Abstract: A plurality of sets of test conditions of a die in a stacked system is established, wherein the plurality of test conditions are functions of temperatures of the die, and wherein the stacked system comprises a plurality of stacked dies. A temperature of the die is measured. A respective set of test conditions of the die is found from the plurality of sets of test conditions, wherein the set of test conditions corresponds to the temperature. The die is at the temperature using the set of test conditions to generate test results.

Abstract: An apparatus with package integrity monitoring capability, includes: a package having a die connected to an interposer through a plurality of bumps, wherein at least some of the bumps comprise dummy bumps; a package integrity monitor having a transmitter to transmit a test signal and a receiver to receive the test signal; and a first scan chain comprising a plurality of alternating interconnects in the die and in the interposer connecting some of the dummy bumps in series, wherein the first scan chain has a first end coupled to the transmitter of the package integrity monitor and a second end coupled to the receiver of the package integrity monitor.

Abstract: The present invention discloses a method of testing a partially assembled multi-die device (1) by providing a carrier (300) comprising a device-level test data input (12) and a device-level test data output (18); placing a first die on the carrier, the first die having a test access port (100c) comprising a primary test data input (142), a secondary test data input (144) and a test data output (152), the test access port being controlled by a test access port controller (110); communicatively coupling the secondary test data input (144) of the first die to the device-level test data input (12), and the test data output (152) of the first die to the device-level test data output (18); providing the first die with configuration information to bring the first die in a state in which the first die accepts test instructions from its secondary test data input (144); testing the first die, said testing including providing the secondary test data input (144) of the first die with test instructions through the device-

Abstract: Aspects of the disclosure provide a method for testing. The method includes determining an electrical characteristic of an integrated circuit (IC), subjecting the IC to a stress test, characterizing the electrical characteristic of the IC subsequently to subjecting the IC to the stress test, and determining a quality attribute of the IC based on a comparison of the respective electrical characteristics of the IC before and after subjecting the IC to the stress test.

Abstract: A method of manufacturing a semiconductor device according to the present invention includes, in a silicon substrate of the semiconductor chip, providing two TSVs (Through-Silicon-Vias) that are formed such that interfaces with the silicon substrate are covered with insulating films and bottom surface sides thereof do not penetrate through the silicon substrate, providing a high concentration impurity region in a peripheral region of the bottom surface sides of the TSVs in the silicon substrate, connecting a test circuit to the TSVs, inputting a test signal from one of the TSVs and detecting the test signal output via the high concentration impurity region and the other TSV, thereby evaluating a failure of the semiconductor chip, thinning a bottom surface of the semiconductor chip and removing the high concentration impurity region.

Abstract: A contactor uses a pogo block in a first configuration as a direct integrated circuit test socket and the contactor can be reconfigured to provide a pogo block assembly to interface between a main test printed circuit board (PCB) and a daughter card that is dedicated to a specific device handler and/or a specific package type that can be different from the main test PCB. A pogo block is inserted into a thick frame with an alignment plate for contactor use in which a device under test fits into a recess in the frame through an alignment plate to align the device under test to make contact with electrical contacts of the contactor. The frame and guide plate can be removed and a thinner frame coupled to the contactor, which changes its function to a pogo block assembly.

Abstract: A chip with a built-in self-test (BIST) component capable of testing the linearity of an ADC is described herein. The BIST component uses hardware registers to facilitate a sliding histogram technique to save space on the chip. A subset of detected digital codes are analyzed, and DNL and INL calculations are performed by a controller to determine whether any of the digital codes in the subset exceed maximum or minimum DNL and INL thresholds. New digital codes being detected by the ADC are added to the subset as lower-value digital codes are pushed out of the subset, maintaining the same number of digital codes being analyzed as the subset moves from lower codes detected during lower voltages to higher codes detected at higher voltages. A synchronizer and pointer ensure that the subset moves through the digital codes at the same rate as the analog input ramp source.

Abstract: The present disclosure discloses a test circuit and a test method for detecting a TFT-LCD electrical defect, which relates to the field of liquid crystal display and is able to distinguish effectively between a capacitive defect and a TFT defect. The test circuit for detecting a TFT-LCD electrical defect includes: a test apparatus connected with the input terminals of a first reference voltage and a second reference voltage corresponding to the same gray scale, the test apparatus controls the output terminals of the first reference voltage and the second reference voltage to output a constant voltage to a data line. The present disclosure can be applied to a liquid crystal display.

Abstract: An assistive fine positioning support device for positioning and/or holding a test probe tip (the test probe tip being distanced from the probing head). The support device includes at least one positionable support member having a first support end and a second support end. A tip adapter at the first support end is for connecting the test probe tip to the at least one positionable support member, the tip adapter being in direct contact with the test probe tip. The second support end having means for holding and securing to a surface supporting an electrical component to be probed.

Abstract: In a case where a semiconductor chip is mounted over a first package, 80 pads are coupled to 80 terminals of the package, and in a case where the semiconductor chip is mounted over a second package, 100 pads are coupled to 100 terminals of the second package. An internal circuit of the semiconductor chip operates as a microcomputer with 80 terminals in a case where electrodes are insulated from each other and operates as a microcomputer with 100 terminals in a case where the electrodes are shorted therebetween by an end part of a bonding wire. Therefore, a dedicated pad for setting the number of terminals of the packages is no longer required.

Abstract: An approach for monitoring electrostatic discharge (ESD) event of an integrated circuit. The approach includes a canary device for exhibiting an impedance shift when affected by an ESD pulse, wherein circuit drain of the canary device is connected to an input terminal of the circuit structure. The approach further includes circuit source and logic gates of the canary device, connected to a circuit drain of ESD transistor of the circuit structure, wherein circuit source of the ESD transistor is connected to an output terminal of the circuit structure. The approach further includes a logic gate of the ESD transistor, connected to an enable signal of the circuit structure, and wherein the enable signal is connected to the output terminal through a capacitor of the circuit structure. In addition, the enable signal is also connected to the input terminal through a resistor of the circuit structure.

Abstract: The capacitive fingerprint sensor according to the exemplary embodiments of the present invention includes: a fingerprint sensing electrode Cfp for sensing a human fingerprint; a first transistor T1 in which the amount of currents flowing therethrough changes depending on an output voltage of the fingerprint sensing electrode Cfp; a second transistor T2 in which the amount of currents flowing therethrough changes due to a difference between the currents flowing through the first transistor T1; and a third transistor T3 which resets a gate electrode of the first transistor T1 and provides capacitive coupling with the gate electrode of the first transistor T1 via a pulse signal.

Abstract: A semiconductor chip panel includes a plurality of semiconductor chips embedded in an encapsulation material. At least part of the semiconductor chips comprise a first electrical contact element on a first main face and a second electrical contact element on a second main opposite to the first main face, respectively. One of the plurality of semiconductor chips is tested by establishing an electrical contact between a test contact device and the first electrical contact element and between an electrically conductive holder and the second contact element.

Abstract: An amplitude expected value data generator generates amplitude expected value data that represents, in increments of sampling points, which of multiple amplitude segments the amplitude of a modulated signal waveform that corresponds to the expected value of data to be output from a device under test belongs to. A demodulator performs sampling of the signal waveform to be tested received from the device under test, and generates judgment data that represents, in increments of sampling points, which of the multiple amplitude segments the amplitude of the signal waveform belongs to. A judgment unit makes a comparison between the amplitude expected value data and the judgment data in increments of sampling points.

Abstract: A transition delay test is conducted such that an internal circuit that is a test object circuit in a semiconductor device is divided into a plurality of circuit blocks and a determination test is conducted while changing concurrently operating circuit blocks, a power supply noise generated during conduction of the determination test is detected, a suitable circuit scale on which the transition delay test can be normally conducted without being affected by the influence of the power supply noise is determined based on the result of the determination test and the detected power supply noise, and clocks to be supplied to the circuit blocks are controlled based on the determination result to limit the number of the concurrently operating circuit blocks.

Abstract: A semiconductor device includes a monitor including a first element coupled between a first power supply line and a second power supply line, and a load for increasing a load value between the first element and the first power supply line or the second power supply line, and a determination unit which determines an operating state of the first element based on an output of the monitor.

Abstract: A test circuit including a light activated test connection in a semiconductor device is provided. The light activated test connection is electrically conductive during a test of the semiconductor device and is electrically non-conductive after the test.

Abstract: Device comprising a ductile layer, a method for making a component comprising a ductile layer and a method for testing a component are disclosed. An embodiment includes an electronic device including a first conductive layer, a ductile layer and a brittle layer between the first conductive layer and the ductile layer.

Abstract: Circuits and methods are provided for a reliability, availability and serviceability (RAS) enabled and self-regulated frequency and delay sensor of a semiconductor. A circuit for measuring and compensating for time-dependent performance degradation of an integrated circuit, includes at least one critical functional path of the integrated circuit, and Wearout Isolation Registers (WIR's) connected to boundaries of the critical functional path. The circuit also includes a feedback path connected to the WIR's, and a sensor control module operable to disconnect the critical functional path from preceding and succeeding functional paths of the integrated circuit, connect the critical functional path to the feedback path to form a critical path ring oscillator (CPRO), and enable the CPRO to generate an operating signal. A delay sensor module is operable to measure a frequency of the operating signal to determine and compensate for a degradation of application performance over a lifetime of a semiconductor product.

Abstract: A test card includes a power interface, a controller, a test interface, and a test point. The test interface includes a power pin, a start pin, and a data signal pin. The power interface is connected to the controller and the power pin, and also connected to an external power to receive a work voltage. The controller transmits a turn-on signal to the start pin. The test point is connected to the data signal pin. When an interface of a motherboard is connected to the test interface, the power pin, the start pin, and the data signal pin are connected to corresponding pins of the interface of the motherboard. The motherboard outputs a data signal to the test point through the motherboard interface and the test interface after the controller receives the turn-on signal.

Abstract: A semiconductor apparatus (IPD) includes a set value storage unit that stores a set value determined based on an initial characteristic value of the IPD, and a detector that detects characteristic degradation of the IPD based on a characteristic value of the IPD at given timing and the set value stored in the set value storage unit. Further, a method of detecting characteristic degradation of a semiconductor apparatus (IPD) includes storing a set value determined based on an initial characteristic value of the IPD, and detecting characteristic degradation of the IPD based on a characteristic value of the IPD at given timing and the stored set value.

Abstract: By constructing a universal test circuit on a tester chip, and stacking the tester chip in an IC package together with operational circuit chips to be tested, the problems inherent with external IC testing are reduced. The tester chip can be standardized across a number of different chip combinations and, if desired, pre-programmed during manufacturing for a particular package. The tester chip interfaces to other chips in the stack advantageously are standardized.

Abstract: Systems and methods for managing process and temperature variations for on-chip sense resistors are disclosed. The system includes a circuit that can leverage a linear gm circuit in order to provide linear gains (positive gains and/or negative gains). The linearity of the circuit enables compensation for temperature and process variations across an entire range of current (positive to negative). A control signal is generated by using a linear gm amplifier and a replica resistor, which is substantially similar to the on chip resistor. The control signal is used to control the gain of a disparate linear gm amplifier within a compensation circuit, which provides an offset voltage to compensate for the variation in resistance of the on chip resistor.

Abstract: Disclosed is a method for testing multi-chip stacked packages. Initially, one or more substrate-less chip cubes are provided, each consisting of a plurality of chips such as chips stacked together having vertically connected with TSV's where there is a stacked gap between two adjacent chips. Next, the substrate-less chip cubes are adhered onto an adhesive tape where the adhesive tape is attached inside an opening of a tape carrier. Then, a filling encapsulant is formed on the adhesive tape to completely fill the chip stacked gaps. Next, the tape carrier is fixed on a wafer testing carrier in a manner to allow the substrate-less chip cubes to be loaded into a wafer tester without releasing from the adhesive tape. Accordingly, the probers of the wafer tester can be utilized to probe testing electrodes of the substrate-less chip cubes so that it is easy to integrate this testing method in TSV fabrication processes.

Abstract: An apparatus for determining an electrical reliability of a ball grid array (BGA) assembly of an integrated circuit is presented. The assembly comprises a testing printed circuit board (PCB) having an integrated circuit (IC) test region located thereon. Vias extend through the testing PCB from a surface to an underside thereof within the IC test region. Each via has an IO pad or ground pad electrically connectable thereto. An IC package having an IC die connected thereto by solder bumps is connected to the IC test region by solder balls, such that each of the IO pads is electrically connectable to a respective pair of the solder balls and solder bumps by the vias. A method of testing interconnection reliability of the BGA using the apparatus is also presented.

Abstract: A test circuitry configured to test for transition delay defects in inter-die interconnects is disclosed. In one aspect, the test circuitry comprises an input port configured to receive a test data value and a data storage element configured to temporarily store the test data value. The test circuitry additionally comprises a second inter-die interconnect configured to be electrically connected to a first inter-die interconnect so as to form a feedback loop for transferring the test data value from the data storage element back to the data storage element. The test circuitry additionally comprises a data conditioner configured to condition the fed back test data value so as to make it distinguishable from the stored test data value. The test circuitry additionally comprises a clock pulse generator configured to generate a delayed clock pulse.

Abstract: A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

Abstract: A system and method for detecting transition delay faults decouples the test enable pins of the clock gating cells from other elements in the circuitry. The test enable pins are controlled during test mode by a unique signal, allowing the tester to independently control the clock gating logic of the circuitry. By being able to ungate the clock, the tester can ensure that the two clock pulses needed to check for transition delay faults will always be present.

Abstract: A burn-in method for an embedded Multi Media Card (eMMC), and a test board using the same, and an eMMC tested by the same. The disclosed burn-in method comprises the steps as below: writing a test pattern to a flash memory of the eMMC; electrically connecting a command line of the eMMC to ground to operate the eMMC in a boot state; performing a burn-in procedure on the flash memory when the eMMC is in the boot state and the test pattern is recognized as being contained in the flash memory; and collecting a test report during the burn-in procedure, wherein the test report is stored in the flash memory.

Abstract: A method of testing a semiconductor device including applying a reference test pattern to the semiconductor device in which a preset number of power pins of the semiconductor device are supplied with current, incrementally disconnecting the power pins from the current to set a number of removal power pins, and determining a final number of power pins which represents a minimum number of power pins with which the semiconductor device operates normally. The method additionally includes applying a delay test pattern to the semiconductor device to set a cycle of the delay test pattern corresponding to the number of removal power pins to reduce or prevent an overkill phenomenon.

Abstract: According to the following disclosure, disclosed is a semiconductor device including: an internal circuit configured to receive and output a signal current; a current mirror unit outputting a copied current corresponding to the signal current; and a test pad from which the copied current is taken out.

Abstract: A semiconductor package and testing method is disclosed. The package includes a substrate having top and bottom surfaces, a semiconductor chip mounted in a centrally located semiconductor chip mounting area of the substrate, and a plurality of test pads disposed on top and bottom surfaces of the substrate and comprising a first group of test pads configured on the top and bottom surfaces of the substrate and having a first height above the respective top and bottom surface of the substrate, and a second group of test pads disposed on the lower surface of the substrate and having a second height greater than the first, wherein each one of the second group of test pads includes a solder ball attached thereto.

Abstract: The present idea refers to a needle head, its use in a probe arrangement, and a method for electrically contacting multiple electronic components. The needle head comprises a body with a lower surface, needle electrodes emerging from the lower surface, and multiple outlets arranged in the lower surface. A channel is arranged between an inlet in the body and the outlets for conveying a medium from the inlet to the outlets. By this means, electronic components arranged in close distance under the lower surface of the needle head are directly exposed to the medium which provides a test environment during a test of the electronic components.

Abstract: In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a cavity between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.

Abstract: A semiconductor device is designed to facilitate analyzing a position and a cause of the failure of an integrated circuit adopting a polyphase clock. To this end, the semiconductor device is provided with an error detecting unit that detects that a problem of the operation occurs in the integrated circuit, a clock state holding unit that holds the information of phases in a predetermined term of a two- or more-phase clock and an output unit that outputs the information of the phases in the predetermined term of the two- or more-phase clock when the error detecting unit detects that the problem of the operation occurs in the integrated circuit.

Abstract: A method for fabricating a stackable integrated circuit layer and a device made from the method are disclosed. A stud bump is defined on the contact pad of an integrated circuit die and the stud-bumped die encapsulated in a potting material to define a potted assembly. A predetermined portion of the potting material is removed whereby a portion of the stud bump is exposed. One or more electrically conductive traces are defined on the layer surface and in electrical connection with the stud bump to reroute the integrated circuit contacts to predetermined locations on the layer to provide a stackable neolayer.

Abstract: A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

Abstract: A first power-cutoff switch is disposed between a power line and an internal power line dedicated for a circuit block, and has a current supply capacity having the level at which ON-current can protect an external examination environment. A second power-cutoff switch is disposed between a power line and an internal power line, and has a current supply capacity having the level at which ON-current can supply consumed current of the circuit block. A detecting circuit detects that a voltage of the internal power line matches a reference voltage. The first power-cutoff switch is ON/OFF by an operation state of the circuit block. The second power-cutoff switch is ON by detecting the matching of the volumes with the detecting circuit and is OFF by the ON/OFF operation of the first power-cutoff switch.

Abstract: In accordance with an embodiment, a method of testing an integrated circuit, includes receiving a supply voltage on the integrated circuit via a first input pin, providing power to circuits disposed on the integrated circuit via the first input pin, comparing the supply voltage to an internally generated voltage, generating a digital output value based on the comparing, and applying the digital output value to a pin of the integrated circuit.

Abstract: A calibrator apparatus for calibrating the performance of partial discharge measurements at electrical components, such as high voltage cables or transformators, comprises a housing (1) and an external electrode (4) to be mounted at the housing (1). A control unit (2) generates a defined charge pulse (QS) depending on a stray capacitance (CS) of the external electrode (4) against ground, which is supplied to the electrical component.

Abstract: A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

Abstract: A device and method are disclosed wherein a receiver signal line within an integrated circuit may be selected for probing. In one embodiment, a plurality of signal pads and a test pad are provided on an external surface of an integrated circuit chip. A plurality of signal lines extends through the integrated circuit chip to the signal pads. A multiplexer on the integrated circuit chip is configured for individually selecting any of the signal lines. An amplifier on the integrated circuit chip amplifies a selected signal and communicates the amplified signal to an externally-accessible test pad to be probed.

Abstract: Methods and apparatus selecting settings for circuits according to various aspects of the present invention may operate in conjunction with a measurement element connected to the circuit. The circuit may include a voltage source adapted to supply a voltage to the measurement element. The voltage may be substantially independent of the characteristics of the measurement element. The circuit may further include a measurement sensor responsive to a current in the measurement element. The measurement sensor may generate a control signal according to the current in the measurement element.

Abstract: A chip testing apparatus and a chip testing method are provided. The chip testing apparatus includes a command generating module, a transceiving module and a control module. When the command generating module generates a first test command, the transceiving module transmits the first test command to a radio frequency identification (RFID) chip and receives a target test result from the RFID chip. The control module determines whether the target test result complies with a reference test result. When the determination result of the control module is no, the control module controls the command generating module to generate a second test command for retesting the RFID chip.

Abstract: A method for conducting IDDQ tests for a device having a plurality of test sites is disclosed. The method includes identifying voltage ranges for each of the plurality of test sites, closing a switch in each of a plurality of voltage drop setup circuits, and setting each of the plurality of test sites to one of a plurality of logic states. Each of the plurality of voltage drop setup circuits includes a resistor parallelly coupled to the switch. One terminal of each voltage drop setup circuit is coupled to a voltage source and the other terminal of each voltage drop setup circuit is coupled to respective tester channels of each of the plurality of test sites. After opening the switch in each of the plurality of voltage drop setup circuits, the voltage drop across the resistor in each voltage drop setup circuit is measured.

Abstract: The method and circuit for testing a TSV of the present invention exploit the electronic property of the TSV under test. The TSV under test is first reset to a first state, and is then sensed at only one end to determine whether the TSV under test follows the behavior of a normal TSV, wherein the reset and sense steps are performed at only one end of the TSV under test. If the TSV under test does not follow the behavior of a normal TSV, the TSV under test is determined faulty.

Abstract: An integrated circuit die comprises an electronic circuit and one or more output ports for outputting signals from the die via an external impedance, to a load, external from the die. The output port is connected to the electronic circuit. The die is further provided with an on-die sampling oscilloscope circuit connected to the output port, for measuring a waveform of the outputted signals.

Abstract: In an embodiment, a chuck to support a solar cell in hot spot testing is provided. This embodiment of the chuck comprises a base portion and a support portion disposed above the base portion. The support portion is configured to support the solar cell above the base portion and to define a space between a bottom surface of the solar cell and the base portion that thermally separates a portion of the bottom surface of the solar cell from the base portion.

Abstract: A semiconductor device (1) includes a semiconductor wafer (11) on which a plurality of semiconductor chip forming regions (1A) is formed, a circuit section (12) which is provided within each of the semiconductor chip forming regions (1A) of the semiconductor wafer (11), a control circuit section (14), provided within each of the semiconductor chip forming regions (1A) and connected to the circuit section (12), that controls electric power supplied to the circuit section (12), a power supply line (18) connected to the plurality of control circuit section (14), and a reference power line (17) connected to the plurality of control circuit section (14). In each of the control circuit sections (14), a voltage of electric power supplied from the power supply line (18) is controlled on the basis of a reference voltage from the reference power line (17).

Abstract: A semiconductor package test apparatus having a test head and a test handler is provided. The semiconductor package test apparatus may include an insert in which a plurality of semiconductor packages are stacked and received in an offset fashion. Further, the semiconductor package test apparatus may include a plurality of sockets located adjacent to the insert and each of the inserts may have a plurality of socket pins. The sockets have different surface levels and are aligned with the semiconductor packages.