Abstract: A 3D extended cooling mechanism includes cabinet, air intake module, heat exchange module including heat exchanger, air baffle and bottom plate, first wind tunnel defined above the air baffle, second wind tunnel defined between air baffle and bottom plate and third wind tunnel defined between bottom plate and bottom of cabinet. First, second and third wind tunnels accept the air drawn by air intake module to form a respective cold air stream. Heat exchanger accepts cold air stream of first wind tunnel for heat exchange, enabling hot air produced in heat exchange to be delivered to air outlet of cabinet for discharge. First, second, and third wind tunnels are designed to dissipate the relatively low temperature airflow into high temperature sensitive heat source components in the longitudinal direction and the lateral direction so that heat source elements can be efficiently dissipated at the same time to achieve three-dimensional expansion cooling.

Abstract: A cooling device includes: a cold plate; a radiator; a pump; a first tank; and a second tank. The cold plate has a first cooling medium flow passage. The radiator has fins and pipes forming a second cooling medium flow passage. The pump circulates a cooling medium. The first tank is coupled to one ends of the pipes. The second tank couples the other ends of the pipes to the pump. The radiator is disposed on the cold plate. The cold plate has a bottom wall portion, a top wall portion, a side wall portion, an internal space, an inlet port, and an outlet port. The bottom wall portion has blades, and an inner peripheral wall of the side wall portion has a first bent portion.

Abstract: A pump unit (10) includes a number of pumps (14) each having a port in fluid connection to a combined port (12) of the pump unit. A processing system (16) is connected to each of the pumps (14) for independent actuation of each pump. A user interface (22) allows user actuation of the pump unit according to one or more mode of operation, requiring various different levels of suction or pressure. The processing system (16) determines what number of pumps (14) is required, and selectively actuates pumps in order to generate the required suction or pressure. Particularly preferred applications include breast pumps. Additional aspects of the invention relate to a cyclic pulsed suction profile generated by the device, implementations that detect when a milk extraction set is not properly deployed, and configurations which allow a touch screen to be used as a power-on switch for the device.

Abstract: Methods and systems for scalable high-performance embedded computing architectures. According to an embodiment, a scalable high-performance embedded computing system increases computational capability within the restrictive size, weight, and power constraints of systems such as the external pod payloads of unmanned aircraft systems, among many other possible systems. The core computer capability can be placed in various environments, and according to one embodiment utilizes a flight-certified aeronautics pod that is scalable in length. The scalable HPEC system can be connected to external data sources, or the nose and tail can be made of Radio Frequency transparent material, enabling the use of various RF sensing technologies within the same aeronautics enclosure. According to an embodiment, a lightweight, thermally-efficient conduction cooled chassis supports the required board and interface hardware.

Abstract: Methods, systems, and assemblies for cooling an electronic component are disclosed. A heat sink assembly includes first and second substrates. The first substrate is in thermal contact with the electronic component. A primary channel is formed in the second surface of the first substrate. The primary channel is configured to direct cooling fluid for cooling the electronic component. An array of primary cooling fluid fins is positioned within the primary channel. The array of primary cooling fluid fins includes upstream solid fins and downstream open fins each having an upstream opening and downstream sidewalls. The secondary channel is formed within the second surface of the second substrate and is configured to direct partially heated cooling fluid away from the electronic component. An array of secondary cooling fluid fins is positioned within the secondary channel downstream. An enclosing layer seals the secondary channel.

Abstract: A motor vehicle light assembly includes a housing; a light source disposed in the housing, and a light-transmissive lens operably attached to the housing. A heater member is disposed between the housing and the light-transmissive lens. The heater member is configured to radiate heat emitted from the light source, with the heater member being routed to direct the radiated heat onto the light-transmissive lens to regulate the temperature of the light-transmissive lens to inhibit fogging, frosting and icing of the light-transmissive lens.

Abstract: A display device including a screen, a base and an adaptor is provided. The adaptor can be selectively detached from or connected to the screen and the base. When the base is connected to the screen through the adaptor, the display device is erected on a plane through the base. When the base and the screen are directly connected, the display device is attached to a wall through the base. Thus, the screen and the base can switch between a stand-up mode or a hanging mode through the adaptor.

Abstract: A crossflow heat-exchanger has first and second sets of fluid-flow channels arranged such that each set crosses the other to afford heat-exchange between cooling air in the first set and hot air in the second set, without the cooling air and the hot air contacting one another. A first series of fans causes flow of the external cooling air through the rows. A second series of fans causes flow of the internal hot air through the columns. External and internal fan controllers control the speed of each fan independently such that external cooling air flows through different rows at different rates and internal hot air flows through different columns at different rates.

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

Abstract: A system for controlling at least one environmental condition within at least one data storage library. The system may include at least one enclosure surrounding at least a portion of at least one data storage library. The system may also include at least one environmental conditioning unit fluidly connected to the at least one enclosure via at least one duct, wherein the at least one environmental conditioning unit is configured to control at least one environmental condition (e.g., temperature and/or humidity) within the at least one enclosure and within the at least one data storage library.

Abstract: An electronic device includes a board to which a heat generation component is attached, a heat sink that radiates heat generated by the heat generation component, a cooling target component that is between the board and the heat sink and is attached to the board, and a duct that takes in a part of a cooling air flow for cooling at least the heat sink and introduces the cooling air flow which is taken in to the cooling target component, thereby sufficiently cooling the cooling target component that is between the heat sink increased in size and the board and is positioned on a side to which the cooling air flow being applied to the heat sink flows away from the heat sink.

Abstract: In general, techniques are described for overriding a programmed set-point of an air moving component of a cooling unit, in order to control an extent of a refrigeration load on an air cooling component of the cooling unit. In one example, an air cooling unit that is configured to be coupled to an electrical bus of a data center includes an air cooling component, an air moving component that is configured to supply air to the air cooling component at a volumetric flow rate according to a fan speed set-point of the air moving component, and a unit controller that is configured to adjust the fan speed set-point of the air moving component to limit power draw by the air cooling unit from the electrical bus to within a bounded range of values that is defined in part by a power draw set-point of the air cooling unit.

Abstract: A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.

Abstract: A power distribution unit for a dielectric cooling system comprising a thermal cutoff or a float switch.

Abstract: A two-phase microchannel heat sink can be a fluid channel including a bottom wall including a superhydrophilic surface with microstructures and a side wall including a surface that is hydrophobic relative to the superhydrophilic surface of the bottom wall. When heat flux is applied to the fluid channel, a liquid film on the bottom wall is maintained and nucleation of boiling occurs only on the side wall.

Abstract: A ventilation device (1) is proposed, in particular designed to ventilate a circuit board (2), preferably in or for a computer, wherein the ventilation device (1) is designed to produce a first cooling air stream (5) from a first fan (12) and to produce a second cooling air stream (7) from a second fan (13), wherein the first cooling air stream (5) and the second cooling air stream (7) flow through on different sides of an air stream boundary plane (L), preferably parallel to the air stream boundary plane (L), through a common ventilation plane (BL) perpendicular to the air stream boundary plane (L), wherein the directions of flow from the first fan (12) and the second fan (13) are crosswise to the air stream boundary plane (L), wherein the ventilation device (1) preferably is designed to be mountable such that the air stream boundary plane (L) coincides with a central plane of the circuit board.

Abstract: A crossflow heat-exchanger has first and second sets of fluid-flow channels arranged such that each set crosses the other to afford heat-exchange between cooling air in the first set and hot air in the second set, without the cooling air and the hot air contacting one another. A first series of fans causes flow of the external cooling air through the rows. A second series of fans causes flow of the internal hot air through the columns. External and internal fan controllers control the speed of each fan independently such that external cooling air flows through different rows at different rates and internal hot air flows through different columns at different rates.

Abstract: A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.

Abstract: In various examples, a portable computing device is provided that has a bottom shell and a top shell pivotally coupled to the bottom shell for movement between a closed position and at least one open position. A display fits within a perimeter rim of the top shell, the display being obscured from view when the top shell is in the closed position and being viewable when the top shell is in the at least one open position. A coupling linkage couples the display, the top shell, and the bottom shell, to move the display between at least a first position with the display closer to the top shell when the top shell is in the closed position and a second position with at least a portion of the display farther from the top shell when the top shell is in the open position.

Abstract: A cooling system includes: a placement plate on which a plurality of components are disposed; and a liquid refrigerant flow path, which is formed on an opposite side of the placement plate with respect to the plurality of components, and is configured to allow a liquid refrigerant for cooling the plurality of components to flow therethrough. The path includes: a first heat-radiating portion disposed at a liquid refrigerant inlet portion around which fins are disposed such that distances from a flow-path inlet portion to the fins are gradually farther away from a flow-path side wall toward a center of the path; a second heat-radiating portion which includes fins having a curved shape; a third heat-radiating portion having no fins; a fourth heat-radiating portion having higher fin-mounting density than the first and the second heat-radiating portions, an inlet and an outlet through which the liquid refrigerant flows in and out.

Abstract: Memory devices having heat spreaders are disclosed herein. In one embodiment, a memory device includes first memories coupled to a front side of a substrate, second memories coupled to a back side of the substrate, and a flexible heat spreader. The flexible heat spreader can include graphite and is coupled to back side surfaces of the first and second memories to dissipate heat generated by the first and second memories.

Abstract: A fiber distribution hub (FDH) provides an interface between an incoming fiber and a plurality of outgoing fibers. The FDH includes a cabinet, at least one door pivotably mounted to the cabinet, and a frame pivotably mounted within the cabinet. The doors wrap around the sides and the front of the cabinet to provide access to both the front and sides of the frame when the doors are open. The frame can pivot out of the cabinet through the open doors to enable access to the rear of the cabinet and the rear side of the frame. The frame includes a termination region and a splitter region. The frame can include a storage region and/or a pass-through region.

Abstract: A modular instrumentation chassis includes a backplane PCB; multiple slots located on the backplane PCB and configured to receive multiple insertable modules, respectively; an AC-DC power supply configured to generate an isolated DC output voltage; and multiple DC-DC switching regulator units corresponding to the multiple of slots, respectively, each DC-DC switching regulator unit separately receiving the isolated DC output voltage from the AC-DC power supply. Each DC-DC switching regulator unit includes at least one DC-DC switching regulator configured to convert the received isolated DC output voltage to at least one different DC voltage, respectively, available to the slot of the multiple slots corresponding to the DC-DC switching regulator unit. A switching frequency of the at least one DC-DC switching regulator in each DC-DC switching regulator unit is separately adjustable to provide the at least one different DC voltage.

Abstract: A method and structure for improving efficiency of cooling and temperature uniformity among a plurality of heat generating electronic devices arranged in rows within a housing, such as a GPU server, utilizing a single source of cooling air. The electronic devices are arranged in a plurality of rows, but the heat sinks for the last row are elevated above the heat sinks of the first row so as to occupy different positions within the cooling air stream. In some embodiments the heat sinks of the electronic devices are extended forward so as to reside near the heat sinks of the electronic devices in the first row, but in a different flow path of cooling air. In other embodiments, a thermo siphon refrigeration system is provided for the electronic devices in the last row, and may be provided for the electronic devices in the first row as well.

Abstract: An external heat dissipation device includes an airflow-guiding base and a refrigerating device. The airflow-guiding base has a supporting surface and a perforation located thereon. The refrigerating device includes a casing, a thermoelectric cooler, a cold air transferring assembly and a hot air transferring assembly. The casing has a storage space. The thermoelectric cooler is located in the storage space and has a cooling surface and a heat releasing surface opposite to each other. The cold air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the cooling surface. The hot air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the heat releasing surface. The storage space is divided into a cold chamber and a hot chamber by the thermoelectric cooler and the cooling plates.

Abstract: An apparatus for cooling an electronic image assembly with ambient gas and circulating gas is disclosed. A first fan may be positioned to force the circulating gas around the electronic image assembly in a closed loop while a second fan may be positioned to cause a flow of ambient gas. A structure is preferably positioned to allow the circulating gas to cross the flow of the ambient gas while substantially prohibiting the circulating gas from mixing with the ambient gas. A pair of manifolds may be placed along the sides of the electronic image assembly and may be in gaseous communication with a plurality of channels placed behind the electronic image assembly. A heat exchanger may be used in some exemplary embodiments.

Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

Abstract: A circuit board and a heat dissipating device are provided. The heat dissipating device is for dissipating heat from a heat element. The heat dissipating device comprises: a base, having a plurality of fixing holes, each of the fixing holes is disposed adjacent to a periphery of the base, each connecting direction is respectively defined according to a connecting line between each of the fixing holes and the adjacent fixing holes; a fin set, disposed on the base and having at least one airflow channel; and a fan assembly, disposed in the fin set to generate an airflow flows through the at least one airflow channel, wherein a vertical projection of the direction of the at least one airflow channel on the base and a vertical projection of the connecting line direction on the base are non-orthogonal and non-parallel.

Abstract: A portable information handling system transfers thermal energy associated with operation of a CPU from a main housing portion to a lid housing portion with thermal conduction through a hinge assembly that rotationally couples the main and lid housing portions to each other. For example, thermal conduits insert into a hinge body and transfer thermal energy across the hinge body through a thermally conductive interface, such as the hinge body itself, thermal grease disposed in the hinge body, a liquid that fills a cavity of the hinge body shared by the thermal conduits, and a vapor chamber integrated in the hinge body.

Abstract: A cooling system for blades of a high performance computer thermally couples blade electronics to the computer's liquid cooling system through one or more heat pipes, without requiring a liquid conduit on, or liquid coupling to, the blade. Moreover, illustrative embodiments allow a blade to be installed in a high performance computer and engage the cooling system without making a liquid connection, and to disengage from the cooling system and be removed from the high performance computer without breaking a liquid connection.

Abstract: A circular heatsink can include a thermally conductive cylinder with an outer circumferential surface and an inner circumferential surface. An emissive and convective and convective surface area can extend radially from the outer circumferential surface. At least one thermally conductive ledge can extend from the inner circumferential surface and be configured to support a planar substrate having heat-generating electrical components. Air flow over the emissive and convective surface area can cause thermal conduction away from the heat-generating electrical components and through the at least one thermally conductive ledge, the thermally conductive cylinder, and the emissive and convective surface area.

Abstract: A thermal conditioning device for an electronic component mounted in a package positioned on a multilayer printed circuit board comprises: at least one active component arranged on the printed circuit board, and suitable for producing or absorbing thermal energy, at least one heat transfer surface internal to the printed circuit board, located under the package, a device for transferring the thermal energy between the active component or components and the heat transfer surface, at least one metallic element linking the heat transfer surface to the package situated on the multilayer printed circuit board. A printed circuit board comprising such a thermal conditioning device for an electronic component, and associated heating and cooling methods are also provided.

Abstract: A cooling device includes a heat receiver that receives heat of an electronic component via a coolant, a heat discharger that discharges heat of the coolant from the heat receiver, and a circulation flow path through which the coolant flows from the heat receiver to the heat discharger and the coolant flows from the heat discharger to the heat receiver. The heat receiver is provided with an attachment surface to which a plurality of the electronic components are attached, a first flow path that communicates with the circulation flow path, and a plurality of surface area increasing members that communicate with the first flow path and that are provided on a rear surface of the attachment surface corresponding to the plurality of electronic components.

Abstract: A heat dissipation system and a coolant distribution module for plural electronic components of an electronic computing device are provided. The heat dissipation system includes plural water-cooling heads, a heat dissipation device and the coolant distribution module. When a fluid medium flows through the heat dissipation device, the heat dissipation device exchanges heat with the fluid medium. The coolant distribution module is connected between the plural water-cooling heads and the heat dissipation device. The coolant distribution module includes a main body and a power module. The module main body includes a cooled fluid chamber. The cooled fluid chamber includes plural first outlets corresponding to the plural water-cooling heads. The power module is installed in the module main body. The power module drives the fluid medium to be outputted from the plural first outlets. Consequently, the fluid medium is transferred through a circulating loop.

Abstract: The present disclosure is a heat sink used for an electronic component. The heat sink includes a shell body, a fan, and a thermally-conductive strip. The thermally-conductive strip abuts against the shell body. The shell body has an internal space and a side wall, and a channel is formed in the side wall of the shell body for a coolant fluid to flow. At two ends of the channel, a coolant fluid inlet and a coolant fluid outlet are respectively formed on an outer wall surface of the side wall. In this way, when flowing through the shell body, the coolant fluid brings heat of the shell body away. Therefore, heat dissipation efficiency can be substantially increased.

Abstract: A battery cooling device for a vehicle is provided. The device repeats phase changes of a refrigerant to cool a battery due to heat of vaporization when a liquid-state refrigerant is vaporized by thermally coming in contact with a battery heat source. The vaporized refrigerant is changed back into a liquid state by thermally coming in contact with a separate coolant. The effect of cooling all battery cells is maximized throughout the entire refrigerant channel for cooling a battery and the battery cells are cooled uniformly.

Abstract: A portable electronic device including host body, display body, hinge and heat pipe assembly. The host body includes base and heat source disposed on base. Side of positioning structure is connected to first fixed part. First fixed part is fixed to base. Second fixed part is fixed to metal casing. Heat pipe assembly includes first heat pipe and second heat pipe. End part of first heat pipe has insertion hole. End part of second heat pipe is pivotally inserted into insertion hole of end part of first heat pipe. Another end part of first heat pipe is in thermal contact with heat source. Another end part of second heat pipe is in thermal contact with metal casing. Another side of positioning structure is fixed to end part of first heat pipe so as to keep pivot part and end part of first heat pipe coaxial.

Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

Abstract: A fluid routing device includes a fluid inlet, first vertical channels, a horizontal channel, a second vertical channel, and a fluid outlet. The first vertical channels are open to the fluid inlet. The horizontal channel is open to each of the first vertical channels. The first vertical channels are oriented to provide fluid coolant from the fluid inlet vertically down to the horizontal channel. The horizontal channel is open on one side such that fluid coolant in the horizontal channel directly contacts an apparatus attached to a bottom of the fluid routing device. The second vertical channel is open to the horizontal channel. The second vertical channel is oriented to provide fluid coolant vertically up away from the horizontal channel. The fluid outlet is open to the second vertical channel such that fluid coolant from the second vertical channel exits the fluid routing device through the fluid outlet.

Abstract: A radiator for a liquid cooling type cooling device includes a plurality of fin plates and connecting members integrally connecting all the fin plates. The fin plate includes a vertically elongated rectangular flat plate body and narrow portions integrated with both end portions of the plate body. All the fin plates are arranged at intervals in the thickness direction of the plate body. The connecting member is formed into a corrugated shape and includes flat plate portions each integrated with the narrow portion of the plate body and arcuate portions and each connecting the adjacent flat plate portions. The plate body, the narrow portion, and the flat plate portion are equal in thickness. Both side surfaces of the plate body, both side surfaces of the narrow portion, and both side surfaces of the flat plate portion are positioned on the same plane.

Abstract: A removable airflow control baffle may be dimensioned to be removably coupled to a receiving component that facilitates the flow of air through an enclosed container. Such an airflow control baffle may include (i) a support frame that is dimensioned to removably couple the airflow control baffle to the receiving component and (ii) an airflow control zone that is coupled to the support frame such that the airflow control zone affects airflow through an opening defined by the receiving component when the airflow control baffle is coupled to the receiving component.

Abstract: System and method for transferring heat generated by internal electronic components of a mobile computer to its external environment. Heat absorption and transfer elements disposed, in part, proximate heat-producing components move the heat to a remote heat sink assembly adapted to dissipate the heat. Example embodiments include one or more fans to produce internal airflow(s) that further facilitate internal heat transfer.

Abstract: A heatsink assembly including a substrate having an active circuitry, at least one cavity located adjacent to at least one heat producing element of the active circuitry, at least one vessel sealably coupled to said substrate in fluid communication with the at least one cavity, and a phase change material (PCM) contained inside the vessel. The vessel and at least one cavity are configured to facilitate migration of the PCM from the vessel into the at least one cavity for absorbing heat produced by the at least one heat producing element of the active circuitry.

Abstract: A removable immersion cooling infrastructure module can have a form factor equivalent to that of one or more of the computing devices being cooled by immersion cooling, thereby enabling the immersion cooling infrastructure module to be installed and removed in the same simplified and efficient manner. Moreover, the quantity of immersion cooling infrastructure modules can be varied depending on need, since the immersion cooling infrastructure modules and computing devices can be interchangeable within the openings designed to house the computing devices. An immersion cooling infrastructure module can comprise a filter, a pump that can circulate the immersion cooling liquid through the filter, a power supply and a controller, with the module receiving power, and, optionally, communications and other like connectivity, from the same source as the computing devices.

Abstract: The invention relates to the production of an optical or optoelectronic assembly (1, 2) comprising an active component (5) and a cooler (3). The cooler (3) is produced by means of a 3D printing method on a composite plate (6).

Abstract: A liquid cooling heat sink structure includes a thermal conduction module configured to dissipate heat and including a heat exchange unit; a cover coupled to the thermal conduction module and enclosing the heat exchange unit, the cover and the thermal conduction module defining a heat exchange chamber that includes the heat exchange unit, the cover defining a first opening and a second opening, and the cover being coupled to the thermal conduction module such that at least one of the first and second openings is above the heat exchange unit; a flow guidance plate disposed on the cover; and a housing disposed on the flow guidance plate and defining a first cavity and a second cavity fluidly isolated from each other, wherein the housing includes two fluid inlets each in fluid communication with the first cavity, and a fluid outlet in fluid communication with the second cavity.

Abstract: Thermal management devices and systems, and corresponding methods of cooling computing devices are described herein. Such devices, systems, and methods may be advantageous in providing optimal thermal management for the computing device and/or minimizing acoustics in the computing device for a plurality of rotational fan speeds. Additionally, optimal thermal management may provide an increase in system performance and an increase in computing device life expectancy. In one example, a thermal management system includes a fan configured to move air through an outlet opening of the fan and at least one airflow guide positioned adjacent to the outlet opening. The at least one airflow guide is configured to direct movement of the air from the outlet opening to dissipate heat within an electronic device, and the at least one airflow guide is configured to pivot about an axis to move between a first position to a second position based on a change in a rotational speed of the fan.

Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Abstract: Provided is a display device. The display device includes a display panel and at least one cooler configured to dissipate heat of the display panel. The at least one cooler includes a vapor chamber including a high temperature heated by the display panel and a low temperature connected to the high temperature portion through a connection portion and spaced apart from the display panel, a fan spaced apart from the vapor chamber to blow air toward the vapor chamber, and an air guide configured to guide the air blown from the fan to the low temperature portion.

Abstract: A cooling assembly for cooling a heat source includes a cold plate to absorb heat from the heat source. The cold plate defines a first groove. A thermally conductive clamp is removably secured to a liquid cooling tube. The thermally conductive clamp defines a second groove. A heat pipe includes a first end to fit within the first groove in the cold plate and a second end to fit within the second groove in the thermally conductive clamp. The heat pipe transfers heat absorbed by the cold plate to the liquid cooling tube via the thermally conductive clamp.