Abstract: The invention relates to an apparatus and a method for clamping, cutting, and joining strips to a continuous strip. Said device comprises a clamping device (125), a cutting device (155), and a joining device (195). The clamping device, cutting device, and joining device are kinematically coupled to each other.

Abstract: A method for constantly controlling a direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants. The direct pressure is applied to an interface between the porous coating and the substrate material via a pressure application mechanism unaffected by heat and air pressure conditions of the bonding process. The pressure application mechanism maintains a pressure on the implant which is constantly controlled throughout the bonding process.

Abstract: A motor vehicle body framing apparatus located at a welding station of a motor vehicle assembly line for use in precisely positioning body panels arriving at the welding station for welding. The apparatus includes a base structure positioned at the welding station and having a longitudinal extent in the direction of body panel movement and a transverse extent; a parking structure upstanding vertically from the base structure on either side of the welding station and each defining parking devices; and a pair of longitudinal side gates each carrying tooling fixtures for engagement with body side panels and each including parking devices operative in coaction with the parking devices on the upstanding parking structures to precisely position the gates on the parking structure and thereby precisely position the tooling fixtures relative to the body panels.

Abstract: The invention discloses a method and a production installation for producing a sub-assembly consisting of a plurality of parts joined together, in which the first part (1) and second part (2) are removed from a parts delivery site in the vicinity of a transport device and deposited oriented in position on one of a plurality of parts transport carriers of the transport device, and subsequently together with the parts transport carrier transported to an assembly station. The parts transport carrier is stopped in the assembly station in a holding position, whereupon the parts (1, 2), oriented towards one another, are moved by means of a vertical positioning device (200a, 200b) together from a transport position on the parts transport carrier into a preparation position, then positioned relative to one another, clamped and then joined to form a sub-assembly, whereupon the joined subassembly is again deposited on one of a plurality of parts transport carriers and transported away thereby.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed, with hot gas from the channeled tip melting the epoxy or solder and with the module forced against the fixed tool to remove it.

Abstract: A method of manufacturing a structural part through diffusion bonding in solid state without secondary materials after stacking multi-sheet metal and a tool thereof are disclosed. The tool for diffusion boding of multi-sheet metal includes a top tool having a top gas inlet, a central tool coupled to the top tool for installing the multi-sheet metal inside the central tool, a bottom tool coupled to the central tool for supporting the multi-sheet metal and having a bottom gas inlet and a vacuum path for making a vacuum state or an inert gas environment, and a sealing plate interposed between the top tool and the central tool.

Abstract: Apparatus for diffusion bonding, brazing, or joining between respective surfaces of two parts, e.g., the exterior wall of a first annular cylinder and the interior wall of a concentric second annular cylinder, includes a cylindrical body having a circumferential cavity positioned between upper and lower ends thereof. A flexible annular membrane is disposed concentrically over the cavity, and respective upper and lower ends of the membrane are each sealingly hinged to the body. The body is assembled coaxially within the first cylinder, and the assembly then inserted coaxially into the second cylinder to the desired axial bonding position. The cavity is pressurized, causing the membrane, and responsively, the first cylinder, to expand radially within the second cylinder. The temperature of the parts is then raised and maintained for a selected period of time to bond the respective walls of the two cylinders to each other.

Abstract: An electronic component mounting device according to the invention includes a bonding head for holding and pressure bonding an electronic component to a mounting substrate, a local stage provided with a support surface formed in an area which is almost equal to or slightly larger than that of a mounting surface of the electronic component and serving to support a pressure bonding force from an antimounting surface of the mounting substrate through the support surface, a length measuring mechanism for measuring a distance between the bonding head and the mounting substrate, thereby calculating a virtual plane in a predetermined mounting position on the mounting substrate, and a tilting and moving mechanism for tilting and moving the bonding head and the local stage, thereby causing a normal of the virtual plane in the mounting position to be coincident with an action line of the pressure bonding force, and the pressure bonding is carried out along the normal.

Abstract: Provided are a laser flip-chip bonding method having high productivity and excellent bonding reliability and a flip-chip bonder employing the same. The flip-chip bonder includes: a bonding stage on which a substrate rests; a bonding head picking up a semiconductor chip and attaching the semiconductor chip to the substrate; and a semiconductor chip heating unit heating the semiconductor chip to a bonding temperature. The semiconductor chip heating unit includes: a laser light source; and a lens assembly refracting a laser beam emitted by the laser light source to a top surface of the semiconductor chip so that a central position of the laser beam varies across the top surface of the semiconductor chip.

Abstract: A flip chip bonding tool tip comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded is disclosed. Methods for manufacturing a dissipative material for use in a flip chip bonding tool tip are further disclosed.

Abstract: A motor vehicle body framing apparatus located at a welding station of a motor vehicle assembly line for use in precisely positioning body panels arriving at the welding station for welding. The apparatus includes a base structure positioned at the welding station and having a longitudinal extent in the direction of body panel movement and a transverse extent; a parking structure upstanding vertically from the base structure on either side of the welding station and each defining parking devices; and a pair of longitudinal side gates each carrying tooling fixtures for engagement with body side panels and each including parking devices operative in coaction with the parking devices on the upstanding parking structures to precisely position the gates on the parking structure and thereby precisely position the tooling fixtures relative to the body panels.

Abstract: Motor-vehicle bodies or sub-assemblies thereof are assembled in a welding-assembly station with the aid of frames arranged at the two sides of the conveying line that traverses the station, said frames being provided with fixtures for locating and clamping the various parts of the body. The side frames are moved between their operative position in the station and an inoperative position at a distance from the station with the aid of multi-axis manipulating robots. Said robots, however, do not carry the frames up to their final operative position for assembling the body, but rather unload them on two rigid structures, which are prearranged at the two sides of the line and are movable in a transverse direction with respect thereto between an open condition and a closed condition. The movable structures, once they have received the frames from the robots in their open condition, displace into their closed condition, thus carrying the frames into their final operative position.

Abstract: A manufacturing plant (1) is provided for vehicle body parts (2, 3). The manufacturing plant includes a number of processing stations (4, 5, 6, 7, 8, 9, 10), which are situated one behind the other along a transfer line (22), and of a number of multiaxial robots (18, 19). In at least one processing station (4, 5, 6, 7, 8, 9, 10), one or more handling robots (18) for transporting parts is/are arranged on at least one axis of travel (20, 21). Next to the handling robot (18), one or more processing robots (19) is/are displaceably arranged on the same axis of travel (20). Working locations (11, 12) are arranged on both sides of a common axis of travel (20), whereby another common axis of travel can be provided on the rear side of the working locations.

Abstract: A machining system and unit, especially a welding cell, is provided for use for the machining of workpieces (2), especially body parts of vehicles. The machining system has one or more machining stations (15, 16) with robots (18, 19, 20) and at least one rotation or turning station (5), which has at least two work stations (6, 7) for carrying out different operations simultaneously. The turning station (5) has at least two said multiaxially movable turning units (8, 9) arranged next to one another with said gripping tools (11, 12, 13). The working areas (10) intersect each other at the work stations (6, 7).

Abstract: A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in which the solder disposed on the surface of the first member to be die bonded is interposed therebetween, and a base portion for mounting the first member thereon in a predetermined position, wherein the base portion has a temperature distribution so that a temperature of a vicinity of a central portion in a predetermined direction of the base portion is higher than that of a vicinity of an end portion of the base portion in a state in which heating is effected in the heat treatment furnace to, so that it is possible to suppress the occurrence of bubbles in the solder.

Abstract: A bondhead assembly having a bond body for mounting a bonding tool, a support structure that is configured to be drivable for moving the bondhead assembly to different locations and flexural elements arranged substantially along at least one plane which couple the bond body to the support structure for flexibly supporting the bond body during movement with respect to the support structure. A motor is coupled to the support structure and it is operative to drive the bond body to move relative to the support structure along an axis extending substantially perpendicular to the at least one plane.

Abstract: An apparatus and method for soldering an LED driving element to an LCD panel includes a panel holding unit, a rotating unit and a soldering unit. The panel holding unit holds the display panel. The rotating unit supports the panel holding unit at initial radial and angular positions relative to a center of rotation of the rotating unit and rotates the holding unit in a horizontal plane about the center of rotation to selected angular positions relative thereto. The soldering unit is disposed above the rotating unit at the initial radial position and at a first angular position relative to initial angular position of the holding unit, and is operable to solder the driving element of the display panel held by the panel holding unit when the rotating unit rotates the panel holding unit to the first angular position. The apparatus and method provide improved display panel productivity.

Abstract: According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by passing a heating element between the first body and the second body to melt the bump by the heating element, the heating element being heated to a melting point or more of a material configuring the bump.

Abstract: A Wire Bonder comprises a bondhead that can be moved in a horizontal plane that has a capillary clamped to a horn and parts of an image recognition system. The tip of the capillary and the optical axis of the image recognition system are separated by a vectorial distance D. The Wire Bonder has a device with a body with an optical marking and with two stop faces that enable the vectorial distance D to be recalibrated at any time. The control program of the Wire Bonder is set up on the one hand to move the capillary towards the first stop face and to determine a first co-ordinate xC of the position of the bondhead as soon as the capillary touches the first stop face and then to move the capillary towards the second stop face and to determine a second co-ordinate yC of the position of the bondhead as soon as the capillary touches the second stop face.

Abstract: Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), and at least a part of the surface of the opposing terminal (3) turned toward the welding terminal (2) is equipped with a flexible absorbing body (4). It is inventive that the surface of the absorbing body (6) turned toward the welding terminal consists of metal.

Abstract: A machine for determining the location of junction tubes along a header and automatically brazing them to the header. A chassis is employed to hold the junction tubes and header in the proper orientation. A carriage then travels along a line which is parallel to the central axis of the header. The carriage includes a sensor which is able to determine the exact position of the junction tubes. This positional information is stored in a controller. The carriage also includes a reciprocating pair of burners for heating the joint to be brazed. A pair of brazing wire feeders are included for feeding the brazing alloy alloy to the joint. A pyrometer is also included for measuring the temperature of the joint during the brazing process. In operation, the carriage slides along with the sensor measuring the position of each joint to be brazed. The burners and brazing alloy feeders are located in such a position on the carriage that the sensor precedes them in coming to each joint location.

Abstract: A workpiece, in which a lead is laid on top of a three-dimensional porous metal body, is placed between an ultrasonic horn and an anvil with a lead portion facing the ultrasonic horn. A support is raised so that the lead portion of the workpiece is pressed between the ultrasonic horn and the anvil. While being rotated around a central shaft with a motor, the ultrasonic horn vibrates at a frequency of 20 kHz in the shaft direction. Thus, the workpiece is advanced continuously, so that the lead is bonded ultrasonically to the three-dimensional porous metal body (i.e., metal-to-metal bonding is established). It is possible to provide a battery electrode that can be produced continuously at a lower running cost, reduce the faulty welding with a current collecting plate, and prevent short-circuits.

Abstract: An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another.

Abstract: The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environments such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.

Abstract: An apparatus and method for aligning and attaching a plurality of solder columns to a patterned array of corresponding electrical contacts on a ceramic substrate. The apparatus includes a flat rectangular alignment plate in which a plurality of through holes are defined in a pattern identical to the pattern of the electrical contacts. Four retainers depend from the four sides of the alignment plate. The retainers hold the alignment plate in a fixed position above the ceramic substrate such that the through holes are vertically aligned with the corresponding electrical contacts. The solder columns are inserted through the through holes so that the solder columns are placed in an upright position on the respective contact pads. Solder paste is applied onto the electrical contacts. The alignment plate and the substrate are heated so that the solder paste is reflowed and wetted onto the solder columns and the electrical contacts.

Abstract: A soldering machine for tape carrier package. The soldering machine includes a cylinder, a linking rod, a cushioning pad, a floating connector and a press head assembly. The cylinder has a first end and a second end. The linking rod passes through the interior of the cylinder. The linking rod also has a first end and a second end. The first end of the linking rod protrudes from the first end of the cylinder while the second end of the first linking rod protrudes from the second end of the cylinder. The first end of the linking rod has a threaded section with an adjusting nut screw onto the threaded section. There is a cushioning pad between the adjusting nut and the cylinder. The second end of the linking rod has a floating connector. The press head assembly and the linking rod is connected together via the floating connector.

Abstract: An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.

Abstract: An apparatus and method for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode includes a contact surface wherein a fluid is deposited on the contact surface prior to the welding process. The fluid may be applied in different ways, including providing an aperture in the contact surface of the sonotrode. In addition, the sonotrode may be cooled below the dew point of the surrounding atmosphere thus causing moisture to form on the contact surface of the sonotrode. Cooling the sonotrode to a temperature above the dew point also reduces sonotrode adhesion during the ultrasonic welding process.

Abstract: Apparatus and methods are provided for thermally coupling a heat dissipation device to a microelectronic device. A reflowable thermal interface material is applied between the back side of a microelectronic die and a heat dissipation device. Heat and pressure is conducted through the heat dissipation device to the interface material and producing thereby liquefaction followed by solidification of the interface material, the solidification occurring progressively from the center to the peripheral edge. A thermal compression bonding apparatus is provided comprising a bonding head adapted to apply heat and pressure to the heat dissipation device whereby providing the desired thermal profile to effect solidification of the interface material from the center outward.

Abstract: A transport apparatus comprises a gripper for the transport of substrates. The gripper has a plate on the underside of which the vacuum grippers can be attached magnetically. The plate preferably consists of steel and each vacuum gripper has a permanent magnet. The transport apparatus is suitable for use on a Die Bonder.

Abstract: A method and apparatus for joining multiple layers of materials using an ultrasonic welding apparatus. The ultrasonic welding apparatus utilizes a sonotrode to perform a weld between at least the top and intermediate layer of the multi-layer member. Then, either the multi-layer member or the ultrasonic welding apparatus is rotated such that the bottom layer is positioned adjacent the sonotrode wherein the sonotrode forms a weld between at least the bottom layer and intermediate layer of the multi-layer member. The apparatus includes an ultrasonic welding gun having a C-shape frame including a base portion and a head portion. An ultrasonic welding device, including a sonotrode, is secured to the head portion and an anvil secured to the base portion. The ultrasonic welding gun is connected to a robot operative to position the ultrasonic welding gun to perform the welding operation.

Abstract: An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another.

Abstract: To provide a seam welding apparatus and a seam welding method that may operate at a low pressure to obtain a suitable overlapped alignment amount. In the seam welding apparatus, a trailing plate clamp moving means is provided with link mechanisms for overlapping and aligning a leading end of a trailing plate with a trailing end of a leading plate and a link drive source for operating the link mechanisms under an extended condition. The link mechanisms are arranged in parallel along both side edges of the trailing plate. The pair of link mechanisms are connected to a link drive source to form a parallel link mechanism assembled through a coupling link. Also, a movable portion of the leading plate clamp means has a tilt pivot. This tilt pivot is adapted to be movable so that the overlapped alignment amount may be adjusted.

Abstract: In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. This mechanics does not loose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.

Abstract: An apparatus for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode tip has a specific surface configuration, including a curvilinear shaped outer surface combined with a plurality of grooves and lands. Due to the curvilinear surface, the depth of the grooves gradually decreases near the outer edge or periphery of a contact surface of the sonotrode tip. Further, such a groove and land combination also provides a sharp edge or corner that reduces sliding of the tip on the workpiece and correspondingly reduces sticking. In addition, various types of coatings or inserts may also be used to reduce sticking of the sonotrode tip to the workpiece.

Abstract: Bump components mounted on a circuit board on a supporting substrate is covered with a flexible separation wall. A pressure difference is provided between the inner and outer sides of the separation wall and thus the bump components are pressed against the circuit board. When heating is carried out in this state, the bump components and the circuit board are connected with a conductive adhesive or solder. During the heating, the circuit board is not deformed. Therefore, a bump-component mounted body can be manufactured with high yield.

Abstract: A terminal pressure-welding apparatus is provided, which includes: a first pattern; a second pattern facing the first pattern, one of the first and second patterns is provided approachably and disapproachably with respect to the other thereof; a mounting portion to mount the other of the first and second patterns; a displacing member carrying the one of the first and second patterns and being movable relatively to the other of the first and second patterns; and a stopping means to check an abutment of the first pattern and the second pattern, wherein a terminal metal fitting and an end portion of an electric wire are placed between the first and second patterns, and the terminal metal fitting and the end portion are pressure-welded by making the first and second patterns approach each other.

Abstract: In a bonding tool which bonds a component to a substrate by urging and vibration, a through hole is formed in the horn. An adhesion section is fit into a lower section of the hole and an engaging section is fit into an upper section of the hole, so that a sealed inner space is formed inside the hole by tightening an outer screw. An adhesion hole open to a bonding section communicates with a sucking hole of the horn via the inner space, so that a simply structured vacuum-adhesion-system can be formed. These mechanics do not lose replaceablility of the adhesion section detachable to the horn. As a result, the adhesion section can be replaceable as an independent part (urging terminal), and a bonding apparatus as well as a bonding tool having the simply structured vacuum-adhesion-system can be provided.

Abstract: A framing station arrangement that includes a bottom plate support device to receive a bottom plate of the car body to be attached thereto. An engaging robot brings separate components of the car body into engagement with the bottom plate. Preassembly devices are used to preassemble the separate components of the car body to the bottom plate and/or to each other in order to obtain the external shape of the car body. A support system having multiple separate framing elements used to support the preassembled car body. At least one other engaging robot is used to bring at least a part of the framing elements into engagement with the support system and/or another framing element. A locking unit that joins at least two separate framing elements together and to the bottom plate support device or at least to three other framing elements to form a support net.

Abstract: The invention concerns an apparatus for mounting semiconductor chips on a substrate with which the substrate is forwarded in steps in a first direction to a bonding station for the presentation of a next substrate position. In order that curved substrates or substrates otherwise slightly shifted in their position at right angles to the transport direction can be presented with positional accuracy at the bonding location, it is suggested that the position of the longitudinal edge of the substrate is measured at right angles to the transport direction at the level of the bonding station and then to carry out a corrective movement with the substrate. An optical sensor with two light barriers arranged next to each other is suggested for the sensor.

Abstract: A plurality of robots are positioned on a rotatable table for transporting parts to be processed through a plurality of work stations positioned around the periphery of the table. Each robot can carry a workpiece from one work station to the next. The rotation of the table moves the robot from one workstation to the next while carrying a part to be processed. Each robot can be independently movable relative to the other robots and each robot can be independently movable relative to the table. Each robot can include a welder for processing the workpiece independent of the workstation or during movement between work stations. Each robot can carry a plurality of differently configured workpieces between the work stations.

Abstract: An attachment apparatus for a heater for attaching the heater, which is configured in an almost circular shape in its side view and cut at a circumferential portion thereof to form opposite circumferential end portions, to an external peripheral portion of a heated member of a cylindrical or column shape, includes a pair of stop metal members fixed near the circumferential end portions of the heater and a spring, both end portions of the spring engaged with the stop metal members in a state being pulled by the stop metal members with a predetermined tension, respectively, the opposite circumferential end portions of the heater are attracted to each other and so the heater is elastically adhered to the external peripheral portion of the heated member.

Abstract: An electronic component mounting method by which a surface-mount component and an IC can be efficiently and reliably mounted on a single substrate is provided. A high-temperature solder paste (4) is supplied to electrodes (2) for receiving surface-mount components (40), and the surface-mount components (40) are provisionally fixed on the electrodes (2) with the high-temperature solder paste (4). In addition, flux (5) is applied to an electrode (1) for receiving an IC (30a) that is provided with eutectic solder bumps (31) or on the eutectic solder bumps (31), and the IC (30a) is provisionally fixed on the electrode (1) with the flux (5). Then, a wiring substrate (10) is heated to a high temperature at which both the high-temperature solder and the eutectic solder melt, so that the surface-mount components (40) and the IC (30a) are reflow-soldered.

Abstract: A pressure welding apparatus includes a pressing die assembly 50 which has a plurality of stuffers 54 that pressure-weld electric wires 45 to the pressure-welding parts 34 of contacts 30, and a comb 70. The pressing die assembly 50 has a plurality of pins 60 which are located adjacent to the respective stuffers 54 and which are constantly driven downward by springs 62 so that the pins 60 protrude beyond the lower ends of the stuffers 54. The widths of the respective pins 60 are set so that these widths are substantially equal to the widths of the cavities 16 of the housing 10 in which the contacts 30 are accommodated. As a result, the pins 60 advance into the housing cavities 16 located adjacent to the contact 30 on which pressure-welding is to be performed, and support the housing partition walls 20 from the sides during the pressure welding process.

Abstract: The present invention provides a system and method for attaching a device to an inside wall of an enclosure. The device is removably attached to a positioner. Where the device includes a metal substance, it may be attached to the positioner by a magnet affixed to the positioner, for example. A first motor-operated moving device moves the enclosure such that the device abuts an inside wall of the enclosure. A second motor-operated moving device, for example a robot, then attaches the device to the inside wall of the enclosure. Where the enclosure and the device are composed of metal, the two may be welded together. In this instance, the first motor-operated moving device may be a non-robotic, motor-operated moving device that provides a ground path for the weld.

Abstract: An automotive framing apparatus with a support frame having a frame roof supported above a generally horizontal support surface. At least four gate assemblies are carried by a carrousel supported on the frame roof for rotational movement around a common vertical axis and form two gate assembly pairs of diametrically-opposed gate assemblies. The gate assemblies of each gate assembly pair are supported for pivotal movement between generally horizontal stowed and generally vertical working positions. A rotary drive selectively positions one gate assembly pair at a time in a framing position from which the two gate assemblies of the selected gate assembly pair can be pivoted by a drive downward to respective diametrically opposed working positions on opposed sides of a vehicle body to be welded.

Abstract: A motor vehicle body assembly and welding station comprises a pair of facing tool (12) support conformators (11) designed to work on the body and taken between them by a conveyor system (14). The conformators are movable between a rest position in which the body is free to enter and exit the station and a work position in which the tools are near the body to work on it. At least some of the tools (12) comprise measurement means (20) for the relative position of facing body parts and the conformators have an intermediate position between said work and rest positions. On command control means (19) take the conformator into said intermediate position and activate the measurement means (20) to determine the agreement of body dimensions with predetermined measurement intervals and issue acceptance or rejection signals (22) for the body on the basis of the survey result.

Abstract: In a method of manufacturing multiple kinds of products in an arbitrarily selected order in one manufacturing apparatus, the rate of operation of the welding robots to be disposed in each of assembly lines for each of parts is improved, the cost for equipment investment is reduced, and the time required to introduce a new kind of motor vehicle into the manufacturing apparatus is shortened, whereby the productivity is improved. The manufacturing apparatus is made up of: a plurality of part assembly lines for assembling a plurality of parts; a combining station for tack-welding these parts to thereby assemble a product; and a reinforce-welding line for reinforce-welding the product. The number of welding points for welding each of the parts in the respective assembly lines is made equal to one another for all kinds of vehicles. Those welding points of each of the parts which fall short of a required number of welding points are welded in the reinforce-welding line.

Abstract: A head gimbal assembly, which is a component of a hard disk drive, has a bending portion that has elasticity and is bent at a predetermined angle under an unloaded condition, and a slider is bonded to a holding portion thereof by mounting the head gimbal assembly on a bonding jig in a state in which the bending portion is stretched. When the head gimbal assembly is separated from the bonding jig after bonding, the bending portion is not restored freely, so that the head gimbal assembly is caught by the bonding jig during the separating process and a locked state is sometimes established.