Abstract: A method of diffusion welding of different metals is accomplished while applying pressure to the butt area and homogeneous heating the butt area to about 0.8 to about 0.9 the melting point of the metals to be welded. Additional heat pulses are then supplied to the butt area. The number of additional heat pulses depends on the diameter of the pieces to be welded. The heat pulses provide for a more even temperature distribution over the butt area and increases the number of active diffusion centers to enhance the diffusion process. The method is useful for different refractory and stainless steels and alloys. The resultant diffusion welds do not produce burring.

Abstract: The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to one another simultaneously with the development of grains of the second material in the second mass. The diffusion bonding comprises solid state diffusion between the first mass and the second mass. A predominate portion of the developed grains in the second material have a maximum dimension of less than 100 microns. The invention also encompasses methods of forming a physical vapor deposition target bonded to a backing plate.

Abstract: A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.

Abstract: A welding process for welding a Cu material to a Ti material includes interposing a tertiary component between the Ti material and the Cu material. The tertiary component is of a type of metal that, with Cu, forms a compound which is liquified at a temperature below the eutectic temperature of Ti and Cu. The above materials are heated and welded at temperature of (700 through 887° C.). The temperature selected is below the eutectic temperature of the Ti and Cu. The finished material forms a sputtering backing plate for a sputtering. A target member, bonded to the Cu material side of the backing plate, completes the sputtering target. In one embodiment, the proportion of the tertiary metal is achieved by controlling a thickness of the tertiary metal deposited on the Cu material. In another embodiment, the proportion of the tertiary metal is achieved by controlling the thickness of a layer of powder of the tertiary material deposited between the Cu and Ti materials.

Abstract: The method of manufacturing a long-life heat-resisting low alloy steel welded component, with which creep damages do not easily occur in the heat affected zone. The manufacturing method includes the steps of subjecting a base metal containing, at % by weight, C: 0.15% or less, Si: 0.5% or less, Mn: 0.3 to 0.8%, Cr: 1.9 to 2.6%, Mo: 0.87 to 1.20%, and a balance of iron and unavoidable impurities, to a hot working, to a heat treatment, and then to a welding. In this method the base metal is normalized once or more times before the welding in addition to the hot working.

Abstract: The invention includes an aluminum-comprising physical vapor deposition target bonded to an aluminum-comprising backing plate to a bond strength of greater than 10,000 pounds/in2. The invention also includes a method of bonding a first aluminum-comprising mass to a second aluminum-comprising mass. The first aluminum-comprising mass has a first surface, and the second aluminum-comprising mass has a second surface. The first and second masses are pressed together to bond the first mass to the second mass. Additionally, the invention includes a method of bonding a physical vapor deposition target material to a backing plate material. The target material and backing plate material are joined in physical contact with one another. The target material and backing plate material are then compressed under a load that progresses sequentially.

Abstract: A lower shell for a sealed compressor includes a shape with a plurality of intricate bends. In particular, u-shaped sections are stamped into a plainer sheet of material to form the lower shell. This stamping process can cause brittleness in the lower shell. Thus, after the stamping process, the lower shell is subjected to a heat-treating process to reduce the brittleness. After the heat-treating process a center shell is welded to the lower shell.

Abstract: A coating film (102) is formed on a substrate (101) of sapphire by coating the substrate with a jointing material prepared by dissolving Al(OC2H5)3 and B(OCH3)3 into xylene. Subsequently, the substrate (101) is heated to about 450° C. and the coating film (102) is irradiated with, e.g., ultraviolet radiation having a wavelength of 172 nm. Thus, xylene in the coating film (102) is vaporized, and Al(OC2H5)3 and B(OCH3)3 are thermally decomposed to form a jointing material composed of amorphous or &ggr;-layer alumina (Al2O3) and amorphous boron oxide (B2O3).

Abstract: An efficient and effective process for manufacturing of hardened aluminum components is achieved by coordinating the material preparation steps with the forming steps. The resulting product is a hardened aluminum component with desirable strength characteristics. The process includes initial heating of sheet material in order to prepare it for further processing. The sheet material is then quenched to promote appropriate material conditioning. A product forming sub-process is then undertaken in a relatively short period of time following the quenching. The product forming is done while the material is in a relatively ductile condition, thus easing forming operations, and avoiding product spring-back problems. Lastly, the component is naturally aged, to provide the final hardening operations. The resulting product has very desirable strength characteristics, due to the combined forming and hardening process.

Abstract: The invention provides an apparatus that separates solder from solder dross, comprising first and second rolls and a fixture. The first roll has a substantially cylindrical surface and is rotatable about a first longitudinal axis. The second roll has a substantially cylindrical surface and is rotatable about a second longitudinal axis parallel to the first longitudinal axis. The fixture is coupled to the first and second rolls and spaces the second roll apart from the first roll by a first distance, such as 0.001 to 0.015 inches, the first distance sufficient to separate a solder-dross mixture directed between the first roll and the second roll into a liquid solder and a dross powder when the first and second rolls are rotated in opposite directions.

Abstract: The invention provides an apparatus that separates solder from solder dross, comprising first and second rolls and a fixture. The first roll has a substantially cylindrical surface and is rotatable about a first longitudinal axis. The second roll has a substantially cylindrical surface and is rotatable about a second longitudinal axis parallel to the first longitudinal axis. The fixture is coupled to the first and second rolls and spaces the second roll apart from the first roll by a first distance, such as 0.001 to 0.015 inches, the first distance sufficient to separate a solder-dross mixture directed between the first roll and the second roll into a liquid solder and a dross powder when the first and second rolls are rotated in opposite directions.

Abstract: An improved method for joining mating surfaces of a metallic sputter target and a backing plate of aluminum, aluminum alloy or aluminum matrix composite material to form a sputter target/backing plate assembly comprises the steps of roughening the mating surface of either the sputter target or the backing plate to form a plurality of salient portions; depositing an intermediate layer comprising nickel on that mating surface; pressing the sputter target and the backing plate together along the mating surfaces so as to disrupt the mating surfaces; and holding the sputter target and the backing plate in contact at a temperature just below the melting points of the sputter target and backing plate materials to promote diffusion bonding. In an especially preferred form of the invention, the mating surface on the harder of the sputter target or the backing plate is roughened by machining a series of concentric grooves.

Abstract: The superplastically formed structural assembly includes first and second structural members having facing surfaces. The first and second structural members can include a first outer structural member, a second outer structural member or at least one intermediate structural member. In one embodiment, the first and second structural members include first and second outer structural members. In another embodiment, the first and second structural members include first and second intermediate structural members. The structural assembly includes at least one friction stir weld joint joining the first and second structural members. In one embodiment, the facing surface of the first structural member is at least partially covered with oxide to prevent thermo-compression welding of the first and second structural members adjacent the at least one friction stir weld joint. In another embodiment, the facing surface of the second structural member is at least partially covered with oxide.

Abstract: The superplastically formed structural assembly includes first and second structural members having facing surfaces. The first and second structural members can include a first outer structural member, a second outer structural member or at least one intermediate structural member. In one embodiment, the first and second structural members include first and second outer structural members. In another embodiment, the first and second structural members include first and second intermediate structural members. The structural assembly includes at least one friction stir weld joint joining the first and second structural members. In one embodiment, the facing surface of the first structural member is at least partially covered with oxide to prevent thermo-compression welding of the first and second structural members adjacent the at least one friction stir weld joint. In another embodiment, the facing surface of the second structural member is at least partially covered with oxide.

Abstract: After copper plates 14 are bonded to both sides of a ceramic substrate 10 via a brazing filler metal 12, UV curing alkali peeling type resists 16 are applied on predetermined portions of the surfaces of the copper plates 14 to etch undesired portions of the copper plates 14 to form a metal circuit portion. While the resists 16 are maintained, undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed (or undesired portions of the brazing filler metal 12 and a reaction product, which is produced by a reaction of the brazing filler metal 12 with the ceramic substrate 10, are removed, and the side portion of the metal circuit portion is etched). Thereafter, the resists 16 are peeled off, and an Ni—P electroless plating 18 is carried out.

Abstract: Low temperature diffusion bonding methods and target/backing plate assemblies bonded by the methods are disclosed. In accordance with the methods, copper and/or cobalt targets are bonded to backing plate members via the use of an interlayer selected from the group consisting of group Ib or group VIII metals. The interlayer is interposed between intended bonding surfaces of the target and the backing plate, and the assembly is diffusion bonded at low temperatures of about 190° C.-400° C. The method results in increased tensile strength of the bonded assembly while not, in the case of copper targets, resulting in undesirable grain growth. When cobalt targets are bonded in accordance with the invention, desirable magnetic properties, such as magnetic pass through flux, are maintained while a strong bond is achieved.

Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.

Abstract: A pin standing resin substrate including a resin substrate having a substantially plate-shaped main surface and composed of one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and a pin soldered to the pin-pad, wherein the pin has been thermally treated by heating so as to soften the pin. The pin has a rod-like portion composed of a copper base metal and an enlarged diameter portion made of the same material as the rod-like portion. The enlarged diameter portion has a larger diameter than the rod-like portion and is formed at one end of the rod-like portion. At least the enlarged diameter portion is soldered to the pin-pad. Also disclosed is a method of making the pin standing resin substrate, a pin for bonding with the resin substrate, and a method of making the pin.

Abstract: In an integrated circuit structure, the improvement comprising a wire bonded Cu-pad with Cu-wire component, wherein the Cu-pad Cu-wire component is characterized by self-passivation, low resistance, high bond strength, and improved resistance to oxidation and corrosion, the Cu-pad Cu-wire component comprising:

Abstract: A process (30) for the repair of a component part (36, 66) incorporating a cold spray process step (50) for depositing material particles (54) to fill a discontinuity (40) in the part surface (42) or to create a desired surface geometry (78) on the part (66). The cold spray process may be controlled to provide a grit blasting effect prior to depositing the material in order to remove contaminants (48) from the surface of the part. The material deposited (56) by the cold spray process may form a joint (78) between an insert (72) and the part (66). The process may be used to repair parts made of directionally solidified (DS) or single crystal (SC) base material (44) without causing a re-crystallization of the base material. The process may further be used to deposit repair material (56) over a braze material (22).

Abstract: A method of bonding respective objects made of different kinds of material to each other is disclosed. The method includes the steps of (A) contacting a bonding material in the fluid state thereof with respective bonding faces of the respective objects to be bonded, (B) mechanically abrading portions of the respective bonding faces contacting the bonding material to be bonded to each other, (C) setting the respective objects fixed in a predetermined position relative to each other while maintaining the respective objects in contact with the bonding material in the fluid state thereof, and (D) solidifying the bonding material to bond the respective objects to each other. In the respective steps (A)-(D), the bonding material is present at the bonding portions to be bonded to each other of the respective objects constantly and without discontinuities.

Abstract: A flip chip interconnect system comprises an elongated pillar comprising two elongated portions, a first portion including solder with or without lead and a second portion including copper or gold or other material having a higher reflow temperature than the first portion. The second portion is to be connected to the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of &agr; particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.

Abstract: Method of repairing metallic components having weight-carrying grooves, whose actual contour, after the removal or displacement of the component material, deviates from the desired contour, by applying a metallic additional material to the actual contour as well as by the removing machining to the desired contour.

Abstract: The invention comprises a continuous hot rolling method in which a rear end portion of a preceding metal block and a fore end portion of a succeeding metal block are cut and the metal blocks are joined to each other by heating and pressing followed by a finish rolling. A region of each metal block is restrained from a clamping position to the end portion thereof in order to prevent a change in level of the metal blocks in heating and pressing the piece. The end portions of the metal blocks can be thus prevented from deformation.

Abstract: An improved method of manufacturing a piezoelectric element and an improved piezoelectric element are provided. The improved method comprises the steps of causing a gas discharge in a predetermined discharge gas at approximately atmospheric pressure and generating an excited active species of the discharge gas as a result of the gas discharge. Then, at least one of a connecting surface of an electrode formed of a piezoelectric piece on a piezoelectric resonator and a connecting portion of a lead terminal are exposed to the excited active species, whereby the exposed connecting portions are surface treated. Finally, the electrode and the lead terminal are connected together, and at least the electrode and the lead terminal are sealed in a case. The improved piezoelectric element is formed by this process and uses less solder and is more stable than prior art piezoelectric elements.

Abstract: A container body is made from a composite sheet having a metal layer which has at least one side covered by a corrosion-resistant layer, such as a layer of thermoplastic. The sheet is moved under one or more high-pressure water jets which remove a strip of the corrosion-resistant layer in the path of the water stream, leaving an exposed area. The composite sheet may be segmented as necessary to form blanks suitable for forming individual container bodies. Each blank is formed generally into a tube or cylinder so that the corrosion-resistant layer faces interiorly, and so that the exposed areas are respectively located at overlapping ends of the blank. The overlapping, exposed areas are then welded along a seam, forming a seal.

Abstract: A welding process for welding a Cu material to a Ti material includes interposing a tertiary component between the Ti material and the Cu material. The tertiary component is of a type of metal that, with Cu, forms a compound which is liquified at a temperature below the eutectic temperature of Ti and Cu. The above materials are heated and welded at temperature of (700 through 887° C.). The temperature selected is below the eutectic temperature of the Ti and Cu. The finished material forms a sputtering backing plate for a sputtering. A target member, bonded to the Cu material side of the backing plate, completes the sputtering target. In one embodiment, the proportion of the tertiary metal is achieved by controlling a thickness of the tertiary metal deposited on the Cu material. In another embodiment, the proportion of the tertiary metal is achieved by controlling the thickness of a layer of powder of the tertiary material deposited between the Cu and Ti materials.

Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).

Abstract: The present invention provides a welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment was conducted after welding, there is no generation of particles or dust, and superior resistance is provided to fluorine system gases.

Abstract: Friction Pull Plug Welding is a solid state repair process for defects up to one inch in length, only requiring single sided tooling, or outside skin line (OSL), for preferred usage on flight hardware. The most prevalent defect associated with Friction Pull Plug Welding (FPPW) was a top side or inside skin line (ISL) lack of bonding. Bonding was not achieved at this location due to the reduction in both frictional heat and welding pressure between the plug and plate at the end of the weld. Thus, in order to eliminate the weld defects and increase the plug strength at the plug ‘top’ a small ‘hat’ section is added to the pull plug for added frictional heating and pressure.

Abstract: A functionally gradient material having desired characteristics without having any joining section is efficiently obtained by means of integration effected by a sintering treatment, the functionally gradient material comprising a metal part composition containing predetermined components based on a basic composition of tungsten and copper and a ceramic part composition containing predetermined components based on a basic composition of aluminum nitride and aluminum. Therefore, the metal and the ceramic are integrated into one unit without providing any joining section to give a high joining reliability and high thermal conductivity.

Abstract: A welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment is conducted after welding, there is no generation of particles or dust. The method provides superior resistance to fluorine system gases. During fluoride passivation treatment, hydrogen is added to the gas (the back shield gas) flowing through the materials to be welded. In one embodiment of the welding method, the thickness of the fluoride passivated film in a predetermined range from the butt end surfaces of the materials to be welded is set to 10 nm or less, followed by subsequent welding. Furthermore, the fluoride passivation retreatment method, includes the steps of heating at least the welded parts following welding and flowing a gas containing fluorine gas in the interior portion of the parts.

Abstract: For the manufacture of a metallic honeycomb body which is wound, layered or looped from at least partially structured sheet metal layers, it is proposed to provide at least the structured sheet metal layers with a layer of rolling oil, to the extent that this is not already present in the process for manufacturing the sheet metal layers. A step for partially thermally removing highly volatile components of the rolling oil can follow. The honeycomb body manufactured from the sheet metal layers is brought into contact with a brazing powder which remains adhered to the rolling oil in particular in the area of the contact lines between the sheets. The honeycomb body is subsequently subjected to a brazing procedure in a high temperature brazing furnace under vacuum or a protective gas.

Abstract: This invention relates to a method of joining silicon nitride having on its surface a thin layer of active silicon metal to carbon steel, wherein the active silicon layer is formed through the thermal dissociation of silicon nitride(Si3N4) into silicon(Si) and nitrogen gas(N2). The active silicon layer is directly joined to carbon steel via an induced eutectic melting reaction between the silicon (Si) an iron (Fe) of carbon steel, or via brazing of two materials Ag—Cu alloys. This joining process does not require the use of expensive Ag—Cu—Ti active brazing alloys containing an active metal (Ti) or a sputtering method designed to coat the active metals on surface of silicon nitride.

Abstract: A method of joining the ends of metal strip material together by positioning a consumable insert of weld filler material between the full thickness of the strip ends and below the lower surface of the strip ends a predetermined depth to establish a predetermined gap between the strip ends thus allowing for full arc penetration of the strip ends and providing a supply of the filler material to the root of the weld to be formed between the strip ends.

Abstract: So as to allow bonding precision to be confirmed on a bonding apparatus, both a confirmation substrate part and a confirmation chip part, which are flip-chip bonding confirmation parts used in the bonding of semiconductor devices that have daisy-chain type patterns, are formed as transparent plate-form members and daisy-chain type patterns are provided thereon.

Abstract: A method for soldering electronic components capable of withstanding high temperature applications. A solder having a composition in the range between 83 and 87% lead, between 8.5 and 11.5% antimony, and the balance of tin provides superior results. The solder uniquely provides a sufficiently low melting point to enable mass flow without destruction of plastic package parts, and a sufficiently high melting point to achieve 200 degrees C. operation. Good mechanical strength is achieved while providing sufficient creep to permit differential expansion between components and a printed wiring board. A heavy solder layer is coated on a printed wiring board and is oxidized to generate a thin solderable layer. Manufacture of the circuit board can be performed with conventional techniques such as wave soldering, hand soldering, solder printing, solder dispensing, and solder pre-forms.

Abstract: The invention relates to a method for drying fluxing of a metallic surface before soldering or tinning using an alloy, according to which the surface to be fluxed is treated, at a pressure close to atmospheric pressure, with a gaseous treatment atmosphere comprising excited or unstable species and being substantially free of electrically charged species, which is obtained from a primary gas mixture and, optionally, an adjacent gas mixture, the primary gas mixture being obtained at the gas outlet of at least one apparatus for forming excited or unstable gas species, in which an initial gas mixture comprising an inert gas and/or a reducing gas and/or an oxidizing gas has been converted, the adjacent gas mixture not having passed through the apparatus.

Abstract: A heat exchanger assembly includes at least one tube having an internal surface and an external surface, a composition cladding having at least lithium and magnesium applied to either one of the internal surface and external surface of the tube, and at least one component disposed adjacent the composition cladding, whereby the tube and component are joined together during a controlled atmosphere brazing process.

Abstract: This invention is directed to an improved bonded sputter target/backing plate assembly and a method of making these assemblies. The assembly includes a sputter target having side and bottom bonding surfaces bonded within a recess in an underlying backing plate, the recess having top and side bonding surfaces. The method of forming the bonded assembly includes treating the bonding surfaces of either the sputter target or backing plate recess by roughening at least a portion of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro-inches. The method further includes orienting the sputter target within the backing plate recess to form one assembly having a parallel interface defined by the top and bottom bonding surfaces and a side interface defined by the side bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.

Abstract: A sputter target assembly includes a cobalt target diffusion bonded to an aluminum or copper backing plate by means of a titanium interlayer. The sputter target assembly may be made by hot vacuum pressing or, preferably, by hot isostatically pressing the target, interlayer and backing plate together. Preferably, the titanium interlayer is provided as a foil, but may also be formed on a mating surface of either the target or the backing plate by electroplating, sputtering, electroless plating, or plasma spraying. The target may be advantageously machined with grooves defining salient points prior to providing the interlayer.

Abstract: The method provides a diffusion-bonding of dual-phase stainless steel material having excellent strength and corrosion. The method includes: cold-working a material to be bonded so as to enhance the proof stress; inserting into the bonding portion an insert material; applying pressure thereto while performing shielding by mixed nitrogen/argon gas; heating the restricted bonding portion; cooling at a restricted rate; so as to form a bonded portion having the ferritic phase percentage of 30-70% by volume.

Abstract: The invention relates to a method for dry cleaning or dry fluxing metallic surfaces before, during, or after a reflow soldering operation. The metallic surfaces that are dry cleaned or dry fluxed include (1) the metallic substrate on which an at least partially metallic, electronic component is to be mounted, (2) the solder paste, and (3) the metallic portions of the electronic component. The method comprises treating the metallic surface with a gaseous treatment atmosphere comprising unstable or excited gaseous species, and is substantially free of electrically charged species.

Abstract: A method of forming hydrogen fluoride (HF), to allow fluxless soldering, from a solid source such as potassium hydrogen fluoride (KF.HF) using a specialized apparatus, including a cartridge which is heated in a controlled atmosphere apparatus. The gaseous reaction product, HF, may be extracted from the apparatus either by itself or in a carrier gas (such as argon or nitrogen). The solid reaction product, potassium fluoride (KF), is an inert material which remains in the cartridge. The combination of the cartridge and KF may be safely disposed of as a unit or refilled with KF.HF under controlled conditions.

Abstract: A method for soldering components to opposite sides of a receptive element includes the steps of applying a solder formulation to both sides of the receptive element (201) and placing components on a first side of the receptive element (204). The solder formulation is hardened on the first side of the receptive element (205). Components are placed on a second side of the receptive element and the solder formulation on the second side of the receptive element is hardened. The components are fixed to the receptive element by performing a single reflow operation (208).

Abstract: This invention is directed to an improved method for making a bonded sputter target/backing plate assembly as well as assemblies produced therefrom. The assembly includes a sputter target having a bonding surface which is bonded to the bonding surface of an underlying backing plate. The method of forming the bonded assembly includes treating one of the bonding surfaces, either by roughening at least a portion of one of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro inches, or by drilling a plurality of holes in one of the bonding surfaces. The method further includes orienting the sputter target and backing plate to form an assembly having an interface defined by the bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.

Abstract: A method for flip-chip bonding of two electronic components (27,28) does not use a flux material. A substrate (13) of one electronic component (28) is roughened during processing to provide an improved adhesive surface for a solder ball (12). The roughened pattern is replicated by additional conductive layers formed over the substrate or in an alternate embodiment may be formed on one of the intermediary or top conductive layers. Tacking pressure is applied to the two components so the solder ball (12) will be affixed to the roughened surface and provide a temporary bond. This bond ensures the surfaces of the two electrical components remain in contact with each other during reflow of the solder ball (12) to form a permanent bond.

Abstract: A process is provided for manufacturing and repairing components, and particularly superalloy components such as gas turbine engine components. The invention entails forming precipitates in a surface of the article that has been cold worked as a result of surface machining, cleaning, handling, etc. The precipitates serve to prevent recrystallization and formation of a secondary reaction zone in the cold worked surface of the superalloy when subsequently exposed to temperatures approaching the solution temperature of the superalloy, such that the microstructure and mechanical properties of the superalloy article are preserved.

Abstract: The present invention provides a method for forming a solder bump (24) on a substrate (20). The substrate (20) includes a bond pad (18) having a faying surface (19) composed of solder-wettable metal. The method includes coating the faying surface (19) with a plate (16) formed of a first metal having a first melting temperature, and projecting a discrete microdroplet (14) onto the plate (16). The microdroplet (14) is formed of a molten second metal and has a second melting temperature greater than the first melting temperature. The microdroplet (14) fuses to the plate (16) to form the solder bump (24).

Abstract: The present invention relates to a thermal barrier coating applied to the inside surface of a catalytic converter and intake pipe between the manifold of an internal combustion engine and the catalytic converter. The catalytic converter and intake pipes are generally formed in two halves to facilitate an effective means by which the thermal barrier coating can be sprayed onto the inside surface by an arc plasma source prior to combining the individual halves of the catalytic converter or intake pipe.