Abstract: Examples herein disclose a coolant distribution unit (CDU) including a valve, a pump, and a controller. The valve controls a coolant through the CDU and the pump maintains a differential pressure of coolant to data center components. The controller exclusively controls the CDU to determine a position of the valve. In the response to the determined position of the valve, the CDU adjusts a speed of the pump.

Abstract: A vehicle inductor assembly includes an inductor, a thermal plate, an emitter, and a controller. The inductor is secured within a housing. The thermal plate supports the inductor and includes a channel having a flexible wall with actionable particles. The emitter is located adjacent the channel. The controller is programmed to activate the emitter to impart a force upon the particles to move the wall such that a cross-sectional area of the channel is adjusted to influence a flow rate of coolant flowing therethrough. The wall may be a membrane partially secured to an interior of the channel and include the actionable particles. The actionable particles may be one of dielectric and magnetic particles and the emitter may selectively output one of a voltage, an electric field, or a magnetic field to move the dielectric or magnetic particles such that the membrane moves to adjust the cross-sectional area of the channel to influence a flow rate of coolant flowing therethrough.

Abstract: The machine cabinet for dissipating heat includes a housing, and an inner chamber, a liquid working medium accommodating area, a heat exchanger and a delivery passage disposed in the housing. The inner chamber is in a vacuum state and accommodates electronic devices to be cooled; the liquid working medium accommodating area accommodates a liquid working medium, the liquid working medium is converted into a gas working medium to enter the heat exchanger after cooling the electronic devices to be cooled; the heat exchanger liquefies the gas working medium into a liquid working medium and guides the liquid working medium obtained by liquefying the gas working medium into the delivery passage; and the delivery passage is connected with the heat exchanger and the liquid working medium accommodating area and guides the liquid working medium obtained by liquefying the gas working medium into the liquid working medium accommodating area.

Abstract: According to one embodiment, a thermal management system is provided that includes at least one chassis frame configured to minimize a thermal spreading resistance of the thermal management system. The chassis frame included at least one chassis body, at least one thermal skeleton embedded into the chassis body, and a working fluid contained within the thermal skeleton and used to dissipate heat from the chassis body.

Abstract: An apparatus for cooling an electrical component includes a circuit board with the electrical component disposed on the circuit board. The apparatus includes a cover disposed on the circuit board. The cover and the circuit board form a closed cavity in which the electronic component is disposed. The cavity has a first opening for introduction of a fluid and a second opening for discharge of a fluid.

Abstract: A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are assembled and disposed in the receiving space. At least one protrusion section protrudes from one side of the first radiating fin assembly. The protrusion section is formed with a first slope and a second slope. The second radiating fin assembly is assembled with the first radiating fin assembly. At least one notch is formed on one side of the second radiating fin assembly corresponding to the protrusion section. The notch is formed with a third slope and a fourth slope. The third slope is in contact with the first slope. A gap is defined between the fourth and second slopes. An open space is defined between the first and second radiating fin assemblies in communication with the gap.

Abstract: Provided is a heat radiating apparatus. The heat radiating apparatus includes a support member in close contact with the heat source, a heat pipe thermally joined with the support member, and a plurality of heat radiating fins placed in a space that faces a second principal surface. The heat pipe includes a first line part thermally joined with the support member, a second line part thermally joined with the heat radiating fins, and a connecting part which connects the first line part to the second line part. A length of the heat pipe is slightly shorter than or equal to the support member. The connecting part has a curved part thermally joined with the support member. When a plurality of heat radiating apparatuses are arranged in the direction in which the first line part extends, the heat radiating apparatuses can be connected such that the first principal surfaces are successive.

Abstract: A spot-cooling system including an electroactive polymer actuator, an enclosure defining an internal cavity, and a port in the enclosure is described herein. The electroactive polymer actuator may be configured to draw air into the enclosure. The electroactive polymer actuator may be configured to force air from the enclosure. The electroactive polymer actuator may comprise a corrugated electroactive polymer actuator. The electroactive polymer actuator may comprise a plurality of layered electroactive polymer actuators.

Abstract: A mobile power supply may include a charging and discharging interface, a charging and discharging circuit, a central processor, and a battery pack. The charging and discharging circuit may be configured to adjust a voltage inputted to the battery pack to charge the battery pack when the voltage inputted to the battery pack is not matched with a voltage of the battery pack, or configured to adjust a voltage output to the electronic device to charge the electronic device when the voltage outputted to the electronic device is not matched with a rated voltage of the electronic device. The central processor may be configured to control the charging and discharging circuit to charge the battery pack, supply power to or charge the electronic device.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

Abstract: A modular data center includes a controller; a data center control system configured to collect data center data associated with the modular data center via communication with one of the controller and a plurality of sensors; and a data module connected to a power supply source. The power supply source includes at least one of a power grid, a backup power source and a power module. The power module includes electronics equipment for conditioning and distributing power to the one or more data modules. The data module includes a first enclosure defining a first internal space; and a first sensor in the plurality of sensors. The first sensor is in communication with at least one of the controller and the data center control system. A second sensor in the plurality of sensors is in communication with the power supply source.

Abstract: A water based closed loop cooling system employed to cool waterborne data center facility generally comprise a plurality of filtered water intake pipes, a plurality of filtered water exhaust pipes, a plurality of heat exchangers, a plurality of closed loop cooling systems or closed loop coolant distribution units that may use freshwater as a coolant, and a plurality of piping systems. The energy efficient water based closed loop cooling system and method described may use naturally occurring cold water as a heat sink in a plurality of heat exchange systems. The systems and methods described in this document may be employed to provide an energy efficient water-based closed-loop cooling system to maintain interior ambient conditions suitable for proper operation of the plurality of computer systems therein.

Abstract: A fluid cooled server may include a reservoir for a cooling fluid, a pump for circulating the cooling fluid between components within the server, one or more tubes for transporting the cooling fluid to a water block adjacent to a component to remove heat from the component. The cooling fluid may be transported from an outlet of the water block to an inlet of a radiator for progressively removing heat from the cooling fluid. The fluid may then be transported from an outlet of the radiator to an inlet of the reservoir. In some instances, the radiator may be sized to be included within a 1U server chassis and may include two or more cooling channels and may be dimensioned such that the radiator may have a heat exchange capacity of between about 300W to about 550W. A fan module may be sized to blow air through the radiator and/or the server chassis.

Abstract: A heat dissipating device includes a first copper plate, a second copper plate, a plurality of first heat pipes, a plurality of second heat pipes, and a heat dissipating component. Evaporating sections of the first heat pipes and the second heat pipes are clamped between and thermally connected to the first copper plate and the second copper plate. The second heat pipe, the evaporating section of the first heat pipes, the first copper plate, and the second copper plate are positioned at a bottom surface of the heat dissipating component. The second copper plate is thermally connected to the bottom surface of the heat dissipating component. Condensing sections of the first heat pipes is thermally connected to a top surface of heat dissipating component.

Abstract: A liquid immersion cooling apparatus that cools an electronic device including a heat generating element, the apparatus includes a liquid immersion tank that accommodates a cooling liquid and the electronic device to be immersed in the cooling liquid, a wall that is disposed within the liquid immersion tank, the wall having a protrusion protruding toward the electronic device, and a drive mechanism that moves a position of the protrusion along the electronic device.

Abstract: A thermal module includes a heat dissipation unit having a receiving space, a first radiating fin assembly and a second radiating fin assembly. The first and second radiating fin assembles are disposed in the receiving space. At least one first protrusion section protrudes from the first radiating fin assembly. A top end of the first protrusion section is formed with a first apex. Two sides of the first apex are formed with a first slope and a second slope. At least one second protrusion section protrudes from the second radiating fin assembly corresponding to the first protrusion section. A top end of the second protrusion section is formed with a second apex. Two sides of the second apex are formed with a third slope and a fourth slope. The second apex abuts against the first apex to define an open space between the first and second radiating fin assemblies.

Abstract: Waste heat generated by devices as a byproduct of their operation is utilized to increase and maintain the temperature of non-potable water to neutralize biological contaminants, thereby rendering such water potable. The potable water can then be utilized for evaporative cooling of the devices. A temperature sensor monitors the temperature of the non-potable water and a controller controls the pump to provide sufficient time for the water to remain in the heat exchanger above a predetermined temperature to neutralize biological contaminants and render such water potable. To the extent that different devices generate different quantities and intensities of waste heat, multiple heat exchangers are utilized, with lower intensity waste heat serving to preheat the water and, thereby, reduce the amount of time needed to reach the target temperature in a primary heat exchanger. Waste heat not utilized to generate potable water can be utilized for other heat-driven processes.

Abstract: An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.

Abstract: An electronic assembly including a machine body and a docking station is provided. The machine body includes a casing, a heat transfer plate, and a heat dissipation fin set. The casing has a first hole and a second hole. The heat transfer plate and the heat dissipation fin set are disposed in the casing. The heat dissipation fin set includes heat dissipation fins, and a diversion portion of at least one of the heat dissipation fins is aligned to the first hole and the second hole. The docking station includes a body and a fan. The body has a third hole. The fan is disposed in the body. When the machine body is assembled to the docking station, an air flow generated by the fan flows into the casing via the third the first holes, and the air flow is divided into two flows by the diversion portion.

Abstract: A heat sink assembly includes a base block having a straight mounting groove on the middle and two U-shaped mounting grooves at two opposite lateral sides, cooling fins installed in the top wall of the base block, each cooling fin having multiple tight-fit mounting holes, a U-shaped heat pipe having a lower segment peripherally press-fitted into the straight mounting groove in flush with the bottom wall of the base block and an upper segment tightly inserted into one respective tight-fit mounting hole of each cooling fin, and two symmetrical, curved heat pipes with respective U-shaped lower segments thereof respectively and peripherally press-fitted into the U-shaped mounting grooves in flush with the bottom wall of the base block and respective upper segments thereof tightly inserted into respective tight-fit mounting holes of each cooling fin. Thus, heat can be drawn upwards from a heat source and evenly distributed through the cooling fins.

Abstract: An electronic device is disclosed. The electronic device includes a chassis and at least one plugin unit mounted in the chassis. The plugin unit includes a substrate, a heat receiving member, a radiator, and a heat transfer member. The substrate mounts a first electronic component and a second electronic component having a higher heat release value than the first electronic component. The heat receiving member receives heat by contacting the second electronic component. The radiator is shaped as a duct. The heat transfer member transfers the heat from the heat receiving member to the radiator. The chassis includes a fan that generates air-current inside the radiator and on one or more component mounting surfaces of the substrate.

Abstract: Enhanced cooling for electronic components within a computing device is provided. Blowers are preferably leveraged as air movers, and an airflow deflection surface (preferably configured as a ramp) is disposed within a plenum to guide airflow under an electronic component (such as a hard disk drive or solid state drive), the electronic component being placed in an inverted alignment whereby a surface having a higher heat transfer rate is facing down (toward the blower), and then into an intake of the blower. Air output from the blower may then pass into a downstream plenum formed at least in part by the blower, an inverted downstream electronic component, and a support member thereof, thus providing serial cooling of the downstream component. Anti-recirculation flaps are preferably disposed at the air output of the blower.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

Abstract: An apparatus, comprising a linecard including a circuit board having a front side connectable to a pluggable optical module and a back side opposite the front side; a heat relay apparatus comprising a heat pipe on the circuit board; a pluggable optical module generating a first amount of heat and being in thermal contact with the heat pipe; and a cooling module including a heat sink in thermal contact with the heat pipe, the cooling module generating a second amount of heat in a range from the first amount of heat to no heat; and wherein heat from the pluggable optical module is transferable through the heat pipe to the cooling module for dispersal from the heat sink.

Abstract: A power conversion device includes a casing, an isolation wall, a first circuit board unit, a converter module, a coolant channel base plate, a circuit board plate and a top cover. The casing includes a base plate which has a base surface and a recessed space. The isolation wall partitions the recessed space into a circuit board accommodation space and a coolant channel. The isolation wall has a circuit board subsidiary wall and a coolant channel subsidiary wall. The circuit board subsidiary wall and the coolant channel subsidiary wall have a height difference. The first circuit board unit is located in the circuit board accommodation space. The converter module is located opposite to the recessed space. The coolant channel base plate fluidly seals the coolant channel. The circuit board base plate seals the first circuit board unit. The top cover seals the converter module.

Abstract: A cooling device for cooling at least two power electronic devices by a working fluid. The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement with a heat dissipator portion of the Pulsating Heat Pipe circuit system and a plurality of fins thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion.

Abstract: A method provides a service mode within a direct-injection liquid-cooled (DL) Rack Information Handling System (RIHS) having at least one liquid-cooled (LC) node. The method includes: in response to detecting selection of the service mode trigger, transmitting a first control signal to cause a proportional valve to move to an open position for enhanced cooling of the node; monitoring a temperature being sensed in the node; and in response to the temperature reaching a pre-established service mode temperature: forwarding a second control signal, to cause the proportional valve to move to a fully closed position; and generating a notification of an entry of the RIHS into a service mode during which an LC node can be re-engaged with the supply and return port, without affecting an operational on-state of the RIHS and without incurring significant hydraulic pressure when re-engaging the LC node with the liquid cooling system.

Abstract: An external function extension device includes a casing, a transition circuit board, a liquid cooling system, at least one connecting member and a power supply unit. The transition circuit board, the liquid cooling system and the power supply unit are disposed in the casing. The transition circuit board has a transition slot. The connecting member is connected to the liquid cooling system. The connecting member is used for connecting an external device, such that the liquid cooling system performs liquid cooling function for dissipating heat of the external device. The power supply unit is electrically connected to the transition circuit board and the liquid cooling system. The power supply unit includes an electric connector. The electric connector is used for connecting the external device, such that the power supply unit supplies power to the external device.

Abstract: According to an embodiment of the present invention, a composite sheet includes a shock mitigating layer including an elastic member and a graphite layer accommodated in the elastic member, a first heat dissipation sheet configured to be attached to one surface of the shock mitigating layer, and a second heat dissipation sheet configured to be attached to another surface of the shock mitigating layer.

Abstract: An apparatus includes a heat exchanger with a body having a passage through the body. The passage defines apertures on multiple sides of the body, and the passage is configured to allow optical signals to pass through the body. One or more tapered edges are at least partially around one or more of the apertures, and each tapered edge is configured to reflect optical radiation inward into the passage. One or more absorptive surfaces are within the passage, and the one or more absorptive surfaces configured to absorb the reflected optical radiation. The heat exchanger is configured to convert the absorbed optical radiation into heat, and the body further includes one or more cooling channels configured to receive coolant that absorbs the heat.

Abstract: Disclosed embodiments include a structurally integrated thermal management system that uses the structure of an aerospace vehicle as part of the heat dissipation system. In this system, structural elements of the aerospace vehicle function as a thermal bus, and are thermally connected with heat-generating electrical components, so that heat from those components is directed away from the component by the structure of the vehicle itself, into lower temperature surfaces of the vehicle.

Abstract: A capillary flow valve for use in a two phase heat transfer system such as a loop heat pipe, including an inlet port for receiving working fluid in a vapor-phase, an outlet port for outputting working fluid in a vapor-phase, and a porous wick material extending across the interior of the valve. Heating the wick evaporates liquid-phase working fluid from the wick and allows the vapor-phase working fluid to pass through the wick to the outlet port. Removing the heat allows liquid to condense in the wick, preventing flow of the vapor-phase working fluid through the wick to the outlet port.

Abstract: The fan includes an impeller, a motor, and a housing. The housing includes a side wall portion and a lower plate portion. at least one of the lower plate portion and an upper plate portion arranged to cover an upper side of the impeller includes an air inlet. The upper plate portion, the side wall portion, and the lower plate portion are arranged to together define an air outlet on a lateral side of the impeller. At or near an opposite end of the heat pipe, the heat pipe includes a contact portion arranged to be in contact with one of an upper surface of the lower plate portion and a lower surface of the upper plate portion. A longitudinal direction of at least a portion of the heat pipe extends at an angle with respect to the air outlet.

Abstract: An electronic device includes an outer housing having an upper enclosure and a foot coupled thereto, a heat generating component, and a fan assembly integrated into the foot and situated proximate a bottom surface of the heat generating component. The foot can include inlet and outlet vents. The fan assembly can include an inlet, outlet, impeller with blades, shroud and fin stack. The electronic device can also include a heat pipe, a heat transfer stage, a PCB, and a bottom shield. Airflow through the electronic device can be directed across the fin stack, heat pipe, heat transfer stage, and bottom shield. Airflow can occur over a substantially level path through the electronic device from the inlet to outlet vents.

Abstract: A heat dissipating system for a data center includes a data center and an air processing unit. The data center includes an enclosure and an electronic device, and defines a first air vent and a second air vent. The air processing unit includes a case and an air processing device. The case defines a first air inlet, a second air inlet, and a first air outlet. At least one air inlet damper is mounted on the case, and a first return air damper is mounted in the case. The data center can adjust cooling based on ambient temperature through the air inlet damper and the first return air damper.

Abstract: A display device includes a plate-shaped display unit; a mounting unit disposed on a back surface side of the display unit, a direction normal to a back surface of the display unit being a thickness direction of the mounting unit; an erect portion that erects towards the back surface side of the display unit along a lateral side of the mounting unit, the erect portion protruding towards a display unit side in a greater manner than the mounting unit; and a plate material that opposes the back surface of the display unit and that is interposed between the display unit and the erect portion.

Abstract: Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.

Abstract: An integrated mounting and cooling apparatus includes a housing body having a first mounting surface configured to receive electronic components to be cooled and a heat dissipation channel extending through the housing body under the first mounting surface. An array of cooling fins is disposed in the heat dissipation channel. The apparatus is configured to serve as a mounting surface for the electronic components, as a housing for the electronic components, and a heat-sink to cool the electronic components.

Abstract: An electronic device shell can be configured to compactly receive at least one expansion card. The electronic device shell comprises a bottom plate, a front plate connected with a front end of the bottom plate, and a rear plate connected with a rear end of the bottom plate. The front plate is recessed away from the rear plate to form a first lead portion. The expansion card is located on the bottom plate and between the front plate and the rear plate. One end of the expansion card is secured on the rear plate, and the other end of the expansion card is received in the first lead portion.

Abstract: An oil-cooled gas compressor provided with a compressor body, an oil separator that separates out oil from a compressed gas, a gas pipe for sending the compressed gas, from which oil has been separated out by the oil separator, to a user, and an oil pipe for returning, to the compressor, the oil separated out by the oil separator. An air-cooled heat exchanger for cooling the aforementioned oil, a controllable-speed cooling fan for blowing cooling air at said air-cooled heat exchanger, and a waste-heat-recovery heat exchanger, provided upstream of the air-cooled heat exchanger, for recovering heat from the oil flowing through the abovementioned oil pipe, are also provided. The speed of the cooling fan is controlled so as to bring the temperature of the compressed gas discharged from the compressor body to within a prescribed range.

Abstract: A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.

Abstract: Methods and apparatus relating for direct attach dock cooling leveraging Maximum Silicon Junction Temperature (Tj) control are described. In an embodiment, performance of a mobile computing device is increased based at least in part on an indication that the mobile computing device is coupled to a dock. The dock includes a cooling fan proximate to a hotspot on a back skin of the mobile computing device. Other embodiments are also disclosed and claimed.

Abstract: The invention relates to a circuit arrangement of a phase leg of a three-point converter. A circuit arrangement of a three-point converter is provided that is optimised with regard to the suppression of parasitic inductance, and at the same time has a compact simple construction, so that the converter can be incorporated in a electrical enclosure in a space-saving and installation friendly manner.

Abstract: A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.

Abstract: A method includes performing operations as follows on a processor: receiving a geographic reference signal, generating location information responsive to the geographic reference signal, defining a portion of a floor surface area of a data center based on the location information, specifying a usage status of the portion of the floor surface area of the data center, and updating a floor plan of the data center based on the usage status of the portion of the floor surface area.

Abstract: Disclosed is a water cooling system for a circuit board with heat generating components. The water cooling system includes a fin module, a water block, a liquid guiding tube and a fan. The fin module is installed on the circuit board and has a through hole; the water block is clamped between the fin module and the circuit board and has a side thermally coupled to the heat generating components, and further has a liquid inlet end and a liquid outlet end; the liquid guiding tube communicates with the liquid inlet end and the liquid outlet end and passes and is fixed into the through hole and thermally coupled to an inner wall of the through hole; and the fan is configured to be corresponsive to the fin module. Therefore, the water cooling system has the advantages of reduced volume and high cooling efficiency.

Abstract: A method of extruding a component includes: creating a first design of a component, wherein in the first design the component comprises a member and is configured for an implementation; adding at least one radial fin to the member in the first design, the member and the radial fins being a second design of the component; extruding a piece that conforms to the second design and has at least one extruded radial fin; and altering the extruded radial fin on the extruded piece, the alteration adding or enhancing a structural property of the component in the implementation.

Abstract: A heat pipe fixing structure includes a heat pipe, a carrier body and a first fixing member. The heat pipe has a main body having a first side and a second side. The carrier body has a channel having an open side and a closed side. The heat pipe is disposed in the channel with the first and second sides respectively corresponding to the open side and the closed side. The first fixing member is disposed on upper side of the heat pipe and upper side of the carrier body. A free end of the first fixing member is in corresponding contact with the first side of the heat pipe to press and abut against or engage with the heat pipe. The heat pipe fixing structure serves to firmly fix the heat pipe to eliminate the shortcomings existing in the conventional welding process for fixing the heat pipe.

Abstract: A light source that utilizes light emitting diodes that emit white light is disclosed. The diodes are mounted on an elongate member having at least two surfaces upon which the light emitting diodes are mounted. The elongate member is thermally conductive and is utilized to cool the light emitting diodes. In the illustrative embodiment, the elongate member is a tubular member through which a heat transfer medium flows.

Abstract: A light source that utilizes light emitting diodes that emit white light is disclosed. The diodes are mounted on an elongate member having at least two surfaces upon which the light emitting diodes are mounted. The elongate member is thermally conductive and is utilized to cool the light emitting diodes. In the illustrative embodiment, the elongate member is a tubular member through which a heat transfer medium flows.