With Shaping Or Forcing Terminal Into Base Aperture Patents (Class 29/845)
  • Patent number: 6108902
    Abstract: An annular insulator is positioned around a compliant contact section of a replacement contact pin for a header contact pin connector prior to insertion of the replacement contact pin through a header pin mounting hole and then both the replacement pin and the annular insulator being carried by the replacement pin are simultaneously pounded into snug received relationship within an associated pin receptor connector hole. A header contact pin repairing fixture has a plurality of size reducing holes for reducing the cross sectional dimension of the compliant section, one of which has an insulator end receiving opening for nesting receipt of a tapered wall at the end of the insulator to hold it in an upright orientation above and in alignment with the smallest sizing hole during insertion of the replacement pin into the insulator bore.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: August 29, 2000
    Assignee: Lucent Technologies, Inc.
    Inventor: Bruce L. Burgholzer
  • Patent number: 6098281
    Abstract: Electrical pin (10) for solderless insertion into metallized apertures of circuit boards, comprising an elastically deformable press-fit portion (14) with four contact areas (26), which are located on a first larger diameter (28) as compared with the diameter of the apertures of the circuit boards. A positioning portion (18) is provided ahead of the press-fit portion (14) and a transition portion (16) lies therebetween. The positioning portion (18) also has four contact areas (36), which are located on a second diameter (30) slightly smaller than the diameter of the apertures. Contrary to the press-fit portion (14) the positioning portion (18) is not deformed during the insertion of the electrical pin (10). Due to the positioning portion (18) the electrical pins can be connected to the circuit board in two operation steps, the first one being the positioning step and the second one being the press-in step.
    Type: Grant
    Filed: September 26, 1997
    Date of Patent: August 8, 2000
    Assignee: Weidmuller Interface GmbH & Co.
    Inventor: Kolb Rudi
  • Patent number: 6098275
    Abstract: An electrical connector press for connecting an electrical connector to a printed circuit board. The electrical connector has contacts with compliant attachment zones for insertion into holes of the printed circuit board The press comprises a gripping device for holding a housing of the connector, a force measuring device connected to the gripping device a distance measuring device connected to the gripping device; and a controller connected to the gripping device, the force measuring device and the distance measuring device. The controller controls movement of the gripping device towards the printed circuit board. The controller is connected to a memory having data of geometry of the contacts and the data of a desired insertion depth of the contacts into the holes. The controller can determine a distance which the contacts should be inserted into the holes based upon the data in the memory and force sensed by the force measuring device after the compliant attachment zones contact the printed circuit board.
    Type: Grant
    Filed: March 9, 1999
    Date of Patent: August 8, 2000
    Assignee: Framatome Connectors International
    Inventors: Robert A. H. J. Wuyts, Yves S. A. Loosen
  • Patent number: 6081998
    Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C.sub.1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is reroved from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.
    Type: Grant
    Filed: April 9, 1998
    Date of Patent: July 4, 2000
    Assignee: Fujitsu Limited
    Inventors: Hideaki Terauchi, Fumio Aoki, Kazuhiko Ota, Yasuhiro Teshima
  • Patent number: 6052895
    Abstract: A novel press-fit electrically-conductive contact member, as, for example, an electrically-conductive metal pin, characterized by a conforming section which has an elastically-deformable region which acts as a spring and which is adapted to engage a substrate hole in a press-fitting relationship. The conforming section comprises opposed beam members configured to accommodate a considerably larger hole tolerance yet still provide sufficient retention force to stabilize the pin during a soldering process that such substrates may typically undergo. The beam cross-sections are configured to allow them to occupy a side-by-side position. Contact members with the conforming section can be manufactured by a wire-forming process in which end-to-end connected pins are formed as a continuous strip needing no excess material for carrying the pins, nor are any air gaps formed between the pins, and thus the finished continuous strip of pins can be wound up on a reel.
    Type: Grant
    Filed: July 29, 1998
    Date of Patent: April 25, 2000
    Assignee: Auto Splice Systems, Inc.
    Inventors: Giuseppe Bianca, Robert M. Bogursky
  • Patent number: 6038763
    Abstract: An apparatus for automatically connecting prepared wires to a connector (plug or socket) is described. The prepared wires have a terminal on at least one end. A connector holder is provided for holding the connector in position. A chuck is provided for taking a prepared wire from a storage case. The wire is transferred to a rotator for correcting the rotational angle of the wire and its associated terminal. The wire is gripped by another chuck, which inserts it into the connector.
    Type: Grant
    Filed: October 17, 1997
    Date of Patent: March 21, 2000
    Assignee: Kodera Electronics Co.,. Ltd.
    Inventors: Hiroji Kodera, Yoji Katsuno
  • Patent number: 6038762
    Abstract: Disclosed is a method and apparatus for mounting an electrical connector on a printed wiring board. The printed wiring board is initially positioned on locating projections on a tooling plate. Eyelets are positioned in hold down apertures in the connector. The hold down apertures initially engage the locating projections to align the connector pins with pin receiving apertures on the printed wiring board. Engagement continues until the pins are positioned in the apertures and the lower end of the eyelet is deformed to engage the innerside of the down aperture and the lower side of the printed wiring board.
    Type: Grant
    Filed: January 26, 1998
    Date of Patent: March 21, 2000
    Assignee: Berg Technology, Inc.
    Inventors: Stephen L. Clark, David C. Horchler, Stuart C. Stoner, Glenn J. Pontius, William K. Nailor, III
  • Patent number: 6032359
    Abstract: A method of making a wiping connection between a male connector and a female connector in a single layer of a flexible polymeric dielectric film substrate having a thickness of less than 0.012 inches is disclosed. A laser directs a beam towards the substrate cutting a smooth pattern through the substrate to define a passage extending through the substrate and providing at least one resilient foldable flap normally closing the passage through the substrate. Next an electrically conductive material is coated on the flexible polymeric dielectric film substrate including a circuit trace providing an electrical contact land area surrounding the pattern extending over the foldable flap to form the female connector.
    Type: Grant
    Filed: October 9, 1997
    Date of Patent: March 7, 2000
    Inventor: Keith C. Carroll
  • Patent number: 6003226
    Abstract: A method is provided for manufacturing an electrical connector which includes a dielectric housing having a plurality of side-by-side channels separated by partition walls at one side of the housing. A plurality of terminals are mounted on the housing, with lead portions of the terminals located in the channels. The method includes the steps of seating the lead portions of the terminals into the channels, and forming first or minor portions from the partition walls onto the lead portions to retain the lead portions in the channels. Second or major portions of the partition walls then are formed onto the first or minor portions which are in contact with the lead portions to securely lock the lead portions in the channels. The seating step and the first forming step may be carried out simultaneously.
    Type: Grant
    Filed: May 14, 1997
    Date of Patent: December 21, 1999
    Assignee: Molex Incorporated
    Inventors: Arvind Patel, Nels Pearson, Jack J. Schafer
  • Patent number: 5960537
    Abstract: A fastener for an electrical connector. The fastener (10) includes a fastener body (12) having an opening (16) therethrough for receiving a pin (21). The fastener body (12) includes a plurality of gripping elements (14) protruding into the hole (16) for securing the fastener (10) to the pin (21) when disposed therebetween. The fastener (10) is then soldered to the pin (21) and to a mounting surface (34), such as a printed circuit board, by known soldering techniques.
    Type: Grant
    Filed: February 2, 1998
    Date of Patent: October 5, 1999
    Assignee: Samtec, Inc.
    Inventors: Brian R. Vicich, John K. Hynes
  • Patent number: 5953803
    Abstract: The current invention is directed to multiple fish hook hold-downs to secure a connector housing to a circuit assembly at least prior to or during soldering of electrical terminals mounted in the connector to the circuit board. The multiple fish hook hold-down comprises contact portions whose one ends are joined together to form a common adjoining portion, intermediate portions whose proximal ends are integral with the other ends of the contact portions, and fish hook portions integral with distal ends of the intermediate portions. The multiple fish hook hold-downs are initially placed in the connector housing at the contact portion of the hold-down. Prior to assembly, the circuit assembly and the connector housing with the hold down in place may be separately transported. When assembling, fish hook portions of the hold-down are placed in a hold-down engagement hole, and the fish hook portions anchor themselves on an inside surface of the hole so as to secure the connector housing onto the circuit assembly.
    Type: Grant
    Filed: September 24, 1997
    Date of Patent: September 21, 1999
    Assignee: FCI Americas Technology, Inc.
    Inventor: Marlyn E. Hahn
  • Patent number: 5940967
    Abstract: Method for inserting an electrical contact pin with a compliant attachment zone into a hole in a printed circuit board. The method consists ofbefore commencing the insertion cycle, the data relating to the dimensions of the contact pins in relation to the connector housing, the geometry of the compliant attachment zone, the desired insertion depth as well as the diameter of the holes in the circuit board is stipulated in the control means;the insertion movement of the press starts with the insertion of the first (non-compliant) section of the pin, which should not induce any resistance force, but merely provides guidance for the pin; during said insertion movement, the insertion force and insertion depth are continually controlled;at the moment of perception when the insertion force begins to increase significantly, i.e.
    Type: Grant
    Filed: October 22, 1997
    Date of Patent: August 24, 1999
    Assignee: Framatome Connectors International
    Inventors: Robert A. H. J. Wuyts, Yves S. A. Loosen
  • Patent number: 5915753
    Abstract: A method of producing a high-density wiring board for mounting comprises the steps of providing an electroconductive metallic film on the main surface thereof with a photosensitive resist layer, subjecting the photosensitive resist layer to selective exposure to light and development thereby forming holes for selectively exposing the surface of the electroconductive metallic foil in the photosensitive resist layer, depositing an electroconductive metal by plating on the exposed surface of the electroconductive metallic foil thereby forming electroconductive bumps thereon, peeling off the remainder of the photosensitive resist layer, superposing an insulating polymer sheet on the electroconductive bump forming surface, pressing the resultant superposed layers so that the electroconductive bumps to pierce the polymer sheet in the direction of thickness thereof and allowing the leading end parts of the electroconductive bumps to emerge from the polymer sheet and give rise to connecting terminal parts, and select
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: June 29, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomohisa Motomura, Osamu Shimada, Yoshitaka Fukuoka
  • Patent number: 5901442
    Abstract: A method of manufacturing an electric member having a number of leads such as in a remote-controlled light receiving module, loosening prevention kinks created on at least one of the leads are shaped such that, the shorter the distance from the loosening prevention kink to the tip of the lead the thinner the loosening prevention kink. When the electric member is mounted on a printed circuit board, the leads are inserted into wiring through-holes on the printed circuit board by pressing the electric member against the board, allowing the position and orientation of the electric member to be firmly fixed automatically by virtue of the loosening prevention kinks.
    Type: Grant
    Filed: May 9, 1997
    Date of Patent: May 11, 1999
    Assignee: Sony Corporation
    Inventor: Yoshio Harada
  • Patent number: 5896655
    Abstract: A method for the manufacture of electrically conductive lead-throughs for metallized plastic housings. Elevations around the lead-through holes in the housing part are formed at the time of making the housing part (e.g. by injection molding). The entire surface of the housing part is then metallized and the metallization on the elevations around the lead-through holes is removed by mechanical processes that act in one plane and where the lower metallization areas remain unaffected on account of the difference in level. Finally, the metal pins are attached in the lead-through holes by soldering or glueing.
    Type: Grant
    Filed: April 3, 1997
    Date of Patent: April 27, 1999
    Assignee: TEMIC TELEFUNKEN microelectronic GmbH
    Inventor: Dieter Knodler
  • Patent number: 5888627
    Abstract: It is an object of the present invention to provide a highly reliable printed circuit board subject to little bowing or twisting of the substrate, wherein the substrate and metal wiring are securely bonded together, and stable electrical and mechanical connection is achieved between the metal wiring and electroconductive resin paste filled into the through holes, and to provide a method of manufacture for same. The present invention relates to a printed circuit board having a multilayer wiring structure comprising a plurality of sheet substrates consisting of resin component layers containing an inorganic filler formed onto both sides of an organic nonwoven fabric material, and two or more circuit patterns, wherein through holes are formed in the sheet substrates in the thickness direction thereof and an electroconductive resin component is filled into the through holes, forming electrical connection between each of the electrode layers, and to a method of manufacture for same.
    Type: Grant
    Filed: May 29, 1997
    Date of Patent: March 30, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Seiichi Nakatani
  • Patent number: 5864945
    Abstract: An inserting apparatus inserts, into specified holes of a board, an axial type electronic component having a pair of lead wires extending from a main body and belonging to an assembly of electronic components which are connected by a tape and arranged at regular intervals. The apparatus includes chucks constructed so that the chucks can move forward and backward while grasping end portions of the axial type electronic component. A component carrying device is provided with the chucks and arranged at regular intervals in a circular form, each operating intermittently so that each chuck stops at least in a component supplying position and a component transferring position. A component supplying device is provided with a cutter for cutting the tape connecting the assembly of axial type electronic components, and operates to supply each axial type electronic component to each chuck located in the component supplying position.
    Type: Grant
    Filed: June 6, 1996
    Date of Patent: February 2, 1999
    Assignee: Matsushita Electic Industrial Co., Ltd.
    Inventors: Kiyoshi Imai, Hideaki Watanabe, Hiromi Kinoshita
  • Patent number: 5864947
    Abstract: A method of producing a press-connecting joint connector and a method of press-connecting wires, in which the step of mounting press-connecting terminals in a housing is eliminated thereby reducing the production time, the housing-forming mold is simplified, and connective portions are prevented from being easily ruptured. Linked press-connecting terminal groups (32) are inserted-molded integrally in housings (34), respectively, thereby forming press-connecting joint connectors (30) which are linked together by a linkage plate (40) which is integral with the press-connecting terminal groups (32). Thus, when molding the housings (34), the press-connecting terminal groups (32) are formed integrally with the housings (34), respectively, so that the step of inserting the press-connecting terminal groups into the respective housings (34) is eliminated.
    Type: Grant
    Filed: July 22, 1997
    Date of Patent: February 2, 1999
    Assignee: Yazaki Corporation
    Inventors: Hiroshi Yamamoto, Akira Kato
  • Patent number: 5857265
    Abstract: The invention concerns a process for producing a modular connection element (C.sub.0) from independent elementary connectors (4.sub.1 to 4.sub.8), having openings. The shielding elements (5d) are made from sheet metal. The surfaces of the overall connection element (C.sub.0) thus obtained are covered by shielding elements (5d) and elementary connectors (4.sub.1 to 4.sub.8) are joined together by pushing of specific zones of shielding elements (50d to 52d) into the openings. One application of the invention would be connection elements (C.sub.0) between printed circuit mother and/or daughter boards.
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: January 12, 1999
    Assignee: Framatome Connectors International
    Inventors: Dominique Etiembre, Jacky Thenaisie
  • Patent number: 5850691
    Abstract: The present invention is directed to a device for securing an electrical component to a pin grid array (PGA) socket that has a substantially planar body portion and a plurality of conductor pins, which are electrically connectable to a circuit board and project outwardly in a direction substantially perpendicular to the planar body portion. The device comprises a base member that has a plurality of conductor pin apertures which extend through the base member. Each of the conductor pin apertures are registered to receive therethrough a corresponding one of the plurality of conductor pins, to thereby sandwich the base member between and anchor the base member to the circuit board and the PGA socket when the PGA socket is electrically connected to the circuit board. The device further comprises a retainer for releasably securing the electrical component to the PGA socket.
    Type: Grant
    Filed: November 4, 1996
    Date of Patent: December 22, 1998
    Assignee: Dell USA, L. P.
    Inventor: James S. Bell
  • Patent number: 5850693
    Abstract: An electronic socket adapter includes an insulative carrier and an array of a plurality of surface mount contacts carried on the base. The pins may be floatably mounted on the carrier. A plurality of relatively large openings are formed in the carrier between adjacent contacts in the array. The openings provide improved heat flow in the region of the surface mount portions of the contacts and also provide for visualization of the surface mount portions of the contacts during and after soldering.
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: December 22, 1998
    Assignee: Berg Technology, Inc.
    Inventors: Orest D. Guran, Donald E. Wood, Richard J. Middlehurst
  • Patent number: 5819403
    Abstract: A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: October 13, 1998
    Assignee: The Panda Project
    Inventors: Stanford W. Crane, Jr., Maria M. Portuondo
  • Patent number: 5815917
    Abstract: Disclosed is a method and apparatus for mounting an electrical connector on a printed wiring board. The printed wiring board is initially positioned on locating projections on a tooling plate. Eyelets are positioned in hold down apertures in the connector. The hold down apertures initially engage the locating projections to align the connector pins with pin receiving apertures on the printed wiring board. Engagement continues until the pins are positioned in the apertures and the lower end of the eyelet is deformed to engage the innerside of the down aperture and the lower side of the printed wiring board.
    Type: Grant
    Filed: May 17, 1995
    Date of Patent: October 6, 1998
    Assignee: Berg Technology, Inc.
    Inventors: Stephen L. Clark, David C. Horchler, Stuart C. Stoner, Glenn J. Pontius, William K. Nailor, III
  • Patent number: 5806176
    Abstract: An insertion tool for inserting substrates having contacts disposed at their distal ends into a connection device and a method of use. The tool of the present invention is useful with any size substrate and contact, but is particularly useful for wires or fiber optic cable having small diameters with insufficient rigidity to withstand the connection force required to insert the contact into the connection device. The tool includes a pusher arm which engages the contact and forces the contact into the connection device. As the contact is inserted, the pusher arm is also inserted into the connection device and is subsequently removed from the connection device.
    Type: Grant
    Filed: February 5, 1996
    Date of Patent: September 15, 1998
    Assignee: Raychem Corporation
    Inventor: Barton A. Biche
  • Patent number: 5802711
    Abstract: An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the optical sub-assemblies and are substantially smaller than the hole. A soldering bridge comprising several separate tabs equally spaced about the land and which project from the land into the hole and are very flexible in relation to the lead so that the lead can be placed in any radial position within the hole, but regardless of the position of the lead within the hole the projections of the soldering bridge project close enough to the lead so that during wave soldering a joint of desired configuration is produced. The soldering bridge can be integral with the land so that the bridge helps connect the solder to the land allowing the land to be smaller and thus providing for closer spacing between connection holes.
    Type: Grant
    Filed: December 6, 1993
    Date of Patent: September 8, 1998
    Assignee: International Business Machines Corporation
    Inventors: Duane Foster Card, Eberhard Siegfried Dittman, Mukund Kantilal Saraiya
  • Patent number: 5778527
    Abstract: A method is provided for processing a number of "L"-shaped sections within a flat strip to form terminals extending from a component. In the strip, these sections are attached to a web by connecting portions. A number of such sections are simultaneously processed within various stations through which the strip is incrementally fed. These connecting portions are first twisted, so that each "L"-shaped section in the number of such sections extends in a plane perpendicular to the web. Next, these connecting portions are deflected so that outward extending legs of the sections extend in a direction needed for insertion into an electronic component structure. Then, these connecting portions are sheared, as each "L"-shaped section separated from the strip is placed in a slot within a receptacle block. Then, the receptacle block is slid to insert the "L"-shaped sections.
    Type: Grant
    Filed: September 3, 1996
    Date of Patent: July 14, 1998
    Assignee: International Business Machines Corporation
    Inventors: Michael Barenboim, Mark Edward Mino, John Lennon Sullivan, Jr., Kenneth Wayne Watts
  • Patent number: 5761801
    Abstract: A method for making a thin film printed board precursor containing a laminate of a controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it. The method comprises adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness. The laminate may be debossed through the metal foil layer and into the dielectric thermosetting resin film layer with a tool containing a raised electrical circuit pattern thereon.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: June 9, 1998
    Assignee: The Dexter Corporation
    Inventors: William F. Gebhardt, Rocco Papalia
  • Patent number: 5740602
    Abstract: A method and apparatus for making wire harness. The apparatus includes the use of a sequential wire processor that serially and sequentially fabricates circuits having terminal ends. The terminated circuits are transferred by a transfer means to an upstanding carousel provided with arrays of circuit-receiving clips. The transfer means receives terminated circuits from the sequential wire processor and places them on the clips of the carousel. The carousel is then moved to an assembly line and robotic station where robots remove the circuits from the clips of the carousel and place the terminated ends of the circuits in cavities of connectors strategically located on the assembly line. The robots have end effectors that physically insert the terminal ends into the connector cavities.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: April 21, 1998
    Assignee: Alcoa Fujikura Limited
    Inventors: Eric C. Peterson, Alex H. Damalas, Glynn R. Bartlett, Steven B. Farmer, Leslie B. Hoffman, Tak Kameoka, Horace H. Wacaser, Paul B. Wood
  • Patent number: 5740607
    Abstract: In order to reemploy the centering strips when equipping wiring backplanes with contact blades, the contact blades (2, 12) have their press-in zones introduced into a blade holder (1, 11) serving as a centering strip, being introduced thereinto in attitudinally correct allocation to one another. The contact blades (2, 12) introduced into the blade holder (1, 11) are pressed into the wiring backplane (5, 15) from the blade holder (1, 11) with a press-in die (7, 17) and the blade holder (1, 11) is pulled off from the contact blades (2, 12) when the press-in die (7, 17) is retracted.
    Type: Grant
    Filed: June 20, 1995
    Date of Patent: April 21, 1998
    Assignee: Siemens Aktiengesellschaft
    Inventors: Karl Zell, Peter Seidel
  • Patent number: 5737829
    Abstract: A terminal insertion machine (10) is disclosed that automatically actuates the insertion head (14) when the lower tooling (24) senses that the circuit board (26) is in proper alignment for receiving the tabs (166, 168) of the terminal (20). The lower tooling (24) includes a locating member (82) that senses the presents of two spaced holes (156, 158) in the circuit board (26) that are to receive tabs of the terminal and a rod (138) that senses the presence of the portion (162) of the circuit board (126) between the two holes (156, 158). A controller responds to a signal that the portion (162) of the circuit board is present and concurrently, that both holes (156, 158) are properly positioned. Upon receiving this signal the controller automatically actuates the insertion head (14) to insert the terminal 20 into the circuit board (26).
    Type: Grant
    Filed: December 13, 1996
    Date of Patent: April 14, 1998
    Assignee: The Whitaker Corporation
    Inventors: Bruce Allen Wolfe, Wilmer Roy Sauder
  • Patent number: 5737833
    Abstract: A method of producing a high-density wiring board for mounting comprises the steps of providing an electroconductive metallic film on the main surface thereof with a photosensitive resist layer, subjecting the photosensitive resist layer to selective exposure to light and development thereby forming holes for selectively exposing the surface of the electroconductive metallic foil in the photosensitive resist layer, depositing an electroconductive metal by plating on the exposed surface of the electroconductive metallic foil thereby forming electroconductive bumps thereon, peeling off the remainder of the photosensitive resist layer, superposing an insulating polymer sheet on the electroconductive bump forming surface, pressing the resultant superposed layers so that the electroconductive bumps to pierce the polymer sheet in the direction of thickness thereof and allowing the leading end parts of the electroconductive bumps to emerge from the polymer sheet and give rise to connecting terminal parts, and select
    Type: Grant
    Filed: October 5, 1995
    Date of Patent: April 14, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomohisa Motomura, Osamu Shimada, Yoshitaka Fukuoka
  • Patent number: 5735039
    Abstract: A method of removing electrical terminals (14) having a compressible compliant section (16) disposed within a circuit board through-hole (46) in an interference fit, the terminal insertion end (18) projecting from the through-hole (46) and beyond a remote surface (44) thereof when fully inserted. The method includes the steps of: providing a tool (50)having a work surface (54) including an array of work sites (56), each associated with a terminal (14); urging the work surface (54) of the tool (50) against the remote side (44) of the board (40) and performing a work step on the insertion end (18) to at least temporarily alter the insertion end at the through-hole exit thereby reducing the retention force; and pulling the terminal (14) from the through-hole from the insertion side (42) of the board. In one embodiment an aperture (56) in the tool (50) is dimensioned to receive the insertion end and the alternation step includes compressing the outwardly extending portion of the compliant section.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: April 7, 1998
    Assignee: The Whitaker Corporation
    Inventors: Todd Alan Shuey, John Douglas Weary
  • Patent number: 5718047
    Abstract: A method of manufacturing an electrical junction box, which is provided with a casing constructing an outline thereof and accommodating a circuit board having a desired circuit pattern, a plurality of housings mounted outside the casing for connecting electrical parts such as a fuse, relay and a connector for wiring harnesses, wherein terminals drawn out from the circuit of the circuit board are accommodated in an aligned form in each of the housings, the method comprising the steps of: making a plurality of terminal insertion holes along a predetermined pattern composed of a plurality of paths formed in the casing; forming a circuit pattern by screen printing an electrically conductive paste on the inner surface of the casing from the upper position of the terminal insertion holes; pressure inserting a bottom base portion of the respective terminals into a corresponding one of the plurality of terminal insertion holes; and forming an electrically conductive circuit pattern by depositing a plated layer of a d
    Type: Grant
    Filed: September 19, 1996
    Date of Patent: February 17, 1998
    Assignee: Yazaki Corporation
    Inventors: Makoto Nakayama, Hitoshi Ushijima, Masashi Kitada
  • Patent number: 5715595
    Abstract: An electrical connection pin blank having at least one compliant section is affixed to a first circuit board by compressive deformation in such a way that the compliant section of the pin blank projects outwardly from the surface of the first circuit board. The end of the pin projecting from the first circuit board is then inserted into a corresponding opening in a second circuit board and the two boards brought together until the second circuit board is firmly affixed to the complaint section of the pin by compliant pin connection.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: February 10, 1998
    Assignee: International Business Machines Corporation
    Inventors: Stephen Joseph Kman, John Arthur Stubecki, William Richard Sondej
  • Patent number: 5692297
    Abstract: For soldering a terminal (14) to a land (13) formed on an FPC (12) made of a material having a softening point below 230.degree. C., such as PET, by using a flow soldering or reflow soldering technique, an opening (17) larger than the land (13) is formed in a thermal insulation holder (11) including a phenolic paper base copper clad laminate board or the like so that the land (13) and the terminal (14) are within sight, and the thermal insulation holder (11) is held in contact with a surface of the FPC (12) to which solder is applied so that the land (13) and the terminal (14) are located within the opening (17) to perform the soldering using the flow soldering or reflow soldering technique, whereby molten solder readily reaches the land (13) through the opening (17) which need not be worked into a conventional trapezoidal configuration in vertical section, thereby preventing poor soldering. (FIG.
    Type: Grant
    Filed: October 31, 1995
    Date of Patent: December 2, 1997
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Haruo Noda
  • Patent number: 5664965
    Abstract: Disclosed is an assembly which comprises a printed circuit board on which there is mounted a component of an electrical connector. The printed circuit board and the electrical connector component have aligned mounting apertures. A boardlock member extends axially through these apertures and has a mounting foot engagement structure from which two resilient spaced legs depend. These spaced legs each have projections which are axially spaced from one another so that the connector member may engage a circuit board of one thickness on the projection of one leg and also engage a circuit board of another thickness by the projection on the other leg.
    Type: Grant
    Filed: March 29, 1996
    Date of Patent: September 9, 1997
    Assignee: Berg Technology, Inc.
    Inventors: Stephen L. Clark, David C. Horchler
  • Patent number: 5655292
    Abstract: A fuse holder (2) for use in electrical apparatus includes a tubular body (6) having outer and inner ends (10, 16). A first electrical contact element (22) and a mounting flange (8) are secured to the inner and outer ends, preferably using resilient retaining rings (53, 68) engaging circular grooves (52, 20; 62, 20) formed in the opposed surfaces. A tubular second electrical contact element (32) is secured within the tubular body and preferably has a flexible electrical terminal strap (24) which extends out through an opening (23) formed in the tubular body. Fluid-tight seals are provided between the inner surface (14) of the tubular body and the outer surfaces (46, 58, 30) of the first and second electrical contact elements and the mounting flange assembly by using pairs of O-rings (38, 50 and 70); an adhesive (39) is also used to secure these elements to the body.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: August 12, 1997
    Assignee: Kuhlman Electric Corporation
    Inventors: John L. Fisher, J. Donald Richerson, Ronald F. Dornbrock, John E. Cloyd, Stephen D. Smith
  • Patent number: 5655293
    Abstract: The present invention relates to a process and apparatus for inserting wire ends into components and an apparatus for manufacturing electrical cable bundles.According to the invention an apparatus for inserting the ends (70) of wire sections (5) in openings (54a) of components (54) comprises a device which moves the components relative to the wire end held in the mating gripper (7) along a curved trajectory.The relevant technical field is that of electrical cable bundles.
    Type: Grant
    Filed: June 27, 1995
    Date of Patent: August 12, 1997
    Assignee: The Whitaker Corporation
    Inventors: Jean Paul Celoudoux, Michel Verhille
  • Patent number: 5655294
    Abstract: To facilitate the insertion of a metal terminal with a waterproof seal into a cavity, a tool is provided with a stepped tubular portion and a grip portion connected to the tubular portion. The stepped tubular portion has, in one embodiment, four cylindrical portions having different outer diameters, and the outer diameters decrease stepwise toward a distal end of the tubular portion. A slit is formed in the tubular portion and extends from the distal end thereof into the fourth cylindrical portion. The slit has a width so as to allow a wire to pass therethrough. With this construction, the distal end of the cylindrical portion can easily push the waterproof seal without deformation.
    Type: Grant
    Filed: June 29, 1995
    Date of Patent: August 12, 1997
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Hirotaka Makino
  • Patent number: 5615478
    Abstract: The present invention relates to wire handling grippers, a process and an apparatus for manufacturing electrical cable bundles which use these grippers. The grippers comprise ar least one sweep arm and an internal articulated arm that can gather the wire ends inserted into openings of a component and the grippers comprise two external articulated arms which can gather wires in an area that is further away from the component, which grippers can move along a guide.
    Type: Grant
    Filed: March 10, 1994
    Date of Patent: April 1, 1997
    Assignee: L'Entreprise Industrielle
    Inventors: Jean P. Celoudoux, Michel Verhille
  • Patent number: 5596178
    Abstract: An apparatus is adapted to be secured in a substrate having at least one conductive path and at least one aperture therein. The apparatus includes a cap and a tubular shaft, connected to the cap and positioned in a first aperture of the substrate. The tubular shaft has an electrically conductive wall portion and perforations therethrough, with the electrically conductive wall portion being operatively connected to a first conductive path of the substrate, and the perforations are adapted to permit flowthrough of material. The material facilitates the securing of at least the tubular shaft to the substrate.
    Type: Grant
    Filed: October 12, 1995
    Date of Patent: January 21, 1997
    Inventor: Suzanne Christian
  • Patent number: 5588206
    Abstract: A pair of terminal grasping picks and a pair of wire clamping plates, which are provided in an insertion unit so that they can freely rise/fall and open/close, fall to grasp a first wire-equipped terminal clipped on a clip of a wire clamping rod; rise to separate the first wire-equipped terminal from the wire clip; advance toward the housing to insert the first wire-equipped terminal into the corresponding terminal container; and thereafter retreated and returned to an initial position, thereby successively inserting wire-equipped terminals. At any timing during the process in which the wire-equipped terminal is separated from the clip and thereafter the insertion unit is retreated and returned, either one of the wire clamping rod and the connector housing is moved in parallel to the other so that a second wire-equipped terminal or the clip is previously positioned oppositely to the a next terminal container of the housing.
    Type: Grant
    Filed: November 22, 1994
    Date of Patent: December 31, 1996
    Assignee: Yazaki Corporation
    Inventors: Takamichi Maejima, Toshihiro Inoue, Hiroshi Hasegawa, Atsushi Nakano
  • Patent number: 5581875
    Abstract: An electronic component is mounted on one major surface of a dual side wiring substrate. A terminal is press-fitted into a mounting hole in the dual side wiring substrate from the one major surface side to be temporarily fixed in the substrate, and an electronic component is mounted on the other major surface of the dual side wiring substrate after soldering paste is applied. A frame having a plurality of bent pieces extending inwardly is mounted onto the dual face wiring substrate from a position above the substrate so that the bent pieces abut against the pattern of the dual side wiring substrate. The terminal press-fitted from the one major surface side, the electronic component mounted on the other major surface, and the frame are soldered simultaneously by a reflow method.
    Type: Grant
    Filed: February 16, 1995
    Date of Patent: December 10, 1996
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Eiichi Hibino, Yoji Maeda, Sadao Kotera, Kazunori Kinoshita
  • Patent number: 5580267
    Abstract: A connector assembly is adapted for electrically connecting a printed circuit board with another electrical device, the circuit board having a mating edge with a generally linear array of contact pads along the edge on each opposite side of the board. An elongated dielectric housing has a cavity along its length for receiving the mating edge of the printed circuit board, and a plurality of narrow closely-spaced slots extending transversely of the cavity. Each slot is adapted for receiving a unitary thin contact member having a singular base portion traversing the cavity with opposed spring contact arms extending from the singular base portion into the slot, and with distal ends of the contact arms engageable with the contact pads on both opposite sides of the printed circuit board. A plurality of pairs of thin contact members are mountable on the housing to form a closely-spaced linear terminal array lengthwise of the cavity. One pair of the contact members is located in each slot in the housing.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: December 3, 1996
    Assignee: Molex Incorporated
    Inventors: John M. Stipanuk, Kent E. Regnier
  • Patent number: 5533665
    Abstract: An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.
    Type: Grant
    Filed: December 21, 1994
    Date of Patent: July 9, 1996
    Assignee: Aries Electronics, Inc.
    Inventors: William Y. Sinclair, James P. Walter
  • Patent number: 5499443
    Abstract: A connector press-fitting apparatus for press-fitting a connector to a printed board has a storing mechanism for storing connectors; a positioning mechanism for maintaining, moving, and positioning a printed board; a press-fitting head having a surface with a channel opening facing a surface of the printed board and mounted to be accessible to and separable from the printed board maintained by the positioning mechanism; a head moving mechanism for moving the press-fitting head in relative to the printed board; a pressure-reducing mechanism for affixing a connector to the press-fitting head by reducing pressure of the above channel of the press-fitting head; a transporting portion for transporting connectors from the storing mechanism and delivering these connectors to the press-fitting head; and a pressure-receiving portion for supporting the printed board from a reverse face thereof at the time of press-fitting a connector to the printed board by the press-fitting mechanism.
    Type: Grant
    Filed: October 24, 1994
    Date of Patent: March 19, 1996
    Assignee: Ando Electric Co., Ltd.
    Inventors: Yasunori Ota, Nobuhide Fujita
  • Patent number: 5497546
    Abstract: Load terminals are mounted to a circuit board by providing a solder layer on each lead terminal and on each conductive inner wall surface of respective holes formed in the circuit board. The lead terminals are thrust into respective holes, and contacting portions of the solder layers are irradiated with an energy beam, to produce sufficient heat for welding in a fluxless manner each lead terminal to the inner wall surface of its respective hole.
    Type: Grant
    Filed: September 14, 1993
    Date of Patent: March 12, 1996
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Masao Kubo, Kazuo Kamada, Masanobu Ogasawara, Yoshimitsu Nakamura
  • Patent number: 5456608
    Abstract: A switching matrix includes at least two parallel circuit boards each having plural conductive traces and multiple matrix holes therethrough arranged to permit traces on one board to be connected to traces on the second board. Connection is achieved by means of a flexible non-conductive circuit jumper pin having a resilient conductive sleeve arranged to extend between an aligned pair of holes in the two boards. The holes are conductively plated to define female contacts to radially compress the conductive sleeve. Circuit jumper pins may be moved between different matrix positions manually or by a pick and place mechanism controlled from a remote location. In one embodiment, serving as a telephone cross-connect switch, connections are made in pairs, therebeing four circuit boards and two conductive sleeves on each pin, each sleeve interconnecting a pair of traces on a respective pair of boards.
    Type: Grant
    Filed: August 25, 1993
    Date of Patent: October 10, 1995
    Assignee: CONX Corporation
    Inventors: Wesley D. Rogers, Douglas G. Hard
  • Patent number: 5455741
    Abstract: An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element mounted in the cavity and having a plurality of leads, a plurality of the leads extending via the through holes from the element to the second surface, and a plurality of lead terminal recesses formed at the second surface for for receiving and forming terminal ends and connections of the leads to the circuit on the second surface.
    Type: Grant
    Filed: October 26, 1993
    Date of Patent: October 3, 1995
    Assignee: Pulse Engineering, Inc.
    Inventors: Ka K. Wai, Moin Ahmad, Aurelio J. Gutierrez, James D. Lint
  • Patent number: 5453702
    Abstract: An automatic fixture loading apparatus which provides for the rapid loading of probes into the bottom plate of a test fixture comprising a replenish station, an elevator storage station having means for storage of at least four (4) cassettes and a fixture loading station having a means for gimballing a mated cassette and fixture. All stations are connected via a trolley which automatically moves cassettes between the stations. The loading station provides for a means for providing a gimbal movement to a fixture having a cassette mated thereon to provide for the loading of probes into fixtures in angles of up to 12.degree. and in a non-grid-dependent manner. The cassette having cavities of at least 0.50 inch by 0.50 inch capable of holding of up to one hundred (100) probes.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: September 26, 1995
    Assignee: Methode Electronics, Inc.
    Inventor: Joseph M. Creeden