Abstract: The exemplary embodiments disclosed herein are directed to a heat exchanger assembly for cooling power module bricks, the heat exchanger assembly having a plurality of spaced apart heat exchanger layers between which external air and a closed loop gas are separately circulated. A series of metallic plates may be located within the spaces between some or all of the heat exchanger layers to conduct heat from the power modules. Circulating fans may be employed to circulate external air and circulating gas through the heat exchanger. Pass through junctions may be positioned near edges of the heat exchanger to permit the circulating gas to cross paths with the external air without allowing the two gas flows to mix with one another.

Abstract: An electronic equipment rack has a support structure made up of post members configured to form a cage having a front, a back, a top, a bottom, a first lateral side, and a second lateral side and defining a space therebetween. A first plenum is arranged along the first lateral side of the support structure. A second plenum is arranged along the second lateral side of the support structure. A sealing panel defining a first wall of the first plenum has a length extending substantially from the top of the support structure to the bottom of the support structure. A portion of the first sealing member is selectively removable to define an intake port in the first plenum.

Abstract: A luminaire includes a housing, a heat sink, and a light assembly. The housing includes a pair of elongated, parallel legs and a cross-member extending between the legs. The cross-member defines a first surface and a second surface opposite the first surface, and the first surface includes an opening. The heat sink is coupled to the housing proximate the second surface of the cross-member. The heat sink is positioned between the legs and the heat sink includes a plate and a fin array. The plate defines a first surface and a second surface opposite the first surface, and the fin array including a plurality of fins protruding from the first surface. The light assembly is coupled to the second surface of the heat sink and includes at least one light-emitting element (e.g., a light-emitting diode or LED).

Abstract: An electronic device includes a first body, a hinge structure, a second body, a cover plate, a fulcrum, a lever element, a stand and a second gear. The first body has a convection groove and an accommodation groove. The hinge structure includes a driving element and a first gear arranged at the first body. The second body is pivoted to the first body through the hinge structure. The cover plate is movably disposed at the first body. The fulcrum is disposed at the first body. The lever element is pivoted to the fulcrum, wherein the lever element includes a first end and a second end. The driving element abuts against the first end, and the second end is movably coupled to the cover plate. The stand is movably disposed at the first body. The second gear is connected to the stand and coupled to the first gear.

Abstract: A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.

Abstract: A semiconductor package structure includes a substrate, a first semiconductor and a second semiconductor over the substrate, and a multi-TIM structure disposed over the first semiconductor die and the second semiconductor die. The first semiconductor die includes a first heat output and the second semiconductor die includes a second heat output less than the first heat output. The multi-TIM structure includes a first TIM layer disposed over at least a portion of the first semiconductor die and a second TIM layer. A thermal conductivity of the first TIM layer is higher than a thermal conductivity of the second TIM layer. The first TIM layer covers the first semiconductor die.

Abstract: An electrical switchgear system includes a switchgear enclosure. The switchgear enclosure has a plurality of compartments housing switchgear components. The electrical switchgear system also includes a vent box. The vent box is in fluid communication with selected compartments of the plurality of compartments. The vent box is disposed on a side of the switchgear enclosure.

Abstract: An example battery-based energy storage device that comprises: a battery chamber configured to host a plurality of rechargeable battery packs; an operation chamber separated from the battery chamber by at least an insulation board; an energy storage inverter mounted on the operation chamber; a battery control box mounted on the operation chamber and configured to control one or more operations of the plurality of rechargeable battery packs; a first door rotatably mounted on the battery chamber; a second door rotatably mounted on the battery chamber. The first door and the second door open outward and are on opposite sides of the battery chamber; and a third door rotatably mounted on the operation chamber. The energy storage inverter is configured to convert AC to DC when charging a rechargeable battery pack and to convert DC to AC when providing power to an external device from a rechargeable battery pack.

Abstract: The invention is directed to a novel solution for improving heat management in computing devices by using thermally active material integrated within a shield can disposed over an integrated circuit or printed circuit board. By integrating the thermally active material within the shield can, isothermal conditions can be maintained for a longer period of time, thereby extending the transient state of a heat-producing system for longer durations, while maintaining slim vertical profiles.

Abstract: A printing apparatus including a manifold shaped as a rectangular parallelepiped having three pairs of parallel faces and including (i) a body thereof defining a plurality of fluidic channels, (ii) a bottom portion thereof defining a slot configured to accommodate insertion of a printing element; and (iii) at least one face defining a plurality of fluidic connections in fluidic communication with the fluidic channels. A method for manufacturing a printing apparatus includes the steps of a) manufacturing a manifold by manufacturing a parallelepiped and defining a slot therein configured to hold a printing element; b) machining features into the manifold for mechanical mounting, electronic connection, and fluid connection; and (c) assembling the manifold with the printing element and a gasket to form the printing apparatus.

Abstract: Two-phase immersion cooling systems can be used to cool electronic components submerged within a dielectric working fluid, but are susceptible to costly losses of working fluid when the cooling systems are opened to allow access to the electronic components for service or replacement. By selectively sealing certain portions of the cooling systems, loss of vaporized working fluid can be reduced.

Abstract: A cooling apparatus that includes a base plate configured to dissipate heat and including a heat exchange unit, and a cover member coupled to the base plate and at least partially enclosing the heat exchange unit. The cover member and the base plate define a heat exchange chamber that includes the heat exchange unit. The cover member defines a first opening and a second opening, and at least one of the first and second openings are above the heat exchange unit. The cooling apparatus further includes a flow guidance plate disposed on the cover member and a housing disposed on the flow guidance plate.

Abstract: A plurality of semiconductor devices (4a-4f, 5a-5f) are provided on an upper surface of the conductive base plate (1) via an insulating substrate (2) and a conductive pattern (3a-3d). A plurality of fins (6) are provided on a lower surface of the conductive base plate (1). A heat dissipating base plate (7) is provided to tips of the plurality of fins (6). A cooler (8) having an inflow port (9a) and an outflow port (9b) in a bottom surface surrounds the plurality of fins (6) and the heat dissipating base plate (7). A partition (10) separates a space surrounded by the cooler (8) and the heat dissipating base plate (7) into an inflow-side space (11a) connected to the inflow port (9a) and an outflow-side space (11b) connected to the outflow port (9b). A first slit (12a) is provided in a central portion of the heat dissipating base plate (7). Second and third slits (12b,12c) are respectively provided on both sides of the heat dissipating base plate (7) along a direction from an inflow side to an outflow side.

Abstract: A storage node for a distributed object storage system, comprising a control board configured to receive a parameter for setting predetermined allowable temperature ranges through a serial port, and sending a signal through said serial port for indicating one or more of said measurements of temperatures lies outside said predetermined allowable ranges. The control board is further configured to receive a parameter for controlling the switching on or off the storage elements through said serial port by sending a signal through said serial port to indicate which storage elements is switched on or off.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

Abstract: The present invention improves heat dissipation by facilitating the flow of the surrounding air. Provided with a heat sink including: a tabular base part; a tabular protruding piece part that protrudes from the base part toward one side in a thickness direction of the base part; and a tubular protrusion which protrudes from the protruding piece part in a thickness direction of the protruding piece part, and the inside of which is bored in a protruding direction thereof, wherein a plurality of the protruding piece parts is provided along a surface of the base part, and a plurality of the tubular protrusions is provided along a surface of each of the protruding piece parts.

Abstract: The electronic assembly includes a printed circuit board; an electronic package that includes an electronic component mounted on a substrate, wherein the substrate is mounted to the printed circuit board; a first memory module mounted to the printed circuit board such that the first memory module is adjacent to the electronic package; a second memory module mounted to the printed circuit board; and a substrate bridge that electrically connects the first and second memory modules to the electronic package, wherein a lower surface of the substrate bridge is connected to an upper surface of the substrate and an upper surface of the first and second memory modules.

Abstract: A heat dissipation device for a device or module which can be plugged into the heat dissipation device includes a mounting bracket, an upper radiator, and at least one side radiator. The mounting bracket includes an upper bracket and two side brackets connected to two sides of the upper bracket. The upper bracket and the two side brackets define a receiving chamber for receiving the device or module. The upper radiator is positioned above the upper bracket. The at least one side radiator is positioned at one side of the side bracket away from the receiving chamber. The upper radiator includes a heat conducting layer, and the heat conducting layer includes a thermally conductive foam and a graphite layer arranged around the thermally conductive foam.

Abstract: In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.

Abstract: Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.

Abstract: An assembly includes a substrate defining a base portion defining a plurality of orifices that extend through the base portion, the plurality of orifices defining a plurality of jet paths extending along and outward from the plurality of orifices, a mesh coupled to the base portion, the mesh defining a plurality of pores aligned with the plurality of jet paths, an encapsulated phase-change layer positioned on the mesh, and a heat-generating device coupled to the mesh opposite the base portion, the heat-generating device defining a bottom surface that is oriented transverse to the plurality of jet paths.

Abstract: In accordance with presently disclosed embodiments, a system and method for controlling the temperature of medium-voltage power electronics assemblies (i.e., medium-voltage drives) is provided. The disclosed system generally includes a medium-voltage drive having one or more cabinets with power electronics devices disposed therein, one or more fans for circulating air through the cabinet to cool the devices, and one or more space heaters disposed in the cabinet. The drive also features temperature sensors used to measure various temperatures of the drive, a controller communicatively coupled to the sensors, and one or more variable frequency drives (VFD) for the fans. The controller may receive measurements regarding the ambient and power device temperatures and apply controls to vary the space heater power and fan speed in response to environmental changes.

Abstract: In one aspect, a computing device-implemented method includes receiving at least one triggering event signal from one or more components of a heat recovery system. The method also includes determining, based in part on the at least one triggering event signal, a computation workload assignment to be executed on one or more computation devices. The method further includes sending one or more command signals to the one or more computation devices. The one or more command signals include a portion of the computation workload assignment for execution by the one or more computation devices. The method also includes initiating capture of heat energy to be stored in one or more heat reservoirs, the heat energy being generated by the one or more computation device based upon the computation workload assignment.

Abstract: A computer system includes a computer housing with a fastening device that fastens the computer housing to a mount; a system component arranged in the computer housing and having at least one component to be cooled; a fan that cools the at least one component arranged in the computer housing in a region of the at least one component; a first ventilation area arranged laterally next to the fastening device in a first housing wall of the computer housing; and a ventilation channel extending in the computer housing between the first ventilation area and the fan, which is fluidically separated from the rest of the computer housing.

Abstract: The present disclosure relates to heat and temperature control. The teachings thereof may be embodied in temperature-control units for electronic components. For example, a temperature-control unit may include: a housing defining a receptacle for the component and a channel system for a fluid. The channel system runs from an inlet via a nozzle and via a cavity to an outlet. The housing comprises a wall structure with an inner surface forming an impact surface situated opposite a nozzle mouth and an outer surface serving as part of the receptacle.

Abstract: An ink-jet recording apparatus includes a plurality of recording heads, a wipe unit, and an entry prevention member. The wipe unit includes a wiper for wiping an ink ejection face in a predetermined direction. The entry prevention member is arranged between the recording heads in a sheet conveying direction to prevent the recording medium from entering the gaps between the recording heads. The entry prevention member is configured to be movable in an up-down direction, is arranged in an entry prevention position where its lower face is flush with, or projects below, the ink ejection face during printing operation, and is arranged in a retracted position where the lower face is retracted above the ink ejection face during wiping operation by the wipe unit.

Abstract: A system and method for cooling an external surface of a heat conductive body heated by a heat source is provided. The system includes a tank containing an evaporation liquid, a conduit supplying the evaporation liquid to the external surface of the body, a controllable supply valve for regulating a flow rate of egress of the evaporation liquid from the tank, and a control unit for controlling operation of the supply valve. The control unit includes a temperature sensor producing a temperature sensor signal representative of the temperature of the body at the predetermined place; and a controller capable of generating control signals for controlling operation of the controllable supply valve to provide a pulsed supply of the evaporation liquid to the external surface of the body for obtaining a desired temperature decrease of the body.

Abstract: A clustered heat dissipation device and a chassis are provided. The clustered heat dissipation device includes a heat-absorbing manifold, plural heat-absorbing heads and plural connection pipes. The heat-absorbing manifold includes an inlet chamber and an outlet chamber. The inlet chamber includes at least one first liquid inlet and plural first liquid outlets. The outlet chamber includes plural second liquid inlets and at least one second liquid outlet. The heat-absorbing manifold is in thermal contact with a first heat source. The plural connection pipes are connected with the heat-absorbing heads and the corresponding first liquid outlets and connected with the heat-absorbing heads and the corresponding second liquid inlets.

Abstract: A liquid discharging apparatus includes a print head that has a driving element and discharges a liquid, a drive signal generation circuit that generates the drive signal based on a drive signal generation control signal for controlling generation of the drive signal, and a drive circuit substrate on which the drive signal generation circuit is provided. The drive circuit substrate has an input connector that inputs the drive signal generation control signal into the drive circuit substrate and an output connector that outputs the drive signal from the drive circuit substrate. A distance between the input connector and the output connector is shorter than a distance between the drive signal generation circuit and the input connector. The distance between the input connector and the output connector is shorter than a distance between the drive signal generation circuit and the output connector.

Abstract: This power conversion device for a railway vehicle includes a first radiation fin radiating heat from a semiconductor device and a second radiation fin arranged at a prescribed interval from the first radiation fin in a traveling direction for radiating heat from the semiconductor device. At least either one of the first and second radiation fins includes an air duct formed by partially not providing a plurality of fin portions.

Abstract: An emissive display assembly including an emissive display, a circuit board associated with the emissive display element, a display chassis, and a support plate. The display chassis may house the emissive display element. The display chassis may further house the circuit board. The display chassis may have an aperture such that a front side of the emissive display element is viewable through the aperture. The support plate may be held in place by the display chassis and positioned between the emissive display element and the circuit board. The support plate may support a back side of the emissive display element such that, when a compressive force is applied to the front side of the emissive display element, the support plate restricts the emissive display element from bending more than a predetermined bending threshold.

Abstract: A compact electronic device includes a base with a plurality of sides each adjacent to a bottom portion, wherein the base houses components comprising a heatsink supporting a fan module located in an interior portion, a Printed Circuit Board (PCB), and a power supply, and wherein vents are disposed on the bottom portion and side vents are disposed on one or more of the plurality of sides; a top cover configured to attach to the base via the plurality of sides forming an air gap extending each of the plurality of sides, wherein the air gap supports air exhaust on one or more sides of the plurality of sides and air intake on the remaining sides; and an electrical plug connected to the power supply and extending out of the bottom portion for insertion into an electrical outlet for power and to physically support the compact electronic device.

Abstract: Exemplary embodiments are directed to equipment cabinets for customized improved cable management and airflow management. The equipment cabinets include a frame structure. The frame structure includes a top frame assembly and a bottom frame assembly. In some embodiments, the equipment cabinets include a chimney assembly. In some embodiments, the equipment cabinets include a slidable vertical rail. In some embodiments, the equipment cabinets include a rotatable top panel. In some embodiments, the equipment cabinets include a condition monitoring assembly. In some embodiments, the equipment cabinets include a reinforced corner construction. In some embodiments, the equipment cabinets include divider panels capable of being split. Embodiments are also directed to methods of equipment cabinet assembly.

Abstract: An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.

Abstract: A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.

Abstract: A thermal management device is described. The thermal management device includes a housing having an upper wall, a lower wall, and a side wall. The upper wall has an outer surface and an inner surface. The lower wall has an outer surface, an inner surface and an inner height between the inner surface of the upper wall and the inner surface of the lower wall. The thermal management device includes a working fluid within the housing. The inner height of the housing is sized to form a continuous meniscus of the working fluid from the inner surface of the upper wall to the inner surface of the lower wall.

Abstract: A heat dissipation element includes a first and a second housing, and a first and a second working fluid. The first housing has a first inner space. At least one pipe is formed on one side of the first housing and has a second inner space. The first and the second inner space are communicable and together define a first chamber. The second housing has a second chamber. A first and a second working fluid is, respectively, provided in the first and the second chamber. One side of the second housing is fixedly connected to one end of the pipe. The first and the second chamber are incommunicable. With these arrangements, the heat dissipation element not only can provide better heat spreading and heat transfer effect, but also can be produced at largely lower manufacturing costs.

Abstract: An electric motor includes a stator having a tubular shape, a rotor rotatable around a rotary axis and having a rotary spindle, a first housing part disposed so as to partially house the rotary spindle, a second housing part disposed at the other end of the stator in the rotary axis direction, a third housing part at a side opposite to the first housing part in the rotary axis direction with respect to the second housing part, a plurality of ventilation parts formed so as to communicate with at least the stator, the second housing part, and the third housing part, and a plurality of fans for ventilating the plurality of ventilation parts, the plurality of fans being disposed in the third housing part on a plane perpendicular to the rotary axis so as not to overlap the rotary axis.

Abstract: An electronic apparatus includes a plurality of parts, a frame having an outer periphery surrounding the plurality of parts and formed from resin, a circuit board disposed at one side in a first direction with respect to the plurality of parts, a chassis disposed at the one side in the first direction with respect to the plurality of parts, and formed from metal, and a metal plate disposed at the other side in the first direction with respect to at least one of the plurality of parts and attached to the frame.

Abstract: A thermoelectric device is disclosed which includes metal thermal terminals protruding from a top surface of an IC, connected to vertical thermally conductive conduits made of interconnect elements of the IC. Lateral thermoelectric elements are connected to the vertical conduits at one end and heatsinked to the IC substrate at the other end. The lateral thermoelectric elements are thermally isolated by interconnect dielectric materials on the top side and field oxide on the bottom side. When operated in a generator mode, the metal thermal terminals are connected to a heat source and the IC substrate is connected to a heat sink. Thermal power flows through the vertical conduits to the lateral thermoelectric elements, which generate an electrical potential. The electrical potential may be applied to a component or circuit in the IC. The thermoelectric device may be integrated into an IC without adding fabrication cost or complexity.

Abstract: A heat dissipating apparatus has a phase change material evaporator, a condenser, a refrigerant output tube, and a refrigerant input tube. The evaporator has a base having an evaporation chamber, a refrigerant inlet and a refrigerant outlet, a reinforcement panel mounted in the evaporation chamber and dividing the evaporation chamber into two spaces, and multiple heat conduction fins separately arranged in the two spaces. An opening area of the refrigerant outlet is larger than an opening area of the refrigerant inlet. The evaporator, the refrigerant output tube, the condenser and the refrigerant input tube form a closed refrigerant circulation loop with a refrigerant filled therein. Gas pressure of a gas-phased refrigerant in the two spaces can be increased. With pressure difference between the refrigerant outlet and the refrigerant inlet, the gas-phased refrigerant can be accelerated to flow toward the refrigerant outlet and flowability of the refrigerant can be increased.

Abstract: A cooling structure for a portable electronic device is provided, configured to accommodate, within a case having a sealing structure, a substrate on which a heat-generating component that generates heat during operation is mounted, and provided with a heat sink that diffuses the heat from the heat-generating component to a place away from the heat-generating component. The heat sink is integrated into an inner surface of an area corresponding to a front cover of the case or an inner surface of an area corresponding to a rear cover of the case, and a flat heat pipe flattened by being compressed in a thickness direction of the case is disposed such that one end is attached by being sandwiched between the heat-generating component and the heat sink while another end is arranged in close contact with the heat sink.

Abstract: An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.

Abstract: There is disclosed a digital signage including a display panel, a housing having the display panel arranged in one surface, the housing comprising a closed inner space, a cooling unit provided in a predetermined portion of the housing, the cooling unit comprising a hole configured to suck and exhaust external air, a heat pipe comprising one end positioned in the inner space of the housing to be coupled to a back surface of the display and the other end positioned in the cooling unit, with a liquid flowing therein to move heat, and a driving circuit board coupled to a back surface of the heat pipe to control driving of the display panel, such that the digital signage having a slim design can exhaust the heat generated from a display panel and a driving circuit board effectively.

Abstract: Cold plates are described herein. In one example, a cold plate can include a thermally conductive plastic forming a coolant channel that includes a heat spreader formed into the thermally conductive plastic and an exterior surface of the thermally conductive plastic with a coupling location to couple a heat pipe to the exterior surface of the thermally conductive plastic.

Abstract: A system, according to one embodiment, includes: a first frame of an automated tape library, wherein an interior of the first frame includes one or more tape drives, an area for storing tape cartridges, and an accessor channel, and a first air conditioning unit coupled to the first frame. The first air conditioning unit is configured to cool the interior of the first frame. Moreover, one or more fans of the one or more tape drives are configured to generate air flow within the interior of the first frame. Other systems, computer-implemented methods, and computer program products are described in additional embodiments.

Abstract: A data storage library system includes at least one data storage library, the at least one data storage library comprising at least one library frame, wherein the at least one library frame has at least one environmental conditioning unit configured to control one or more environmental conditions within the at least one library frame. The system also includes at least one access door for providing access to an interior portion of the at least one library frame, a library controller, and at least one louver, where the louver may be selectively moveable to control a communication pathway for external air to enter the at least one library frame. In one embodiment, the at least one louver may be controlled by the library controller to automatically open when it is detected that the one or more access doors are opened, and to close the louver when the one or more access doors are closed.

Abstract: An apparatus for air-conditioning of watercraft and the like including: an electronically controlled variable-r.p.m. compressor, a main gas/water condenser (5), at least one environmental heat-exchanger (3) with an electronically controlled fan (14), at least one electronically controlled expansion valve (8), and at least one first electronic control unit (4) programmed for calculating continuously a temperature deviation detected (DeltaT=T_ad?T_a), and as a function of the temperature deviation regulating in combination, the r.p.m. of the compressor (1), opening of the flow valve (8), and the r.p.m. of the fan of the heat-exchanger (3).

Abstract: A hybrid power control unit for a vehicle according to the present disclosure includes: a capacitor module; first and second coolers disposed on opposite sides of the capacitor module, the coolers including flow paths extending along lengthwise directions of the capacitor module; a plurality of power modules each being installed between the branch flow paths of one of the first and the second coolers; a low DC-DC converter (LDC) module disposed on one of the first and second coolers to be in contact with a remaining one of the branch flow paths of the cooler having the LDC module; a gate board having a top surface being electrically connected to the power modules; and a control board having a top surface being electrically connected to the gate board and the LDC module.

Abstract: An apparatus includes an electrically-powered component, a hermitically-sealed, liquid-impermeable, high thermal-conductivity, container encapsulating the electrically-powered component, and a liquid bath surrounding the hermitically-sealed container. The electrically-powered component can include a computer motherboard, a central processing unit of a computer, or an electrical power transformer. The container can include a substance in direct contact with the electrically-powered component and can include a silicone compound, an epoxy compound, or a polyurethane compound.