Abstract: An apparatus and method for first inserting wire pins in a printed circuit board and then bending the pins in progressive die fashion by means of a bending ram. The apparatus consists of an improved insertion and bending ram for use with a pin insertion machine. The improved insertion and bending ram comprises primary and secondary rams held in position by a tooling head, each ram comprising at least two bending notches. The primary ram is designed to first insert the pin vertically into a hole on a printed circuit board. While the primary ram inserts a second pin vertically, a bending notch of the primary ram bends the first pin downward. While the primary ram inserts a third pin vertically, the second pin is bent downward and the first pin is bent so that it contacts the printed circuit board. The primary ram has at least one bending notch. The secondary bending ram functions in the same manner as the primary bending ram but is used to reach pins not bent by the primary bending ram.

Abstract: A method is described for fabricating an arrangement where a connector (12, FIG. 1) lies on a circuit board (14) and contacts (26) have forward contact parts lying in passages (18) of the connector insulator (16) and board-received contact parts lying in interference fit in holes (24) of the circuit board, which facilitates replacement of a single damaged contact. An installing tool (70, FIG. 3) has channels (80) that receive the forward contact parts (40) and leave the board-received contact parts (32) projecting therefrom. The installing tool with contacts therein is moved towards the circuit board to press the projecting board-received parts of the contacts into the circuit board holes (24). The installing tool is then removed, leaving the contacts behind with their forward parts projecting up from the circuit board. The connector insulator (16, FIG. 4) is then moved so its passages receive the forward contact parts, the connector then being fastened to the circuit board.

Abstract: An improved connection through a substrate layer is formed by embedding a conductive element such as a pin on one or more balls or spheres in a thermoplastic material which is preferably a liquid crystal polymer. The substrate may be heated to facilitate the embedding process in which material of the substrate layer is reflowed under pressure to retain the conductive element by means of a preload force. The formation of such connections with either pins or plural conductive elements allows independence of aspect ratio of the connection and, hence, feature size of conductive patterns on the substrate and the thickness of the substrate layer.

Abstract: An apparatus for press-fitting a connector to a printed circuit board, comprising a magazine for accommodating a plurality of connectors (1) for the printed circuit board (8), the connectors (1) having a plurality of pins (1A) each with an outer diameter of an end portion (14) smaller than an outer diameter of an intermediate portion (11); a first transport mechanism (3) for moving a chuck (3A) used to releasably hold a connector (1); an alignment block (4) having alignment apertures (4A) each with a tapered entrance thereto and a diameter larger than the outer diameter of the end portion (14) and smaller than the outer diameter of the intermediate portion (11), provided so as to correspond to the locations of the pins (1A) of the connector (1); a second transport mechanism (5) for moving the alignment block (4) in a horizontal direction; a press head (6) for releasably holding the connector (1); a press (7) for moving the press head (6) in a vertical direction so as to press-fit a connector (1) attached ther

Abstract: To facilitate the registered connection between a ball grid array package and an associated multi-tiered circuit board, a spaced series of vias are formed transversely through the board substrate between its opposite first and second sides. A spaced series of relatively shallow, circularly cross-sectioned socket areas, offset from the vias, are also formed on the first side of the circuit board. The sockets have diameters slightly larger that those of the generally ball-shaped leads of the BGA package, and are positioned on the same centerline pattern as the leads. After the vias and sockets are formed, a multi-layer metallic coating is deposited on their interiors and around their open ends on the first board side, with the coating being extended across the first board side between associated socket and via pairs.

Abstract: A circuit board (12) and electrical connector (10) mounted to an edge (18) thereof is disclosed. The circuit board (12) includes an edge (18) and two major surfaces (14, 16) extending therefrom having circuitry (20). Plated through holes (24) are arranged adjacent the edge and are interconnected to circuitry on the circuit board. Each plated through hole (24) is associated with an opening such as a slot (26) or partial slot (27) that is formed in the edge (18) of the board so that it intersects the hole. The posts (32) of the connector (10) extend into the openings (26, 27) preferably in interference fit therewith whereafter soldering completes the electrical connections of the posts to the through holes.

Abstract: A method of preparing a large-current printed circuit board comprises inserting a fastener with a bottom flange in a through-hole formed in a printed circuit board so that the bottom flange is engaged with a surface of the printed circuit board, putting a washer having substantially the same outer diameter so the flange around the fastener at the other surface of the board, forming a radial extension at the outer side of the washer by caulking the fastener, whereby the fastener is fixed to the printed circuit board by means of the radial extension and the bottom flange wherein the washer is interposed between the radial extension and the printed circuit board.

Abstract: A tool for inserting electrical sockets (4) mounted on a carrier strip (2) into holes in a circuit board (80) has a socket guide (14) which is indexable to accommodate different sockets each having one of several possible known lengths. The tool includes a body (12) and a carrier strip advancing mechanism (42, 44, 46) operable on the carrier strip to feed the sockets to a feed station (52) in a vertical orientation. A ram (20) is movable through the feed station along a path between a first position above the feed station and a second position below the feed station to drive one of the sockets from the carrier strip to an insertion station. A guide tube (24) connected to the body below the feed station defines a tubular bore (26) through which the ram passes for guiding the socket driven by the ram from the carrier strip to the insertion station. The socket guide (14) is disposed between the feed station and the guide tube and guides the socket driven by the ram from the feed station to the guide tube.

Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

Abstract: An insertion module for a wire-assembly device for gripping, positioning and joining to connector devices contact-connector elements disposed at the ends of electric leads, particularly leads for motor vehicles. A lead end provided with a contact-connector element, fed by a workpiece-carrier gripper, is transferred to an insertion module, which includes a centering gripper and an insertion gripper. The insertion module can travel horizontal and vertically and surrounds the contact-connector element during the insertion operation with a positive fit and inserts the contact-connector element into the connector device in an insertion plane and tests for a proper lock.

Abstract: An electrical connector has an insulating body 30 with longitudinal chambers 45, 46 and 47 running through it. Electrical contact elements 81, 82 and 83 are received one each in the chambers. Each chamber has projections .alpha. and .beta. and each contact element has a rebate 86. Rotation of the contact element in the chamber relative to the body from an initial orientation to a second orientation engages the rebate 86 with the projections .alpha. and .beta. to restrain the elements from longitudinal displacement relative to the body. Projections 50 on the external face of the body 30 can engage an external portion of the contact element when that element is rotated to its second orientation to retain the element from rotating relative to the body. The connector can be a plug or a socket. A corresponding method of assembling an electrical connector is described.

Abstract: An electromagnetic shielding clip for providing an electrical connection between two mating surfaces. The clip of the present invention comprises an electrically conductive sheet. The sheet is curved into a series of interconnected arc-shaped sections, each oriented opposite to the arc-shaped section adjacent to it. Two of the arc-shaped sections appear at opposite ends of the clip and are used to attach the clip to a mating surface through two parallel slots. Another arc-shaped section curves away from the parallel slots for contract to another mating surface. The present invention also includes a tool and method for inserting the clip.

Abstract: A boardlock is provided for holding down the housing of an electrical connector to a circuit board, which can be constructed at low cost and which assures good electrical and mechanical connection between the connector housing and circuit board. The boardlock is designed to be pushed downwardly through a cylindrical hole in a connector flange and through a larger diameter cylindrical hole drilled into the circuit board. The boardlock is formed from a piece of sheet metal which is bent to form largely tubular upper and lower portions (40, 42, FIG. 2 ) received respectively in the flange hole and in the larger diameter board hole, with largely vertical edges of the bent sheet metal engaging the walls of the hole.

Abstract: There is disclosed a method for loading an adapter for a printed circuit board testing device with adapter pins having head ends and contact ends. The adapter pins to be loaded into the adapter are transferred by gravity from at least one main magazine, with their head ends first, into an intermediate magazine. Also, the adapter pins that have been transferred into the intermediate magazine are then transferred by gravity with the contact ends first into the adapter. For simpler and more rapid loading of the adapter with minimal constructional outlay, the adapter pins are transferred from the main magazine head first into the intermediate magazine.

Abstract: For pressing the contact elements of multipolar plug-in connectors into boreholes on printed circuit boards, the contact elements are pressed-in in several steps, so that only some contact elements are pressed in during each step, while the remaining contact elements are pressed-in in other steps, such that the pressing-in force does not become excessively large and can be performed with conventional presses.

Abstract: Disclosed is a method of forming bonding metal bumps on electrodes of a submount for use with an optical device array. Small bonding metal pieces are arranged on a transfer piece resting substrate so as to be aligned with the electrodes of the submount. Next, the bonding metal pieces thus arranged are transferred onto respective electrodes of the submount. In one embodiment, bonding metal pieces are preferably formed by punching a ribbon-shaped bonding metal and respectively fixed by a force of the punching operation directly onto the electrodes of the submount.

Abstract: A method of preparing a large-current printed circuit board comprises inserting a fastener with a bottom flange in a through-hole formed in a printed circuit board so that the bottom flange is engaged with a surface of the printed circuit board, putting a washer having substantially the same outer diameter so the flange around the fastener at the other surface of the board, forming a radial extension at the outer side of the washer by caulking the fastener, whereby the fastener is fixed to the printed circuit board by means of the radial extension and the bottom flange wherein the washer is interposed between the radial extension and the printed circuit board.

Abstract: A plurality of terminals each serving to fixedly mounting a connector housing on a printed circuit base board are successively produced by punching a single metallic plate of which opposite surface are coated with plated layers by actuating a press machine. Each terminal includes an electrical contact portion adapted to come in electrical contact with an opponent terminal at one end part, a fixing portion for fixedly securing the terminal to a connector housing at the intermediate part, and a base board connecting portion at other end part thereof. Each of the electrical connecting portion and the base board connecting portion has a rectangular sectional shape while the plated layers are kept alive thereon as they are.

Abstract: Before the flat plug (4) is inserted into a perforation (3) of the base (1), at least one rib (7) extending in the direction of insertion is stamped on a flat side. After the flat plug (4) has been inserted, the rib (7) is peeled opposite the direction of insertion and deformed in the direction towards the underside of the base. This results in a positively locking fastening of the flat plug (4) without deformations in the perforation (3) of the base.

Abstract: An apparatus is described for individually inserting successive components of a series of components having mounting legs by movement of the components along an insertion direction to introduce the mounting legs into holes in a substrate at an insertion station. The apparatus includes a guide for guiding a strip of components along a feedpath generally normal to the insertion direction with the mounting legs oriented in the direction of the substrate surface. The strip is advanced stepwise after each insertion operation to position the next successive components of the strip at the insertion station. The carrier web between a components to be inserted and the next successive upstream component is centered relative to a web shearing line, a first cutting element at the insertion station being arranged for abutment against a carrier edge or line proximate to the mounting legs for preventing movement of that portion of the carrier web upstream of the shearing line in the insertion direction.

Abstract: A method and apparatus is provided which allows simultaneous placement of electrical components on to a printed circuit board (PCB). Further, verification of the proper placement of these components on the PCB is provided such that an operator can immediately replace any components having pins which are bent, deformed, or the like. A press is included with moveable platens which receive a product specific assembly that is used in the manufacture of a particular type of PCB. For example, a PCB may require a number of electrical components, such as card connectors to be affixed thereto. This product specific assembly includes a top plate, pressure bar, which contacts the component being pressed into place, and an intermediate spring. A bottom plate is provided and includes a test block assembly. The test block serves to support the PCB receiving the electrical component and verifies the presence of each pin of the component in its respective via.

Abstract: A supportive ground clip for a computer system board mounted in a computer chassis and a method for installing a grounded printed circuit board in a computer shassis using the supportive ground clip. The supportive ground clip includes a base member for providing a grounding connection with the chassis, flexible support members attached to opposite ends of the base member and ascending vertical members attached to the flexible support members for mounting the supportive ground clip to the computer system board. Each of the flexible support members includes a contact point for providing a grounding connection with the bottom side of the computer system board and each of the ascending vertical members includes a contact point for providing a grounding connection with the top side of the computer system board. The first and second flexible support members are shaped such that compressive forces exerted on the supportive ground clip support the computer system board within the chassis.

Abstract: A telephone line overvoltage protection device and a method of forming an overvoltage protection device are provided. A first terminal guard housing defines a plurality of terminal receiving channels. A second housing contains a printed wiring board and the first terminal guard housing is arranged for mating engagement with the second housing. A plurality of terminals are inserted in the terminal receiving channels. Each of the terminals includes an outwardly extending terminal portion extending outside the first terminal guard housing. The outwardly extending terminal portion of each of the terminals is formed to define a line of terminal portions corresponding to a plurality of terminal receiving apertures in the printed wiring board. Then the terminal portions are inserted in the terminal receiving apertures and soldered to the printed wiring board. The terminals are bent to position the printed wiring board and a mating portion of the first terminal guard housing for insertion into the second housing.

Abstract: A programmable insertion tool is provided for inserting the contact pins of a pin header connector into plated through holes in a printed circuit board. The tool utilizes push pins of differing lengths to position selected contact pins to selected different depths thereby providing a make first, break last capability for these contact pins when connecting or disconnecting to a mating connector half.

Abstract: An electronic component with at least one silicon chip is proposed, where the silicon chip is provided with electronic switching elements on at least one main surface. The silicon chip is bonded to a glass support with its main surface provided with the electronic switching elements and forms a unit together with it, which is applied to a housing having connector pins for the electrical contact with the silicon chip. The glass support has through-bores in the same modular pattern as the connector pins of the housing, into which the connector pins extend. The through-bores in the glass support are filled with conductive paste, so that the electrical contact between the silicon chip and the connector pins is provided by the conductive paste.

Abstract: A method and apparatus for fixing a connector having pins onto a printed circuit board wherein the apparatus is movable between a position rear the pins and a position retracted from the pins. The apparatus includes heating means and pressure heads which act in a complimentary manner. After the pins are heated and are cooling, the pressure heads upset the pins thereby strengthening the connection.

Abstract: For the purposes of connecting and joining conductive traces on printed circuit boards, the stripped ends of a flexible multi-conductor flat cable are inserted into metallized openings in the printed circuit boards. The cables are cut to length and their ends are stripped of insulation and supported in an injection molded bar member. Those ends are desirably not to be bent in storage and transportation. In order to protect them, a U-shaped device is pushed onto the bar member over the cable ends. The bottom plate portion of the device has holes of a conical configuration. In a transportation position the ends are disposed within the walls of those holes and are held therein. The device latches in the transportation position. For the ends to be inserted into the holes in the printed circuit board the device is pushed further onto the cable ends in an operative position. As such, the ends pass in a guided fashion through the holes in the bottom plate portion and into the holes in the printed circuit board.

Abstract: A multi-layer rigid prototype printed circuit board is fabricated by applying a heat activated, rapid setting or tacking melt-remelt adhesive utilizing a moderate temperature heat laminating device onto appropriate surfaces of pre-etched and plated insulative film based, flexible film layers. A computer guided drill drills through-holes within an electrical insulative material planar substrate core using prescribed drill sizes for each through-hole pin size desired for a given hole location. The etched layers with the adhesive applied are positioned in proper sequence aligned to the drilled hole pattern and heat laminated thereto as a stacked array on the top and/or bottom surfaces of the substrate core. Computer guided drilling of the adhered films with prescribed smaller drill sizes at each through-hole location is effected to create film cantilever portions extending radially outwardly of the edge of the through-holes.

Abstract: A method of attaching a flat annular contact plate of a horn ring assembly to a flat annular flange of plastic substrate such as a turn signal canceling cam includes the steps of forming deformable tabs on the contact plate perpendicular to the plane thereof, forming slots in the substrate adjacent an inner edge if the annular flange, forming integral plastic shrouds with pockets therein adjacent the slots and perpendicular to the plane of the flange, seating the contact plate agaianst the flange with the deformable tabs projecting through the slots into the pockets on the shrouds, and bending the tabs against the flange to clamp the contact plate to the flange. The pockets hold the shrouds over the bent tabs and prevent spurious electrical contact with the tabs.

Abstract: A header assembly includes an insulating block having a given thickness and a plurality of pin-receiving passages therethrough. A plurality of terminal pins are received in the passages and project from the insulator block for insertion into holes in a printed circuit board and for solder connection to circuit traces on the circuit board. The terminal pins are interference-fit in the passages in the insulator block to allow the block to be slid off the pins after soldering to the printed circuit board. The area of the inference-fit between the terminal pins and the pin-receiving passages is less than the thickness of the insulator block to reduce the amount of force required to slide the block off of the pins while affording the block to be of a substantial thickness. The pin-receiving passages are provided with chamfered mouths to facilitate insertion of terminal pins into the passages.

Abstract: Apparatus for taking a plurality of terminals arranged in a first spatial configuration, and rearranging them into a second spatial configuration for insertion into a stator or other electrical component, is provided. The apparatus includes a plurality of tubes, one for each terminal, which convey the terminals to new locations and, if necessary, twist along the way to change the orientations of the terminals.

Abstract: A method for mounting electronic components, such as capacitors and the like, to a flat flexible insulating substrate having conductive material thereon. In one form of the invention, an electronic component is attached to a given area of the substrate with one conductive side of the electronic component in electrical connection with the conductive material on the substrate. A slot is formed in the substrate substantially about the electronic component but less than 360.degree. thereabout to define a tongue, including the electronic component, and an integral hinge portion of the substrate. The tongue is bent about the integral hinge portion to move the tongue out of the plane of the substrate and thereby move the electronic component therewith into a desired position for connection of an opposite conductive side of the electronic component to an appropriate terminal. In another form of the invention, a closed or 360.degree. slot is formed in the substrate.

Abstract: The connector is for receiving the edge of a printed circuit board and making contact with the pads along the edge thereof. The connector has a body in which is positioned a plurality of longitudinally arranged U-shaped sockets which receive the edge of the board. Formed points are located in the sockets at a different distance from the bottom of the socket. These points are spaced so that the board may slide therebetween and then, as the board is turned in the socket, it engages the points to make assured contact.

Abstract: A method of bonding bumps to leads of a TAB tape comprises the steps of preparing a substrate which is provided with through-holes, each having a size which will not allow the bumps to pass therethrough, at positions corresponding to bonding positions of the leads of the TAB tape where the bumps are to be bonded; provisionally arranging the bumps at positions of the through-holes at one side of the substrate by reducing a pressure in another side of the substrate opposite to said one side thereof to such the bumps in said through-holes; disposing the substrate on which the bumps are provisionally arranged and said TAB tape in such a positional relationship that said bumps face to the bonding positions of the leads of said TAB tape; and bonding the provisionally arranged bumps to the leads at the bonding positions and an apparatus for arranging bumps in a positional relationship corresponding to bonding positions of leads of a TAB tape.

Abstract: A printed circuit board connector is shown having an elongated body of electrically insulating material in which several rows of apertures extend from a flat surface on one side, each row extending to one of a series of platforms on an opposite side spaced at progressively greater distances from the flat surface in order to accommodate contact pins having right angle bends with the same spacing beyond the right angle bend as on the flat surface. The contact pins received in the apertures communicating with the flat surface may be of the male pin or female receptacle type.

Abstract: A method of and an apparatus for inserting into a terminal cavity of a connector housing, a terminal of a wired terminal in which the terminal is connected with an electric wire, comprising: a terminal grip member for gripping the terminal, which includes a pair of guide arms openable and closable in a horizontal plane and a terminal press arm pivotable in a vertical plane; a wire grip member for gripping the electric wire, which includes a chuck retractably advanced along the guide arms between the guide arms, a first drive member for retractably advancing the chuck and a second drive member for opening and closing the chuck such that a state of grip of the terminal by the terminal grip member is cancelled and established by the chuck at a forward end and a rearward end of a stroke of the chuck, respectively; and a robot flange for supporting the terminal grip member and the wire grip member.

Abstract: An electrical contact terminal which includes a terminal portion (1); an insertion portion (2); and a press-fit portion (4) provided between the terminal portion and the insertion portion and having a pair of abutment portions (5, 6) and a bridge portion (7) between the abutment portions to form an S-shaped cross section, the bridge portion having a pair of expanded portions (11, 12) connected to the abutment portions with a pair of tie portions (8, 10) and interconnected with a central tie portion (9), with the tie portions each being defined by a recess (13, 15) and a concave surface (14, 16) and the central tie portion being defined by the recesses, the tie portions having substantially the same cross sections having equal yielding deformations, the abutment portions, the expanded portions, and the central tie portion being made symmetrical about a center O of the bridge portion, a distance L between the abutment portions and a distance L' between the expanded portions when the press-fit portion is not pre

Abstract: An apparatus and method for removing pins from a bandolier type carrier and for loading groups of pins into a carrier block, for insertion into printed circuit boards. A bandolier carrying pins is moved along a passline and a group of a desired number of the bandoliered pins is positioned in a pin loading station of the apparatus. The pins are held by opposed gripping members, which are relatively movable towards each other into pin holding positions and are then operable to cause relative movement of the bandolier and the group of pins laterally of the passline, thereby separating the pins from the bandolier. While pins of the group are held by the gripping members, relative movement of the carrier block and the group of pins causes ends of the pins to be received in pin receiving locations in the carrier block. The pins are then released by moving the gripping members apart so that the pins remain in the carrier block.

Abstract: A first set of plated-through holes in the printed circuit board (PCB) are covered by a protective solder mask on the solder side of the PCB while a second set of plated-through holes are exposed. Electrical components are disposed on the component side with leads inserted in the second set of holes. Solder is prevented from flowing into the first set of holes during wave soldering by the mask covering. Conductive pins designed for press fitting into the first set of holes are inserted therethrough to define connecting pins on each side of the PCB following wave soldering. This permits both a wave soldering and press fit operation to be accommodated.

Abstract: A wiring structure of a loudspeaker having a signal input path to a voice coil, the path being established by electrically interconnecting a conductor and an input terminal mounted on a frame, and the conductor being disposed, on a damper having corrugations of concentric circles, along the corrugations from the inner to outer periphery thereof, includes a projection mounted on the damper extending from the outer periphery of the damper to a substrate of the input terminal, the end of the conductor being extended on and along the projection, whereby the end portion of the conductor is connected to a lug on the substrate of the input terminal.

Abstract: A modular press block assembly for use in a press tool to mount an electrical connector assembly having a housing and depending terminal pins into a printed circuit board. The modular press block assembly includes a pair of end holders and at least one modular press block positioned between the end holders for engaging the connector assembly and pressing the terminals into the printed circuit board. The invention contemplates a plurality of the modular press blocks of different sizes to form a set thereof for accommodating a plurality of different sizes of connector assemblies. Complementary interengaging keys are provided between the end holders and the modular press blocks and between the press blocks themselves to define proper positioning of the press blocks between the end holders and to maintain that positioning when the end holders are held against the sides of the press block. Spacer blocks also can be used between adjacent press blocks.

Abstract: An interposing connector for interconnecting a pattern of conductive areas of opposing spaced apart surfaces. The connector includes a housing having one or more openings therethrough. A plurality of canted coil springs are positioned within the housing so that outer coil portions are exposed to engage the conductive areas of the opposing surfaces to thereby establish the electrical interconnection. The canted coil springs are secured to the housing by retaining means, such as a retainer strip extending through the springs and secured to the housing. The springs may also be secured by heat staking or laser welding a portion thereof to the housing. The canted coil springs have a relatively constant compliance over a range of radial deflection. The springs also produce contact wipe over the conductive areas and establish redundant contact points therewith.

Abstract: The invention relates to the combination of a support and a semiconductor body and to a method of manufacturing same, in which a deformable metal layer is disposed between the semiconductor body and the support.The semiconductor body is connected to the support by pressing the semiconductor body and the support against each other under pressure after heating the metal layer. The semiconductor body is then provided at its surface facing the support with at least one projecting part, which is embedded in the metal layer.

Abstract: There is herein described an improved surface mounted component placement mechanism head structure which automatically accepts a very wide size range of such components.

Abstract: A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the hold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.

Abstract: A method for affixing pins to a ceramic substrate substantially eliminating cracking of the substrate by pre-bulging the pin blanks and, then after inserting the pin blanks into the substrate, a clearance is provided between the lower pin holding die and the lower face of the substrate for the subsequent head forming operation on the opposite face of the substrate.

Abstract: Insulated hookup wire is processed to provide point-to-point interconnections on a circuit board, including helical terminals formed integrally from stripped portions of the hookup wire and set into circuit board holes; the helical terminals serve as receptacles for contact pins of components such as DIP ICs, leads of components such as resistors or capacitors, or even for stripped ends of additional hookup wire, for example in interboard wiring. Regular dip or wave soldering may be performed subsequently. For special purposes, the wiring system of this invention may be utilized throughout a circuit board, or else it may be utilized strategically to supplement regular printed circuitry. In a three piece machine tool set, a shaped mandrel rotates to wind a portion of stripped wire into a dual interleaved helix and then press the helix into place as a helical terminal/receptacle in a circuit board hole, with one or two insulated hookup wires integrally attached for interconnection.

Abstract: An apparatus and method are disclosed for making connections between the pins of a multi-pin component and sockets mounted on a circuit board. A plurality of converter elements are installed between the component pins and sockets. Each converter element includes a receptor for mating with a pin of the multiple pin component. The receptor is sized to engage a pin having any diameter within a coarse range of diameters. Each converter element also includes a precision pin for mating with a socket on the circuit board. The diameter of the precision pin is held to a tolerance so that it is within a precision range of diameters. The variation in diameter within the precision range is less than the variation within the coarse range of diameters.

Abstract: A method and apparatus is provided for forming a power distribution system during a punching operation. A planar member of conductive material is located proximate to the substrate upon which the power distribution system is to be formed. A punch used to form the conductors from the planar member and deposit the conductors on the substrate. The action of the punch causes mechanical interference between the conductor and the substrate thereby securing the conductor to the substrate.

Abstract: Electrically conductive patterns on opposite sides of a printed circuit board are connected by way of through holes formed in the board. A plug formed of fusible material such as solder and having an electrically conductive coating is located in the or each hole. The plug is upset to expand it so that the electrically conductive coating contacts the wall of the hole. Solder is applied to opposite ends of the plug to bridge any gap between the conductive pattern and the conductive coating. The body of the plug may then be removed by a desoldering step.