Abstract: A heat dissipation component includes a plate that presses a heat receiving portion against a heat generating portion, and a heat pipe installed at a first surface side of the plate to be in contact with the heat receiving portion, wherein the plate has a shape of an equilateral triangle in plan view from a normal direction of the first surface of the plate, an outer circumferential portion of the plate, except for a portion between each two vertexes of the equilateral triangle, is bent to the first surface side of the plate, and the heat pipe extends to an outside of the plate through a non-bent portion in the outer circumferential portion of the plate.

Abstract: An electronic assembly comprises a heat-generating semiconductor device that has a first side and a second side opposite the first side. An evaporator stack has a floor and a hollow body. The evaporator stack overlies the first side of the semiconductor device. The heated floor can convert a liquid-phase of a coolant (e.g., refrigerant) into a gas-phase of the coolant. A condensation container is in communication with the evaporator stack and is arranged to receive a gas-phase of the coolant. The condensation container is configured to convert the received gas-phase of the coolant into a liquid phase to replenish the liquid-phase coolant for interaction with the floor of the evaporator stack.

Abstract: Techniques of managing heat within an electronic device involve routing a flexible cable or a set of flexible cables within the electronic device to deliver heat to desired locations within the electronic device. Advantageously, it is possible to distribute heat uniformly while using existing components, thus not adding significantly to cost. Furthermore, the flexible cables may be routed in any way that accomplishes it goals of distributing heat and/or electricity.

Abstract: Provided is a cooling device, a power conversion device, and a cooling system in which bubbles produced by boiling in the cooling device are inhibited from flowing out of the cooling device, and thus, vibration, noise, and damage to pipes and other components can be prevented. A cooling device according to the present invention includes a housing having a hollow interior, the housing having a refrigerant inlet from which refrigerant flows in and a refrigerant outlet from which the refrigerant flows out, and having, in the hollow interior, a refrigerant flow path through which the refrigerant flows, and an opening body provided in the housing, dividing the refrigerant flow path into a first area including a heating surface being at least one of a bottom surface and side surfaces of the housing and heating the refrigerant, and a second area including the refrigerant outlet, and having a plurality of openings.

Abstract: A portable electronic device includes a body and a display device connected to the body. The display device includes a display panel, an optical module, and a heat dissipation module including a vapor chamber and a light-emitting module. The vapor chamber has flow channels extending from a bottom side to a top side of the vapor chamber and working fluids capable of displacement therein. The light-emitting module is disposed at the bottom side. A rear frame element of the display device has a front bezel onto which the display panel is embedded and a rear receptacle. The front frame element is coveringly disposed at the rear frame element and presses against the display panel. First screwing elements screw the vapor chamber and the rear frame element together. Second screwing elements screw the vapor chamber, the front frame element, and the rear frame element together sequentially.

Abstract: A closure (100) facilitates upgrading a network to extend optical fibers closer to, or all the way to, the subscribers by facilitating the transition between optical signals to electrical signals. The closure includes a base (110) and a cover (120) defining an interior; and a circuit board (130) disposed within the interior. A management tray (140) can be coupled to the base. The circuit board (130) includes the optoelectronic circuitry. The management tray (140) includes a platform (141) disposed between the circuit board (130) and the cover (120). Various types of fiber and electrical cable sub-assemblies (160) can be received at a port (113) defined in the closure.

Abstract: Provided is a power conversion apparatus that has a simple drain structure of coolers without increasing a size of the power conversion apparatus. The power conversion apparatus includes a housing equipped with a first cooler and a second cooler. One of the first and second coolers has a plurality of coolant openings. The other cooler is constituted by a plurality of members that are connected to each other. The housing includes a plurality of first sealing portions for sealing connecting portions of a plurality of connecting coolant passages that connect to the coolant openings, and second sealing portions for sealing connecting portions between the members. Each of the sealing portions has a first sealing member, a second sealing member, and a drain opening. The drain openings merge into a single drain exit.

Abstract: An LD module cooling device includes, in a cooling plate, common flow paths that supply/drain a cooling medium in parallel to/from a plurality of cooling portion flow paths that correspond to a plurality of LD modules, in which the cooling portion flow path is a thin layer flow path having a flow path height and a flow path width that are constant in at least a majority of a flow path length, a rectangular shape of the cooling portion flow path defined by the dimensions flow path length×flow path width overlaps with at least the majority of a main contact surface between the cooling plate and the LD modules as viewed from a front surface of the cooling plate, the flow path height of the cooling portion flow path satisfies at least either one of a condition that flow path height is 1/20 or less of the flow path length and the flow path width, and a condition that the flow path height is 0.

Abstract: A marine subsea data vessel includes a plurality of server boards, in certain embodiments forming a carousel, coupled with a heat exchanger. The heat exchanger operates to extract heat and transfer the heat to seawater entirely surrounding the marine subsea data vessel. The heat transfer may be through the outer shell of the vessel, or via an external heat exchanger, or both. Various heat exchanger configurations provide additional heat transfer efficiency. The subsea data vessel may be clustered providing additional advantages. The subsea data vessel may be powered via a variety of power sources.

Abstract: Chip packages and electronic devices are provided that include a thermal capacitance element that improves the operation of IC dies at elevated temperatures. In one example, a chip package is provided that includes an integrated circuit (IC) die, a lid thermally connected to the IC die, and a thermal capacitance element thermally connected to the lid. The thermal capacitance element includes a container and a capacitance material sealingly disposed in the container. The capacitance material has a phase transition temperature that is between 80 and 100 percent of a maximum designed operating temperature in degrees Celsius of the IC die.

Abstract: A cooling mechanism includes a plurality of support stands which is provided in a vertical direction over a plurality of stages in an atmospheric transfer chamber where a down-flow is formed, a plurality of support pins which is provided in each of the support stands and supports a target object in contact with the backside of the target object. The cooling mechanism further includes a plurality of air guide plates which is provided in the support stands and cools the target object supported by the support stand located at a lower stage using the down-flow.

Abstract: Systems and methods for thermal management for telecommunications enclosures are provided. In one embodiment, a method for thermal management for modular radio frequency (RF) electronics housed within an electronics enclosure comprises: distributing heat generated from an RF electronics component installed on a first thermal region of an electronics module base plate across the first thermal region using at least one primary heat pipe that laterally traverses the first thermal region; distributing heat generated from the RF electronics component to a second thermal region using at least one secondary heat pipe not parallel with the at least one primary heat pipe; conductively transferring heat across a thermal interface between the electronics module back-plate and a backplane of an electronics enclosure that houses the electronics module, wherein the backplane comprises a plurality heat sink fins aligned with the at least one primary heat pipe and the at least one secondary heat pipe.

Abstract: A fluid heat exchange apparatus including a casing, and a heat-dissipating device is provided. The casing includes a chamber, an inlet, and an outlet. The chamber includes a first channel including a first entrance and a first exit and a second channel including a second entrance and a second exit. The cross-sectional area of the first channel decreases from the first entrance to the first exit and the cross-sectional area of the second channel decreases from the second entrance to the second exit. The heat-dissipating device is located between the first exit and the outlet. A first fluid flows from the inlet and flows through the first channel and the heat-dissipating device and then flows to the outlet. Part of the first fluid flowing through the heat-dissipating device absorbs heat and forms bubbles moving to the second channel and then forms a second fluid converging into the first channel.

Abstract: A substrate dry cleaning apparatus, a substrate dry cleaning system, and a method of cleaning a substrate are disclosed. The substrate dry cleaning system includes a substrate support and a reactive species generator. The reactive species generator includes a first conduit defining a first flow channel that extends to an outlet of the first conduit, the outlet of the first conduit facing the substrate support, a first electrode, a second electrode facing the first electrode, the first flow channel disposed between the first electrode and the second electrode, a first inert wall disposed between the first electrode and the first flow channel, and a second inert wall disposed between the second electrode and the first flow channel.

Abstract: An electrical communications apparatus includes a support structure having a support heat transfer member. An electrical unit is received within the support structure. The electrical unit includes a module side defining a bore therethrough. The module side is arranged to receive an electrical module within the bore. The electrical unit further includes a conduction side adjacent the module side and a unit heat transfer member coupled to the conduction side. The unit heat transfer member and the support heat transfer member are correspondingly tapered to facilitate slidably coupling the unit heat transfer member and the support heat transfer member.

Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

Abstract: A portable electronic device includes a host module having a housing with an accommodation space, a display module and a lift structure. The display module is pivotally connected to the housing by a shaft. The lift structure includes a bottom cover covering the accommodation space, a swing member and a follower member. The bottom cover includes an abutment portion including an abutment surface and located on an end surface of the bottom cover adjacent to the accommodation space. The swing member is in the accommodation space and connected to the shaft. The swing member moves with the display module. The follower member connects to the swing member and contacts the abutment surface. The follower member moves in a first direction according to swinging of the swing member, therefore the follower member abuts against the abutment surface and the bottom cover moves in a second direction to lift up the housing.

Abstract: An optical transceiver cooling assembly includes stacked cages mounted to a PCB. A heat radiator also is mounted on the PCB. Cooling devices (e.g., heat pipes) are coupled to the heat radiator and at least one of the cages. In some embodiments, the cages may include a divider that extends beyond the cage and is coupled to at least one of the cooling devices outside the cage. In some embodiments, the cooling devices extend into the cage and may be coupled together.

Abstract: A blank cartridge includes an impedance portion to control a flow of cooling media through the blank cartridge to a plurality of computing components, and an actuator to change an impedance level of the impedance portion. The actuator receives a control signal to change the impedance level of the impedance portion based on a location of the plurality of computing components relative to the blank cartridge.

Abstract: A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.

Abstract: An electronic device case with a thermal dissipation system is disclosed. The electronic device case is configured to draw heat out of an electronic device disposed therein. The electronic device case includes a connector plug configured to engage a connector receptacle of the electronic device. The thermal dissipation system includes a thermally conductive pathway that both transfers heat to a heat spreader and electrically couples the electronic device to an electrical component within the electronic device case.

Abstract: A half bridge circuit includes an input connection configured to supply an electric input, an output connection configured to supply an electric output to a load to be connected to the output connection, a switch and a diode arranged between the input connection and the output connection and a voltage limiting inductance arranged in series between the switch and the diode. The voltage limiting inductance is configured to limit, upon switching the switch, a maximum voltage across the switch to below a breakdown voltage of the switch. A corresponding method of operating the half bridge circuit and package are also described.

Abstract: The disclosed apparatus may include (1) a cage that houses at least one field-replaceable electronic module that, when operational, emits heat within a computing device, wherein the cage comprises (A) a front entry side that facilitates installation of the field-replaceable electronic module and (B) a back side that is located opposite the front entry side, (2) a heatsink that removably interfaces with the field-replaceable electronic module when the field-replaceable electronic module is installed in the cage and (3) a spring mechanism that (A) is coupled to the back side of the cage and (B) applies force to the heatsink such that the heatsink (I) is pressed against the field-replaceable electronic module and (II) establishes thermal contact with the field-replaceable electronic module to facilitate heat transfer from the field-replaceable electronic module to the heatsink. Various other apparatuses, systems and methods are also disclosed.

Abstract: The disclosure discloses a device for terminal heat dissipation and a mobile terminal, including: a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid; and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield.

Abstract: An electronic device for a vehicle includes a metal tubular casing extending longitudinally and opening at its two ends, and a wall having a curved profile with cooling fins on its outer surface. The electronic device includes an assembly of printed circuit boards comprising a first plurality of printed circuit boards that include heat-generating electronic components. The printed circuit boards of the assembly are connected together by flexible conductive elements. The device further comprises a first heat sink arranged inside the tubular casing comprising a curved wall generally extending parallel to the curved wall of the tubular casing. The first plurality of printed circuit boards is interposed between the curved inner surface of the wall of the casing and the curved wall of the first heat sink so heat is dissipated through the first heat sink and through the curved wall equipped with cooling fins of the tubular casing.

Abstract: An outdoor unit according to the present invention includes: a casing; and a heat exchanger accommodated in the casing. The casing includes a bottom panel on a bottom surface of the casing. The bottom panel includes: a first bottom plate portion formed below the heat exchanger; and a second bottom plate portion formed on the bottom panel at a portion other than the first bottom plate portion. A lower end of the heat exchanger is arranged at a position above any point on an upper surface of the first bottom plate portion and below any point on an upper surface of the second bottom plate portion.

Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Abstract: The purpose of the present invention is to more efficiently cool exhaust heat, of an apparatus or the like that emits heat, by preventing a situation where a gas-phase medium is cooled and turns into a liquid-phase medium and thereby transfer of the gas-phase medium is hindered. For this purpose, a cooling system includes a heat receiving means for receiving a gas heated by heat emitted by an electronic apparatus and changing a liquid-phase heat medium into a gas-phase heat medium. a heat radiation means for cooling the gas-phase heat medium so as to be changed into the liquid-phase heat medium. a first transfer means for transferring the gas-phase heat medium from the heat receiving means to the heat radiation means. and a second transfer means for transferring the liquid-phase heat medium from the heat radiation means to the heat receiving means. wherein at least part of the first transfer means is heated by the heat emitted by the electronic apparatus.

Abstract: The invention relates to a cooling circuit system, comprising a plurality of juxtaposed racks; a double bottom consisting of double bottom elements mounted on a base bottom on which double bottom the racks are mounted; electric or electronic components to be cooled, which components are accommodated in the racks; and a cooling system, the components of which are accommodated in the double bottom, wherein the cooling system comprises fans that are connected in parallel and that blow cooled air from the double bottom towards the juxtaposed racks. The invention relates also to a method of controlling a cooling circuit system of that type.

Abstract: A method of apparatus for immersion cooling electronic equipment including immersing the electronic equipment in a pressure-sealed tank containing a heat transfer fluid and including a vapor space fluidicly coupled to a condenser; operating the electronic equipment to generate heat and evaporate some of the heat transfer fluid, causing heat transfer fluid vapor to enter the condenser; condensing the heat transfer fluid vapor in the condenser to produce a condensate; returning the condensate to the tank; and increasing power consumption to increase heat generated by the electronic equipment and develop an increased pressure of the heat transfer fluid vapor to bring the apparatus into an equilibrium condition.

Abstract: A motor controller is provided including a motor controller housing an air inlet and an air outlet. A plurality of heat generating elements is disposed within the motor control housing. A cooling system includes a cooling device having a fluid sealed therein arranged within the motor control housing. The plurality of heat generating elements is cooled by conduction to the cooling device and by convection from an air flow between the air inlet and the air outlet.

Abstract: A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening, and the connecting channel is communicated between the first outlet opening and the second inlet opening. The first impeller is pivotally arranged in the first rotor chamber, and an outer periphery of the first impeller is arranged corresponding to the first outlet opening. The second impeller is pivotally arranged in the second rotor chamber, and a center of the second impeller is arranged corresponding to the second inlet opening. Accordingly, the first impeller and the second impeller are serially arranged.

Abstract: An example heating apparatus comprises a light emitting diode (LED) array comprising at least one LED to heat a target object. The heating apparatus further comprises a heatsink thermally coupled to the LED array to dissipate heat from the LED array. The heatsink comprises a refrigerant path including an input to and an output from the refrigerant path to pass cooled refrigerant therethrough.

Abstract: A system may include a removable board that is adapted for inserting into and removing from an enclosure, an electronic component that is attached to the removable board, and a cooling system that is attached to the removable board. The cooling system may include a first heat exchanger that is attached to the electronic component by a physical interface. The cooling system may include a coolant pipe that that is at least partially filled with a working fluid to receive heat, generated by the electronic component, via the first heat exchanger. The cooling system may include a second heat exchanger, attached to the coolant pipe and situated to be located outside of the enclosure when the removable board is inserted into the enclosure. The cooling system may be adapted to remain attached to the removable board when inserting and removing the removable board.

Abstract: Electrical systems and devices with substrate interconnections having reduced parasitic inductance are provided. A first substrate includes one or more capacitors and plurality of connection interfaces, wherein a first subset of connection interfaces electrically connected to a first reference voltage are interleaved with a second subset of connection interfaces electrically connected to a different reference voltage. A second substrate includes a third subset of connection interfaces are electrically connected to a first terminal of a first switching element and the first subset of connection interfaces and a fourth subset of connection interfaces electrically connected to a second terminal of a second switching element and the second subset of connection interfaces, and the third subset and the fourth subset are also interleaved.

Abstract: A static synchronous compensator configured to be installed in and provide reactive power to a medium voltage electric distribution system. There is a multi-level cascaded H-bridge (CHB) converter in an enclosure, having a nominal operating voltage in the medium voltage range. There is a first electrical bushing connecting the medium voltage electric distribution system to the input of the CHB converter. There is a second electrical bushing connecting ground or floating ground to the output of the CHB converter. There is a cooling system, which circulates the cooling fluid between in the interior of the enclosure to cool the CHB converter. There is a controller to control the converter to output reactive power at a medium voltage level.

Abstract: A fluid distribution unit for a two-phase cooling system can include a reservoir configured to receive a two-phase flow of dielectric coolant. A first pump can be fluidly connected to a supply line extending from the reservoir. A heat rejection loop can be fluidly connected to the reservoir. The heat rejection loop can include a heat exchanger and a second pump. The second pump can be configured to circulate a flow of single-phase liquid coolant from the reservoir, through the heat exchanger, and back to the reservoir.

Abstract: The present invention relates to a fan device with modular functionality, whereby an output end and input end of the fan are respectively provided with terminal joints. Two connector joints on the I/O module connecting wires are connected respectively to the terminal joints of the output end and the input end of the fan. Therefore, the output/input terminals are modularized by means of the separated wires to reduce the problems of wire trimming.

Abstract: There is disclosed a display device comprising a front case, a display panel spaced apart from the front case to define a first space therebetween, a backlight unit coupled to a rear surface of the display panel, a middle frame spaced apart from a rear surface of the backlight unit to define a second space therebetween, a rear case spaced apart from a rear surface of the middle frame to define a third space therebetween, wherein the rear case is coupled to the front case to enclose the first space, the second space, and the third space such that air is not permitted to flow between the first, second, and third spaces and an exterior of the display device, a closed cooling unit disposed such that air is permitted to flow between the closed cooling unit and the first, second, and third spaces, a closed heat exchange unit disposed at the rear case and configured such that air is permitted to flow between the closed heat exchange unit and the first, second, and third spaces via the closed cooling unit, an open he

Abstract: A motor includes a rotor with a shaft, a stator, first and second bearings supporting the shaft, a bus bar assembly holding the second bearing, a circuit board, a sensor magnet fixed to the shaft, and a rotation sensor which is attached to the circuit board and faces a direction. The bus bar assembly includes a bus bar and a bus bar holder. The bus bar holder includes a cylindrical main body portion including an opening at a second side. The bus bar includes a coil connection portion that protrudes from an inner surface of the main body portion and is electrically connected to a coil of the stator. The end of the second side of the coil connection portion is located at a second side ahead of a surface of a first side of the circuit board.

Abstract: A heatsink with an internal cavity for liquid cooling includes: a first part having a first group of fins extending into the internal cavity; a second part attached to the first part so that the internal cavity is formed, the second part having a second group of fins that extend into the internal cavity and that are configured to fit among the first group of fins; an inlet into the internal cavity on at least one of the first and second parts; and an outlet from the internal cavity on at least one of the first and second parts.

Abstract: The device and system for secure network communications disclosed herein can simultaneously operate one or more secure computing components in a single housing and integrating multiple secure networks. The device can operate networking and other software applications. The disclosed device can have physically and electromagnetically separated computing components in separate enclosures within the device, with physical attributes of the device designed to minimize spurious electronic emissions between enclosures. The device can have one or more shielded covers allowing removal and replacement of computing components within each enclosure. The device can allow simultaneous operations of multiple electromagnetically separated enclosures for multiple secure computers in a single space to integrate multiple secure networks.

Abstract: A heat exchanger includes first, second, and third heat sinks, multiple heat pipes located within the heat sinks, and a first aluminum bar located within the heat sinks. The first aluminum bar extends from an outside edge of the first heat sink, through the first, second, and third heat sinks, and to an outside edge of the third heat sink.

Abstract: A controller structure is applied to electrically conduct at least one LED light string and contains: a control box, a high voltage circuit unit, and a lid. The control box includes an opening, a hollow accommodation portion, two pins, and a first fitting portion. The high voltage circuit unit is accommodated in the hollow accommodated portion and includes an input segment and an output segment, a positive-electrode contact and a negative-electrode contact of the input segment are electrically connected with the two pins, a positive-electrode contact and a negative-electrode contact of the output segment are electrically connected with at least two power wires, and the high voltage circuit unit further includes a control unit. The lid covers the opening and includes a socket and a connection portion which is electrically connected with the output segment of the high voltage circuit unit via the at least two power wires.

Abstract: A Rack Information Handling System (RIHS) has a liquid-to-liquid heat exchanger (LTLHE) that is received in a rear section of a rack and includes node-receiving supply port/s and return port/s. LTLHE includes a first liquid manifold extending between the node-receiving supply port/s and the node-receiving return port/s. LTLHE includes a second liquid manifold capable of being in sealed fluid connection to a supply conduit and a return conduit of a liquid cooling supply for fluid transfer of a second cooling liquid. LTLHE includes a transfer plate formed of thermally conductive material separating the first and second liquid manifolds for transferring heat from the first cooling liquid to the second cooling liquid. RIHS includes a node-receiving chassis configured to receive inserted liquid cooled nodes that sealingly engage for fluid transfer of the first liquid to LTLHE embedded in the rack for heat absorption and transfer by the second liquid.

Abstract: An engagement fan includes a fan base, a cover plate and a fan base plate. The fan base has an opening at the bottom surface thereof. The rim of the opening is disposed with at least one engagement slot and at least one restricting protrusion. The cover plate covers the fan base. The engagement protrusion engages to the corresponding engagement slot such that the fan base plate can be attached to the opening of the fan base.

Abstract: An arrangement for a computer system includes a heat-producing expansion card and a cooling device. The cooling device has at least one fan and a hollow body with a first opening and a second opening to cool the expansion card. The hollow body is arranged with the first opening on the expansion card. The at least one fan is arranged on the hollow body in a region of the second opening or is at least partly surrounded by the hollow body by the second opening. The at least one fan produces a flow of air through the hollow body to cool the expansion card.

Abstract: An information handling system (IHS), peripheral component interface (PCI) system and method for expanding PCI nodes in an IHS. The PCI system includes a primary PCI node. The primary PCI node has a PCI switch communicatively coupled to a processor via a system interconnect. The PCI switch is communicatively coupled to several PCI devices. A communication module is communicatively coupled to the PCI switch. A PCI expansion node is communicatively coupled to the primary PCI node via a PCI bus and a sideband bus. The IHS executes firmware that enables expansion of the IHS by configuring the primary PCI node to recognize the one or more interconnected PCI expansion nodes and integrate the functions of the interconnected PCI expansion nodes into an expanded PCI subsystem. The primary PCI node and PCI expansion node can be substantially identical IHSs, having the same motherboards and chassis.

Abstract: A thyristor assembly radiator for a DC converter valve. A water discharging port of an Nth radiator is communicated with a water discharging port of an (N?2)th radiator. A water feeding port of the Nth radiator is communicated with a water feeding port of an (N+2)th radiator. Or, a water feeding port of the Nth radiator is communicated with a water feeding port of the (N?2)th radiator, and a water discharging port of the Nth radiator is communicated with a water discharging port of the (N+2)th radiator. A water discharging port of an Mth radiator is communicated with a water discharging port of an (M?2)th radiator, and a water feeding port of the Mth radiator is communicated with a water feeding port of an (M+2)th radiator, or a water feeding port of an Mth radiator is communicated with a water feeding port of the (M?2)th radiator, and a water discharging port of the Mth radiator is communicated with a water discharging port of an (M+2)th radiator.

Abstract: An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion.