Abstract: The present invention provides an integrated circuit including a field effect transistor formed in an active area segment of a semiconductor substrate, the transistor comprising: a first and a second source/drain contact region; and a channel region arranged in a groove formed in the active area segment and extending to a groove depth larger than a lower first contact depth, wherein the second source/drain contact region is arranged at a vertical extension above the extension of the first source/drain contact region and a corresponding manufacturing method.

Abstract: A method for manufacturing the DRAM includes first providing a substrate where patterned first mask layer and deep trenches exposed by the patterned first mask layer are formed. Deep trench capacitors are formed in the deep trenches and each of the deep trench capacitors includes a lower electrode, an upper electrode, and a capacitor dielectric layer. A device isolation layer is formed in the first mask layer and the substrate for defining an active region. The first mask layer is removed for exposing the substrate, and a semiconductor layer is formed on the exposed substrate. The semiconductor layer and the substrate are patterned for forming trenches, and the bottom of the trench is adjacent to the upper electrodes of the trench capacitor. Gate structures filling into the trenches are formed on the substrate. A doped region is formed in the substrate adjacent to a side of the gate structure.

Abstract: A dynamic random access memory (DRAM) is provided. The DRAM comprises a substrate, a vertical transistor, a deep trench capacitor and a buried strap. The substrate has a trench and a deep trench located on one side of the trench thereon. The vertical transistor is disposed in the trench, a portion of which is disposed on the substrate. The deep trench capacitor is disposed in the deep trench, and comprises a bottom electrode, a capacitor dielectric layer and a top electrode. The vertical transistor comprises a gate structure disposed in the trench and above the substrate, a first doped region disposed in the substrate on sidewalls and bottom of the trench, and a second doped region disposed in the substrate on top of the trench. The buried strap is disposed in the substrate below the vertical transistor, and is adjoined to the first doped region and the top electrode.

Abstract: A method of manufacturing dynamic random access memory (DRAM) cylindrical capacitor is provided. A substrate having a polysilicon plug formed therein is provided. A dielectric layer having an opening is disposed on the substrate, wherein the opening exposes the polysilicon plug. Thereafter, an amorphous silicon spacer is formed on the sidewall of the opening to expose a portion of the polysilicon plug. Next, a top portion of the exposed polysilicon plug is removed and a seeding method is used to grow a hemispherical silicon grain (HSG) layer on a surface of the amorphous silicon spacer. A capacitor dielectric layer is formed on the surface of the HSG layer and a conductive layer is then formed on the capacitor dielectric layer. As no HSG is formed on the polysilicon plug, and therefore the contact area of the capacitor is not decreased.

Abstract: A method for void free filling with in-situ doped amorphous silicon of a deep trench structure is provided in which a first fill is carried out in at a temperature, pressure and dopant to silane ratio such that film deposition occurs from the bottom of the trench upwards. By way of this first fill, step coverages well in excess 100% are achieved. In the second fill step, deposition is carried out under changed conditions so as to reduce the impact of dopant on deposition rate, whereby trench fill is completed at a deposition rate which exceeds the deposition rate of the first fill. In an application of this method to the formation of deep trench capacitor structures, the intermediate steps further including the capping of the void free filled trench with a thick layer of amorphous silicon, planarization of the wafer thereafter, followed by a thermal anneal to re-distribute the dopant within the filled trench. Thereafter, additional steps can be performed to complete the formation of the capacitor structure.

Abstract: A semiconductor device manufacturing method includes selectively removing portions of a buried oxide layer and first semiconductor layer in an SOI substrate having the first semiconductor layer formed above a semiconductor substrate with the buried oxide layer disposed therebetween and exposing part of the semiconductor substrate, removing an exposed region of the semiconductor substrate in a depth direction, and burying a second semiconductor region in the region from which part of the semiconductor substrate has been removed in the depth direction.

Abstract: A fabrication method of a memory device is disclosed. A substrate having a trench is provided, comprising a trench capacitor, a conductive column, a collar dielectric layer and a top dielectric layer therein. A gate structure with spacers on sidewalls is disposed on the substrate and neighboring the trench. An opening is formed on the substrate between the collar dielectric layer and the gate structure. Next, a portion of the top dielectric layer and the collar dielectric layer is removed to expose a portion of the conductive column. An insulating layer is deposited on the gate structure and the exposed conductive column, filling the opening. The insulating layer is etched to expose a portion of the capacitor-side region of the substrate and the conductive column. A transmissive strap is formed by selective deposition, electrically connecting the capacitor-side region of the substrate and the conductive column.

Abstract: A dynamic random access memory (DRAM) is provided. The dynamic random access memory includes a deep trench capacitor disposed in a first trench of a substrate, a conductive layer disposed in a second trench of the substrate, a gate structure, and a conductive layer disposed on the surface of the substrate at two sides of the gate structure. The depth of the second trench is smaller than the depth of the first trench, and the second trench partially overlaps with the first trench. The conductive layer disposed in the second trench is electrically connected with the conductive layer of the deep trench capacitor. The gate structure is disposed on the substrate. The conductive layer at one side of the gate structure is electrically connected with the conductive layer disposed in the second trench.

Abstract: According to an aspect of the present invention, there is provided a non-volatile memory including: a transistor formed on a semiconductor substrate, the transistor including: two diffusion layers and a gate therebetween; a first insulating film formed on a top and a side surfaces of the gate; a first and a second contact plugs formed on corresponding one of the diffusion layers to contact the first insulating film; a ferroelectric capacitor formed on the first contact plug and on the first insulating film, the ferroelectric capacitor including: a first and a second electrodes and a ferroelectric film therebetween; a third contact plug formed on the second electrode; and a fourth contact plug formed on the second contact plug.

Abstract: A method of manufacturing a dielectric layer for a capacitor including sequentially supplying and purging a first and a second precursor material for a first and a second predetermined amount of time, respectively, in an initial cycle, sequentially supplying and purging the first and the second precursor materials for a third predetermined amount of time, which is shorter than the first and/or second predetermined amount of time, in a post cycle, which follows the initial cycle, and repeating the initial and post cycles to form a dielectric layer having a predetermined thickness.

Abstract: Capacitors having upper electrodes that include a lower electrode, a dielectric layer and an upper electrode that includes a conductive metal nitride layer and a doped polysilicon germanium layer are provided. At least part of the conductive metal nitride layer is oxidized and/or at least part of the dielectric layer is nitridized.

Abstract: A semiconductor memory device includes diffusion regions formed in an active region; cell contacts connected to the diffusion regions, respectively; pillars connected to the cell contacts, respectively; a bit line connected to the pillar; capacitor contacts connected to the pillars, respectively; and storage capacitors connected to the capacitor contacts, respectively. Accordingly, the pillars exist between the cell contacts and the capacitor contacts, and thus, depths of the capacitor contacts are made correspondingly shorter. Therefore, it becomes possible to prevent occurrence of shorting defects while decreasing resistance values of the capacitor contacts.

Abstract: A semiconductor device having a semiconductor substrate including a first region and a second region is provided. The semiconductor device further includes a gate electrode on the first region and having a first sidewall and a second sidewall, a first source region in the first region proximate to the first sidewall, a first drain region in the first region proximate to the second sidewall, an upper electrode on the second region and having a first sidewall and a second sidewall, a second source region in the second region proximate to the first sidewall of the upper electrode, and a second drain region in the second region proximate to the second sidewall of the upper electrode, wherein an impurity doping concentration of the first source region and the first drain region is greater than an impurity doping concentration of the second source region and the second drain region.

Abstract: A one cylinder storage device and a method for fabricating a capacitor are disclosed, realizing simplified fabrication by overexposure with a mask having a plurality of holes, in which the method includes forming a contact hole in an insulating layer on a semiconductor substrate; forming a conductive layer on the insulating layer to fill the contact hole; forming a photoresist layer on the conductive layer; forming a photoresist layer pattern by overexposure and generating a side lobe phenomenon; forming a cylindrical lower electrode by patterning the conductive layer using the photoresist layer pattern as a mask; and forming a dielectric layer and an upper electrode covering the lower electrode.

Abstract: A dynamic random access memory device including a capacitor structure, e.g., trench, stack. The device includes a substrate (e.g., silicon, silicon on insulator, epitaxial silicon) having a surface region. The device includes an interlayer dielectric region overlying the surface region. In a preferred embodiment, the interlayer dielectric region has an upper surface and a lower surface. The device has a container structure within a portion of the interlayer dielectric region. The container structure extends from the upper surface to the lower surface. The container structure has a first width at the upper surface and a second width at the lower surface. The container structure has an inner region extending from the upper surface to the lower surface. In a specific embodiment, the container structure has a higher dopant concentration within a portion of the inner region within a vicinity of the lower surface and on a portion of the inner region near the vicinity of the lower surface.

Abstract: Capacitor structures for use in integrated circuits and methods of their manufacture. The capacitor structures include a bottom electrode, a top electrode and a dielectric layer interposed between the bottom electrode and the top electrode. The capacitor structures further include a metal oxide buffer layer interposed between the dielectric layer and at least one of the bottom and top electrodes. Each metal oxide buffer layer acts to improve capacitance and reduce capacitor leakage. The capacitors are suited for use as memory cells and apparatus incorporating such memory cells, as well as other integrated circuits.

Abstract: A method of forming a ferroelectric random access memory includes sequentially forming a conductive pattern, an etch-stop layer, a ferroelectric capacitor and an interlayer dielectric on a semiconductor substrate, which includes a first region and a second region. The ferroelectric capacitor is formed on the first region and the conductive pattern is formed on the second region. The interlayer dielectric is patterned to simultaneously form a first opening to expose a top surface of the ferroelectric capacitor and a second opening to expose a top surface of the etch-stop layer. The patterned interlayer dielectric is annealed in an ambient atmosphere, including oxygen atoms. The etch-stop layer exposed through the second opening is etched to expose a top surface of the conductive pattern. First and second top plugs are formed to connect to the ferroelectric capacitor and the conductive pattern through the first and second openings, respectively.

Abstract: According to an aspect of the present invention, there is provided a semiconductor memory device, comprising a memory cell portion, the memory cell portion having a ferroelectric capacitor and a memory cell transistor, the ferroelectric capacitor having a plurality of electrode films and a ferroelectric film, the plurality of electrode films being stacked in layer on a semiconductor substrate, the ferroelectric film being formed between the plurality of electrode films, a source and a drain of the memory cell transistor being formed between the electrode films, the source and the drain directly contacting the ferroelectric film or indirectly contacting the ferroelectric film via an insulator, one of the source and the drain being connected to one end of the electrode film, the other of the source and the drain being connected to the other end of the electrode film.

Abstract: Provided are FeRAM device constructions and fabrication methods that provide for the direct connection of metal patterns to ferroelectric capacitors. The FeRAM device constructions utilize a combination of one or more barrier layers incorporated in conductive plugs, barrier layers incorporated in primary conductive patterns or conductive patterns formed using one or more noble metals to suppress parametric drift associated with conventional FeRAM constructions.

Abstract: Exemplary embodiments relate to a semiconductor memory device and method of fabricating the same. The semiconductor member device may include a semiconductor substrate, a plurality of storage node contact plugs formed above the semiconductor substrate, and a plurality of storage node electrodes, each of the plurality of storage node electrodes may be located respectively above each of the plurality of storage node contact plugs. Each of the storage node electrodes may include a cylindrical body and a generally Y-shaped connection portion extending from the cylindrical body and interfacing the storage node contact plugs.

Abstract: A semiconductor device may include a semiconductor substrate that includes first and second regions; first, second, and third insulating layers; a capacitor dielectric layer that includes first and second dielectric layers; a gate insulating layer formed on the first and second regions; a gate formed on the gate insulating layer of the second region; a first capacitor electrode formed on the capacitor dielectric layer; and junction regions formed in the semiconductor substrate on sides of the gate. The first and second regions may include first and second trenches, respectively. The third insulating layer may be formed on the second insulating layer, which may be formed on the first insulating layer, which may be formed on an inner surface of the second trench. The second dielectric layer may be formed on the first dielectric layer, which may be formed on an inner surface of the first trench.

Abstract: A method of making a semiconductor device includes the steps of: providing a semiconductor substrate (110, 510, 1010, 1610) having a patterned interconnect layer (120, 520, 1020, 1620) formed thereon; depositing a first dielectric material (130, 530, 1030, 1630) over the interconnect layer; depositing a first electrode material (140, 540, 1040, 1640) over the first dielectric material; depositing a second dielectric material (150, 550, 1050, 1650) over the first electrode material; depositing a second electrode material (160, 560, 1060, 1660) over the second dielectric material; patterning the second electrode material to form a top electrode (211, 611, 1111, 1611) of a first capacitor (210, 710, 1310, 1615); and patterning the first electrode material to form atop electrode (221, 721, 1221, 1621) of a second capacitor (220, 720, 1320, 1625), to form an electrode (212, 712, 1212, 1612) of the first capacitor, and to define a resistor (230, 730, 1330).

Abstract: A semiconductor device includes cylindrical capacitors each including corresponding cylindrical electrodes. Each cylindrical electrode includes hemispherical silicon grains. The hemispherical silicon grains protruding from an upper region of the cylindrical electrode have a large size, and the hemispherical silicon grains protruding from a lower region of the cylindrical electrode have a small size or the lower region of the cylindrical electrode has no hemispherical silicon grains.

Abstract: A plasma-enhanced chemical vapor deposition process for depositing relatively high dielectric constant silicon nitride or oxynitride to form an MIM capacitor is described. The flow rate ratios for the silicon nitride layer are: silane-to-ammonia between 1:20 and 6:5 and silane-to-nitrogen flow between 1:40 and 3:5. A pressure in the process chamber is between 260 Pa and 530 Pa. The flow rate ratios for the silicon oxynitride layer are: silane-to-dinitrogen monoxide between 1:2 and 25:4 and silane-to-nitrogen between 1:100 and 1:10. A larger, non-stoichiometric amount of silicon is incorporated in the layers as the flow rate of the silicon precursor is increased. The layers are deposited in substeps in which the deposition is interrupted between successive substeps. The layer is exposed to an oxygen-containing plasma such that electrically conductive regions of the layer are converted into electrically insulating regions as a result of interaction with the plasma.

Abstract: A single transistor vertical memory gain cell with long data retention times. The memory cell is formed from a silicon carbide substrate to take advantage of the higher band gap energy of silicon carbide as compared to silicon. The silicon carbide provides much lower thermally dependent leakage currents which enables significantly longer refresh intervals. In certain applications, the cell is effectively non-volatile provided appropriate gate bias is maintained. N-type source and drain regions are provided along with a pillar vertically extending from a substrate, which are both p-type doped. A floating body region is defined in the pillar which serves as the body of an access transistor as well as a body storage capacitor. The cell provides high volumetric efficiency with corresponding high cell density as well as relatively fast read times.

Abstract: The short circuit between the bit line and thee cell contact can be prevented without considerably increasing the number of the manufacturing processes. The bit line 6 electrically coupled to the cell contact 9 is formed of the material, which is same as the material of cell contact 9. In the process for forming the bit line 6 on the cell contact interlayer film 8 by etching, the etching for creating an upper surface of the cell contact 9 that is not coupled to the bit line 6 being lower than an upper surface of the cell contact 9 that is coupled to the bit line 6. Further, after the formation of the bit line 6, the barrier metal layer 5 formed on the lower surface of the bit line 6 is selectively etched.

Abstract: The invention encompasses a method of forming a silicon nitride layer. A substrate is provided which comprises a first mass and a second mass. The first mass comprises silicon and the second mass comprises silicon oxide. A sacrificial layer is formed over the first mass. While the sacrificial layer is over the first mass, a nitrogen-containing material is formed across the second mass. After the nitrogen-containing material is formed, the sacrificial layer is removed. Subsequently, a silicon nitride layer is formed to extend across the first and second masses, with the silicon nitride layer being over the nitrogen-containing material. Also, a conductivity-enhancing dopant is provided within the first mass. The invention also pertains to methods of forming capacitor constructions.

Abstract: A first electrode and a doped oxide layer laterally proximate thereof are provided over a substrate. A silicon nitride layer is formed over both the doped oxide layer and the first electrode to a thickness of no greater than 80 Angstroms over at least the first electrode by low pressure chemical vapor deposition using feed gases comprising a silicon hydride, H2 and ammonia. The substrate with silicon nitride layer is exposed to oxidizing conditions comprising at least 700° C. to form a silicon dioxide layer over the silicon nitride layer, with the thickness of silicon nitride over the doped oxide layer being sufficient to shield oxidizable substrate material beneath the doped oxide layer from oxidizing during the exposing. A second electrode is formed over the silicon dioxide layer and the first electrode. In one implementation, the chemical vapor depositing comprises feed gases of a silicon hydride and ammonia, with the depositing comprising increasing internal reactor temperature from below 500° C.

Abstract: A system to package high performance microelectronic devices, such as processors, responds to component transients. In one embodiment, the system includes a decoupling capacitor that is disposed between a Vcc electrical bump and a Vss electrical bump. The decoupling capacitor has Vcc and Vss terminals. The Vcc and Vss terminals share electrical pads with the Vcc electrical bump and the Vss electrical bump. A simple current loop is created that improves the power delivery for the system.

Abstract: In one embodiment, a plurality of bottom electrodes spaced apart from each other are formed on a lower insulating layer. A high-k dielectric layer and an upper conductive layer are sequentially and conformally formed overlying the bottom electrodes. The high-k dielectric layer and the upper conductive layer cover the bottom electrodes and the lower insulating layer between the bottom electrodes. A hard mask layer is selectively formed on the upper conductive layer to have an overhang over each of the bottom electrodes. Then the upper conductive layer is anisotropically etched using the hard mask layer as an etch mask, thereby forming upper electrodes spaced from each other. Therefore, a photolithography process of forming upper electrodes can be omitted, and damage to the upper electrodes due to etch can be prevented.

Abstract: In a storage electrode of a semiconductor device, and a method of forming the same, the storage electrode includes an outer cylinder including a first outer cylindrical portion having a first outer diameter, and a second outer cylindrical portion that is formed on the first outer cylindrical portion and having a second outer diameter, which is less than the first outer diameter, the first and second outer cylindrical portions having substantially equal inner diameters, and an inner cylinder formed on inner surfaces of the outer cylinder.

Abstract: A storage node contact forming method and structure reduces the number of processes required by the conventional art and increases a critical dimension of a storage node to prevent a leaning phenomenon and reduce a manufacturing cost of semiconductor memory devices. The method includes preparing a semiconductor substrate that involves at least one contact pad contacted with an active region of a memory cell transistor through an insulation layer. The method also includes forming a storage node contact of T-shape, the storage node contact being composed of a lower region contacted with an upper part of the contact pad, and an upper region that is extended to a gate length direction of the memory cell transistor and that is formed as a size larger than a size of the lower region, in order to electrically connect the contact pad with a storage node to be formed in a later process.