Abstract: Provided are spectrometers utilizing surface plasmons and surface plasmon resonance. The spectrometer includes a substrate including a region having a permittivity slope (varying permittivity), a dielectric spacer configured to correspond to the region having a permittivity slope, and a detector configured to face the region having a permittivity slope with the dielectric spacer therebetween. The region having a permittivity slope includes a region having a dopant concentration slope (varying concentration).

Abstract: The invention concerns a detection device for detecting electromagnetic radiation, comprising a substrate, an array of thermal detectors, each thermal detector comprising a suspended absorbent membrane and a reflective layer. The detection device comprises at least one opaque vertical wall, arranged on the substrate and extending longitudinally between two adjacent thermal detectors, and produced from a material that is opaque to the electromagnetic radiation to be detected.

Abstract: Bolometers and methods of forming the same are provided. A bolometer that includes a substrate, a support structure comprising at least one SiGe layer and at least one Si layer, an absorber comprising reduced graphene oxide, and a thermistor comprising partially reduced graphene oxide are described. Also described are methods for forming bolometers and the parts contained therein.

Abstract: A camera device includes a first IR illuminator that is configured to irradiate a first irradiation range in a capturing area with first IR light, a second IR illuminator that is configured to irradiate a second irradiation range narrower than the first irradiation range in the capturing area with second IR light, and a controller that is configured to obtain a zoom magnification of the lens and controls the irradiation of the first IR light and the second IR light in a case where the zoom magnification is equal to a predetermined zoom magnification. The controller changes a supplied current of the first IR illuminator for the irradiation of the first IR light over a first predetermined time period, and changes a supplied current of the second IR illuminator for the irradiation of the second IR light over a second predetermined time period.

Abstract: A downhole logging tool includes a radiation generation source operable to emit radiation into a formation surrounding the tool and a radiation detector operable to detect backscattered radiation from the formation surrounding the tool. The tool also includes a sleeve positioned around the radiation generation source, the sleeve including at least one aperture for forming a pathway for a radiation beam, emitted from the radiation generation source, to enter the formation, the sleeve being rotatable about an axis of the tool to change a position of the aperture to distinctly inspect different regions of the formation.

Abstract: An optically transparent electromagnetic shield assembly comprising an electrical connection device with variable electrical resistance. The electrical connection device electrically connects a conductive two-dimensional structure, which covers a transparent substrate, to a shell portion which is electrically conductive. The resistance of the connection device can be adjusted, either initially for a detection system for which the shield assembly is intended or in real time while the shield assembly is in use, according to an RF radiation intensity.

Abstract: A patient support apparatus includes a plurality of primary sensors adapted to measure different parameters used in the control of the patient support apparatus. One or more suites of secondary sensors are added to the patient support apparatus to provide data about the primary sensors. The secondary sensors may be used to detect errors in the primary sensors, to modify outputs from the primary sensors, and/or to provide usage and/or diagnostic data about the use of the patient support apparatus. The suite(s) of secondary sensors may measure parameters that affect the outputs of one or more of the primary sensors. In some embodiments, the suite(s) of secondary sensors include one or more dormant sensors that are not used on the patient support apparatus until a code modification is received from one or more external sources instructing the control system of the patient support apparatus to begin using the dormant sensor(s).

Abstract: An optical module includes a base, a first optical component and at least two washers. The first optical component is disposed on the base and the first optical component has a flange. The washers are disposed on the first optical component and sandwiched in between the base and the flange. Each of the washers has a first side surface and a second side surface, wherein the first side surface and the second side surface tilt with respect to each other by an angle.

Abstract: An object is to provide an optical element that is thin and can gather and reflect light in a specific wavelength range in a predetermined direction, and a sensor including the above-described optical element. The optical element includes a cholesteric liquid crystal layer, in which the cholesteric liquid crystal layer has a liquid crystal alignment pattern in which a direction of an optical axis derived from a liquid crystal compound changes while continuously rotating in at least one in-plane direction, and in a case where a length over which the direction of the optical axis rotates by 180° in the in-plane direction in which the direction of the optical axis changes while continuously rotating is set as a single period, the cholesteric liquid crystal layer has in-plane regions having different lengths of the single periods in the liquid crystal alignment pattern.

Abstract: A thermal detector including a substrate, an absorbent membrane including a fixed part and a deformable part, the latter including a shape-memory alloy, and being arranged with respect to the substrate in such a way that its free end is in contact with the substrate at the contact temperature Tc above the austenite start temperature As.

Abstract: A bolometer circuit may include an active bolometer configured to receive external infrared (IR) radiation. The bolometer circuit may be configured to reduce power consumption at high temperatures. In particular, the bolometer circuit may include additional resistors provided in the resistive loads for bolometer conduction paths to limit power at high temperatures. In some embodiments, the bias (e.g., a voltage level) to the gates of transistors in the resistive loads for the bolometer conduction paths may be adjusted based on temperature to limit power and/or current at high temperatures. In bolometer circuits with a feedback resistor provided across an amplifier to configure a feedback amplifier, a circuit with adjustable amplifier power may be provided to save power. In some embodiments, a bolometer circuits may be provided with reduced gains to allow for very hot scenes to be imaged without railing the output.

Abstract: Systems and methods that facilitate non-pertubative measurements of low and null magnetic field in high temperature plasmas.

Abstract: The present disclosure relates to an exponential model based uncooled infrared focal plane array readout circuit, including: a first microbolometer unit and a second microbolometer unit, for obtaining a detection signal and a reference signal; a conversion unit, connected with the first and second microbolometer units, and configured for converting the detection signal and reference signal to obtain a linear detection signal and linear reference signal; a subtraction unit, connected with the conversion unit, and configured for calculating a difference between the detection signal and the reference ratio signal to obtain a difference signal; and an integration unit, connected to the subtraction unit, and configured for integrating the difference signal to obtain an electrical signal for characterizing the infrared light signal of the to-be-detected object.

Abstract: A recessed carbon nanotube article includes a base; a substrate disposed on the base; wells disposed in the substrate and bounded by the base and a substrate wall; and a carbon nanotube element disposed in individual wells and including vertically aligned carbon nanotubes such that a longitudinal length of the vertically aligned carbon nanotubes is less than a depth of the well in which the carbon nanotube element is disposed. A recessed carbon nanotube bolometer includes a base; a substrate on the base; radiation wells in the substrate; carbon nanotubes in the wells; thermistors and heaters on the membrane arranged as an electrical substitution member. A process for making a recessed carbon nanotube bolometer includes forming a substrate on a base; forming a radiation well in the substrate; forming carbon nanotubes in the well; disposing a cover on the wells; and forming a thermistor and a heater on the base.

Abstract: A component comprises a first part and a second part, wherein said second part is in contact with said first part, wherein: (i) said first part comprises a polymer having a repeat unit of formula —O-Ph-O-Ph-CO-Ph-??I and a repeat unit of formula —O-Ph-Ph-O-Ph-CO-Ph??II wherein Ph represents a phenylene moiety; and (ii) said second part comprises a metal.

Abstract: Imaging devices including dielectric metamaterial absorbers and related methods are disclosed. According to an aspect, an imaging device includes a support. The imaging device also includes multiple dielectric metamaterial absorbers attached to the support. Each absorber includes one or more dielectric resonators configured to generate and emit thermal heat upon receipt of electromagnetic energy.

Abstract: Various techniques are disclosed for smart surveillance camera systems and methods using thermal imaging to intelligently control illumination and monitoring of a surveillance scene. For example, a smart camera system may include a thermal imager, an IR illuminator, a visible light illuminator, a visible/near IR (NIR) light camera, and a processor. The camera system may capture thermal images of the scene using the thermal imager, and analyze the thermal images to detect a presence and an attribute of an object in the scene. In response to the detection, various light sources may be selectively operated to illuminate the object only when needed or desired, with a suitable type of light source, with a suitable beam angle and width, or in otherwise desirable manner. The visible/NIR light camera may also be selectively operated based on the detection to capture or record surveillance images containing objects of interest.

Abstract: A terahertz wave detection device includes a low-dimensional electron system material formed on a substrate; and a first electrode and a second electrode opposingly arranged on a two-dimensional plane of the low-dimensional electron system material. The first electrode and the second electrode are made of metals having different thermal conductivity. An 8-element array sensor includes eight terahertz wave detection devices aligned in an array. The terahertz wave detection device includes carbon nanotube film; a first electrode disposed on one side of the carbon nanotube film; and a second electrode disposed on the other side of the carbon nanotube film. The first electrode and the second electrode have different thermal conductivity.

Abstract: An optical fiber heat exchanger includes an outer body and an inner body inserted into the outer body. The inner body includes a plurality of guide walls to guide a cooling liquid through the optical fiber heat exchanger to exchange heat from an optical fiber inserted in the optical fiber heat exchanger, a first set of parallel straight channels, extending along an inlet portion of the inner body, formed by a first subset of the plurality of guide walls, a set of U-shaped channels, extending through a transition section of the inner body, formed by a second subset of the plurality of guide walls, and a second set of parallel straight channels, extending along an outlet portion of the inner body, formed by a third subset of the plurality of guide walls.

Abstract: An apparatus and method to determine a property of a substrate by measuring, in the pupil plane of a high numerical aperture lens, an angle-resolved spectrum as a result of radiation being reflected off the substrate. The property may be angle and wavelength dependent and may include the intensity of TM- and TE-polarized radiation and their relative phase difference.

Abstract: An induction trash can circuit includes an active infrared sensor, a microcontroller, a driving circuit and a motor for controlling the opening and closing of a lid. The power-saving method is achieved through the following steps: in a standby state, the microcontroller controls the active infrared sensor to emit an infrared pulse signal to an induction area; if no obstacle exit in the induction area, the active infrared sensor outputs no signals, the program of the microcontroller immediately enters a sleep state; after the program of the microcontroller sleeps for a period of time, a watchdog timer in the microcontroller wakes up the microcomputer controller to make the microcontroller re-enter a working state; and if the microcontroller is in a standby state, the above process is repeated.

Abstract: Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays disposed in the focal plane of two corresponding focusing lenses. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.

Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

Abstract: A spectral sensor includes a wiring substrate which has a principal surface; a light detector which is disposed on the principal surface of the wiring substrate and is electrically connected to the wiring substrate; spacer which is disposed around the light detector, on the principal surface of the wiring substrate; and a Fabry-Perot interference filter which has a light transmission region and is disposed on the principal surface of the wiring substrate with the spacer therebetween. The spacer support the Fabry-Perot interference filter in a surrounding region of the light transmission region and the spacer is arranged to form opening communicating with an inner side of the surrounding region and an outer side of the surrounding region, when viewed from a light transmission direction in the light transmission region.

Abstract: A moving object localization system includes: a sensor that detects a moving object and measures positional information of the moving object; and a server that collects measured information from the sensor and calculates a position of moving object.

Abstract: A method implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable medium being operable to perform a thermal analysis of a data center and overlay the thermal analysis on a map of the data center to provide an overlaid thermal analysis. Additionally, the computer executable code is operable to dynamically control at least one partition in the data center based on the overlaid thermal analysis.

Abstract: Focal plane arrays and infrared detector device having a transparent common ground structure and methods of their fabrication are disclosed. In one embodiment, a front-side illuminated infrared detector device includes a contact layer and a detector structure adjacent to the contact layer. The detector structure is capable of absorbing radiation. The front-side illuminated infrared detector device further includes a common ground structure adjacent the detector structure, wherein the common ground structure is transmissive to radiation having a wavelength in a predetermined spectral band, and the common ground structure has a bandgap that is wider than a bandgap of the detector structure. The front-side illuminated infrared detector device further includes an optical layer adjacent the common ground structure.

Abstract: An optical sensor assembly is provided. The optical sensor assembly includes a circuit board, an optical sensor positioned on the circuit board, and a front cover attached to the circuit board and covering the optical sensor. The front cover includes an optical element configured to guide or condense an incident light of a predetermined wavelength onto the optical sensor. The front cover is made of polypropylene or polyethylene. The predetermined wavelength is in a range from 8 micrometers to 12 micrometers.

Abstract: An optical sensor including: a semiconductor layer including a source region and a drain region; a gate electrode facing a region between the source region and the drain region; a photoelectric conversion layer between the region and the gate electrode; and a first transistor having a first gate coupled to one of the source region and the drain region.

Abstract: What is described is a high-frequency integrated circuit provided on a III-V compound semiconductor, wherein an emitting device is radiation-coupled with the integrated circuit such that the emitting device irradiates the integrated circuit, and wherein the integrated circuit has at least one of an oscillator, a mixer, a phase shifter, a frequency divider or an amplifier.

Abstract: A semiconductor device according to the present invention includes: a substrate; a heat generating portion provided on the substrate; a cap substrate provided above the substrate so that a hollow portion is provided between the substrate and the cap substrate; and a reflection film provided above the heat generating portion and reflecting a medium wavelength infrared ray. The reflection film reflects the infrared ray radiated to the cap substrate side through the hollow portion due to the temperature increase of the heat generating portion, so that the temperature increase of the cap substrate side can be suppressed. Because of this function, even if mold resin is provided on the cap substrate, increase of the temperature of the mold resin can be suppressed.

Abstract: A method is described for closing off a micromechanical device by laser melting, having the steps: (A) providing a micromechanical device having an access channel that has a collar at an external opening; (B) closing off the external opening of the access channel by laser irradiation of the collar, the collar being at least partly melted and the external opening being closed with melt made of a material of the collar. Also described is a micromechanical device having a laser melt closure, in particular produced by the method according to the present invention, the micromechanical device having an access channel that has a collar at an external opening, the external opening of the access channel being closed by a melt closure made of a material of the collar.

Abstract: In some embodiments, the present disclosure relates to an integrated chip having an inter-layer dielectric (ILD) structure along a first surface of a substrate having a photodetector. An etch stop layer is over the ILD structure, and a reflector is surrounded by the etch stop layer and the ILD structure. The reflector has a curved surface facing the substrate at a location directly over the photodetector. The curved surface is coupled between a first sidewall and a second sidewall of the reflector. The reflector has larger thicknesses along the first sidewall and the second sidewall than at a center of the reflector between the first sidewall and the second sidewall.

Abstract: Methods and apparatus for sensing or measuring an electromagnetic field. The method entails excitation into a distribution of Rydberg states of atoms of a gas occupying a test volume coextensive with the electromagnetic field. Transmission along a path traversing the test volume of at least one probe beam of electromagnetic radiation is measured at one or more frequencies overlapping a spectral feature, and a physical characteristic of the electromagnetic field is derived on the basis of variation of the spectral feature. In various embodiments, the electromagnetic field may be place in interferometric relation with another electromagnetic field. Time-varying electric field amplitude, frequency, phase and noise spectral distribution may be measured, and thus AM and FM modulated fields, as well as magnetic fields of about 1 Tesla. The apparatus for measuring the electromagnetic field may be unilaterally coupled to a probe field and detector or array of detectors.

Abstract: The invention relates to a method for improving the screening of histological samples, especially samples that may include cancerous or precancerous cells, or cells having other disease states. The method involves analysing a sample obtained from a subject and comprises the steps of providing the spectra produced by scanning the sample using FTIR spectroscopy and identifying or sorting the cells in the sample according to the spectrum each produces.

Abstract: A method for manufacturing an optical wafer may include coating multiple optical components with a substrate. The multiple optical components may include a light emitting component and a light detecting component, and each of the optical components may include one or more electrical connections. The method may also include depositing a redistribution layer onto at least one of the electrical connections, wherein the redistribution layer routes the electrical connection within the optical wafer to an external connection. The method may also include depositing a passivation layer over the redistribution layer and depositing a dark photoresist layer on at least the passivation layer. The photoresist layer may operatively reduce optical interference between at least one light emitting component and at least one light detecting component.

Abstract: Laser energy has a non-uniform energy distribution in its profile such that at least one first portion of the laser energy is more intense than at least one second portion of the laser energy. The laser energy is absorbed using a beam dump having an absorbing surface, which converts the laser energy into thermal energy. A shape of the absorbing surface is based on the profile. At least one first portion of the absorbing surface has one or more first angles of incidence with respect to the laser energy and receives the first portion(s) of the laser energy. At least one second portion of the absorbing surface has one or more second angles of incidence with respect to the laser energy and receives the second portion(s) of the laser energy. The one or more first angles of incidence are larger than the one or more second angles of incidence.

Abstract: A display device includes a base substrate, a pixel defining layer, a spacer layer and a photosensitive circuit. The pixel defining layer is on the substrate and includes a pixel region and a pixel gap region; the spacer layer is on the pixel gap region of the pixel defining layer and at a side of the pixel defining layer away from the base substrate; and the photosensitive circuit is at a side of the pixel defining layer away from the spacer layer. The spacer layer is lightproof, a first opening is in the spacer layer, the first opening and the photosensitive circuit are overlapped with each other in a direction perpendicular to the base substrate, and the photosensitive circuit is configured to detect light passing through the first opening.

Abstract: A sensor, including light emitters projecting directed light beams, light detectors interleaved with the light emitters, lenses, each lens oriented relative to a respective one of the light detectors such that the light detector receives maximum intensity when light enters the lens at an angle b, whereby, for each emitter E, there exist corresponding target positions p(E, D) along the path of the light from emitter E, at which an object located at any of the target positions reflects the light projected by emitter E towards a respective one of detectors D at angle b, and a processor storing a reflection value R(E, D) for each co-activated emitter-detector pair (E, D), based on an amount of light reflected by an object located at p(E, D) and detected by detector D, and calculating a location of an object based on the reflection values and target positions.

Abstract: An object is to provide a display device with low power consumption and good display quality. A first substrate is provided with a terminal portion, a pixel electrode, a switching transistor including an oxide semiconductor, a first optical sensor having high optical sensitivity to visible light, and a second optical sensor having optical sensitivity to infrared light and having lower optical sensitivity to visible light than the first optical sensor. The illuminance or color temperature around a display device is detected using the first and second optical sensors, and the luminance or color tone of a display image is adjusted. A second substrate is provided so as to face the first substrate, and is provided with a counter electrode. In a period for displaying a still image, the switching transistor is turned off so that the counter electrode is brought into a floating state.

Abstract: The present specification generally relates to the field of imaging device and particularly discloses an imaging device for detecting infrared radiation. The imaging device comprises a first set of detectors responsive to infrared electromagnetic radiation in a first wavelength band, a second set of detectors and a filter disposed above the second set of detectors to prevent registration of electromagnetic radiation outside a second wavelength band at the second set of detectors. The second wavelength band is a subset of the first wavelength band. The imaging device is configured to detect a deviation from an expected value of a level of electromagnetic radiation in a third wavelength band based on signals obtained from the first set of detectors and the second set of detectors. The third wavelength band is within the first wavelength band and outside the second wavelength band.

Abstract: A dual sensor module includes a substrate, a light source, a first encapsulant, a second encapsulant, a photodetector, and an electrode. The light source is disposed on the substrate. The first encapsulant is formed over the light source. The photodetector is disposed on the substrate. The second encapsulant is formed over the photodetector. The electrode is electrically connected to the substrate and is entirely located between the light source and the photodetector. A dual sensing accessory and a dual sensing device having the dual sensor module for detecting optical and electrical properties are also provided.

Abstract: A photodetector includes a Helmholtz resonator and a photosensitive structure that is placed in an electric-field-concentrating interval forming part of the Helmholtz resonator. Such a photodetector is in particular suitable for imaging applications. The wavelength of the radiation to be detected is determined by dimensions of the Helmholtz resonator, within a detection spectral interval of the photosensitive structure.

Abstract: A microelectromechanical (MEMS) Fabry-Perot interferometer includes a transparent substrate; a first metallic mirror structure on the transparent substrate, including a first metal layer and a first support layer; a second metallic mirror structure above the first metallic mirror structure on an opposite side of the first metallic mirror structure in view of the transparent substrate, the second metallic mirror structure including a second metal layer and a second support layer, wherein the first and the second support layer are parallel and including at least one of aluminum oxide or titanium dioxide; a Fabry-Perot cavity between the first and the second support layer, whereby the Fabry-Perot cavity is formed by providing an insulation layer on the first mirror structure, and at least partially removing the insulation layer after providing the second mirror structure; and electrodes for providing electrical contacts to the first and the second metal layer.

Abstract: The micromechanical photothermal spectroscopy system and method includes a cantilever assembly having at least one cantilever thermal sensor extending from a support. The sensors may be simple bimetallic sensors, or may include microchannels made from two materials having different thermal expansion coefficients for analysis of microfluids. A beam of infrared light is separated out from solar radiation by gratings and filters, and is at least partially projected on the cantilever sensor(s). Heat released from the analyte by absorbance of infrared light results in deflection of the cantilever sensor(s), which is measured by a deflection detector. A filter wheel permits tuning of the sunlight-based infrared light beam to plot a spectrum of absorbance as a function of wavelength or wave number characteristic of the analyte. The deflection detector may be optical (using a laser and position sensitive detector(s)), or may use piezo-resistive material embedded in the sensor(s).

Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

Abstract: A holographic waveguide LIDAR comprises a transmitter waveguide coupled to a beam deflector and a receiver waveguide coupled to a detector module. The transmitter waveguide contains an array of grating elements for diffracting a scanned laser beam into a predefined angular ranges. The receiver waveguide contains an array of grating elements for diffracting light reflected from external points within a predefined angular range towards the detector module.

Abstract: According to some embodiments a method of assembling an optical system comprises steps of: measuring retardance profiles of a plurality of optical elements, relatively positioning the optical elements in relative orientations that enhance complementarity between the retardance profiles of the optical elements, and securing the combinations of relatively oriented optical elements together, to control or minimize the combined retardance of the stacked optical elements.

Abstract: A mobile robot, comprising: a body and a drive system for driving a movement of the mobile robot, a light emitter for emitting light toward a surface to be detected, a photoelectric sensor responsive to light from an environment and/or emitted by the light emitter, a variable impedance unit connected to the photoelectric sensor and having a reduced impedance when the photoelectric sensor is responsive to light of a preset intensity, and a control unit, where the light emitter is controlled by the control unit to form at least two operating states in which light is emitted at different intensities, and in the operating state other than the last operating state, if a sampling difference value determined when the light emitter is in the OFF state and ON state does not satisfy a preset condition, an operating state of the light emitter is changed to prevent misjudgment.

Abstract: A papillary print sensor comprising in superposition a contact surface to which the print to be imaged is intended to be applied, an array optical sensor and illuminating device. The illuminating device is arranged between the contact surface and a detecting surface of the array optical sensor, and consists of a plurality of organic light-emitting diodes, referred to as OLEDs. Each OLED extends uninterruptedly over more than a third of a width (L1) of the detecting surface, and the OLEDs extend together along one or two series of patterns that are parallel to one another and distributed along the length (L2) of the detecting surface. This configuration of the OLEDs allows in particular the transistors for controlling the OLEDs to be placed off the detecting surface (125).