Abstract: A miniature gas sensing device includes a silicon-based substrate including an opening. A first membrane is formed over the silicon-based substrate and a first portion of the first membrane covers the opening. A gas sensing layer is formed over a number of electrodes disposed over a first surface of the first portion of the first membrane and one or more heating elements. A permeable enclosure encapsulating the gas sensing layer can maintain thermal energy density over the gas sensing layer at a level sufficient to destroy a target gas to allow measuring a zero baseline.

Abstract: A method for forming a sealed cavity includes bonding a non-conductive structure to a first substrate to form a non-conductive aperture into the first substrate. On a surface of the non-conductive structure opposite the first substrate, the method includes depositing a first metal layer. The method further includes patterning a first iris in the first metal layer, depositing a first dielectric layer on a surface of the first metal layer opposite the non-conductive structure, and patterning an antenna on a surface of the first dielectric layer opposite the first metal layer. The method also includes creating a cavity in the first substrate, depositing a second metal layer on a surface of the cavity, patterning a second iris in the second metal layer, and bonding a second substrate to a surface of the first substrate opposite the non-conductive structure to thereby seal the cavity.

Abstract: This disclosure discloses a light-emitting element having a light-emitting unit, a transparent layer and a wavelength conversion layer formed on the transparent layer. The transparent layer covers the light-emitting unit. The wavelength conversion layer includes a phosphor layer having a phosphor and a stress release layer without the phosphor.

Abstract: A method of manufacturing an integrated circuit device includes providing a substrate comprising a semiconductor active layer, and forming source/drain regions, temperature sensors, and heating elements either in the semiconductor active layer or on the front side of the semiconductor active layer. The semiconductor active layer has channel regions between adjacent source/drain regions, and each of the heating elements is aligned over at least a portion of a corresponding temperature sensor. The method also includes forming a metal interconnect structure over the front side of the semiconductor active layer and exposing the channel regions from the back side of the semiconductor active layer substrate. A fluid gate dielectric layer is formed over the exposed channel regions.

Abstract: A method of functionalizing carbon nanotubes with metallic moieties is disclosed. Carbon nanotubes are first associated with one or more binding moieties to provide carbon nanotubes encapsulated by the binding moieties. The encapsulated carbon nanotubes are then contacted with a metal salt or a metal complex that binds to the binding moieties. Reduction of the metal salt or metal complex provides carbon nanotubes functionalized with metal nanoparticles.

Abstract: A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.

Abstract: Embodiments of multi-frequency excitation are described. In various embodiments, a natural frequency of a device may be determined. In turn, a first voltage amplitude and first fixed frequency of a first source of excitation can be selected for the device based on the natural frequency. Additionally, a second voltage amplitude of a second source of excitation can be selected for the device, and the first and second sources of excitation can be applied to the device. After applying the first and second sources of excitation, a frequency of the second source of excitation can be swept. Using the methods of multi-frequency excitation described herein, new operating frequencies, operating frequency ranges, resonance frequencies, resonance frequency ranges, and/or resonance responses can be achieved for devices and systems.

Abstract: A device for monitoring fluid media, and methods of manufacture thereof are disclosed. The monitoring device may be implemented as a single monolithic unit made from a certain type of material without a separate packaging, and having a base element comprising at least one fluid port and at least one cavity or fluid flow path fluidly coupled to the at least one fluid port for enabling fluid exchange of fluid media therewith. The device comprises at least one sensing element associated with the cavity or fluid flow path and configured and operable for measuring at least one property or condition of fluid media introduced thereinto, and generate measurement data or signals indicative thereof. Electrical contacts disposed on the base element of the device, and electrically coupled to the at least one sensing element are used for establishing electrical connection with the at least one sensing element.

Abstract: A gas detection system, comprising a sample gas inlet, a reference gas inlet and a gas modulation valve alternatingly connecting one of the sample gas inlet and the reference gas inlet to a gas sensor, is characterized in that a selective transfer filter is located in the gas flow path connecting the gas modulation valve and the gas sensor.

Abstract: An organic light emitting display device in an embodiment of the present invention comprises a display panel equipped with a plurality of pixels each including an OLED and a driving TFT for driving the OLED and a sensing circuit connected to pixels through a sensing line and detecting driving characteristics of a corresponding pixel. The sensing circuit may comprise a plural sensing units including an integrator for integrating currents respectively flowing two adjacent sensing lines connected to inverting and non-inverting input terminals of a fully differential amplifier, a sampling unit for respectively sampling two integral outputs of the integrator and a scaler for regulating an operating range of outputs of the sampling unit, a differential amplifier for differentially amplifying one or more outputs of the scaler, and an ADC for converting an output of the differential amplifier into a digital sensing value.

Abstract: A method for forming a micro-electro-mechanical system (MEMS) device structure is provided. The MEMS device structure includes a micro-electro-mechanical system (MEMS) substrate, and a substrate formed over the MEMS substrate. The substrate includes a semiconductor via through the substrate. The MEMS device structure includes a dielectric layer formed over the substrate and a polymer layer formed on the dielectric layer. The MEMS device structure also includes a conductive layer formed in the dielectric layer and the polymer layer. The conductive layer is electrically connected to the semiconductor via, and the polymer layer is between the conductive layer and the dielectric layer.

Abstract: Embodiments described herein include an input device including an array of sensing pixels configured to sense an input object in a sensing region, each of the sensing pixels including a sense element. Each of the sensing pixels also includes a first transistor, wherein the first transistor includes a gate terminal connected to a row select line and a second terminal connected to the sense element. Each of the sensing pixels also includes a non-linear circuit element, wherein the non-linear circuit element includes a first terminal connected to the sense element and the second terminal of the first transistor, and wherein the non-linear circuit element further includes a second terminal connected to a column output line.

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Abstract: A micromechanical sensor device and a corresponding manufacturing method. The micromechanical sensor device is equipped with a substrate which includes a diaphragm area, multiple sensor layer areas being formed on the diaphragm area, which have a particular structured sensor layer; and a particular electrode device, via which the sensor layer areas are electrically connectable outside of the diaphragm area, the sensor layer areas being structured in such a way that they have length and width dimensions of a magnitude between 1 and 10 micrometers.

Abstract: Provided herein is a method including forming a cavity in a first side of a first silicon wafer. An oxide layer is formed on the first side and in the cavity. The first side of the first silicon wafer is bonded to a first side of a second silicon wafer, and a gap control structure is deposited on a second side of the second silicon wafer. A MEMS structure is formed in the second silicon wafer. The second side of the second silicon wafer is eutecticly bonded to the third silicon wafer, and the eutectic bonding includes pressing the second silicon wafer to the third silicon wafer.

Abstract: A method for measuring a temperature of magnetic junction switchable using spin transfer. The magnetic junction includes at least one magnetic layer. The method includes measuring a temperature variation of at least one magnetic characteristic for the magnetic layer(s) versus temperature. The method also includes measuring a bias variation in the magnetic characteristic versus an electrical bias for the magnetic junction. This measurement is performed such that spin transfer torque-induced variation(s) in the magnetic characteristic(s) are accounted for. The temperature versus the electrical bias for the magnetic junction is determined based on the temperature variation and the bias variation.

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.

Abstract: MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

Abstract: A finger print and pressure dual sensor includes first electrodes disposed on a substrate and extending in a first direction, and source electrodes and drain electrodes disposed to face each other in the first direction; channel regions disposed on the substrate and electrically connected to the source electrode and drain electrode; a first dielectric layer disposed on the substrate, covering the first electrodes, the source electrodes, and the drain electrodes and having first openings for exposing the channel region; second electrodes disposed on the first dielectric layer and extending in a second direction; a second dielectric layer disposed on the first dielectric layer, covering the second electrodes and having second openings for exposing the channel region; gate electrodes disposed on the second dielectric layer, extending in the second direction and disposed on the channel region; and a cover layer disposed on the second dielectric layer and covering the gate electrodes.

Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.

Abstract: A magnetic field sensor can sense a movement of an object along a path. A movement line is tangent to the path. The magnetic field sensor can include a semiconductor substrate. The semiconductor substrate can have first and second orthogonal axes orthogonal to each other on the first surface of the substrate. A projection of the movement line onto a surface of the semiconductor substrate is only substantially parallel to the first orthogonal axis. The magnetic field sensor can also include first, second, third, and fourth magnetic field sensing elements disposed on the substrate. The first and second magnetic field sensing elements have maximum response axes parallel to the first orthogonal axis and the second and fourth magnetic field sensing elements have maximum response axes parallel to the second orthogonal axis. Signals generated by the second and fourth magnetic field sensing elements can be used as reference signals.

Abstract: A microelectronic device capable of detecting multiple gas constituents in ambient air can be used to monitor air quality. The microelectronic air quality monitor includes a plurality of temperature-sensitive gas sensors tuned to detect different gas species. Each gas sensor is tuned by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the sensor at a desired temperature. A temperature sensor may also be integrated with each gas sensor to provide additional feedback control. The heater, temperature sensor, and gas sensors are in the form of patternable thin films integrated on a single microchip. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.

Abstract: A resistive element includes a resistive region in a semiconductor substrate, a first contact structure and a second contact structure. The semiconductor substrate includes a first main surface area. The resistive region extends in a lateral direction parallel to the main surface area and in a vertical direction perpendicular to the main surface area, and includes a first piezo-resistive coefficient for a current flow in the lateral direction and a second piezo-resistive coefficient for a current flow in the vertical direction. The first contact structure contacts a portion of a first face of the resistive region and the second contact structure contacts a portion of a second face of the resistive region. The resistive element generates a current flow distribution within the resistive region having a lateral component and a vertical component that results in a piezo-resistive coefficient of the resistive element.

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

Abstract: A back-biased magnetic field sensor can have one or more vertical Hall effect elements arranged within a substrate region of a substrate, wherein magnetic fields are oriented substantially vertical to the substrate within the substrate region when a ferromagnetic object is not proximate. When the ferromagnetic object becomes proximate, the magnetic field sensor can sense at least the proximity, and, in some embodiments, can also localize a position of the ferromagnetic object relative to the magnetic field sensor.

Abstract: A bipolar junction transistor having a relatively reduced size and an improved current gain and a method of manufacturing the same are disclosed. The bipolar junction transistor includes a plurality of emitter regions disposed in a substrate, a plurality of base regions disposed in the substrate and configured to surround the emitter regions, respectively, and a collector region disposed in the substrate and configured to surround the base regions. The plurality of emitter and base regions may be arranged in a matrix.

Abstract: A high-efficiency fingerprint identification device includes an electrode substrate, plural 1-to-N switch circuits formed on the electrode substrate, plural sensing electrodes and plural wires. Each 1-to-N switch circuit has one first end, N second ends and m control ends. The m control ends control connection between the N second ends and the first end. Each sensing electrode corresponds to a nearby 1-to-N switch circuit. The wires are divided into sensing and driving lines and control lines. The sensing electrodes in each column correspond to a sensing and driving line. The sensing and driving line is connected to one of the N second ends of the 1-to-N switch circuits in the column. The sensing electrodes in each row correspond to m control lines. Each control line is connected to ones of the m control ends of the 1-to-N switch circuits in the row.

Abstract: Methods, kits, systems, and apparatuses, for measuring and/or verifying end effector flatness using electrical continuity are provided.

Abstract: According to embodiments of the present invention, a microfluidic chip, a manufacturing method therefor and an analysis device using the same are provided. The microfluidic chip comprises: a substrate comprising an inflow part through which a fluid flows in, a fluid channel through which the fluid moves and an outflow part through which the fluid flows out; and a film attached to the substrate to protect at least one of the inflow part, the outflow part and the fluid channel from the outside, wherein the inflow part and the outflow part are implemented by penetrating through the surface of the substrate, and the fluid channel can be implemented by being sunk from the surface of the substrate.

Abstract: An organic light emitting diode display including: a substrate including a pixel part for displaying an image and a peripheral part enclosing the pixel part; a plurality of scan lines formed on the substrate, each for transferring a scan signal; a plurality of data lines for transferring a data voltage, and a plurality of driving voltage lines intersecting the plurality of scan lines for transferring a driving voltage, respectively; a plurality of pixels connected to the plurality of scan lines and the plurality of data lines, respectively and formed in the pixel part; and at least one dummy pixel connected to the plurality of scan lines and the plurality of data lines and formed in the peripheral part.

Abstract: Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.

Abstract: Embodiments of the present invention relate generally to logic devices, and more particularly, to magnetoelectric magnetic tunneling junction computational devices. Aspects of the disclosed technology include a stand-alone voltage-controlled magnetoelectric device that satisfies essential requirements for general logic applications, including nonlinearity, gain, concatenability, feedback prevention, and a complete set of Boolean operations based on the majority gate and inverter. Aspects of the present disclosed technology can eliminate the need for any auxiliary FETs to preset or complicated clocking schemes and prevents the racing condition.

Abstract: Embodiments of the present invention relate generally to logic devices, and more particularly, to magnetoelectric magnetic tunneling junction computational devices. Aspects of the disclosed technology include a stand-alone voltage-controlled magnetoelectric device that satisfies essential requirements for general logic applications, including nonlinearity, gain, concatenability, feedback prevention, and a complete set of Boolean operations based on the majority gate and inverter. Aspects of the present disclosed technology can eliminate the need for any auxiliary FETs to preset or complicated clocking schemes and prevents the racing condition.

Abstract: A method for forming a micro-electro mechanical system (MEMS) device is provided. The method includes bonding a semiconductor substrate with a carrier substrate through a dielectric layer and patterning the semiconductor substrate into multiple elements. The method also includes partially removing the dielectric layer to release some of the elements such that the released elements become one (or more) first movable element and one (or more) second movable element. The method further includes bonding a cap substrate with the semiconductor substrate to form a first closed chamber containing the first movable element and a second closed chamber containing the second movable element. In addition, the method includes opening the second closed chamber and sealing the second closed chamber after vacuumizing the second closed chamber such that the second closed chamber has a reduced pressure smaller than that of the first closed chamber.

Abstract: According to an embodiment, a facial recognition system includes an image sensor, a facial recognition processing unit, a heart rate detection unit, and an authentication unit. The image sensor detects incident light by an infrared pixel, and outputs detected infrared information. The facial recognition processing unit recognizes the face of a person based on image information signal captured by the image sensor. The heart rate detection unit reads the heart rate of the person from pulses in a blood vessel in the face based on the infrared information. The authentication unit receives facial recognition signal outputted from the facial recognition processing unit. The authentication unit authenticates the person as an identical person when the heart rate is inputted, and authenticates the person as a photograph when the heart rate is not inputted.

Abstract: A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector includes a housing and a pair of connecting elements that flank a card-receiving slot of the connector. The cables exit from the rear of the connector elements and from the connector port. The connector elements engage the connector port to fix the connector in place within the connector port.

Abstract: A vertical Hall element and method of fabricating are disclosed. The method includes forming a buried region having a first conductivity type in a substrate having a second conductivity type and implanting a dopant of the first conductivity type into a well region between the top surface of the substrate and the buried region. The buried region has a doping concentration increasing with an increasing depth from a top surface of the substrate and the well region has a doping concentration decreasing from the top surface of the substrate to the buried region. The method includes forming first through fifth contacts on the well region. First and second contacts define a conductive path and second and third contacts define another conductive path through the well region. The fourth contact is formed between first and second contacts and the fifth contact is formed between second and third contacts.

Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.

Abstract: A spatial light modulator is provided that uses light modulation structures at each pixel to employ electromagnetic interference to modulate the intensity and/or phase of the transmitted and/or reflected light from the pixel. The use of the modulation structures enables the independent and dynamic changing of the intensity and/or phase of the reflected and/or transmitted light at each pixel. The modulation structure can incorporate a plate with a semi-reflective surface that is separated from a substrate having either a reflective or semi-reflective surface. The modulation structure can have actuators positioned between the substrate and the plate to control the separation distance between the plate and the substrate. By controlling the separation distance, the amount of light reflected by and/or transmitted through the surfaces of the plate and substrate can be controlled. The separation distance can be related to the resulting interference applied to particular wavelengths of the light.

Abstract: The disclosure extends to devices, systems and methods for connecting one or more sensors to one or more printed circuit boards (PCB) in the distal end or tip of a scope. The disclosure also extends to a connector assembly for an image sensor for protecting the sensor and conveying information from the sensor to the PCB.

Abstract: A printed circuit board includes an insulating layer and an element embedded in the insulating layer and exposed through a surface of the insulating layer.

Abstract: Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.

Abstract: A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.

Abstract: A micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.

Abstract: The disclosed subject matter provides thin films including a metal silicide and methods for forming such films. The disclosed subject matter can provide techniques for tailoring the electronic structure of metal thin films to produce desirable properties. In example embodiments, the metal silicide can comprise a platinum silicide, such as for example, PtSi, Pt2Si, or Pt3Si. For example, the disclosed subject matter provides methods which include identifying a desired phase of a metal silicide, providing a substrate, depositing at least two film layers on the substrate which include a first layer including amorphous silicon and a second layer including metal contacting the first layer, and annealing the two film layers to form a metal silicide. Methods can be at least one of a source-limited method and a kinetically-limited method. The film layers can be deposited on the substrate using techniques known in the art including, for example, sputter depositing.

Abstract: The present disclosure relates to a microelectronics package with optical sensors and/or thermal sensors. The disclosed microelectronics package includes a module substrate, a thinned flip-chip die with an upper surface that includes a first surface portion and a second surface portion surrounding the first surface portion, and a first mold compound component. The thinned flip-chip die is attached to the module substrate and includes a device layer with sensor structure integrated at a top portion of the device layer. Herein, the sensor structure is below the first surface portion and not below the second surface portion. The first mold compound component is formed over the second surface portion to define a first cavity over the upper surface of the thinned flip-chip die. The first mold compound component is not over the first surface portion, and the first surface portion is exposed at the bottom of the first cavity.

Abstract: A finger biometric sensor may include a lower conductive layer, an upper conductive layer, and a spacer between the lower and upper conductive layers to define an air gap therebetween. The finger biometric sensor may also include a finger biometric sensing integrated circuit (IC) above the upper conductive layer and capable of deflecting the upper conductive layer toward the lower conductive layer to change a capacitance thereof based upon pressure applied to the finger biometric sensing IC. A pressure sensing circuit may be coupled to the lower and upper conductive layers to sense the change in capacitance.

Abstract: An electronic module includes a mounting surface, a cover disposed above the mounting surface, wherein the cover includes a protruding portion extending from a lower surface of the cover to a predetermined distance, and an adhesion part adhering the protruding portion to the mounting surface.

Abstract: A plurality of micro-electro-mechanical system (MEMS) transducers in a phased array are coupled to a flexible substrate using carbon nanotubes (CNTs) for conformal ultrasound scanning. Each transducer comprises a cantilever, magnetic material deposited on the cantilever, and a solenoid positioned relative to the magnetic material. The carbon nanotubes are grown on the cantilever and mechanically couple the transducer to one side of the flexible substrate. The other side of the flexible substrate is applied to a surface of a part under inspection, and the transducers are electrically connected to a processer to cause movement of the cantilevers when the solenoids are energized by the processor. The movement of the cantilevers results in movement of the carbon nanotubes, which imparts a force to the flexible substrate that results in ultrasound waves, which permeate the part. Returns from the ultrasound waves are interpreted by the processor to generate images of the part.