Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

Abstract: To provide enhanced operation of data storage devices and systems, various systems and apparatuses are provided herein. In a first example, a data storage assembly includes an enclosure configured to house at least one data storage device and a fan assembly configured to provide airflow within the enclosure to ventilate the at least one data storage device. A plurality of acoustic waves emanate into the data storage device from one or more fans of the fan assembly during operation. An acoustic attenuation device is positioned within the enclosure and configured to deflect at least a first portion of the plurality of acoustic waves away from the at least one data storage device and absorb a portion of acoustic wave energy of at least a second portion of the plurality of acoustic waves.

Abstract: An apparatus includes: a getter material (310) disposed within a vacuum chamber (210) to absorb stray molecules within the vacuum chamber; a thermal mass (340) disposed adjacent the getter material and in thermal communication with the getter material; a cold station (312) disposed within the vacuum chamber above the thermal mass; and a convective cooling loop (310) connected between the thermal mass and the cold station and configured to convectively cool the thermal mass when the cold station is at a lower temperature than the thermal mass, and to thermally isolate the thermal mass from the cold station when the cold station is at a higher temperature than the thermal mass. The thermal mass may be water ice and may be thermally isolated from the walls of vacuum chamber by low loss support links (360, 362, 364) and/or thermal reflective shielding.

Abstract: Approaches presented herein enable cooling a data center with a cooling system having a relatively high coolant temperature. This cooling system is controlled by a building management system and includes piping through which coolant flows, an air cooling unit in thermal contact with the coolant, and a chiller to cool the coolant to a temperature between 18 and 22 degrees Celsius as instructed by the building management system. The building management system uses a chiller controller to vary the chilling of coolant within a range of 18-22 degrees Celsius, thereby controlling the air temperature within the data center to within a required temperature range. Because the building management system maintains the coolant temperature to 18-22 degrees Celsius, the cooling system can be simplified by excluding typical cooling system components such as variable flow control valves and their controllers. This simplification decreases the need for maintenance and reduces operating cost.

Abstract: A luminaire including a housing made of thermally conductive material having a top, a bottom and two opposite sides connecting the top to the bottom, each side having plurality of external, vertically spaced, substantially parallel cooling fins that extend longitudinally and project laterally outwardly of the housing, preferably at a shallow downward and outward angle. The housing configuration provides a large surface area per unit of housing length to optimize heat dissipation. A configurable, cartridge-like LED bezel assembly—readily replaceable in the field—is supported on the bottom of the housing. A driver for the LED assembly—also readily replaceable in the field—is located within the housing.

Abstract: The present invention discloses a water cooling system for a computer, which includes a radiator, a cooling block in fluid communication with the radiator, and a liquid storage tank in fluid communication with the radiator and the cooling block. The radiator, the cooling block and the liquid storage tank are of an integrated structure. The water cooling system of the invention has an integrated structure which does not require user to assemble the components, thereby avoiding incidents such as liquid leakage. The water cooling system is provided with the liquid storage tank that is at least partially exposed outside a water cooling case, thereby increasing the amount of a cooling liquid, improving the heat dissipating efficiency, enabling a user to easily observe the amount of the cooling liquid, and improving the appearance of the water cooling case.

Abstract: A cooling system for a rotorcraft laser system is provided. The cooling system includes at least one laser carrying component operatively coupling a laser turret and a laser generating assembly. The cooling system also includes at least one fuel line fluidly coupled to a fuel tank containing a fuel. The cooling system further includes a heat exchanger containing a portion of the laser carrying component and the fuel line to transfer heat therebetween to cool the laser carrying component.

Abstract: A power electronics assembly includes a cooling chip having a first subassembly and a second subassembly. The cooling chip includes a first metallization layer and a second metallization layer on a portion of a first surface of the cooling chip, an inlet through a second surface of the cooling chip opposite to the first surface, an outlet through the second surface, and one or more micro-channels extending between and fluidly coupled to the inlet and the outlet. The first subassembly includes a light source coupled to a first electrode and the first metallization layer, which provides a second electrode. The light source is configured to receive an electrical signal and operable to produce light in response to the electrical signal. The second subassembly includes one or more wide band gap semiconductor photonic cores acting as an electric switch positioned to receive the light produced by the light source.

Abstract: The object is to provide a technology capable of enhancing a cooling performance of a semiconductor device. The semiconductor device includes a fin portion including a plurality of projecting portions that are connected to a lower surface of a heat-transfer base plate, a cooling member covering the fin portion and being connected to an inlet through which coolant to flow toward the fin portion flows in and an outlet through which coolant flowing from the fin portion flows out, and a header being a water storage chamber that is provided between the inlet and the fin portion and is partitioned from the fin portion so as to be capable of allowing coolant to flow through from the inlet to the fin portion.

Abstract: Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.

Abstract: A heat dissipation device includes a first fin group, a second fin group, a heat pipe and a base. The base is in thermal contact with a heat source. The heat pipe includes a first pipe part and a second pipe part. The second pipe part is connected with the first pipe part and extended upwardly. The first pipe part is arranged between the base and the second fin group. The second pipe part is penetrated through the first fin group. The distance between a top surface of the first fin group and the base is larger than the distance between a top surface of the second fin group and the base. Since influences of the dissipating area and the wind resistance are taken into consideration, the heat dissipation device has enhanced heat dissipating efficacy.

Abstract: A ganged shielding cage assembly include a plurality of passageways that allows modules to be inserted into the assembly. Walls between the passageways have a heat transfer passages that extends between the front and back ends and allows for coolant to flow through the assembly. Because of the dimensions, heat can be transferred from an inserted module to the walls and then to the coolant flowing through the heat transfer passages.

Abstract: An exemplary battery cell support structure includes a thermal exchange plate, and a plurality of support fins providing a cavity to receive a battery cell assembly. The plurality of support fins extend directly from the thermal exchange plate. An exemplary method of supporting a battery cell within a battery pack includes positioning a battery cell assembly within a cavity provided by a plurality of support fins extending directly from a thermal exchange plate.

Abstract: A heat dissipation device includes a heat dissipation piece, heat conduction plates, a rod piece and a switch. The heat conduction plates are connected to the heat dissipation piece and spaced apart from and arranged parallel to each other so as to define accommodating spaces. Each heat conduction plate has a free end away from the heat dissipation piece, and the free end has a through hole. The rod piece has a first end and a second end opposite to each other, the rod piece penetrates through the through holes, and the second end has a limitation portion. The switch has a cam portion pivoted to the first end. When the switch is pivoted with respect to the heat conduction plates, the cam portion drives the rod piece to move among the through holes, making the limitation portion to press against or be separated from the heat conduction plates.

Abstract: An electric motor inverter includes at least one DC-link capacitor that has contacting layers. The electric motor inverter also includes circuit breakers which are mounted on at least one substrate, and capacitor connecting plates which are attached with first sections to the contacting layers. Second sections of the capacitor connecting plates which are arranged opposite the first sections are attached to the at least one substrate.

Abstract: An air agitator assembly for use with a heat-emitting object, where the air agitator assembly includes a perforated flexible plate confronting and spaced from a portion of the heat-emitting object to define an air space there between and at least one piezoelectric structure located on the perforated flexible plate and operably coupled to a power source.

Abstract: A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

Abstract: A mobile device auxiliary battery is disclosed. The mobile device auxiliary battery can supply electric current to the mobile device. A processing device associated with the auxiliary battery may be wirelessly connected to the mobile device, such as with a Bluetooth interface, and thereby control operational aspects of the battery, including for example control over supplying power to the mobile device. The auxiliary battery may be part of a charging system or kit that includes a uniquely designed separate charger or part of a protective case. In yet another aspect, the protective case may include unitary bumper flexible bumper co-molded to the body of the case and a male connector extending from a nested portion that is adapted to tilt outward from the case to facilitate insertion of the corresponding female port on the mobile device into the connector and into the case.

Abstract: A novel heat sinking technology, uniquely adaptive to LED lighting devices in a generally LED array format containing multiple openings on said heat sink's base portions and optionally fin portions providing “short path cooling” technology. The “short path cooling” technology is thoroughly taught with multiple examples. Also taught, are methods of heat sink area maintenance when said openings are placed on said heat sinks. Indeed, even surface area increases are shown to be possible when multiple openings are placed on said heat sinks. Lastly, other non-LED semiconductor cooling is discussed and illustrated in various figures using said “short path cooling” technology.

Abstract: A printed circuit board includes a substrate base including first and second inner base layers, a plurality of cover base layers, and a screw hole extending from a top to a bottom surface of the substrate base. At least one first cover base layer is disposed on the first inner base layer. At least one second cover base layer is disposed on the second inner base layer. A heat pipe is disposed along an interface between the first and second inner base layers. A ground conductive layer is disposed on at least one of the top surface and the bottom surface of the substrate base at an edge of the screw hole. A first heat dissipating structure is positioned between the top and bottom surfaces of the substrate base. The first heat dissipating structure is connected to the heat pipe and is in direct contact with the ground conductive layer.

Abstract: Systems and methods are provided that may be implemented to electronically link together and cool multiple graphics boards (also known as graphics cards) within an information handling system chassis, such as notebook computer chassis. The multiple graphics boards may be positioned at different levels relative to each other, and may be mounted separate from the main board (e.g., motherboard) in order to achieve a reduced total projective printed circuit board (PCB) area for the combination of the multiple graphics boards and main board. The multiple graphics boards may be stacked on opposite sides of the same thermal cooling module to allow a common thermal cooling module to simultaneously cool a GPU of each of the multiple linked graphics boards, as well as one or more other processors (e.g., central processing units and/or chipsets) mounted to the main board of the system.

Abstract: A passive pre-heater assembly includes a thermally conductive heat-spreading block and a plurality of passive pre-heaters in thermally conductive communication with the heat-spreading block. The plurality of the pre-heaters exchanges heat with the thermally conductive heat-spreading block. Each pre-heater includes a thermally conductive base in thermal communication with the heat-spreading block, and a plurality of thermally conductive fins is in thermal communication with the thermally conductive base. The plurality of fins of each pre-heater exchanges heat convectively with ambient air and conductively with the thermally conductive base of that pre-heater. A given one of the passive pre-heaters further comprises a tube in thermally conductive contact with the thermally conductive base of the given passive pre-heater. The thermally conductive heat-spreading block exchanges heat with a fluid passing through the tube of the given passive pre-heater.

Abstract: An electronics rack comprising a first cage, a first heat sink positioned at a rear and in thermal communication with the first cage, a second cage positioned above the first cage, and a second heat sink in thermal communication with the second cage. In another aspect, the present invention provides an electronics rack comprising a frame, a cage, a heat sink positioned at a rear of the frame, and a compliant thermal collector operatively positioned between the cage and the heat sink. The compliant thermal collector can comprise a heat pipe having a non-linear shape that facilitates flexing of the heat pipe to change the length of the thermal collector. The thermal collector advantageously includes a plurality of heat pipes and a contact bar coupling the plurality of heat pipes. Preferably, the rack further includes an adjusting mechanism (e.g., threaded rods) for adjusting a position of the contact bar.

Abstract: A system for immersion cooling computing system equipment includes a container, a volume of cooling liquid disposed in the container, a computing system equipment holder disposed in the volume of cooling liquid and a liquid-liquid heat exchanger attached to and supported by the computing system equipment holder. The liquid-liquid heat exchanger is disposed in the volume of cooling liquid.

Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.

Abstract: A cooling system includes a chassis defining a housing and including a wall having an outer surface. A computing device is located in the housing. A heat transfer device located in the housing engages the computing device and the wall, providing for heat transfer from the computing device, through the heat transfer device, and through the wall to the outer surface to produce supplemental passive cooling of the computing device via the outer surface. A heat dissipation aperture is defined by the chassis, and a heat dissipation device located in the housing adjacent the heat dissipation aperture engages the heat transfer device, which provides for heat transfer from the heat transfer device to the heat dissipation device. A forced convection device located in the housing generates an airflow past the heat dissipation structure and through the heat dissipation aperture to enable primary active cooling of the computing device.

Abstract: A computing device comprises an air moving device operable to produce an airflow that removes heat from one or more components that are arranged upstream from the air moving device. The airflow corresponds to an acoustic energy signature. The computing device further comprises one or more mechanical drives that are arranged downstream from the air moving device, and a baffle comprising a first surface and an opposing second surface. The baffle is disposed between the air moving device and the one or more mechanical drives. The baffle defines a plurality of perforations extending between the first surface and the second surface, and the plurality of perforations are dimensioned and arranged to mitigate one or more predefined components of the acoustic energy signature of the airflow while permitting a first portion of the airflow to pass through the baffle to remove heat from the one or more mechanical drives.

Abstract: A liquid cooling system for cooling an electronic device comprising a chip or a chip package comprising a chip is described. The liquid cooling system comprises an inlet plenum comprising a coolant feeding channel oriented substantially parallel with the plane of a main surface to be cooled of the chip and a plurality of inlet cooling channels fluidically connected to the coolant feeding channel and arranged vertically for impinging a liquid coolant directly on said main surface of the chip. The vertically oriented inlet cooling channels are substantially parallel to vertically oriented outlet cooling channels and are separated by a thermally isolating material. The liquid cooling system further comprises at least one cavity wherein a plurality of inlet and outlet cooling channels end. The cavity is arranged for allowing interaction between the liquid coolant and the main surface of the chip and thus comprises a heat transfer region.

Abstract: A computer-implemented method controls liquid cooling of a direct injection liquid-cooled (DL) rack information handling system (RIHS). The method includes receiving, at a liquid cooling control subsystem, an incoming cooling liquid supply flow rate corresponding to an incoming cooling liquid supply being supplied to the DL RIHS. A maximum flow rate cap is calculated for each of the LC nodes. The maximum flow rate cap is transmitted to a controller for each of the LC nodes. The controller triggers each of the LC nodes to adjust the associated flow rate for that LC node to correspond to the received maximum flow rate cap for that node.

Abstract: An ultraviolet LED array is provided. The ultraviolet LED array includes a heatsink. The heatsink includes (i) a base heatsink element, and (ii) a thick film layer applied to the base heatsink element. The ultraviolet LED array also includes a plurality of ultraviolet LED elements coupled directly to the thick film layer of the heatsink.

Abstract: Embodiments described herein generally relate to an assembly including a manifold structure. The manifold structure includes a fluid inlet and a fluid outlet. The fluid inlet is for receiving a cooling fluid into the manifold structure and the fluid outlet is for removing the cooling fluid from the manifold structure. The manifold structure also includes a first cooling surface and an opposite second cooling surface. The first cooling surface includes a cooling chip inlet opening fluidly coupled to a cooling chip outlet opening. The fluid inlet is fluidly coupled to the cooling chip inlet opening. The second cooling surface includes a cavity. A first integrated fluid channel fluidly couples the cooling chip outlet opening to the cavity and a second integrated fluid channel fluidly couples the cavity to the fluid outlet. A cooling chip includes a plurality of microchannels, which fluidly couple the cooling chip to the first cooling surface.

Abstract: A ventilation device for electrical panels, comprising a box-like metallic base (10), which is placed on top of an electrical panel and which has at least one lower opening (11) through which flows an air or heat flow (F) coming from said electrical panel, and at least one sheet or laminar element (12), preferably made of plastic material, placed above said box-like metallic base (10); a flap (13) is obtained in at least one portion of said laminar element (12), so that at least one portion of the perimeter of said flap (13) is made in one piece with said laminar element (12) and constitutes a linear fold (16) of said laminar element (12), suitable to allow said flap (13) raising and lowering with respect to said laminar element (12) for opening and closing a corresponding upper opening (15) of the laminar element (12) which is defined by said flap (13).

Abstract: A heat dissipation assembly includes a pressing unit and a heat dissipation module. The pressing unit includes a pressing plate, a plurality of elastic cantilevers and contacting members. The pressing plate can be secured on a bottom plate so that a heat source can be sandwiched between the pressing plate and the bottom plate. The elastic cantilevers are respectively disposed on the pressing plate and protruded outwards from the pressing plate to be suspended in midair. The contacting members are respectively disposed on the elastic cantilevers for abutting the bottom plate. The heat dissipation module is fixedly connected to the pressing plate and a carrier member for thermally guiding the heat source.

Abstract: A method of at least partially filling a gap between adjacent elements in a data center having a hot aisle and a cold aisle to decrease air leakage between the hot aisle and the cold aisle through the gap is provided. The method includes providing a gap filler having a compressible material and an outer layer having an outer surface and an inner surface. The inner surface defines a sealed inner space and the outer layer encapsulates the compressible material in a compressed state within the inner space. The method also includes placing the gap filler in the gap between the adjacent elements in the data center and at least partially releasing a seal within the outer layer to allow air to flow into the inner space of the outer layer to permit the compressible material to expand from the compressed state within the inner space of the outer layer to an expanded state within the inner space of the outer layer, thereby at least partially filling the gap between the adjacent elements in the data center.

Abstract: An air agitator assembly for use with a heat-emitting object having a contour, the air agitator assembly including a perforated flexible structure having a thermally absorbing first side confronting and spaced from a portion of the heat-emitting object to define an air space there between and a second side opposite the first side and where at least a portion of the first side of the perforated flexible structure has a contour that matches a contour of a corresponding portion of the heat-emitting object.

Abstract: A power conversion device includes a main board, an electromagnetic interference filter module, an auxiliary power module, a capacitor group, a main power unit, a control plate, an output bus bar and a fan. A first air channel is formed between the auxiliary power module and the electromagnetic interference filter module. A second air channel is formed between two rows of the capacitor group. A third air channel is formed between the two main power conversion modules of the main power unit. The control plate is perpendicularly installed on the main board. The output bus bar is perpendicularly installed on the main board, arranged in parallel with the control plate and located near the control plate. The fan is located near the main power unit and producing airflow to the first air channel, the second air channel and the third air channel.

Abstract: A massive array antenna apparatus is configured with a cantilevered heat pipe that allows a semiconductive millimeter-wave device to move independently from a heat-sink base during thermal expansion and contraction.

Abstract: A heat sink is provided. The heat sink includes a single-piece housing having a floor and two walls, the walls perpendicular to the floor and the walls are parallel to each other. The heat sink includes the housing having an inlet and an outlet. The housing is configured to attach power modules to an outer surface of the floor and to outer surfaces of the two walls. The housing is configured to cool the power modules in response to fluid flow into the inlet.

Abstract: In a heat spreading module for a portable electronic device configured such that a heat pipe is attached along a metal plate with which a heating element is brought into close contact, and heat of a heated region of the metal plate with which the heating element is brought into close contact is transferred to a place on the metal plate apart from the heated region by the heat pipe, the heat pipe is configured such that a container is formed of a pipe, a portion of the container arranged on the heated region is a heated portion, and a portion of the container apart from the heated region is a heat dissipation portion that dissipates heat to the metal plate, and the heated portion is formed in a flat shape, and the heat dissipation portion is formed to be thicker than the heated portion having the flat shape.

Abstract: An apparatus for cooling an electronic image assembly with ambient gas and circulating gas is disclosed. A first fan may be positioned to force the circulating gas around the electronic image assembly in a closed loop while a second fan may be positioned to cause a flow of ambient gas. A structure is preferably positioned to allow the circulating gas to cross the flow of the ambient gas while substantially prohibiting the circulating gas from mixing with the ambient gas. A pair of manifolds may be placed along the sides of the electronic image assembly and may be in gaseous communication with a plurality of channels placed behind the electronic image assembly. A heat exchanger may be used in some exemplary embodiments.

Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.

Abstract: A fiber distribution hub (FDH) provides an interface between an incoming fiber and a plurality of outgoing fibers. The FDH includes a cabinet, at least one door pivotably mounted to the cabinet, and a frame pivotably mounted within the cabinet. The doors wrap around the sides and the front of the cabinet to provide access to both the front and sides of the frame when the doors are open. The frame can pivot out of the cabinet through the open doors to enable access to the rear of the cabinet and the rear side of the frame. The frame includes a termination region and a splitter region. The frame can include a storage region and/or a pass-through region.

Abstract: A heat sink for cooling an integrated circuit device includes a body having a first side and a second side. A fluid inlet opening is formed in the second side of the body for receiving pressurized fluid from a fluid source. A plurality of impingement openings are formed in the first side of the body. At least one fluid delivery channel is provided and configured to deliver pressurized fluid from the fluid inlet opening to the plurality of impingement openings for generating a plurality of fluid streams expelled from the plurality of impingement openings. A plurality of fluid diverters are formed on the first side of the body and arranged generally between each of the plurality of impingement openings for diverting a flow of fluid around each of the plurality of impingement openings.

Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Abstract: The present invention provides a liquid cooling heat sink device for cooling a heat source. The liquid cooling heat sink device includes a heat conduction module, a liquid supply module, and a liquid guiding module. The heat conduction module includes a vapor chamber and at least one heat conducting column. The vapor chamber has at least one space and one side of the vapor chamber contacts the heat source. The heat conducting column is mounted on one side of the vapor chamber, and the side of the vapor chamber is distal from the heat source. The liquid supply module is mounted on one side of the vapor chamber and has a casing and a pump. The casing has a liquid entrance terminal and a liquid exit terminal out of the casing. The liquid guiding module is mounted on one side of the vapor chamber and a receiving space is formed between the vapor chamber and the liquid guiding module.

Abstract: A cooling device includes a heat sink that includes a plurality of first heat radiating fins and a plurality of second heat radiating fins, and a compressor as a blower that causes cooling air to flow from an inlet toward an outlet of a cooling passage of the heat sink. The cooling device includes in a flow direction of the cooling air that passes via the heat sink a mist supplier arranged upstream of the heat sink and that supplies mist M to the cooling passage of the heat sink.

Abstract: Provided is a flexible heat radiating sheet with high thermal conductivity. The heat radiating sheet includes a resin material and a heat radiating member that extends in the planar direction and has a required thickness. The heat radiating member is bent such that in portions of a thin plate member between adjacent slit rows, projecting portions and recess portions are alternately repeated in the X-axis direction, and a projecting portion and a recess portion that are adjacent in the Y-axis direction are located facing each other. The heat radiating member is entirely buried in the resin material excluding apexes of the projecting portions and the recess portions.

Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.

Abstract: A heat sink is disclosed in which a set of fins dissipates heat, where the heat is conducted from a heat source to two sides of the set of fins by a vapor chamber assembly. In an embodiment, a thin vapor chamber assembly is configured to conduct heat to both the bottom and the top of a set of fins. In an embodiment, a thin vapor chamber assembly is configured to conduct heat to a lower set of fins and also to an upper set of fins.

Abstract: A power electronics module comprises a first liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the first liquid cooler comprises a metal body providing a first terminal of the power electronics module; a second liquid cooler comprising a cooling channel for receiving a cooling liquid, wherein the second liquid cooler comprises a metal body providing a second terminal of the power electronics module; a plurality of semiconductor chips arranged between the first liquid cooler and the second liquid cooler, such that a first electrode of each semiconductor chip is bonded to the first liquid cooler, such that the first electrode is in electrical contact with the first liquid cooler, and an opposite second electrode of each semiconductor chip is in electrical contact with the second liquid cooler; and an insulating encapsulation, formed by molding the first liquid cooler, the second liquid cooler and the plurality of semiconductor chips into an insulation material, such that the fir