Abstract: Nanoimprint molds for molding a surface of a material are provided. A nanoimprint mold includes a body with a molding surface that is formed by shaped nanopillars. The nanopillars may be formed on a substrate and shaped by performing at least a first partial oxidation of the nanopillars and then removing at least a portion of the oxidized material. Once shaped, a hard substance is deposited on the nanopillars to begin forming the molding surface of the nanoimprint mold. The deposition of a hard substance is followed by the deposition of carbon nanotube on the hard substance and then the removal of the substrate and nanopillars from the molding surface.

Abstract: A method for separating a semiconductor from a substrate is disclosed. The method comprises the following steps: forming a plurality of columns on a substrate; epitaxially growing a semiconductor on the plurality of columns; and injecting etching liquid into the void among the plurality of columns so as to separate the semiconductor from the substrate. The method of this invention can enhance the etching efficiency of separating the semiconductor from the substrate and reduce the fabrication cost because the etching area is increased due to the void among the plurality of columns. In addition, the method will not confine the material of the above-mentioned substrate.

Abstract: The present invention relates to a novel printable etching medium having non-Newtonian flow behavior for the etching of surfaces in the production of solar cells, and to the use thereof. The present invention furthermore also relates to etching and doping media which are suitable both for the etching of inorganic layers and also for the doping of underlying layers. In particular, they are corresponding particle-containing compositions by means of which extremely fine structures can be etched very selectively without damaging or attacking adjacent areas.

Abstract: The present invention is generally directed toward a regiofunctional carbon nanotube beam structures and a method the same. The regiofunctional carbon nanotube beam structures contain chemical moieties attached selectively to the ends and/or the sidewalls of the nanotube which differentiate the physico-chemical properties of the nanotube ends from the physico-chemical of the sidewalls to enable directed self-assembly. The method comprises the steps including opening carbon nanotube ends, protecting those ends from sidewall functionalization chemistry by chemically differentiating the open carbon nanotube ends from the nanotube sidewall, functionalizing the sidewalls, functionalizing the ends of the carbon nanotube and attaching crown to ends.

Abstract: The present invention relates to methods for marking a coated substrate. In particular, the present invention relates to methods for marking a coated substantially cementitious substrate in the form of a cementitious building product. The method comprises the steps of treating at least a portion of an uncoated cementitious substrate to form indicia; and applying a surface coating on said cementitious substrate to at least partially cover said indicia such that a marking is formed.

Abstract: An etching composition which comprises at least one organic carboxylic acid compound selected from acetic acid, propionic acid, butyric acid, succinic acid, citric acid, lactic acid, malic acid, tartaric acid, malonic acid, maleic acid, glutaric acid, aconitic acid, 1,2,3-propanetricarboxylic acid and ammonium salts of these acids, a polysulfonic acid compound and water, and an etching process which comprises etching a conductive film comprising zinc oxide as the main component using the etching composition described above.

Abstract: A method for manufacturing a thermal interface material includes the following steps: providing a carbon nanotube array formed on a substrate, the carbon nanotube array having a number of carbon nanotubes and a number of interstices between the adjacent carbon nanotubes; filling a liquid state first base material into the interstices; curing the first base material, thereby achieving a carbon nanotube/first base material composite; dripping a liquid state second base material onto the surface of the carbon nanotube/first base material composite, the first base material melting and flowing out of the carbon nanotube/first base material composite, until the carbon nanotube array being substantially submerged in the second base material; and curing the second base material, thereby achieving a thermal interface material.

Abstract: A method of forming an opening through a substrate includes defining an area on a first surface of the substrate where the opening is to be formed, the area having a center region flanked by edge regions. A top layer having a substantially closed space located over the area is formed on the first surface. Structure for promoting etching of the center region is provided, and the first surface of the substrate is etched in the area. In one embodiment, the method can fabricate an inkjet printhead having a substrate having an ink feed hole formed therethrough and an orifice plate formed thereon. A plurality of particle tolerance elements located over a center region of the ink feed hole promoted etching during the fabrication of the printhead.

Abstract: A process for selectively stripping a coating from a component of a turbomachine, and particularly a coating having a ceramic matrix that contains metallic particles dispersed therein that render the coating more difficult to remove from the component after the component has been subjected to elevated temperatures during operation of the turbomachine. The process generally includes immersing the component in an aqueous solution containing ferric chloride, nitric acid, and phosphoric acid, for a duration sufficient to attack the metallic particles in the coating. The component is then removed from the aqueous solution and its surface rinsed of the aqueous solution. The immersing and removing steps are then sequentially repeated a sufficient number of times to sufficiently attack the metallic particles to enable the coating to be mechanically removed from the component.

Abstract: The invention relates to a method of fabricating an ink jet nozzle. The method includes the steps of depositing and etching a passivation layer on a silicon substrate having drive circuitry and an interlayer dielectric interconnect to form a first sacrificial scaffold. Also included are the steps of depositing heater material over the first sacrificial scaffold and etching said heater material to define a heater element, and depositing and developing a layer of photoresist to define a second sacrificial scaffold defining sidewalls for a nozzle chamber. The method also includes the steps of depositing silicon nitride onto the second sacrificial scaffold to form a roof over the nozzle chamber, and etching a nozzle aperture through the roof down to the second sacrificial scaffold.

Abstract: A method for selectively removing an aluminum-poor overlay coating from a substrate of a component, which as a result of its low aluminum content is highly resistant to a selective stripping solution. The method entails diffusing aluminum into the overlay coating to form an aluminum-infused overlay coating having an increased aluminum level in at least an outer surface thereof. The diffusion step is carried out so that the increased aluminum level is sufficient to render the aluminum-infused overlay coating removable by selective stripping. The outer surface of the aluminum-infused overlay coating is then contacted with an aqueous composition to remove the aluminum-infused overlay coating from the substrate. The aqueous composition includes at least one acid having the formula HxAF6, and/or precursors thereof, wherein A is Si, Ge, Ti, Zr, Al, and/or Ga, and x is from 1 to 6.

Abstract: To reduce and homogenize the thickness of a semiconductor layer which lies on the surface of an electrically insulating material, the surface of the semiconductor layer is exposed to the action of an etchant whose redox potential is adjusted as a function of the material and the desired final thickness of the semiconductor layer, so that the material erosion per unit time on the surface of the semiconductor layer due to the etchant becomes less as the thickness of the semiconductor layer decreases, and is only from 0 to 10% of the thickness per second when the desired thickness is reached. The method is carried out without the action of light or the application of an external electrical voltage.

Abstract: A hollow carbon sphere having a carbon shell and an inner core is disclosed. The hollow carbon sphere has a total volume that is equal to a volume of the carbon shell plus an inner free volume within the carbon shell. The inner free volume is at least 25% of the total volume. In some instances, a nominal diameter of the hollow carbon sphere is between 10 and 180 nanometers.

Abstract: A thin film device, such as an intravascular stent, is disclosed. The device is formed of a seamless expanse of thin-film (i) formed of a sputtered nitinol shape memory alloy, defining, in an austenitic state, an open, interior volume, having a thickness between 0 5-50 microns, having an austenite finish temperature Af below 37° C.; and demonstrating a stress/strain recovery greater than 3% at 37° C. The expanse can be deformed into a substantially compacted configuration in a martensitic state, and assumes, in its austenitic state, a shape defining such open, interior volume. Also disclosed is a sputtering method for forming the device.

Abstract: A liquid within a processing tank is caused to overflow, and the overflowing liquid is circulated by a circulation system. In this process, bubbles are discharged into the liquid within the processing tank. Thus, particles within the processing tank are not only carried along by a flow of the liquid but also attach to the bubbles to be carried with the bubbles outwardly of the processing tank. A dip-type substrate processing apparatus removes the particles within the processing tank in a short time with efficiency.

Abstract: A distributor nozzle for a two-phase charge, to be used in fixed-bed reactors in order to increase the area over which the mixture is dispersed and to make its flow rate the same over the whole area of the bed in the reactor. The device includes a number of fixing bars and a deflector cone frustum. The deflector cones or cone frusta may have more than one angle in order to improve the distribution, and they have a number of apertures or slits and a number of vertical directing elements or a directing cage or frame to direct the stream of the two-phase charge in order to increase the area over which the mixture is dispersed and to make its flow rate the same over the entire area of the bed in the reactor.

Abstract: A coating film removal method for a coated member having a coating film formed over the surface of a substrate is disclosed, which can easily achieve a coating film removal, even for a carbon-based coating film containing carbon as a main component, besides a carbon-based coating film containing a metal element etc. A coated member regeneration method is also disclosed, which removes a coating film from a coated member, and then forms a new coating film over the member, to regenerate the coated member. The coating film removal method is adapted to remove a carbon-based coating film from a coated member (10) including a substrate, and the carbon-based coating film coated on at least a portion of a surface of the substrate while containing carbon as a main component.

Abstract: A method of fabricating a packaging substrate is disclosed. A cladding sheet comprised of a first metal foil, a second metal foil and an etch stop layer interposed between the first and second metal foils is provided. The first metal foil is then patterned into a first circuit trace. An insulating layer is laminated onto the first circuit trace. Thereafter, the second metal foil is patterned into a plurality of bump pads. The etch stop layer that is not covered by the bump pads is stripped off. A solder mask is applied to fill the spacing between the bump pads. A top surface of each of the bump pads is etched to form a bonding aperture in a self-aligned fashion.

Abstract: After a water film is formed on a wafer front surface in a chamber, the water film is supplied sequentially with an oxidizing component of an oxidation gas, an organic acid component of an organic acid mist, an HF component of an HF gas, the organic acid mist, and the oxidizing component of the oxidation gas. As a result, the HF component and the organic acid component provide cleaning effect on the wafer surface, and a concentration of the cleaning components in the water film within a wafer surface can be even.

Abstract: A method of fabricating a liquid crystal display array substrate includes forming a gate wiring line having a gate pad electrode, forming a data wiring line having a data pad electrode, forming a protection layer over the gate pad electrode and the data pad electrode, and positioning etching tapes on the protection layer over the gate pad electrode and the data pad electrode.

Abstract: A superhydrophobic polymer fabrication is provided. According to one method for preparing a superhydrophobic polymer fabrication, the superhydrophobic polymer fabrication can be fabricated quickly and easily, and the superhydrophobic surface can be repeatedly imprinted using a template, so that mass production of the superhydrophobic polymer fabrication over a large area can be economically implemented.

Abstract: A method for reducing the roughness of a free surface of a semiconductor wafer that includes establishing a first atmosphere in an annealing chamber, replacing the first atmosphere with a second atmosphere that includes a gas selected to and in an amount to substantially eliminate or reduce pollutants on a wafer, and exposing the free surface of the wafer to the second atmosphere to substantially eliminate or reduce pollutants thereon. The second atmosphere is then replaced with a third atmosphere that includes pure, and rapid thermal annealing is performed on the wafer exposed to the third atmosphere in the annealing chamber to substantially reduce the roughness of the free surface of the wafer.

Abstract: A method for a repair process includes the steps of subjecting a substrate coated with at least one protective metallic coating to a nitric acid solution and then subjecting the substrate with the at least one protective metallic coating to a hydrochloric acid solution to remove the at least one protective metallic coating from the substrate. The substrate includes about 5 wt %-15 wt % chromium, about 2 wt %-8 wt % cobalt, about 2 wt %-6 wt % tungsten, about 0.5 wt %-2.5 wt % titanium, about 8 wt %-16 wt % tantalum, about 2 wt %-8 wt % aluminum, hafnium in an amount no greater than 1 wt %, and a remainder of nickel.

Abstract: In one aspect, a composition is provided which is capable of removing an insulation material which includes at least one of a low-k material and a passivation material. The composition of this aspect includes about 5 to about 40 percent by weight of a fluorine compound, about 0.01 to about 20 percent by weight of a first oxidizing agent, about 10 to about 50 percent by weight of a second oxidizing agent, and a remaining water.

Abstract: The present invention provides a high strength hot rolled steel sheet raised in Si content, wherein a conversion coating can be formed homogeneously over the entire surface of the steel sheet, no new step is added in the production of the steel sheet, and quality control is also facilitated, comprising, by mass %, C: 0.03 to 0.15%, Si: 0.8 to 3.0%, Mn: 0.5 to 3.0%, P: 0.07% or less, S: 0.01% or less, Al: 0.015 to 0.1%, N: 0.001 to 0.008%, and, if necessary, having Ti, Nb, etc. added, the oxides on the steel sheet surface having an Si concentration of 3.5% or less and an Mn concentration of 3.5% or less. Preferably, the average roughness Ra is 3.0 ?m or less and the pitting due to pickling is an average of 5 or less in 10 ?n side squares. The scale after the hot rolling is washed off by dipping the sheet in a solution having an HCl concentration of 7 to 15% and an Fe ion concentration of 4 to 12% at a solution temperature of 80 to 98° C. for 40 sec or more.

Abstract: A method for making a high-density carbon nanotube array includes the steps of: (a) providing a substrate having a carbon nanotube array formed thereon; (b) providing an elastic film; (c) stretching the elastic film uniformly, and covering the elastic film to the carbon nanotube array; (d) exerting a pressure uniformly on the elastic film, and shrinking the carbon nanotube array and the elastic film under the pressure; and (e) separating the nanotube array from the elastic film to acquire a high-density carbon nanotube array.

Abstract: There are provided simplified methods for etching diamond, as compared to conventional methods. More particularly, the methods disclosed herein involve contacting at least a portion of the diamond with a metal or metal oxide so that redox etching of the contacted portion of the diamond occurs. Also provided are diamonds polished using the present method, as well as optical windows, heat sinks, cutting tools and electrical components incorporating diamonds polished/etched via the disclosed method.

Abstract: A catalyst-aided chemical processing method is a novel processing method having a high processing efficiency and suited for processing in a space wavelength range of not less than several tens of ?m. The catalyst-aided chemical processing method comprises: immersing a workpiece in a processing solution in which a halogen-containing molecule is dissolved, said workpiece normally being insoluble in said processing solution; and bringing a platinum, gold or ceramic solid catalyst close to or into contact with a processing surface of the workpiece, thereby processing the workpiece through dissolution in the processing solution of a halogenide produced by chemical reaction between a halogen radical generated at the surface of the catalyst and a surface atom of the workpiece.

Abstract: A method for chemical modification of graphene includes dry etching graphene to provide an etched graphene; and introducing a functional group at an edge of the etched graphene. Also disclosed is graphene, including an etched edge portion, the etched portion including a functional group.

Abstract: In a method for manufacturing an optical fiber probe in which an optical fiber is formed as an optical fiber probe by etching a tip section and sharpening a core region of the optical fiber, the optical fiber is a polarization maintaining optical fiber including the core region, a stress-applying region, and a clad region. The optical fiber probe is formed by mechanical-grinding of the edge of the optical fiber into a sharpened shape so that the core region is located at the tip of a sharpened portion, and by dipping the formed edge of the optical fiber in an etchant for further sharpening the core region. Accordingly, a new optical fiber probe both with high transmission efficiency and with a large polarization degree is obtained.

Abstract: Method of manufacturing a lead frame wherein a bare lead frame material is immersed in a salt solution. Gas bubbles are provided in the salt solution next to the bare lead frame material such that the bubbles contact a surface of the lead frame material and pop in proximity to the bare lead frame material causing chemical reactions on the surface of the lead frame, thereby forming a plurality of dimples of irregular sizes on the surface of the lead frame.

Abstract: The present invention provides a manufacturing method of a substrate for an ink jet head including forming an ink supply opening to a silicon substrate, including (a) forming, at the back surface of the silicon substrate, an etching mask layer, which has an opening that is asymmetric with a center line, extending in the longitudinal direction, of an area on the surface of the silicon substrate where the ink supply opening is to be formed; (b) forming a non-through hole on the silicon substrate via the opening on the etching mask layer; and (c) forming the ink supply opening by performing a crystal anisotropic etching to the silicon substrate from the opening.

Abstract: An etchant for and method of removing a glass coating on a metallic wire is provided. The etchant comprises an acid solution having metal ions contained therein. The metal ions prevent the acid solution from pitting or damaging the metallic wire, while allowing the acid solution to effectively etch and remove the glass coating. In one embodiment, a fluorine-based acid solution can be used. In another embodiment, a glass coated, metal alloy microwire is etched and the metal ions added to the etchant are chosen to be the same as the majority constituent element in the metal alloy. The glass coating can be either removed in full or only partially removed.

Abstract: An optical element manufacturing method includes: disposing a light-shielding layer (14) that includes at least an Si layer as an uppermost layer, on a substrate (12) used as a base member, forming an optical aperture (14a) at the light-shielding layer (14) and forming a fine recession/projection structure (MR) at a surface of the uppermost layer through dry etching.

Abstract: The present invention is directed to processes for ink jet printing of etchant or modifier materials for creating patterns, particularly for electronics and display applications. The present invention also relates to devices made using the processes.

Abstract: A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition to polishing with a polishing pad for a nickel-containing object to be polished; and a process for preventing clogging of a polishing pad comprising applying a composition comprising a hydrophilic polymer having two or more hydrophilic groups in its molecule and a molecular weight of 300 or more, or a compound capable of dissolving nickel hydroxide at a pH of 8.0, and water to polishing with a polishing pad for a nickel-containing object to be polished.

Abstract: There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed wiring board of machining the via by laser directly through the copper foil of a copper-clad laminate in which the copper foil is clad on a base material resin, a process for machining the via is carried out in a sequence of (a) a copper foil surface treatment step of forming an oxide film on the surface of said copper foil, (b) a laser via machining step, (c) an alkali treatment step and (d) a molten and scattered Cu etching step. It is desirable to carry out (e) a de-smearing treatment after the molten and scattered Cu etching.

Abstract: A single crystal silicon etching method includes providing a single crystal silicon substrate having at least one trench therein. The substrate is exposed to a buffered fluoride etch solution which undercuts the silicon to provide lateral shelves when patterned in the <100> direction. The resulting structure includes an undercut feature when patterned in the <100> direction.

Abstract: The invention concerns etching and doping substances free of hydrochloric/fluoride acid used for etching inorganic layers as well as for doping subjacent layers. The invention also concerns a method wherein said substances are used.

Abstract: Systems and methods for fabrication, delivery, and transfer of carbon nanotubes are provided. In accordance with some embodiments, carbon nanotubes can be grown and then transferred to a surface for carrying grown nanotubes. Grown nanotubes can be formed in a mat of nanotubes that are integrally held together on a film. Grown nanotube mats can be formed as a mat of freestanding carbon nanotubes bound to each other. A method to fabricate transferable carbon nanotubes can include providing a surface to carry carbon nanotubes, applying a removable adhesive on a surface, and locating carbon nanotubes on a surface having the removable adhesive located thereon. A device for holding carbon nanotubes can include a surface for carrying carbon nanotubes, at least one grouping of free standing carbon nanotubes, and a removable adhesive disposed generally between the surface and the at least one grouping of free standing carbon nanotubes. Other aspects, embodiments, and features are also claimed and described.

Abstract: A method for manufacturing carbon nanotubes with a desired length includes the steps of: providing an array of carbon nanotubes; placing a mask having at least an opening defined therein on the array of carbon nanotubes, with at least one portion of the array of carbon nanotubes being at least partially exposed through a corresponding opening of the mask; forming a protective film on at least one exposed portion of the array of carbon nanotubes; removing the mask from the array of the carbon nanotubes, with the carbon nanotubes being compartmentalized into at least a first portion covered by the protective film and at least one uncovered second portion; breaking/separating the first portion from the second portion of the array of the carbon nanotubes using a chemical method, thereby obtaining at least a carbon nanotube segment with a protective film covered thereon; and removing the protective film from the carbon nanotube segment.

Abstract: A method is provided of fabricating a reflective mirror having a reflective surface on which light is incident. This method includes: coating at least one of opposite faces of a plate-shaped etchable material made of a single crystal material, with a film-like etching mask; forming a mask pattern on at least one of opposite faces of the etching mask, the mask pattern having a planar shape to which a circle is more similar than a quadrangle; and wet-etching the etchable material. This method allows the reflective mirror to be fabricated so as to have a silhouette of a planar shape to which a circle is more similar than a quadrangle, when viewed in a direction normal to the reflective surface.

Abstract: Systematic and effective methodology to clean capacitively coupled plasma reactor electrodes and reduce surface roughness so that the cleaned electrodes meet surface contamination specifications and manufacturing yields are enhanced. Pre-cleaning of tools used in the cleaning process helps prevent contamination of the electrode being cleaned.

Abstract: A microwaviness reducing agent for polishing a substrate for a precision part, containing either a surfactant having two or more ionic hydrophilic groups, or a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, or a salt thereof; a polishing composition for a substrate for a precision part, containing the microwaviness reducing agent, an abrasive and water; a polishing composition comprising water, an abrasive, an organic acid or a salt thereof, and a surfactant, wherein the organic acid is a polycarboxylic acid compound having 2 to 15 total carbon atoms and having either OH group or groups or SH group or groups, and wherein the surfactant has two or more ionic hydrophilic groups in its molecule and has a molecular weight of 300 or more; a method of reducing microwaviness of a substrate for a precision part; and a method for manufacturing a substrate for a precision part.

Abstract: A method of fabricating spacers for use in a flat panel device includes: preparing a core glass having a low solubility in a chemical etching solution and a tube glass having a high solubility in the chemical etching solution and having a larger inner diameter than an outer diameter of the core glass; inserting the core glass into the tube glass to obtain a cylindrical glass; drawing the cylindrical glass at a predetermined temperature until the core glass has a predetermined diameter; cutting the drawn cylindrical glass to a predetermined length; and removing the tube glass in the cylindrical glass using the chemical etching solution.

Abstract: A micro movable device includes a base substrate, a fixed portion bonded to the base substrate, a movable portion having a fixed end connected to the fixed portion and extending along the base substrate, and a piezoelectric drive provided on the movable portion and the fixed portion on a side opposite to the base substrate. The piezoelectric drive has a laminate structure provided by a first electrode film contacting the movable portion and the fixed portion, a second electrode film and a piezoelectric film between the first and the second electrode films. At least one of the movable portion and the fixed portion is provided with a groove extending along the piezoelectric drive.

Abstract: The present disclosure provides a method of cleaning a semiconductor substrate after a DRIE etch process, wherein residue from the DRIE process is removed without damaging the substrate. The process may include contacting the micro-fluid ejection head with an aqueous solution of TMAH, stripping a photoresist etch mask from the micro-fluid ejection head, and dissolving a passivating coating from the substrate. Then the substrate may be contacted with an acidic solution. The method may further include rinsing and drying the substrate.

Abstract: A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combination thereof. In one embodiment, the periodic acid is present in an amount in a range of from about 0.05 to about 0.3 moles/kilogram, and the abrasive is present in an amount in a range of from about 0.2 to about 6 weight percent. In another embodiment, the composition further comprises a pH-adjusting agent present in an amount sufficient to cause the pH of the composition to be in a range of from about pH 5 to about pH 10, or of from about pH 1 to about pH 4.

Abstract: A method of treating a surface for the removal of a surface portion comprising irradiating the surface with laser light, wherein the irradiation is effected by covering said surface in a sequential manner with a plurality of discrete spots of laser light. The spots of laser light overlap and may be arranged in a geometric arrangement defined by the locations of the centers of the spots of laser light. The spots of laser light may be applied sequentially.

Abstract: A method and a device for locally removing coatings from components. An absorbent medium supplied with a coating removal liquid is brought into contact with one or more areas of a component from which a coating is to be removed.