Abstract: Stacked semiconductor chip package system vertical interconnects and related methods are disclosed. A preferred embodiment of the invention includes a first semiconductor chip with a surface bearing a plurality of first fusible metallic coupling elements. A second semiconductor chip has a plurality of second fusible metallic coupling elements. The first and second fusible metallic coupling elements correspond at the adjoining surfaces of the first and second semiconductor chips when stacked, and are fused to form a gold-tin eutectic alloy fused metallic coupling vertically interconnecting the stacked chips.

Abstract: Methods and associated structures of forming an indium containing solder material directly on an active region of a copper HIS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.

Abstract: A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the printed wiring board to melt the solder to form a solder circuit. The characteristic feature of this method is that the tackiness-imparted printed wiring board is kept in a liquid, etc at not more than 10° C. before attaching the solder powder.

Abstract: A process for coating a metallic surface with an aqueous composition containing a) as the main component, an organic film former consisting of at least one synthetic resin, 70 to 100 wt. % of the content of synthetic resin(s) in the organic film former comprising at least one water-soluble or/and water-dispersible synthetic resin in the form of polymers, copolymers, block copolymers or/and graft copolymers based on synthetic resins selected from the group consisting of polycarbonate, polyurethane, ionomer, poly(meth)acrylate, polyester, polyether or/and polystyrene, the content of polycarbonate and polyurethane being at least 10 wt. % each, at least one long-chain alcohol as film-forming aid for the organic film former, a crosslinker, a lubricant, and a substance based on silane, silanol or/and siloxane or/and at least one inorganic compound in particle form with an average particle diameter measured on a scanning electron microscope in the range from 0.005 to 0.

Abstract: A method of forming a ball bond (10) includes forming a bonding ball (12) at an end of a bonding wire (16). The bonding ball (12) is preformed to a substantially ball bond shape at a preform location (14) remote from a bonding site (24). The preformed bonding ball (22) is subsequently bonded to the bonding site (24).

Abstract: A coupling apparatus that may have a first component having a first sealing surface and a second component having a second sealing surface. The first and second sealing surfaces are in facing relationship with one another when the first and second components are coupled together. One of the first and second sealing surfaces has a metallic film layer that transforms into a liquefied metal layer when the metallic film layer is exposed to a temperature that exceeds a melting temperature of a metal from which the metallic film layer is formed. The liquefied metal layer forms a seal between the sealing surfaces.

Abstract: This invention relates to a method of brazing while the thickness of the opening between materials being brazed can not be maintained constant or can not be adjusted in the appropriate range. In order to solve this issue the porous material of metals or metal alloys consisting of Ni, Cu, Ti, Al, Ag or W should be utilized. The metallic porous material is inserted into the brazing opening mentioned above by using the softness of it, and is made to hold the brazing solder and to reinforce the bonding part after brazing.

Abstract: A wiring board includes an insulating layer having a plurality of through holes formed therein, a base substrate layer positioned below the insulating layer, and a plurality of electrodes disposed on the base substrate layer, each electrode having an exposed surface exposed from a respective through hole, each exposed surfaces being coated with a flux. A plurality of solder balls are disposed on the fluxes in the through holes, respectively. An apparatus for mounting the solder balls on the plurality of electrodes includes: a solder ball removing unit configured to remove a first plurality of solder balls located other than in the through holes; and a solder ball pressing unit configured to press a second plurality of solder balls individually disposed in the through holes towards respective electrodes and into respective flux.

Abstract: This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

Abstract: A method for producing a solder circuit board includes the steps of imparting tackiness to a surface of an electrically conductive circuit electrode on a printed-wiring board to form a tacky part, causing only one solder particle to adhere to the tacky part, and heating the printed-wiring board, thereby melting the solder particle to form a bump part which corresponds to the tacky part and to which an electronic part is to be connected and forming a solder circuit.

Abstract: A soldering system includes a circuit board having first soldering terminals, a soldering object having second soldering terminals, soldering blocks disposed between the circuit board and the soldering object for electrically interconnecting the first soldering terminals and the second soldering terminals respectively, and a supporting structure supporting the soldering object and having a height that determines the height of the solder blocks. A related soldering method is also provided.

Abstract: A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting condensed flux on the upper surface of the diffuser plate from flowing through the nozzles. A drain hole permits condensed flux on the upper surface to flow downward through the plate.

Abstract: A method for raising a demagnetization temperature of a permanent magnet is disclosed. The method provides a ferromagnetic arrangement around the magnet to increase demagnetization thresholds for the duration of soldering, or any other process requiring high temperatures. Using the method disclosed, it is possible to apply high levels of heat directly to permanent magnets without demagnetization, and more particularly to create permanent magnetic assemblies fit for any environment.

Abstract: A laminate aluminum block for forming an article includes a series of aluminum laminate plates to collectively form a tool body for forming an article in a forming operation. A series of aluminum brazing layers are formed for brazing together adjacent aluminum laminate plates. The series of aluminum laminate plates and the series of aluminum brazing layers are deoxidized. Draining apertures are formed through a plurality of the series of aluminum laminate plates. The series of aluminum laminate plates are stacked alternating with the aluminum brazing layers between adjacent aluminum laminate plates without a flux. The stacked series of alternating aluminum plates and aluminum brazing layers are pressed. The stacked series of alternating aluminum plates and aluminum brazing layers are heated in a vacuum furnace to a temperature wherein the aluminum brazing layers braze the aluminum laminate plates together and excess braze material drains from the draining apertures.

Abstract: In a lead-free solder, a semiconductor package and a method of manufacturing the semiconductor package, the lead-free solder includes about 3.5 percent by weight to about 6 percent by weight of silver, about 0.05 percent by weight to about 0.5 percent by weight of copper and a remainder of tin. The lead-free solder is employed in the semiconductor package. The lead-free solder has high impact resistance and high heat resistance to reduce failures of the semiconductor package.

Abstract: A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 to 2.0% by weight Sb or Bi, and 0.5 to 3.0% Ag. Formation of voids at an interface between the solder and the solder capture pad is suppressed, by including Zn. Interlayer dielectric delamination is suppressed, and electromigration characteristics are greatly improved. Methods for forming solder joints using the solders.

Abstract: A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 to 2.0% by weight Sb or Bi, and 0.5 to 3.0% Ag. Formation of voids at an interface between the solder and the solder capture pad is suppressed, by including Zn. Interlayer dielectric delamination is suppressed, and electromigration characteristics are greatly improved. Methods for forming solder joints using the solders.

Abstract: A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump.

Abstract: A soldering apparatus has a conveyor which conveys an electronic circuit board, a fluxer which applies a flux having water as a solvent to a surface of the electronic circuit board to be soldered, a first heating device which heats the electronic circuit board, a water removal device which removes water attached to the electronic circuit board, a second heating device which heats the electronic circuit board to maintain the electronic circuit board at a temperature at which the flux exerts its activating action, a flow soldering bath in which molten solder is attached to the electronic circuit board, and a cooler. The water removal device includes a gas blowing portion having a first jig which blows a gas to an electronic component disposition surface, and a drawing portion having a second jig which draws water from the surface to be soldered.

Abstract: A method of assembling a fuel nozzle includes providing a first nozzle component and a second nozzle component, wherein the first nozzle component is configured and adapted to engage within the second nozzle component. Braze is applied to at least one of the first and second nozzle components. The first nozzle component is assembled into the second nozzle component to provide a diametral interference fit therebetween. The method further includes joining the first and second nozzle components together. A fuel nozzle includes a first cylindrical nozzle component, a second cylindrical nozzle component disposed with an interference fit on an outward surface of the first nozzle component, and a layer of braze joiningly disposed between the first and second nozzle components.

Abstract: Method for producing coated assembly parts for chemical device elements including the following series of steps: (a) the formation of an initial assembly including a steel support part, typically a plate, a zirconium or zirconium alloy coating, typically a sheet having dimensions similar to those of the steel plate, and at least one brazing material between the support part and the coating, wherein said brazing material is an alloy including silver and copper; (b) the insertion of the initial assembly into a brazing chamber with a controlled atmosphere; (c) the formation of a controlled atmosphere in said chamber; (d) the reheating of said assembly to a temperature at least equal to the melting temperature of said brazing material; wherein, prior to the formation of said initial assembly, the deposition of a titanium or titanium alloy layer on said zirconium (or zirconium alloy) coating is performed, and in that said coating is placed so that its titanium- or (titanium alloy-) coated surface is in contact w

Abstract: The invention relates to a saturable absorber component comprising an absorbent material located between a front mirror and a rear mirror as well as a method for manufacturing a saturable absorber component. The metallic rear mirror is a metallic buried mirror fixed via a welding joint on a heat conductive substrate. The invention applies to the field of high-rate optical transmission.

Abstract: A lead terminal bonding method includes the steps of forming a land part on a front surface of a base substrate, the land part including a metal foil; forming a metal plating layer on a surface of the land part, the metal plating layer having a Young's modulus greater than that of the metal foil; and directly bonding a metal plate to the metal plating layer by spot-welding.

Abstract: A method for soldering or hybridizing two components to each other by means of a solder material, including producing, on the opposite-facing surfaces of the components to be soldered or hybridized, a surface capable of being wetted by said solder material, this surface being produced on a first component which is in electrical contact with a metallic conductor, depositing an appropriate quantity of solder material capable of constituting a solder or hybridization pad on one of the wettability surfaces, depositing a flux material in liquid form, bringing the wettability surface of the other component into contact with the solder material thus deposited and raising the temperature until at least the melting temperature of the solder material is reached in order to ensure effective soldering or hybridization of the two components to each other due to the reflow effect.

Abstract: A method for manufacturing a printed wiring board, the method including forming a solder resist layer having a small-diameter aperture and a large-diameter aperture, each aperture exposing a respective joint pad. A metal ball having a first diameter is mounted in the small-diameter aperture by using a mask for small diameter metal balls, which includes a small-diameter aperture area that corresponds to the small-diameter aperture on the solder resist layer. A metal ball having a second diameter larger than the first diameter is mounted in the large-diameter aperture by using a mask for large diameter metal balls, which includes a large-diameter aperture area that corresponds to the large-diameter aperture on the solder resist layer.

Abstract: In one disclosed embodiment, the present method for preventing void formation in a solder joint formed between two metallic surfaces includes forming at least one slit in a layer of solder to form a slit solder layer, positioning the slit solder layer between the two metallic surfaces, and heating the slit solder layer to form the solder joint, wherein the at least one slit forms an outgas alley to prevent void formation in the solder joint. Where solder joint width is a concern, the present method includes applying external pressure concurrently with heating. The outgas alley is formed to provide a ready avenue of escape for flux gasses produced during formation of the solder joint.

Abstract: It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux. Another object is to provide a printed wiring board wherein the surface of a metal conductive part has been brought into contact with the above water-soluble preflux and a soldering method which comprises bringing the surface of a metal conductive part into contact with the above water-soluble preflux and subsequently soldering the surface.

Abstract: A method for bonding electronic components finished with electroless NiXP layer for preventing a brittle solder joint fracture is provided with the steps comprising: forming an electroless NiXP metal layer on a metal deposition of electronic components, wherein X is selected from the group consisting of W, Mo, Co, Ti, Zr, Zn, V, Cr, Fe, Nb, Re, Mn, Tl and Cu; and reflowing a lead-free solder on the electroless NiXP layer to be bonded. X element was suppressed the formation of Ni3P, Ni3SnP intermetallic compound and prevented the spalling behavior of Ni3Sn4. Therefore, solder joint reliability can be improved significantly.

Abstract: A radio-frequency shield comprised of a sheet of steel and tin-plating on at least one side of said sheet of steel. In addition, a method of making a radio-frequency shielding consisting of tin-plating at least one side of at least one sheet of steel. In addition, a backer material can be added to the back side the steel sheet which allows tin-plated steel sheets to be overlayed and attached to one another.

Abstract: A device and method are provided for reflow soldering workpieces wherein a plasma device for an atmospheric plasma treatment of the workpiece is upstream of a solder application and/or upstream of a soldering zone, and wherein the method subjects the workpiece to an atmospheric plasma treatment with the aid of a plasma device prior to the application of the solder and/or prior to the soldering process.

Abstract: A process for encapsulating metal microparticles in a pH sensitive polymer matrix using a suspension containing the polymer. The process first disperses the metal particles in a polymeric solution consisting of a pH sensitive polymer. The particles are then encapsulated in the form of micro-spheres of about 5-10 microns in diameter comprising the pH sensitive polymer and the metal ions (Ni2+, Cu2+) to be coated. The encapsulated matrix includes first metal particles homogeneously dispersed in a pH sensitive matrix, comprising the second metal ions. A high shear homogenization process ensures homogenization of the aqueous mixture resulting in uniform particle encapsulation. The encapsulated powder may be formed using spray drying. The powder may be then coated in a controlled aqueous media using an electroless deposition process. The polymer is removed when the encapsulated micro-spheres encounter a pH change in the aqueous solution.

Abstract: There is provided a printed circuit board in which space between pads used for surface mounting can be narrowed and an FPC can be mounted along with electronic components by the reflow method even when the FPC is mounted and a method of producing the same. A printed circuit board is configured such that a solder resist 3 is formed on the surface of the printed circuit board so as to expose pads 2, a solder resist 4 is formed between the adjacent pads, and solder paste which is as high as or higher than the solder resist 4 is provided by printing on the pad 2 separated from other pads 2 by the solder resists 3 and 4.

Abstract: A stacked die semiconductor package comprises a die coupled to a substrate, the first die having a die bonding area, a bonding wire supporting layer affixed to a top surface of the first die, and a bonding wire bonded to the die bonding area and to a substrate bonding area on the substrate, the bonding wire fixably attached to the bonding wire supporting layer.

Abstract: This invention is related to an electronic board comprising an area forming a BGA type electronic component backing, an electric heating resistor at right angle to said area, said resistor being able to supply an amount of heat for soldering the component onto the plate, characterized in that the board comprises a plurality of conductive layers alternating with electrically insulating layers, said resistor forming one of the conductive layers immediately underlying the surface layer. The board comprises, if need be, a thermal drain. This invention is also related to a facility for implementing the method. It also allows for an electronic board to be repaired through replacing defective members without risking to unsolder or to damage adjacent members.

Abstract: A stainless steel for a fume extractor which has a main body formed by stamping and soldering includes a stainless steel base board of a selected thickness. The stainless steel base board has the surface treated to form a coarse surface. Then the surface of the stainless steel base board is coated with a transparent lacquer to form a protection layer to prevent rusting and corrosion when submerged in a chemical detergent or exposed in a salty environment. Such a structure also facilitates wiping of filthy materials smeared on the surface.

Abstract: A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.

Abstract: Example embodiments of the present invention include a printed circuit board (PCB) capable of controlling the size and position of voids during a surface mounting process. To this end, the PCB includes: an insulating plate made of an insulating material; printed circuit patterns formed on the insulating plate; a plurality of lands to support a plurality of solder joints, each land coupled to one end of each of the printed circuit patterns; and anti-wetting layers mounted on a surface of each of the lands for solder joint therein. The anti-wetting layers allow a void produced during a surface mounting process to move to a central surface on a pad, so that the solder joint reliability between the solder ball and the land is increased. As a result, the reliability of a semiconductor device is enhanced.

Abstract: A method of making a circuitized substrate (e.g., a chip carrier) with solder balls thereon which are each formed in such a manner so as to have rough surfaces thereon, thereby providing enhanced connections with conductors (e.g., conductive sites) of an electronic device (e.g., a semiconductor chip). Methods of making an electrical assembly including both substrate and device, as well as this assembly and another substrate, thereby forming a multiple substrate assembly, are also provided.

Abstract: A method for welding to a superalloy material without causing cracking of the material. The method includes the steps of depositing a weld strip (18) of a weldable material onto a superalloy substrate material (12) using a spray deposition process (20) and then forming a weldment (26) to the weld strip. None or a controlled amount of the substrate material (12) is melted during the weld in order to maintain the concentration of strengthening elements in the local melt within a zone of weldability. The spray deposition process may be a thermal process such as HVOF or a cold spray process. A groove (16) may be formed in a surface (10) of the superalloy substrate material to receive the weld strip. A diffusion heat treatment step may be used to improve adhesion between the weld strip and the superalloy material.

Abstract: A method of attaching a solder element to a contact and the contact assembly formed thereby. The contact assembly is used in a connector. The solder element is either staked or stapled to the contact. The solder element can take a variety of shapes and disclosed herein is a tear-drop shape, a “wolf's head” shape and a circular shape. An over-stress feature is also provided for when the contact assembly is mounted to a printed wiring board.

Abstract: A method for mounting an electronic component on a substrate includes: forming an Au bump (24) on a surface of an electrode (20) of a substrate (10); placing an Sn-based solder sheet (26) on the Au bump; subjecting the Sn-based solder sheet and the Au bump to reflow soldering, to thus form an Au—Sn eutectic alloy (28); smoothing the eutectic alloy; and bonding an electronic component (30) on a surface of the smoothed eutectic alloy.

Abstract: Medical devices and methods for manufacturing medical devices. An example manufacturing method includes providing a metallic tubular member having a inner surface with a metal oxide layer disposed thereon, mechanically scoring and/or removing a portion of the metal oxide layer to create a bonding zone along the inner surface, and soldering an additional metallic structural element to the bonding zone.

Abstract: Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.

Abstract: A hydrofluoroether compound comprises at least one five- or six-membered, perfluorinated heterocyclic ring, each ring comprising four or five ring carbon atoms and one or two catenated heteroatoms selected from divalent ether oxygen atoms and trivalent nitrogen atoms, at least one of the catenated heteroatoms being a divalent ether oxygen atom, and each of the ring carbon atoms adjacent to the divalent ether oxygen atom bearing a fluorochemical group that comprises a tetrafluoroethylidene moiety (—(CF3)CF—) that is directly bonded to the ring carbon atom, the fluorochemical group optionally comprising at least one catenated heteroatom selected from divalent ether oxygen atoms and trivalent nitrogen atoms.

Abstract: An electrically heatable honeycomb body, in particular for cleaning exhaust gas originating in an internal combustion engine. The honeycomb body has at least two zones arranged in series in the flow direction with different coatings. The honeycomb body preferably has a first zone and a second zone which is arranged downstream, the first zone having an adsorbing coating, and the second zone having a catalytically active coating. The electrically heatable honeycomb body serves in particular as a trap for pollutants, preferably hydrocarbons or nitrogen oxides, which are contained in the exhaust gas. The configuration of the adsorbing first zone is matched to the light-off performance of the electrically heatable honeycomb body.

Abstract: The present invention provides a method of joining members to be joined by use of an Au—Sn brazing material, in which joining is performed by adjusting the composition and thickness of the Au—Sn brazing material so that the Sn content of the joint after joining is from 20.65 to 23.5 wt %. The invention has been completed on the basis of the discovery that the true eutectic point of this alloy system corresponds to 20.65 wt % Sn. In the invention, as means for adjusting the composition of a resulting joint, it is necessary to appropriately adjust the composition and thickness of a brazing material according to the thickness of a gold plating. In the invention, the relationship between the brazing material thickness and the gold plating thickness is shown when the brazing material to be used has an Sn content of 21 wt % to 25 wt %.

Abstract: A method for preparing a metal surface (34) for a soldering operation is provided. In accordance with the method, the metal surface is treated with a solder flux (31) comprising a supersaturated solution of a carboxylic acid.

Abstract: A metallic alloy made of metallic constituent elements is fabricated and utilized by first furnishing a mixture of nonmetallic precursor compounds of the metallic constituent elements, and thereafter chemically reducing the mixture of nonmetallic precursor compounds to produce a metallic alloy as a metallic alloy powder, without melting the metallic alloy. The metallic alloy powder is applied to a surface of a substrate article, preferably in a coating, joining, or deposition application.

Abstract: The present invention provides a welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment was conducted after welding, there is no generation of particles or dust, and superior resistance is provided to fluorine system gases. In the present invention, when materials to be welded comprising stainless steel subjected to fluoride passivation treatment are welded, hydrogen is added to the gas (the back shield gas) flowing through the materials to be welded. Furthermore, in the welding method for materials to be welded which are subjected to fluoride passivation treatment in accordance with the present invention, the thickness of the fluoride passivated film in a predetermined range from the butt end surfaces of the materials to be welded, comprising stainless steel subjected to a fluoride passivation treatment, is set to 10 nm or less, and welding is conducted.

Abstract: A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both surfaces, a filler alloy layer comprised of an Al—Si-based alloy and contains Mg incorporated at least in a constituent layer except the filler alloy layer, thereby to form a hollow structure whose one surface clad with the filler alloy is the inner surface, wherein the brazing is carried out in an inert gas atmosphere without applying any flux; and an aluminum alloy brazing sheet which satisfies the relationship: (X+Y)?a/60+0.5 and X>Y, wherein a (?m) represents the thickness of the filler alloy layer clad on the core material of the inner side of the hollow structure, and X and Y (mass %) represent the Mg contents of the core material and the brazing material, respectively.