Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a package of a light emitting diode, the package comprising: a base layer including an entire top surface that is substantially flat; a light emitting diode chip on the base layer; a lead frame electrically connected to the light emitting diode chip; and a reflective coating layer comprising titanium oxide, wherein a top surface of the reflective coating layer is substantially parallel to a top surface of the base layer, and wherein ends of the reflective coating layer and base layer are aligned with each other.

Abstract: A light emitting device package capable of achieving an enhancement in light emission efficiency and a reduction in thermal resistance, and a method for manufacturing the same are disclosed. The method includes forming a mounting hole in a first substrate, forming through holes in a second substrate, forming a metal film in the through holes, forming at least one pair of metal layers on upper and lower surfaces of the second substrate such that the metal layers are electrically connected to the metal film, bonding the first substrate to the second substrate, and mounting at least one light emitting device in the mounting hole such that the light emitting device is electrically connected to the metal layers formed on the upper surface of the second substrate.

Abstract: A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.

Abstract: A light emitting diode device includes: at least one light emitting diode chip, which includes a semiconductor unit, two electrodes that are disposed on an electrode-mounting surface of the semiconductor unit, a light-transmissive insulating layer that is disposed on the electrode-mounting surface and that has two via holes, a reflective metal layer disposed on a portion of the light-transmissive insulating layer, a protective insulating layer that is disposed on the reflective metal layer, a conductor-receiving insulating layer that has two conductor-receiving holes respectively in communication with the via holes, and two conductor units that are formed respectively in the conductor-receiving holes; and a light-transmissive envelope layer that covers a surface of the light emitting diode chip opposite to the electrode-mounting surface, that extends to cover outer lateral surfaces of the light emitting diode chip, and that is doped with a fluorescence powder.

Abstract: A light-emitting diode (LED) wafer picker that may increase a suction force and may perform stable adsorption without a concern for contact with a top surface of an LED wafer is provided. An LED wafer picker may include a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker, a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface, a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface, and a support portion to support the LED wafer, the support portion extending downward from the guide member. Accordingly, it is possible to easily perform adsorption of an LED wafer that is relatively far from the LED wafer picker.

Abstract: Provided are a light emitting device package and a lighting system including the same. The light emitting device package includes: a body, a plurality of electrode layers, a light emitting device, and a molding member. The body includes a plurality of pits. The electrode layers include first protrusions disposed in the pits, and second protrusions protruding in a direction opposite to the first protrusions. The light emitting device is disposed on at least one of the plurality of electrode layers. The molding member is disposed on the light emitting device.

Abstract: A light-emitting diode (LED) device is provided. The LED device has a substrate, a reflective structure over the substrate, and an LED structure over the reflective structure. The reflective structure is formed of non-metallic materials. In one embodiment, the reflective structure is formed of alternating layers of different non-metallic materials having different refractive indices. In another embodiment, the reflective structure is formed of alternating layers of high-porosity silicon and low-porosity silicon. In yet another embodiment, the reflective structure is formed of silicon dioxide, which may allow the use of fewer layers. The reflective structure may be formed directly on the same substrate as the LED structure or formed on a separate substrate and then bonded to the LED structure.

Abstract: The light emitting device has a light emitting element 101, and translucent material 102 that passes incident light from the light emitting element 101 and emits that light to the outside. The sides of the translucent material 102 perimeter are inclined surfaces 107 that become wider from the upper surface to the lower surface. The area of the lower surface of the translucent material 102 is formed larger than the area of the upper surface of the light emitting element 101. The lower surface of the translucent material 102 and the upper surface of the light emitting element 101 are joined together, and the part of the lower surface of the translucent material 102 that is not joined with the light emitting element 101 and the inclined surfaces 101 are covered by light reflecting resin 103.

Abstract: A light emitting device and a light unit including the same are provided. The light emitting device includes a body, a first cavity disposed at a center of the body, the first cavity having an open upper side, a second cavity disposed around an upper portion of the body, the second cavity being spaced from the first cavity, first and second lead electrodes disposed within the first cavity, a light emitting chip disposed on at least one of the first and second lead electrodes, and a first molding member in the first cavity. The second cavity has an upper width greater than a lower width thereof and a side surface of the second cavity is formed of a vertical side surface with respect to a top surface of the body.

Abstract: An LED package includes a substrate, an LED chip and an encapsulation. The substrate includes a main plate, and a first soldering pad and a second soldering pad attached to the main plate. The first soldering pad and the second soldering pad are separated from each other. The LED chip includes a first electrode and a second electrode. The LED chip is mounted on the substrate with the second electrode electrically connected to the second soldering pad of the substrate. The encapsulation includes a main body enclosing the LED chip and an electric connecting unit electrically connecting the first electrode of the LED chip and the first soldering pad.

Abstract: A photosensor comprises a photoelectric conversion device region and a connection pad on the lower surface of a semiconductor substrate, and also comprises a wiring line connected to the connection pad via insulating film under the semiconductor substrate, and a columnar electrode as an external connection electrode connected to the wiring line. As a result, as compared with the case where the photoelectric conversion device region and the connection pad connected to the photoelectric conversion device region are formed on the upper surface of the semiconductor substrate, a piercing electrode for connecting the connection pad and the wiring line does not have to be formed in the semiconductor substrate. Thus, the number of steps can be smaller, and a fabrication process can be less restricted.

Abstract: There is provided a light emitting diode package, including a package body including a recess portion having a housing space and a lead frame mounted on the recess portion to be exposed; a light emitting diode chip mounted to be electrically connected to the lead frame; and a position indicator formed on the lead frame and guiding the mounting position of the light emitting diode chip.

Abstract: A light-emitting diode chip package body with an excellent heat dissipation performance and a low manufacturing cost, and a packaging method of the same are disclosed. A LED chip package body is provided, the LED chip package body comprising: a LED chip having an electrode-side surface and at least two electrodes mounted on said electrode-side surface; an electrode-side insulating layer formed on said electrode-side surface of said LED chip and formed with a plurality of through-holes registered with corresponding said electrodes; a highly heat-dissipating layer formed in each of said through-holes of said insulating layer on said electrode-side surface; and a highly heat-conducting metal layer formed on said highly heat-dissipating layer in each of said through-holes.

Abstract: An LED package and a lead frame include a reflector cup having a bottom surface with an LED asymmetrically positioned on the bottom surface and a wall surface inclined relative to the bottom surface and defining an opening at an upper end thereof. The bottom surface of the reflector cup has a first axial dimension along a first axis and a second axial dimension along a second axis, orthogonal to the first axis. A display having an asymmetrical FFP and asymmetrical screen curve includes an array of the LED modules including a plurality of LED packages. At least some of the LED packages include a dome-shaped lens asymmetrically positioned with respect to a geometric center of the bottom surface of the reflector cup.

Abstract: An optoelectronic component includes a semiconductor body and a carrier substrate connected to the semiconductor body with a solder joint, wherein the carrier substrate includes first and second apertures, through which first and second electrically conductive connecting layers are guided from a first primary surface of the carrier substrate facing away from the semiconductor body to a second primary surface of the carrier substrate facing away from the semiconductor body, the carrier substrate made of a semiconductor material and having side flanks, which run obliquely to the primary surfaces at least in a first partial region, wherein the side flanks are provided with an electrically insulating layer in the first partial region.

Abstract: A chip module package structure applied to an optical input device includes a cover body, a first chip module, and a second chip module. The first chip module and the second chip module are respectively combined with the cover body, the first chip module has an optical source, and the second chip module has an optical sensor. Further, the optical source and the optical sensor form a preset relative spatial position relation, such that a part of light emitted by the optical source is received by the optical sensor after at least one reflection.

Abstract: An organic light-emitting display apparatus including: a substrate; a plurality of pixels that are formed on the substrate and each have a light emission area from which visible rays are emitted and a transmission area through which external light is transmitted; a pixel circuit portion disposed in each light emission area of the plurality of pixels; a first electrode that is disposed in each light emission area and is electrically connected to the pixel circuit portion; an intermediate layer that is formed on the first electrode and includes an organic emissive layer; a second electrode formed on the intermediate layer; and a capping layer that is disposed on the second electrode and includes a first capping layer corresponding to the light emission area and a second capping layer corresponding to the transmission area. Accordingly, electrical characteristics and image quality of the organic light-emitting display apparatus may be improved.

Abstract: An LED package structure includes: a carrier; at least a first protruding portion and a plurality of electrical contacts formed on the carrier; a plurality of LED chips disposed on the first protruding portion and on the carrier in a region free from the first protruding portion, respectively; a plurality of bonding wires electrically connecting the LED chips and the electrical contacts; and a phosphor covering the LED chips, the electrical contacts and the bonding wires. The LED chips are disposed at different heights so as to allow the portions of the phosphor on the LED chips to have different thicknesses and thus generate light with different color temperatures.

Abstract: An LED package includes a substrate with two opposite lateral bulging portions, an LED die, an electrode structure, and a reflective layer. The substrate includes a first substrate and a second substrate stacked together; the first substrate and the second substrate are transparent; and the substrate includes an emitting surface for emitting light of the LED package. The electrode structure is sandwiched between the first substrate and the second substrate. The LED die is mounted in the substrate and electrically connected to the electrode structure. The reflective layer is formed on an outer surface of the substrate except the emitting surface and the bulging portions. The disclosure also provides a method for manufacturing such an LED package.

Abstract: A light emitting device comprises: a plurality of light emitting diodes and an insulating (low temperature co-fired ceramic) substrate with an array of recesses each for housing a respective one of the light emitting diodes. The substrate incorporates a pattern of electrical conductors that is configured for connecting the light emitting diodes in a selected electrical configuration and to provide at least two electrical connections on the floor of each recess. Light emitting diodes can be electrically connected to the electrical connections by at least one bond wire or by flip chip bonding. Each recess is filled with a transparent material to encapsulate each light emitting diode. The transparent material can incorporate at least one phosphor material such that the device emits light of a selected color and/or color temperature.

Abstract: A tunable light-emitting diode (LED) lamp for producing an adjustable light output. In one embodiment, the LED lamp includes a drive circuit for driving LED dies in one of a plurality of light output configurations (e.g., a pre-sleep configuration, a phase-shift configuration, and a general lighting configuration). Further, the LED lamp may include an output-select controller and/or input sensor electrically coupled to the drive circuit to select the light output configuration. As such, the LED lamp is tunable to generate different levels of spectral output, appropriate for varying biological circumstance, while maintaining a commercially acceptable light quality and color rendering index.

Abstract: The light emitting device according to the present invention includes a resin molded body having a recess, a first electrically conductive member and a second electrically conductive member each having terminal portions respectively exposed from a first outer side surface and second outer side surface which are opposite outer side surfaces among the outer side surfaces of the resin molded body, and a light emitting element mounted on the first electrically conductive member exposed at a bottom surface of the recess. The recess has a first bottom surface on which the light emitting element is mounted and a second bottom surface arranged at a higher position of the outer periphery of the first bottom surface.

Abstract: A light emitting diode (LED) package structure includes a substrate, at least one enclosure made of a transparent material, an LED, a first package material, and a second package material. The enclosure is disposed on a surface of the substrate, and forms a configuration area for disposing the LED therein. The first package material made of a transparent material is disposed in the configuration area and covers the LED. The second package material containing a fluorescent material covers the enclosure, the LED, and the first package material.

Abstract: A light-emitting diode device is described, which includes a luminous body and a colloid. The luminous body has a light-emitting surface and a bottom surface on opposite sides. The luminous body has a first length, a first width and a beam angle. The colloid covers the luminous body. The colloid includes a first surface and a second surface on opposite sides. The second surface has a second length and a second width. The colloid has a refractive index. A distance between the light-emitting surface of the luminous body and the second surface of the colloid is smaller than a first value and greater than a second value. The first value < the ? ? second ? ? width - the ? ? first ? ? width 2 · cot ? ? ? . The second value < the ? ? second ? ? width - the ? ? first ? ? width 2 · cot ? ? v . The sin ?=1/the refractive index of the colloid, and the ? is a full width at half maximum of the beam angle.

Abstract: An organic light emitting diode display comprises a display substrate including an organic light emitting element, an encapsulation substrate disposed to face the display substrate, a sealant disposed between edges of the display substrate and the encapsulation substrate for bonding and sealing the display substrate and the encapsulation substrate together, a filler filling in a space between the display substrate and the encapsulation substrate, first spacers formed on one surface of the display substrate contacting the filler, and second spacers formed on one surface of the encapsulation substrate contacting the filler. The display substrate and the encapsulation substrate are divided into a dropping area and a spreading area surrounding the dropping area and positioned relatively close to the sealant, and either or both of the first spacers and the second spacers have different shapes in the dropping area and in the spreading area.

Abstract: A stacked structure of semiconductor packages includes an upper semiconductor package, a lower semiconductor package and inter-package connectors. The upper semiconductor package includes an upper package substrate, a plurality of upper semiconductor chips stacked on the upper package substrate, and conductive upper connection lands formed on a bottom surface of the upper package substrate. The lower semiconductor package includes a lower package substrate, a plurality of lower semiconductor chips stacked on the lower package substrate, and lower through-silicon vias vertically penetrating the lower semiconductor chips. The inter-package connectors may electrically connect the through-silicon vias to the upper connection lands.

Abstract: A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.

Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.

Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

Abstract: A light emitting diode apparatus with enhanced luminous efficiency is disclosed in the present invention. The light emitting diode apparatus includes a light emitting diode chip for providing a first light beam; a substrate, having a cross-section of a trapezoid, for supporting the light emitting diode chip, which is transparent to the first light beam; and an encapsulating body, containing a phosphor and encapsulating the light emitting diode chip and the substrate, for fixing the light emitting diode chip and the substrate and providing a second light beam when the phosphor is excited by the first light beam. Due to the shape of the substrate, contact area of the substrate with the phosphor is enlarged. Luminous efficiency is enhanced as well.

Abstract: In the present invention, a semiconductor film is formed through a sputtering method, and then, the semiconductor film is crystallized. After the crystallization, a patterning step is carried out to form an active layer with a desired shape. The present invention is also characterized by forming a semiconductor film through a sputtering method, subsequently forming an insulating film. Next, the semiconductor film is crystallized through the insulating film, so that a crystalline semiconductor film is formed. According this structure, it is possible to obtain a thin film transistor with a good electronic property and a high reliability in a safe processing environment.

Abstract: A luminous means (1) including at least one optoelectronic semiconductor device (2) which emits electromagnetic radiation during operation at at least one first wavelength (L1) and at at least one second wavelength (L2), wherein the first wavelength (L1) and the second wavelength (L2) differ from one another and are below 500 nm, in particular between 200 nm and 500 nm. Furthermore, the luminous means (1) includes at least one conversion means (3) which converts the first wavelength (L1) at least partly into radiation having a different frequency. The radiation spectrum emitted by the luminous means (1) during operation is metameric with respect to a black body spectrum. Such a luminous means makes it possible to choose the first wavelength and the second wavelength in such a way that a high color rendering quality and a high efficiency of the luminous means can be realized simultaneously.

Abstract: Provided are a light emitting device. The light emitting device comprises a package body, an insulating layer on a surface of the package body, first and second electrode layers on the insulating layer, a light emitting diode disposed on the package body and electrically connected to the first and second electrode layers, a resistor layer connected to the first electrode layer, a first element part in a first doping region within the package body, a second element part in a second doping region within the package body, and a third electrode layer connected to the first element part and the second element part.

Abstract: An improved solid image-pickup device is so formed that its semiconductor device has on its surface an image-pickup area having a plurality of light sensors arranged thereon. A plurality of bonding pads are formed on the surface of the semiconductor device and arranged around the image-pickup area. A plurality of through holes are formed through the semiconductor substrate, extending from the lower surfaces of the bonding pads to the back surface of the semiconductor substrate and each of the through holes is filled with an electrically conductive material, thereby effecting an electric connection between the bonding pads and the copper wire of the flexible circuit substrate bonded to the back surface of the semiconductor substrate.

Abstract: The light emitting device 10 comprises a mounting substrate 11, LED chips 20 flip-chip bonded on the mounting substrate 11, and a glass sealing member 30 made of a plate-shaped glass material that seals the LED chips 20 formed on the mounting substrate 11. Here, the glass sealing member 30 is in a state in which fine voids are almost evenly dispersed and distributed between the powder grains of the glass material, and the powder grains are connected with each other, and the fine bumps/dips 30a are almost evenly dispersed and distributed on the surface of the glass sealing member 30.

Abstract: An optical module package structure includes a light-emitting chip and a light sensor chip respectively installed in a first cavity and a second cavity in a substrate, a reflective layer coated on the periphery of the first cavity, two packaging adhesive structures respectively molded in the first cavity and the second cavity to encapsulate the light-emitting chip and the light sensor chip respectively, and a lid integrally formed on the substrate to enhance the airtightness of the whole optical module package structure.

Abstract: A thin-type light emitting diode lamp includes a blue light emitting diode chip (6) disposed at a substantial center of an inner bottom surface of a groove-shaped recess (3) formed at an end surface and having a thin elongated rectangular opening, a red light conversion layer (7) covering the blue light emitting diode chip (6) and made of a light-transmitting synthetic resin containing powder of a red fluorescent material which emits red light when excited by blue light emitted from the blue light emitting diode chip, and a green light conversion layer (10) made of a light-transmitting synthetic resin containing powder of a green fluorescent material which emits green light when excited by the blue light. The light emitting diode lamp further includes a light transmitting layer (9) intervening between the red light conversion layer (7) and the green light conversion layer (10).

Abstract: A multichip package structure includes a substrate unit, a light-emitting unit, a current-limiting unit, a frame unit and a package unit. The substrate unit includes a first chip-placing region and a second chip-placing region. The light-emitting unit includes a plurality of light-emitting chips electrically connected to the first chip-placing region. The current-limiting unit includes at least one current-limiting chip electrically connected to the second chip-placing region and the light-emitting unit. The frame unit includes a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting chip. The package unit includes a first package colloid body surrounded by the first annular colloid frame to cover the light-emitting chips and a second package colloid body surrounded by the second annular colloid frame to cover the current-limiting chip.

Abstract: The present invention relates to a light-emitting diode die package having an LED die and an accommodating housing. The LED die has a first doped layer doped with a p- or n-type dopant and a second doped layer doped with a different dopant from that doped in the first doped layer. Each of the first and second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is formed. The insulation layer is formed with exposure holes for exposing the electrodes corresponding thereto. Each of the exposure holes is formed inside with an electrically conductive linker. The accommodating housing has an open end through which an accommodating space is accessible. The LED die is positioned within the accommodating space in such a manner that the electrically conductive linker protrudes outwardly from the accommodating space.

Abstract: A light emitting device includes a light emitting diode chip, and a first lead terminal in which a bottom portion including a mounting region for the light emitting diode chip is formed, and a side wall continuing to the bottom portion and having an inner surface serving as a reflecting surface for light emitted from the light emitting diode chip is continuously formed. Further, the light emitting device includes a second lead terminal provided to be spaced from the first lead terminal. Furthermore, the light emitting device includes a resin portion which supports the first lead terminal and the second lead terminal, and in which a cavity exposing a portion of the second lead terminal and the mounting region in the first lead terminal is formed.

Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.

Abstract: A light emitting device includes a package body, a light emitting diode, a transparent resin material, and a wire. The package body includes a bottom part and a side part. The bottom part includes a first electrode and a second electrode electrically connecting the upper surface and the bottom surface of the bottom part, respectively. The side part includes an upper surface including a trench and a bottom surface being in contact with the upper surface of the bottom part, wherein the upper surface of the bottom part is lower than the upper surface of the side part such that the package body includes a cavity surrounded by the side part, and the bottom surface of the bottom part includes a second opened portion that divides the first electrode and the second electrode, and wherein a portion of the transparent resin material is disposed inside of the trench.

Abstract: A semiconductor light emitting device has a support substrate, a light emitting element, and underfill material. The light emitting element includes a nitride-based group III-V compound semiconductor layer contacted via a bump on the support substrate. The underfill material is disposed between the support substrate and the light emitting element, the underfill material comprising a rib portion disposed outside of an end face of the light emitting element to surround the end surface of the light emitting element.

Abstract: A semiconductor package structure includes a dielectric layer, a patterned metal layer, a carrier, a metal layer and a semiconductor die. The dielectric layer has a first surface, a second surface and an opening. The patterned metal layer is disposed on the first surface. The carrier is disposed at the second surface and has a third surface, a fourth surface and at least a through hole. A portion of the third surface and the through hole are exposed by the opening. The metal layer is disposed on the fourth surface and has a containing cavity and at least a heat conductive post extending from the fourth surface and disposed in the through hole. An end of the heat conductive post protrudes away from the third surface, and the containing cavity is located on the end of the heat conductive post. The semiconductor die is located in the containing cavity.

Abstract: A light emitting device includes a light emitting element, a base, and a transparent layer. The base has an upper side portion including a first portion and a second portion. The first portion includes a mounting region of the light emitting element, and has a first porosity. The second portion surrounds the first portion, includes a plurality of transparent particles, and has a second porosity larger than the first porosity. The light transmitting layer encapsulates the light emitting element, and is attached to the first portion in a state where the transparent layer is apart from the second portion.

Abstract: A semiconductor component comprising at least one optically active first region (112) for emitting electromagnetic radiation (130) in at least one emission direction and at least one optically active second region (122) for emitting electromagnetic radiation (130) in the at least one emission direction. The first region (112) is here arranged in a first layer (110) and the second region (122) in a second layer (120), the second layer (120) being arranged over the first layer (110) in the emission direction and comprising a first passage region (124) assigned to the first region (112), which first passage region is at least partially transmissive for the electromagnetic radiation (130) of the first region (112).

Abstract: Provided are a light emitting device package and a lighting system comprising the same. The light emitting device package comprises a package body having a trench, a metal layer within the trench, and a light emitting device over the metal layer.

Abstract: A light emitting diode (LED) package including a carrier, at least one LED chip, and a light guide element is provided. The LED chip is disposed on the carrier. The light guide element including a light transmissive body, a light integration part, a reflective film, and a support part is disposed on the carrier and above the LED chip. The light integration part connected to the light transmissive body and disposed between the light transmissive body and the LED chip has a light incident surface facing the LED chip and at least one side. The side connects the light transmissive body and the light incident surface. The reflective film is disposed on the side. The support part leaning on the carrier is connected to the light transmissive body and surrounds the light integration part. The light transmissive body, the light integration part, and the support part are integrally formed.

Abstract: An optoelectronic component is specified that emits a useful radiation. It comprises a housing having a housing base body with a housing cavity, and a light-emitting diode chip arranged in the housing cavity. At least one base body material of the housing base body has radiation-absorbing particles admixed in a targeted manner to reduce its reflectivity. According to another embodiment of the component, the housing additionally or alternatively has a housing material transmissive for the useful radiation that has radiation-absorbing particles admixed in a targeted manner to reduce its reflectivity. In addition, a method for manufacturing such a component is specified.

Abstract: A semiconductor light emitting device having a semiconductor stacking structure bonded onto the support member and having excellent characteristics is provided by a preferable electrode structure. The semiconductor light emitting device comprising; a semiconductor stacking structure having a first semiconductor layer and a second semiconductor layer of conductivity types different from each other, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer, wherein one principal surface of the first electrode has a portion that makes contact with the first semiconductor layer so as to establish electrical continuity and an external connection section.