromagnet. The outer cover may include at least one slot and at least one slot cover to cover the at least one slot. The electromagnet may be fixedly disposed in the housing and aligned with the at least one slot cover to electromagnetically control a movement of the at least one slot cover.

Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.

Abstract: An electronic device includes a first main body, a second main body, a pivoting mechanism, and a heat dissipation module. The second main body includes a first housing, a second housing, and a cover plate. The pivoting mechanism is pivotally connected between the first main body and the second main body. Two sides of the cover plate are pivotally connected to the second housing and the pivoting mechanism respectively. The heat dissipation module is disposed in the second main body and includes at least one elastic member. The elastic member is fixed between the first housing and the cover plate. In response to that the first main body is in unfolded position relative to the second main body through the pivoting mechanism, the pivoting mechanism drives the cover plate to be located between an open position relative to the second housing, so that the elastic member is stretched.

Abstract: A communication system includes a receptacle assembly and a pluggable module. The receptacle assembly has a receptacle housing includes walls forming a module cavity with a communication connector at a back end thereof. The receptacle assembly has a liquid cooling assembly having a liquid cooling channel coupled to the receptacle housing and a fitting in flow communication with the liquid cooling channel. The pluggable module is receivable in the module cavity and has a pluggable body holding a module circuit board and a liquid cooling assembly coupled to the pluggable body. The liquid cooling assembly includes a liquid cooling channel in thermal communication with the pluggable body and a module fitting mated with the fitting of the receptacle assembly to couple the liquid cooling channel of the pluggable module in flow communication with the liquid cooling channel of the receptacle assembly.

Abstract: The invention discloses a heat dissipation architecture. The heat dissipation architecture includes an electronic component, a flexible heat conductive film and a heat conductor. The flexible heat conductive film is disposed on the electronic component. The heat conductor includes a first portion and a second portion connected to the first portion. The first portion of the heat conductor is interposed in the flexible heat conductive film.

Abstract: A heat dissipation module and a projection apparatus are provided. The heat dissipation module dissipates the heat generated by a plurality of heating elements, includes a heat pipe, a heat dissipation plate, a first and a second heat dissipation fins. The heat pipe includes a first portion of the heat pipe passes through the first heat dissipation fin and a second portion of the heat pipe passes through the second heat dissipation fin and a third portion connected with the first and the second portions. The third portion of the heat pipe and the heating elements are connected to the heat dissipation plate. The heat generated by the heating elements is dissipated by the heat dissipation plate, the first and the second heat dissipation fins through thermal conduction method and thermal convection method. The invention saves accommodating space in the projection apparatus and has an efficient heat dissipation effect.

Abstract: One example aspect of the present disclosure is directed to a system for cooling a surface. The system can include a housing. The housing can include an evaporator portion. The housing can include at least one trifurcated heat exchange portion. The at least one trifurcated heat exchange portion can include a condenser portion coupled to the evaporator portion. The at least one trifurcated heat exchange portion can include a coolant portion substantially surrounded by the condenser portion. The at least one trifurcated heat exchange portion can include a phase change material portion substantially surrounding the condenser portion.

Abstract: Examples disclosed herein provide a computing device. One example computing device includes a heat generating component disposed within the computing device, and shape memory material (SMM) that adjusts a clearance below a bottom surface of the computing device according to a temperature of the heat generating component.

Abstract: A battery cooling device for a vehicle is provided. The battery cooling device generates a continuous phase change of the refrigerant within an entire area of a refrigerant channel having a refrigerant flowing for cooling a battery module to maximize a cooling performance of all battery cells of the battery module, and enable even cooling of the battery cells.

Abstract: An electronic rack includes an array of server shelves inserted into at least some of a plurality of standard slots of the electronic rack. Each server shelf contains one or more servers and each server includes one or more processors. At least some of the processors are mounted on cold plates for liquid cooling. The electronic rack further includes a liquid manifold shelf inserted into one of the standard slots. The liquid manifold shelf includes a pair of an upstream supply port and an upstream return port and further includes one or more pairs of a downstream inlet port and a downstream outlet port. The upstream supply port is coupled to a facility liquid supply line to receive cooling liquid from an external cooling liquid source and the upstream return port to return the cooling liquid back to the external cooling liquid source.

Abstract: A thermodynamic heat exchanger is an electronic device having one or more heat generating devices, a heat exchanging element, and one or more heat exhaust elements. The heat generating devices can be the active and passive electronics elements included within a power conversion circuit, such as a power adapter used to charge a cellular telephone or other type of consumer electronics device. The heat exchanging element is configured to accept radiated thermal energy from the heat generating devices and distribute the accepted thermal energy across an outer surface to evenly distribute hot spots corresponding to the individual heat generating devices. The heat exchanging element is also configured to minimize heat radiating from its outer surface, thereby blocking heat in the thickness of the thermally conductive material.

Abstract: A processor module includes a first circuit substrate and a second circuit substrate each having a processor mounting area and a memory mounting area on one surface thereof. One processor is mounted in the processor mounting area, while comb-like arranged memory modules are mounted in the memory mounting area. The surface of the first circuit substrate and the surface of the second circuit substrate are combined face-to-face and positioned such that the processor mounting area and the memory mounting area of the first circuit substrate are placed face-to-face respectively with the processor mounting area and the memory mounting area of the second circuit substrate, and end parts of the plurality of comb-like arranged memory modules of the first circuit substrate and end parts of the plurality of comb-like arranged memory modules of the second circuit substrate are alternately arranged with clearances produced between adjacent memory modules.

Abstract: Non-Volume displacement pumps used at nuclear power plants (NPP) in reactor coolant pump sets for the primary coolant circuit of the nuclear power system. The reactor coolant pump set comprising a vertical vane-type single-stage pump with bottom arrangement of the impeller, the pump shaft is connected to the electric motor shaft by a rigid coupling, the radial-axial bearing, installed in the electric motor upper chamber, is made of two main elements: a radial bearing made in the form of a rotor metallic bushing installed on the cylindrical part of the collar and an axial bearing consisting of two stator lever-type balance arm systems with cover plates of antifriction material and rotor cover plates of antifriction material. The radial-axial bearing is cooled by water from the NPP system, pressure head whereof is increased by the screw-type pump located on the upper butt of the radial-axial bearing collar.

Abstract: The disclosure provides a centrifugal fan, including an enclosure, a spacer, and a fan blade rotor. The enclosure includes a top panel, a bottom panel, and a side wall connected between the bottom panel and the top panel. The top panel, the bottom panel, and the side wall together form a first air exhaust vent and a second air exhaust vent. The spacer is disposed in the enclosure, is connected between the bottom panel and the top panel, and spaces a first space in communication with the first air exhaust vent and a second space in communication with the second air exhaust vent in the enclosure. The spacer includes a first opening. The first opening is in communication with the first space and the second space. The fan blade rotor is rotatably disposed in the second space.

Abstract: A heat pipe with a non-condensable gas includes a thermal conductor, and a working fluid and a non-condensable gas filled into a hollow chamber of the thermal conductor, and the thermal conductor has a heat-absorbing side attached to a heat-generating electronic component and an exothermal side attached to a radiator, and the exothermal side has at least one protrusion, and the exothermal side with the protrusion can reduce the contact area with the radiator, and the heat pipe lowers the conduction efficiency by the non-condensable gas and the protrusion, so as to achieve a work efficiency of the heat-generating electronic component in an operation within a working temperature range.

Abstract: A wavelength conversion module and a projection device are provided. The projection device includes an illumination system providing an illumination light, a light valve forming the illumination light into an image light, and a projection lens forming the image light into a projection light. The illumination system includes an excitation light source providing an excitation light, and a wavelength conversion module receiving the excitation light. The wavelength conversion module includes a case and a wavelength conversion layer. The case has a liquid inlet, a liquid outlet, and a cavity connecting the liquid inlet and the liquid outlet for circulation of a cooling liquid. The wavelength conversion layer is located on the case, wherein the relative positions of the wavelength conversion layer and the excitation light remain unchanged. The projection device and the wavelength conversion module have good reliability.

Abstract: The invention relates to the technical field of stage lights, and in particular to a novel heat dissipation system, a stage light cap body and a waterproof stage light. The present invention discloses a heat dissipation system comprising a heat transfer substrate and a heat dispassion assembly positioned on one side of the heat transfer substrate, a first through hole being arranged on the heat transfer substrate and a displaceable unit used to open and close the first through hole being arranged on the heat dispassion assembly at a position corresponding to the first through hole. The heat dispassion system is simple in structure and convenient to use, and the light source assembly can be taken out for replacement or maintenance without completely removing the heat dispassion system and components alike on the bottom of the stage light cap body.

Abstract: A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion to a vapor chamber integrated in a lid housing portion that distributes the thermal energy across the lid housing portion. A hinge protrusion formed in the lid housing portion defines a cylindrical opening that accepts a hinge pin to rotationally couple the housing portions to each other. The cylindrical wall defines a barrier with the vapor chamber so that a thermal conduit passing from the main housing portion to the hinge pin transfers thermal energy from the hinge pin through the cylindrical wall to the vapor chamber.

Abstract: A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.

Abstract: A stacked heat exchanger includes: passage tubes stacked with each other to support a heat exchange object, a passage being defined in the passage tube for a heat medium to exchange heat with the heat exchange object; and a pipe connected to one of the passage tubes located at one end in a stacking direction of the plurality of passage tubes. Each of the passage tubes has a protruding pipe portion protruding in the stacking direction and communicating with the adjacent passage tube in the stacking direction. The one of the passage tubes located at the one end in the stacking direction is an in/out passage tube. The pipe has a surface at one end in a longitudinal direction of the pipe, and the surface intersects the longitudinal direction of the pipe and is joined to the in/out passage tube.

Abstract: An outdoor unit of an air-conditioning apparatus includes a fan chamber, a machine chamber, a partition plate, and an electrical component unit. The partition plate is provided, in its upper part, with a planar receiving surface portion for receiving a holder. The holder is provided with a positioning protrusion protruding downward. A cutout portion into which the positioning protrusion is inserted is formed in the receiving surface portion. At least one inclined surface portion that is inclined downward from the receiving surface portion and guides the positioning protrusion to the cutout portion is provided at an end portion of the receiving surface portion that leads to the cutout portion.

Abstract: A liquid cooling-type cooling device includes a heat-receiving unit, a working fluid that transports heat, a radiator that cools the working fluid from the heat-receiving unit, and a pump. The heat-receiving unit includes a first component that is bottomed tubular, receives the heat from the heat-generating body, and gasifies the working fluid; a second component that is bottomed tubular, is disposed within the first component spaced apart from the first component by a predetermined gap, and has a base including a plurality of through-holes; an inlet for introducing the working fluid to a gasification space between the first component and the second component; an outlet for emitting the working fluid that has passed through the plurality of through-holes and has flowed medial of the second component; and an applier that applies a voltage to the first component and the second component.

Abstract: A component mounting device includes a heater unit which heats along a range which is narrower than a movement range of a head and which is a partial length of a board, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.

Abstract: A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod may include a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

Abstract: A cooling device includes a circulation channel through which a refrigerant is circulated, a heat receiving part which is disposed in the circulation channel and in which the refrigerant receives heat generated by a heat generating component, a heat dissipating part which is disposed in the circulation channel and in which the refrigerant dissipates the heat received in the heat receiving part, a pump which is disposed in the circulation channel and which sends the refrigerant to the heat receiving part, and a tank which is coupled to the circulation channel and which has a space therein, wherein the tank is disposed at a higher position in a vertical direction than the pump in a state where the pump is located on an upper side in the vertical direction with respect to the heat receiving part and the heat dissipating part.

Abstract: In one implementation, a system for scalable coolant distribution unit includes a parameters engine to determine real time pump parameters of a first CDU, wherein the real time pump parameters correspond to a functionality of the first CDU, a pump engine to alter pump parameters of the first CDU based on the real time pump parameters, a communication engine to send the altered pump parameters of the first CDU to a second CDU, the pump engine to alter pump parameters of the second CDU based on the altered pump parameters of the first CDU and determined real time pump parameters of the second CDU, a functionality engine to determine a functionality of the first CDU and the second CDU based on the real time pump parameters and altered pump parameters.

Abstract: A modular arrangement is provided for housing electronic equipment and associated cooling structure in a data center environment. The modular units provide cooling air on an as-needed basis to individual pieces of equipment by way of individual plenums and associated valves. The units can be interconnected by vertical stacking, in side-to-side arrangements, and back-to-back arrangements. A number of units can be interconnected to form a cell. The cells can be interconnected to form larger units. In this manner, data centers can be configured in any desired arrangement without requiring complicated cooling design.

Abstract: An electronic component cooling module includes a tube disposed in parallel with an electronic component mounted on a board, in which a coolant liquid that cools the electronic component flows, and configured to include an expansion portion that expands, due to a pressure of the coolant liquid, toward the electronic component disposed beside the tube so as to be brought into surface contact with the electronic component, and a height maintaining portion that maintains a dimension in a height direction, and a supporter configured to support the tube, and a height of the tube and a height of the supporter are equal to or smaller than a height of the electronic component in a state in which the electronic component is mounted on the board.

Abstract: A cooling unit can be downsized. Air is taken in through an intake port, and heat is discharged from a heat source through an exhaust port. A heat transport unit, forming a part of a cooling fan or is substantially in contact with it, has a first region which has one end facing the heat source and another end having a through hole which air taken in or air to be discharged passes through, and in which air passes through the through hole to perform heat exchange with the air in an inner wall of the through hole. The cooling fan has an intake opening and an exhaust opening. The through hole has an intake through hole and/or an exhaust through hole. Air passes through the intake port, the intake through hole, the intake opening, the exhaust opening, the exhaust through hole, and the exhaust port in this order.

Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.

Abstract: A water-cooling head includes a casing, a base, an input channel, an output channel and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The heat absorbed by the base is transferred to the working medium. The input channel is in communication with the active space. The cooled working medium is introduced into the active space through the input channel. The output channel is in communication with the active space. The heated working medium is outputted from the active space through the output channel. The pump is installed on the casing, and includes an impeller. The impeller is disposed within the active space and located near the output channel. The impeller is driven to guide the working medium to be outputted from the active space through the output channel.

Abstract: A thermal management device for dissipating heat from an electrical component includes a volume of working fluid configured to change from a liquid state to a vapor state in response to being heated by the electrical component. The thermal management device also includes a working fluid chamber configured to move the working fluid. The working fluid chamber includes an impermeable outer portion and a porous inner portion integrally formed with and connected to the impermeable outer portion. The inner portion is configured to move the working fluid when in the liquid state toward the electrical component. The impermeable outer portion is made of a first material and the porous inner portion is made of a second material. The first material is different from the second material.

Abstract: A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.