Abstract: A method is provided for producing an electrically conductive connection between metallic components (2, 6), such as an agitator blade assembly (6) and a drive shaft (2) which have a non-conductive coating (7). In the method an at least partially electrically conductive pasty medium (8) is located in a pocket (12) between the components (2, 6) in contact with metallic portions (9, 10) of the components (2, 6) which are substantially free of any non-conductive coating (7). The connection between the components (2, 6) themselves provide a protection against the pasty medium (8) being accidentally removed from the region in use. For example, the components (2, 6) may be shrink-fitted together to form the connection with the pasty medium (8) located within the area of contact between the components (2, 6) and surrounded by interference fitted contact areas (11) between the components (2, 6) to provide the protection for the pasty medium (8).

Abstract: A method of connecting a flat cable and a terminal, comprising a sticking step in which cramp pieces (13b-13d) are stuck through a flat cable (10) to be received in corresponding cavities (15b, 15c) that are provided to allow the cramp pieces to maintain their shapes, and a cramping step in which the cramp pieces that have been stuck through the flat cable are bent and thereby cramped to the flat cable.

Abstract: An equipping installation introduces fitted-out cable ends into plug housings and is arranged downstream from a fitting-out installation. A contact for the first plug housing is arranged at the leading cable end and a contact for the second plug housing is arranged at the trailing cable end. A feeder unit takes over the cable loop fitted-out to a finished state from a second transfer unit and transfers the leading cable end to a positioning unit and the trailing cable end either to a rotatable store or, after the positioning unit is again free of cable, to the positioning unit in accordance with a cable plan. An equipping unit takes over the cable ends in succession at the positioning unit and introduces the cable ends into the corresponding plug housings.

Abstract: A connector press provides for learning a specified connector pressed position, adjusting a force based threshold, and simultaneously pressing multiple connector types into a circuit board. The force based threshold may be adjusted via a slider bar on a user interface. The specified pressed position may be learned by measuring and storing a position or force value, upon the user causing the press to press the connector into a circuit board. A total force based threshold may be determined in order to simultaneously press multiple connector types. The total force based threshold may be based upon quantities and pressing forces of each of the connectors types. Further, the press may provide near capacity pressing force, even with an asymmetrical load, by including linear guides.

Abstract: A power semiconductor module is presented in which terminal elements are press-fitted into openings in a plastic housing. This measure improves the reliability of the internal bonds between the substrate and the terminal element since there is no longer a risk of the terminal elements loosening in the plastic housing.

Abstract: A method of mounting a package such as a Butterfly package to a printed circuit board in order to make efficient use of the board's real estate is described. According to a preferred embodiment of the invention the package is mounted on its side such that leads of one side (now the bottom) of the butterfly package are connected either directly to surface mount pads on the PCB or project through and connected to through-holes in the PCB. The leads on the other side (now top) are connected to a flex circuit or ribbon cable. A heatsink can be attached to the package without impinging significantly on the PCB layout.

Abstract: A contact pin assembly for a socket for electrical parts comprises a plurality of contact pins provided for a socket body of a socket for electrical parts and a connection member, formed separately, connecting all the contact pins with a predetermined distance between adjacent ones. The predetermined distance is made substantially equal to a distance between adjacent ones of terminals provided for an electrical part which is held in the socket body.

Abstract: A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer by a small polymeric connecting element which can be broken or peeled away from the lead. Leads in a connecting element may be covered by an insulating jacket applied by a coating process, and the insulating jacket may in turn be covered by a conductive layer so that each lead becomes a miniature coaxial cable. This arrangement provides immunity to interference and facilitates operation at high speeds.

Abstract: A redistribution metallization scheme combines solder bumps and wire bond pads in addition to existing bond pads to enhance the connectivity of a semiconductor device, especially in flip-chip applications. The fabrication method includes forming the additional bond pads during the redistribution deposition step. The metals used in the redistribution layer provide a solderable surface for solder bumping and a bondable surface for wire bonding.

Abstract: The present invention provides a method of making an electronic parts mounting board, comprising the steps of: punching a conductive sheet to form a circuit pattern portion and through-holes in which electronic parts are to be mounted by use of a progressive die device while at the same time partially folding said circuit pattern portion to form connection terminal portions by use of said same progressive die device; and molding an insulative resin over the whole opposite sides of said circuit pattern portion and the base ends of the terminal portions including the folded parts thereof to form an integral covering portion having openings for electrically connecting said circuit pattern portion to electronic parts to be mounted thereon.

Abstract: A method for electrically connecting a circuit board connector to an external device. An embodiment of the method comprises providing a probe block through one end of a guide sleeve open on opposing ends, linking at least one contact on the probe block is linked to the external device, positioning the probe block so that the at least one contact is substantially aligned with a corresponding pin on the circuit board connector, and moving the probe block through the guide sleeve until the at least one contact makes a connection through one of the opposing open ends of the guide sleeve with the corresponding pin on the circuit board connector.

Abstract: This method includes punching a bus-bar pattern out of a conductive metal sheet. A bus bar terminal piece is punched out of the remaining material in the conductive metal sheet. An electrical connection is formed between the bus-bar pattern and the bus-bar terminal piece using male and female connections.

Abstract: A method 10, 90 for making a multi-layer electronic circuit board 82, 168 including the steps of forming at least one protuberance 15, 100 upon an electrically conductive member 12, 92 and adding additional electrically conductive layers of material 34, 56, 58, 104, 114, 138, 140 to the member 12, 92 while selectively extending the protuberance 15, 100 within the layers 82, 168, thereby forming a circuit board 82, 168. A portion of the formed circuit board may be etched in order to selectively create air-bridges 86 or interconnection portions 164.

Abstract: A contact of a circuit element is fixed to a terminal of a metallic plate by plastically deforming a portion of the terminal against the contact. The method of connecting the contact to a terminal includes forming a contact through-hole in the terminal, and inserting the contact into the contact through-hole. Next, a crushing punch plastically deforms a portion of the upper surface of the terminal adjacent the contact through-hole so that the terminal is connected to the contact.

Abstract: Methods for the fabrication of an array of electrical connectors are provided. A conductive layer is formed into an array of generally-shaped electrical contacts which are interconnected with original structural material. The relative positioning of the contacts is reinforced. The original structural material is then removed, and the array is attached to a substrate.

Abstract: Various aspects of the invention provide methods of manufacturing probe cards and test systems which may test microelectronic components using such probe cards. In one specific example, a probe card may be manufactured by forming a plurality of blind holes in a substrate, with each hole having a closed bottom spaced from a back of the substrate by a back thickness. An electrically conductive metal may be deposited on the substrate to fill the holes and define an overburden on the substrate. The metal in each hole may define a conductor. At least a portion of the overburden may be removed to electrically isolate each of the conductors from one another. A portion of the substrate including the back thickness is removed to define an array of pins extending outwardly from a remaining thickness of the substrate, with each pin being an exposed length of one of the conductors.

Abstract: Device for the contacting of a wire conductor (113) in the course of the manufacture of a transponder unit arranged on a substrate (111) and comprising a wire coil (112) and a chip unit (115), wherein in a first phase the wire conductor (113) is guided away via the terminal area (118, 119) or a region accepting the terminal area and is fixed on the substrate (111) relative to the terminal area (118, 119) or the region assigned to the terminal area by a wire guide and a portal, and in a second phase the connection of the wire conductor (113) to the terminal area (118,119) is effected by means of a connecting instrument (125).

Abstract: A method and circuit board assembly provide a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a floating connection in one plane thereby enabling a connection in another plane.

Abstract: A printed circuit board with SMD components electrically connected to the printed circuit board by means of a reflow soldering process. In order to provide the printed circuit board with connection elements which can be mounted at minimal cost, the printed circuit board is provided with one or more connection elements for making an electric connection to other electric components. These connection elements are journaled in recesses of the printed circuit board and do not project to the exterior via the surface of the printed circuit board on which the SMD components are secured.

Abstract: A method of mounting a package such as a Butterfly package to a printed circuit board in order to make efficient use of the board's real estate is described. According to a preferred embodiment of the invention the package is mounted on its side such that leads of one side (now the bottom) of the butterfly package are connected either directly to surface mount pads on the PCB or project through and connected to through-holes in the PCB. The leads on the other side (now top) are connected to a flex circuit or ribbon cable. A heatsink can be attached to the package without impinging significantly on the PCB layout.

Abstract: A device for the assembly of printed circuit boards with contacts having one or more terminal posts for insertion into corresponding holes in the printed circuit board in different orientations, the device comprising a guide block which executes a raising and lowering movement perpendicular to the printed circuit board; a transport device operated by the guide block for supplying the contacts secured to a carrier strip, with a cutting device operated by the guide block for the removal of the carrier strip; a setting finger operated by the guide block for holding and inserting one of the contacts with terminal posts into the printed circuit board, characterised in that the setting finger is coupled to the guide block and executes with the guide block a corresponding movement perpendicular to the printed circuit board, and the setting finger is connected to a curved groove cylinder the axis of which coincides with the perpendicular movement direction and which has at least one curved groove on its cylinder jack

Abstract: A connector press provides for learning a specified connector pressed position, adjusting a force based threshold, and simultaneously pressing multiple connector types into a circuit board. The force based threshold may be adjusted via a slider bar on a user interface. The specified pressed position may be learned by measuring and storing a position or force value, upon the user causing the press to press the connector into a circuit board. A total force based threshold may be determined in order to simultaneously press multiple connector types. The total force based threshold may be based upon quantities and pressing forces of each of the connectors types. Further, the press may provide near capacity pressing force, even with an asymmetrical load, by including linear guides.

Abstract: Explosive forces are used to fill interconnect material into trenches, via holes and other openings in semiconductor products. The interconnect material may be formed of metal. The metal may be heated prior to the force filling step. The explosive forces may be generated, for example, by igniting mixtures of gases such as hydrogen and oxygen, or liquids such as alcohol and hydrogen peroxide. To control or buffer the explosive force, a baffle may be interposed between the explosions and the products being processed. The baffle may be formed of a porous material to transmit waves to the semiconductor products while protecting the products from contaminants. Various operating parameters, including the flow rate of the fuel and the oxidizing materials, may be positively controlled. In another embodiment of the invention, a piston is used to transmit the explosive force. If desired, an annular space at the periphery of the piston may be maintained at atmospheric pressure to protect against wafer contamination.

Abstract: An attaching device is provided for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board, and a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.

Abstract: A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element.

Abstract: A method of connecting a flat cable and a terminal, comprising a sticking step in which cramp pieces (13b˜13d) are stuck through a flat cable (10) to be received in corresponding cavities (15b, 15c) that are provided to allow the cramp pieces to maintain their shapes, and a cramping step in which the cramp pieces that have been stuck through the flat cable are bent and thereby cramped to the flat cable.

Abstract: An apparatus for making optical fiber circuits including a mechanism that supplies optical fibers, a rotary support for supporting an adhesive-coated substrate in such a way that the substrate is in contact with the optical fiber, and a linear tracking arm that is equipped with a fiber routing and fixing head that routes and fixes the fibers into a shape on the substrate. Further included is a method for making optical fiber circuits including the steps of mounting a substrate on a rotary support and layering at least one layer of optical fibers from an optical fiber supply mechanism on the substrate in a shape such as a spiral by using the rotary range of motion of the substrate support and a linear range of motion of a tracking arm.

Abstract: An apparatus for inserting terminals carried on a carrier strip into cavities in a housing having a slide assembly with a cam track movable between a first and a second position, and a pivoting lever with a cam follower. The cam follower is positioned in and cooperates with the cam track. The lever is movable between an open and closed position and has first and second shearing blades. An eccentric pin extends through the lever and is attached to a rotary actuator. The eccentric pin is positioned to act as the pivot point for the lever. The rotary actuator is movable between an engaged and disengaged position. As the lever is moved to the closed position, the first shearing blades engage and shear a first portion of the carrier strip. As the rotary actuator moves to an engaged position, the second shearing blade engages and shears a second portion of the carrier strip.

Abstract: An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).

Abstract: A method of mounting a banana-type electrical receptacle on the substrate includes the steps of placing the electrical receptacle over an aperture formed in the substrate with support ribs formed on the outer surface of the receptacle supporting the receptacle over the aperture. A deformable electrical lead extends from a centrally disposed conductive member making an electrical connection with an electrical contact on the substrate. The electrical lead is affixed to the electrical contact on the substrate and the receptacle is inserted into the aperture crushing or shearing the support ribs and the deforming the electrical lead. Alignment ribs formed on the outer surface of the receptacle have shoulders that contact the substrate for positioning the receptacle in the substrate. The mounting method is compatible with automated soldering processes, such as wave flow soldering.

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: Methods for forming a modular bare die socket assembly 10 and attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

Abstract: An automatic electronic component-mounting apparatus is provided. A nut member is slidably arranged between a pair of rails. A head-lifting/lowering member is lowered and lifted with respect to the main block via the pair of rails and the nut member. A mounting head is attached to the head-lifting/lowering member. The head-lifting/lowering member is lowered and lifted to cause the mounting head to pick up an electronic chip component and then mount the electronic chip component on a printed circuit board. The head-lifting/lowering member is formed of a metal-ceramic composite material produced by combining a ceramic reinforcing material with a metal.

Abstract: An axial type electronic component inserting apparatus is provided for inserting into holes of a board a pair of lead wires of each of axial type electronic components connected by a tape at regular intervals. A first kind of the components have a larger tape interval and a second kind of the components have a smaller tape interval. The apparatus includes a pair of centering chucks having recesses for contacting both sides of the body of the component, and being movable in a symmetrical manner with respect to the center to adjust the body of the component from both sides of the main body while the recesses come in contact with both sides of the body of the component, thus resulting in centering of the component.

Abstract: The present invention relates to a copper ball insertion machine, for integrating metal inserts in via holes provided through a printed circuit board (PCB), comprising a motor driven X-Y table (2) with the PCB on top. The X-Y table (2) is adjustable to position a selected via hole in a predetermined location aligned with a closable outlet opening (12) of a movable container (6) for metal inserts. The container is by means of a clamping cylinder (28) displaceable for clamping the part of the PCB adjacent said via hole against the working surface (2) of said X-Y table. By means of a pivoting cylinder (20) the container is rotatable for feeding one metal insert through the outlet opening (12) into said via hole. A stamp (30) is drivable by a hammer cylinder (40) for compressing said metal insert to shape and deform it into a tight fit with the via hole.

Abstract: A device is disclosed herein for engaging and disengaging electrical connector halves, particularly electrical connector halves mounted on printed assembly boards that are to be electrically connected to a back plane. The device provides a drive train mechanism comprised of a plurality of gears and racks that, when attached, act to reduce the insertion force required to make the electrical connector halves disposed on the printed board assemblies and the back plane. A further aspect of the present invention involves the method of attaching a back plane to at least one stationary printed board assembly by actuation of a drive train.

Abstract: In a socket used to house semiconductor die during testing, a recessed socket contact is provided that avoids pinching the die's contacts. Also provided are socket contacts that allow for smaller socket holes and, therefore, denser arrays of socket contacts. In one embodiment, the body of the socket contact comprises a head, a spring coupled to the head, and a shaft coupled to the spring; no outer shell is needed for the spring, as the non-conductive sides of the socket hole serve that function. In another embodiment, the body of the socket contact comprises a metal shaft having an aperture. Compression causes the shaft to close around the slit, thereby decreasing the amount of lateral buckling. In yet another embodiment, semiconductor fabrication techniques are used to construct a dense array of contacts.

Abstract: A system for fitting pins into a connector, wherein the pins are formed by portions including an end portion of a continuous wire, which portions are arranged one after another and linked together by and separable at frangible regions. The continuous wire is fed to a first unit which advances the wire and guides the end portion of the wire in a rectilinear direction of advance toward a second unit. The second unit is mounted on a rotary shaft perpendicular to this rectilinear direction and rotated so that the end portion of the continuous wire is introduced into the second unit by the first unit and then the second unit is further rotated to cause separation of the end portion from the continuous wire by bending. The second unit then inserts the separated portion into the connector.

Abstract: A press-fitting unit includes a vertically movable press blade for press-fitting a stripped end of an electrical wire to a terminal disposed in a connector. A connector retaining bar movable in a horizontal direction is disposed to be opposed to the press blade. The retaining bar is provided with a plurality of connector receiving recesses in parallel to respectively hold a connector with a press-fit terminal. A wire chuck is disposed so as to opposing to the rear part of the press blade. The wire chuck is horizontally movable along a horizontal guide to a side of the press blade so as to holding the wire. Alternatively, the connector retaining bar is fixed to the apparatus by a frame and a transfer mechanism can carry the press-fitting unit along the bar in a horizontal direction. In addition, the apparatus may have a pair or two pairs of the upper and lower symmetrical press-fitting units; and the connector retaining bar is disposed between the upper and lower press-fitting units.

Abstract: A press-fitting unit includes a vertically movable press blade for press-fitting a stripped end of an electrical wire to a terminal disposed in a connector. A connector retaining bar movable in a horizontal direction is disposed to be opposed to the press blade. The retaining bar is provided with a plurality of connector receiving recesses in parallel to respectively hold a connector with a press-fit terminal. A wire chuck is disposed so as to opposing to the rear part of the press blade. The wire chuck is horizontally movable along a horizontal guide to a side of the press blade so as to holding the wire. Alternatively, the connector retaining bar is fixed to the apparatus by a frame and a transfer mechanism can carry the press-fitting unit along the bar in a horizontal direction. In addition, the apparatus may have a pair or two pairs of the upper and lower symmetrical press-fitting units; and the connector retaining bar is disposed between the upper and lower press-fitting units.

Abstract: A method for making a socket connector for connecting a CPU module to a circuit board includes the steps of (1) attaching a conductive film to a first face of an insulative plate to form a laminate, the insulative plate defining at least an array of bores therein; (2) photo-etching or laser-etching the conductive film to remove the conductive film with a portion thereof left in the laminate corresponding to each bore of the insulative plate, the portion of the conductive film having a base section attached to the first face of the insulative plate and a beam section extending from the base section over the corresponding bore; and (3) performing a second forming process to bend each beam section through the corresponding bore and partially extending over a second face of the insulative plate to be opposite the base section, the beam section being spaced from the second face of the insulative plate for resilient deformation in engaging the CPU module.

Abstract: A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin.

Abstract: A connector utilized to electrically connect together conductive pads disposed on different substrates includes a flexible substrate having a plurality of conductive through-holes therein. A conductive line formed in the flexible substrate extends between at least two of the conductive through-holes. A plurality of contacts is mounted in the conductive through-holes of the flexible substrate. Each contact includes a post connected to a base of a crown-shaped head having a plurality of projections around the periphery of the base that extend away from the base in the direction opposite the post. The post of each contact is soldered into one of the plurality of conductive through-holes. A compression mat positioned on a side of the flexible substrate opposite the crownshaped heads includes a plurality of resilient cylinders that extend away from a resilient base. Each resilient cylinder has a distal end alignable in registration with a distal end of the post of one of the plurality of contacts.

Abstract: Disclosed is a method and apparatus for mounting an electrical connector on a printed wiring board. The printed wiring board is initially positioned on locating projections on a tooling plate. Eyelets are positioned in hold down apertures in the connector. The hold down apertures initially engage the locating projections to align the connector pins with pin receiving apertures on the printed wiring board. Engagement continues until the pins are positioned in the apertures and the lower end of the eyelet is deformed to engage the innerside of the down aperture and the lower side of the printed wiring board.

Abstract: A kit and method for minimizing the chance of a short circuit during servicing of a signal tap. The kit includes a pair of insertion tools. Each insertion tool includes a shaft dimensioned to be received within a plug port of the tap and a slot extending along its length. The kit further includes a pair of external insulator strips, each having an insertion portion configured to be positionable within the shaft slot. To prepare the tap for servicing, each insertion tool is positioned in a respective plug port. An external insulator strip is positioned in and moved along the respective slot to a position that isolates the contact terminals and reduces the risk of a short circuit. In taps including an internal bypass switch, the kit may further include a pair of internal insulator strips which are positioned between the bypass switch ends and the tap housing.

Abstract: A method (100) for providing an electrical ground connection between a printed circuit board (700) and a metallic substrate (200) comprises the steps of: (i) providing an aperture (204) in the substrate (200); (ii) forming a ground plug (302) out of a metallic blank (300); (iii) inserting the ground plug (300) into the aperture in the substrate (200); (iv) compressing the ground plug (302) into the aperture (204) in the substrate (200); (v) placing the printed circuit board (700) onto the substrate (200); and (vi) applying solder into the aperture in the printed circuit board (700) and onto the ground plug (302). The steps of forming (104), inserting (106), and compressing (108) are carried out in a single punching operation (120). The method (100) efficiently provides a high quality electrical ground connection and avoids any need for sophisticated machinery.

Abstract: The present invention provides a pin deforming apparatus for deforming a normally straight pin for use in an electrical connection, wherein the apparatus includes a frame, a die coupled to the frame and an operating member coupled to the frame and die, whereby moving the operating member moves the die into contact with the pin sufficiently to bend at least a part of it. The invention encompasses a method of deforming a pin, as well as a method of making an electrical connection using a deformed pin.

Abstract: A strap spring for insertion into a circuit board for securing a heat sink to an electronic device is disclosed that has a body portion having two ends and a contact section and one or more engaging sections extending from said ends. The ends are inserted into an aperture in the circuit board and an aperture in the heat sink to anchor the circuit board to the heat sink. Electronic assemblies comprising a circuit board having a microprocessor and a heat sink having a surface larger than the microprocessor are also disclosed in which a strap spring is disposed on a side of the circuit board opposite the heat sink, and the strap extends through the circuit board to engage the heat sink.

Abstract: The present invention provides a method of manufacturing a heat sink for use with a circuit board having a predetermined thickness and an opening formed therein. In one particularly embodiment the method comprises forming a heat sink body, forming a support shoulder in the heat sink body by protruding a portion of the heat sink body to a predetermined first height, and forming a button shoulder in the heat sink body by protruding a portion of the support shoulder to a predetermined second height. Preferably, the heat sink body comprises aluminum or aluminum alloy. However, it should, of course, be recognized that other extrudable or malleable materials may be used in place of aluminum or its alloys. Additionally, it should be understood that a plurality of such support shoulders and button shoulders may be formed to provide a plurality of coupling points with the circuit board, which could also have a corresponding number of openings.

Abstract: An in-line connector adapted for use in a disk drive apparatus and a method for attaching the connector to a flexible circuit. The connector advantageously includes pins having shoulder portions which are adapted to receive and support the flexible circuit. The method includes the step of squeegee soldering the flexible circuit to electrically adhere the flexible circuit to the in-line connector apparatus.