Abstract: A Radio-Frequency (RF) waveguide comprising at least a folded sheet (3) is described, wherein the sheet comprises a first layer made of a plastic, and at least a second layer made of a electric conductive material. Furthermore a method for manufacturing such a RF waveguide plus a device to perform said method is described.

Abstract: That portion of a wire harness, corresponding to an installation path region E1 where a cable is not required to have flexibility, includes rigid wires 1 each having a single conductor 1a, and a metal shielding case 2 covering outer peripheries of the rigid wires 1. Each of those portions of the wire harness, corresponding respectively to installation path regions E2 where the cable is required to have flexibility, includes flexible wires 4, and a flexible shielding member 5 covering outer peripheries of the flexible wires 4. Conductors 4a of the flexible wires 4 are connected to the conductors 1a of the rigid wires 1, and the metal protector 2 is connected to the flexible shielding members 5.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: Disclosed herein are a transmission line of coaxial type and a manufacturing method thereof, capable of preventing a radiative signal loss of signal lines during transmission of an RF signal and removing signal interference between adjacent signal lines, thus allowing signal lines to be compactly arrayed during a manufacture of IC, and reducing a dimension of the IC. The transmission line of coaxial type includes grooves provided on a semiconductor substrate, a first ground layer, an electrically conductive epoxy coated on a flat part of the first ground layer except the grooves, second ground layers provided on the electrically conductive epoxy, a dielectric film provided at a position above the grooves and the second ground layers, a third ground layer provided on an upper surface of the dielectric film, and signal lines placed in spaces defined by the grooves and a lower surface of the dielectric film.

Abstract: A memory device is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The structure for transmission line operation includes a second layer of electrically conductive material on the second layer of insulating material.

Abstract: A thin, light and soft electromagnetic wave absorber is disclosed exhibiting an excellent workability. The first conductor element group of a first conductor element layer consists of aligned cross conductor elements and square conductor elements in regions surrounded by cross conductor elements. A radio wave incident from the first conductor element layer side is received by each element, internally subjected to multiple reflection and then absorbed by a first loss material layer. Since the first conductor element group is realized by the cross conductor elements and the square conductor elements, receiving effect is enhanced and the radio wave can be collected with a high collection efficiency.

Abstract: A coaxial waveguide converter circuit is provided for converting an input/output coaxial section of a traveling-wave tube to a waveguide. The circuit comprises a waveguide matching part for connecting an inner conductor of the coaxial section extending into the waveguide to a wall of the waveguide. The waveguide matching part includes a fitting hole for fitting the inner conductor thereinto, and a plurality of cantilever supports which define the fitting hole at leading end portions thereof. The leading end portions of the plurality of cantilever supports defining the fitting hole are uniformly kept in close contact with a peripheral surface of the inner conductor.

Abstract: Techniques for reducing the number of layers in a multilayer signal routing device are disclosed. The technique may be realized as a method for routing one or more conductive traces between a plurality of electronic components of a multilayer signal routing device. The method comprises forming a first inter-component channel at a first routing layer of the multilayer signal routing device, the first inter-component channel extending between a first set of two or more electronic components of the plurality of electronic components and having a first orientation and forming a second inter-component channel at a second routing layer of the multilayer signal routing device, the second inter-component channel extending between a second set of two or more electronic components of the plurality of electronic components and having a second orientation different from the first orientation.

Abstract: A transmission line is provided which has a low loss and can flow large current. A superconductor transmission line has: an internal conductor; and an external conductor surrounding the internal conductor, made of oxide superconductor and having four planes, which four planes have a cross section of a hollow quadrilateral with each corner portion being removed, and adjacent planes of which define a slit narrower than ?/4 (? being a wavelength of a high frequency wave to be transmitted).

Abstract: A substrate having a microstrip line structure is provided comprising a trench provided at least in one main surface of a base body constituting the substrate having an inner surface geometry of an unbent curved surface and corresponding to the pattern of the microstrip line; a laminate film having a ground conductive layer and an insulating layer formed along the inner surface geometry of the trench; and a signal line layer constituting the microstrip line formed on the laminate film; where the signal line layer has a configuration separated for each trench.

Abstract: A Radio-Frequency (RF) waveguide comprising at least a folded sheet (3) is described, wherein the sheet comprises a first layer made of a plastic, and at least a second layer made of a electric conductive material. Furthermore a method for manufacturing such a RF waveguide plus a device to perform said method is described.

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: The idea of the invention is to fabricate a multilayer coaxial transmission line into a printed circuit. The outermost conductor is fabricated by conductive strips in different layers, using conductive via posts in isolation layers connecting the strips. The innermost conductor can be a single conductive strip or multi strips in different layers connected together through conductive via posts.

Abstract: Multi-layer metal-shielded monolithic transmission lines are formed in side-by-side arrangement by depositing parallel planar thin film, conductive layers, separated by nonconductive separator layers to form a stack of alternating conductive and nonconductive layers. The conductive layers form a top and a bottom conductive plane and establish a mutually registered selected width of the stack. A center conductive layer has laterally spaced apart conductive strips separated by nonconductive spacer layers. The two laterally terminal of the conductive strips are spaced at the selected width. Each of the nonconductive separator layers provides a plurality of elongated vias between the two lateral terminals of the three conductive strips and the conductive planes.

Abstract: A connector providing an offset interconnect has a dielectric body with first and second longitudinally opposed and laterally offset portions and an internal cavity. An offset electrically conductive path is disposed within the internal cavity. The offset electrically conductive path extends from the first portion of the dielectric body to the second portion of the dielectric body. A compressible conductor is disposed within the internal cavity in the second portion of the dielectric body.

Abstract: A signal transition device such as a coplanar waveguide launch package is disclosed. The coplanar waveguide launch package has a first portion and a second portion. The first portion is adapted to receive electrical signals from a conductive wire. The received signals terminate proximal to a launch at a first surface of the first portion. The second portion, connected to the first portion, has a support surface at a substantially normal angle. The support surface of the second portion is adapted to support a coplanar waveguide. Because the coplanar waveguide launch package of the present invention does not require removing of bottom portions of the coplanar waveguide launch package, it does not require machining of the bottom-side, does not require removal of the bottom-side material, and does not require a bottom lid.

Abstract: A multi-layered, flat, flexible cable capable of transmitting both power and multiple control signals to the components of a network is disclosed. The cable provides all connections on its top surface using a via-less design that does not reduce the cross-sectional area of power and ground buses within the cable. This effect is achieved through the use of folded conducting tabs appearing at periodic intervals along one of the power and ground conducting layers, which are folded over onto the top of the cable for electrical connection thereto.

Abstract: The idea of the invention is to fabricate a multilayer coaxial transmission line into a printed circuit. The outermost conductor is fabricated by conductive conduit strips in different layers, using conductive via posts in isolation layers connecting the strips. The innermost conductor can be a single conductive strip or multiple strips in different layers connected together through conductive via posts.

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract: Support structure for high frequency coaxial transmission line. A conductive bead ring is split in two halves longitudinally, containing a relief for excess glass flow and provision for locking the halves together. A glass dielectric surrounds the center conductor, which is tapered from a first larger diameter to a second smaller diameter in the region of the glass dielectric. A fixture for forming the glass to metal seal uses dams to control the positioning of the glass with respect to the taper in the center conductor.

Abstract: A broadband coaxial transmission line is formed by joining smaller coaxial transmission lines having particularly formulated lengths. Insulating supports in the transmission line are situated in a prescribed manner to reduce reflections along the transmission line. The insulating supports are also formed with particularly positioned symmetric voids to minimize weight, provide adequate structural support, and minimize reflections.

Abstract: This invention is a braided gold wire coaxial cable of micron size which generates hyperspace energy by coupling to the tetrahedral geometry of subspace, dimension and the Planck mass.

Abstract: Transmission line type components (1, 1′), which form coaxial lines having a very low characteristic impedance by coaxially installing a cylindrical outer conductor made of a conducive material being larger in diameter than an inner conductor so as to cover via a high dielectric insulating material the surface of an inner conductor made of a conductive material, are inserted in series between a power supply line (8) and a ground line (9) connected with a dc source on a printed circuit board and an I.SI (6) power supply port, whereby almost the entire high-frequency power supply current generated from the I.SI (6) is reflected off the I.SI (6) power supply port, and part of the high-frequency power supply current intruding into the components (1, 1′) is consumed and does not reach the external power supply line (8).

Abstract: A structure of digital transmission line having a core material, a middle material layer and a coating layer. The core material is a transmission medium enveloped with an insulation PE foam layer. The coating layer includes at least one layer and is made of polyvinyl chloride. The middle material layer is provided between the core material and the coating layer, and is characterized by that the middle material layer is comprised of a copper foil wrapping layer, at least a metallic-wire knitting layer and a foamed Telfon-tape wrapping layer (PTFE). The middle material layer can get 100% obscuring, can minimize the degree of mutual interference, can maintain the characteristic impedance at 75&OHgr;, and can get the result that no refraction or reflection of transmitted signals is induced during transmission.

Abstract: An RF coaxial cable with clad conductors includes an inner tubular conductor having a first base layer formed of a relatively higher conductivity material, and a first bulk layer formed of a relatively lower conductivity material. The first base layer of higher conductivity material extends over an area greater than an area of the first bulk layer to form first margin regions composed of only the higher conductivity material. The first margin regions of the first base layer of the higher conductivity material are joined together to form the inner tubular conductor with only the first margin regions of the higher conductivity material being joined. Also included is a dielectric material surrounding the inner conductor, an outer tubular conductor formed in the same manner as the inner conductor.

Abstract: Occurrence of EMI is reduced without a sharp increase of the manufacturing cost by suppressing a common mode current stably. There is provided a disclosed printed-circuit board being adapted such that a width of an outer edge section of a T-shaped pattern is widened so as to surround a recessed section with a frame-shaped additional electric conductor by electrically connecting the frame-shaped additional electric conductor with the T-shaped pattern making up a ground pattern so as to close the recessed section.

Abstract: An AC power feed device for conducting electrical power from a source to a load. The feed device has a constant characteristic impedance along its length and an outer periphery that varies in size progressively along its length, or the feed device has an input end connected to the match network and an output end connected to an electrode, and has a characteristic impedance which varies from a value substantially equal to the output impedance of a match network coupled at the input end to a value equal to the impedance of the electrode.

Abstract: A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including coaxial cables, cavity antennas, microstrip lines, coplanar lines, and waveguides.

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Abstract: A method of forming a coaxial transmission line on a high density PCB. A metal layer (102) on the PCB (104) forms the bottom part of the shield, and is covered by a first dielectric (112). Two parallel trenches (122) are formed in the first dielectric to reveal part (123) of the metal strip. The signal conductor (132) is then formed on the first dielectric. A second dielectric (142) covers the signal conductor and the first dielectric. A second set of two parallel trenches (172) are formed in the second dielectric immediately above the first two trenches. Metal deposit (182) is plated in the parallel trenches to contact the metal strip, and also covers a portion of the second dielectric that lies between the trenches, to create a shield. The resulting coaxial transmission line has a center conductor insulated from the shield by the dielectrics.

Abstract: A structure of digital transmission line comprising a core material, a middle material layer and a coating layer, whereof, the core material is a transmission medium enveloped with an insulation PE foam layer; the coating layer includes at least one layer and is made of polyvinyl chloride; the middle material layer is provided between the core material and the coating layer, and is characterized by that the middle material layer is comprised of a copper foil wrapping layer, at least a metallic-wire knitting layer and a foamed Teflon-tape wrapping layer (PTFE). The middle material layer can get 100% obscuring, can minimize the degree of mutual interference, can maintain the characteristic impedance at 75&OHgr;, and can get the result that no refraction or reflection of transmitted signals is induced during transmission.

Abstract: An RF coaxial cable with clad conductors includes an inner tubular conductor having a first base layer formed of a relatively higher conductivity material, and a first bulk layer formed of a relatively lower conductivity material. The first base layer of higher conductivity material extends over an area greater than an area of the first bulk layer to form first margin regions composed of only the higher conductivity material. The first margin regions of the first base layer of the higher conductivity material are joined together to form the inner tubular conductor with only the first margin regions of the higher conductivity material being joined. Also included is a dielectric material surrounding the inner conductor, an outer tubular conductor formed in the same manner as the inner conductor.

Abstract: The invention provides a transmission line that is fabricated by forming the bottom base that is formed by means of a process in which a groove is formed on a circuit substrate, a conductive film is formed on the surface of the groove, the groove is filled with dielectric material, and a metal conductor is formed on the dielectric material, by forming the top base that is formed by means of a process in which a groove is formed, a conductive film is formed on the surface of the groove, and the groove is filled with dielectric material, and by putting the top base on the bottom base so that the metal conductor is interposed between the top base and the bottom base. Thereby, a transmission line with reduced leakage of the electromagnetic field is provided. Furthermore, an electronic parts or electronic apparatus with good high frequency performance that use the above-mentioned transmission line is provided.

Abstract: The idea of the invention is to fabricate a multilayer coaxial transmission line into a printed circuit. The outermost conductor is fabricated by conductive conduit strips in different layers, using conductive via posts in isolation layers connecting the strips. The innermost conductor can be a single conductive strip or multiple strips in different layers connected together through conductive via posts.

Abstract: In concentrated multiprocessor systems conforming to the presently disclosed modular architecture, a host processor and plural client processors are packaged in a single box containing a high speed (short length) bus connecting all of the processors, and data storage resources via the bus. The bus may be of a type commonly used in contemporary single computer systems; e.g. one conforming to PCI specifications. The host processor and associated resources are mounted directly on an integrated circuit motherboard containing the bus and card connectors attached to the bus. The card connectors removably receive integrated circuit cards containing individual client processors. In one embodiment, client processors are configured to be used as workstations or PC's—in a residence, office or small factory environment—relative to users and accessories remote from the system enclosure.

Abstract: Disclosed is a coaxial type signal line that solves problems associated with signal interference and the connection of signal lines that are generated in a radio frequency (RF) electrical system. A method for manufacturing the coaxial type signal line includes the steps of forming a groove on a substrate, forming a first ground line on a surface of the groove and a plain surface of the substrate, forming a first dielectric layer including dielectric material on the first ground line formed on the surface of the groove, forming a signal line on the first dielectric layer the signal line for transmitting signals, forming a second dielectric layer including dielectric material on the signal line and the first dielectric layer, and forming a second ground line on the first ground line and the second dielectric layer.

Abstract: A computer system employs electrically lossy transmission systems to dissipate RF energy, and thus reduce RF emissions near the source. An electrically lossy dielectric includes a colloidal dispersion of lossy material, e.g., graphite, in a polymer matrix. A layer of this material can be placed in contact with a conductor or with its surrounding dielectric. A metal layer contacts the other side of the lossy dielectric so that an electrically lossy transmission system is defined. Such transmission systems are defined with respect to signal conductors, shields for coaxial cables, PCB boards, and structural metal, such as heat sinks and vent openings, etc. In some cases, impedance mismatches are used to reflect unwanted energy back through or back and forth through the lossy transmission system. The lossy transmission systems dissipate RF energy so that there is less RF energy to radiate to the computer's exterior.

Abstract: An interconnect device for connecting components of high frequency communication systems, including RF and phased array applications. The device is capable of carrying RF and microwave signals between pairs of components and includes an outer conducting tube and an insulated conducting wire disposed within the tube. The outside diameter of the insulated wire is less than the inside diameter of the tube allowing movement of the wire relative to the tube. As a result of this movement, the longitudinal axis of the wire may vary from the longitudinal axis of the tube resulting in a “sloppy coax” interconnect. The ability of the wire to move within the tube facilitates installation and replacement of the wire when required.

Abstract: A system and method is described for safely and economically providing up to 1800 watts to downhole equipment over existing logging cables. In one embodiment, the system includes a standard multiconductor logging cable which supports orthogonal signal transmission modes on circumferentially spaced insulated conductors. A high-power power source on the surface is coupled to the insulated conductors in the cable to drive a power signal on the lowest impedance signal transmission mode. Bearing in mind that high-power electrical currents can present a safety hazard, system safety may be enhanced by the addition of a reliable current imbalance detector configured to shut down all power sources when currents in the insulated conductors don't add up to zero. The system may further include multiple power sources operating on different independent signal transmission modes, and may also include multiple telemetry channels which share the power transmission modes via frequency multiplexing.

Abstract: A method and device for forming metal capacitor and integrated coaxial lines using energy transfer so as to form conductive links among conductors. Conductors are embedded within nonconductive layers, such that the conductors form a matrix of at least three levels. A source of energy is directed at the layers, such that at least one conductor is wholly shielded by at least one other conductor, and conductive paths form so that a conductor becomes shielded by the paths. Particular conductive path formation is encouraged by use of: differing surface areas of conductors; diffusion barriers to increase relative energy absorption; varied relative distances among conductors; some conductors having a lower melting point than other conductors; directing the energy to conductors in a particular order; or combinations thereof. In one variation, links among differing layers are formed using more than one energy source or sequentially generated and directed pulses of energy.

Abstract: Disclosed is a coaxial type signal line that solves problems associated with signal interference and the connection of signal lines that are generated in a radio frequency (RF) electrical system. A method for manufacturing the coaxial type signal line includes the steps of forming a groove on a substrate, forming a first ground line on a surface of the groove and a plain surface of the substrate, forming a first dielectric layer including dielectric material on the first ground line formed on the surface of the groove, forming a signal line on the first dielectric layer the signal line for transmitting signals, forming a second dielectric layer including dielectric material on the signal line and the first dielectric layer, and forming a second ground line on the first ground line and the second dielectric layer.

Abstract: The present invention refers to circuit board (10), in particular a multilayer circuit board including at least a first carrying section (11) and a second section (12), conductor pattern (17a, 17b, 17c) and via holes (14, 14b, 14c), at least one of the sections (11; 12) comprises at least one cavity (13a, 13b) for receiving a least one electric component (15), preferably a naked circuit, the second section (11, 12) constitutes a protective cover essentially hermetical sealing of the component (15). The circuit board (10) comprises substrates of a non ceramic material and that said substrates are protected against moisture penetrating in the transverse direction of the substrates by means scaling arranged at outer edges of the substrates.

Abstract: A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including coaxial cables, cavity antennas, microstrip lines, coplanar lines, and waveguides.

Abstract: Disclosed is a coaxial type signal line that solves problems associated with signal interference and the connection of signal lines that are generated in a radio frequency (RF) electrical system. A method for manufacturing the coaxial type signal line includes the steps of forming a groove on a substrate, forming a first ground line on a surface of the groove and a plain surface of the substrate, forming a first dielectric layer including dielectric material on the first ground line formed on the surface of the groove, forming a signal line on the first dielectric layer the signal line for transmitting signals, forming a second dielectric layer including dielectric material on the signal line and the first dielectric layer, and forming a second ground line on the first ground line and the second dielectric layer.

Abstract: A common interface (10) for a PIM sensitive diplexing filter (30) is provided in a non-contacting, or isolated, configuration while providing PIM reliability, ESD conduction and thermal conduction, making it ideal for high power space applications. The common interface (10) is a one-piece construction of a diplexed, or multiplexed, coaxial, or squareax, transmission line that is constructed with a direct non-contacting (34, 36), or connectionless, interface. Terminations (26, 28) connect the inner conductor (20) to the outer conductor (12) of the interface (10) making the device one integral piece yet providing the necessary isolation through non-contacting interface with a PIM sensitive device and terminations (26, 28) that provide thermal and ESD conduction necessary for PIM reliablity.

Abstract: An RF interconnect between a rectangular coaxial transmission line including a coaxial center conductor and a dielectric structure with a rectilinear cross-sectional configuration fitted around the coaxial center conductor and an RF circuit separated from the airline circuit by a separation distance. The RF interconnect includes a compressible conductor structure having an uncompressed length exceeding the separation distance, and a dielectric sleeve structure surrounding at least a portion of the uncompressed length of the compressible conductor structure. The RF interconnect structure is disposed between the rectangular coaxial transmission line and the RF circuit such that the compressible conductor is placed under compression between the substrate and the RF circuit. Examples of the RF circuit include a vertical coaxial transmission line or a grounded coplanar waveguide circuit disposed in parallel with the center conductor of the rectangular coaxial transmission line.

Abstract: An RF connector includes male and female connector components. The male component has a multi-diameter dielectric housing cylinder with a metal center conductor extending through an opening in the housing. The center pin extends from each end of the dielectric housing. The center pin and the dielectric housing are sized appropriately to provide a matched impedance at microwave frequencies for the use environment to which the male component is connected. The female connector component includes a dielectric body having a center cavity formed therein. A compressible wire bundle forming a compressible conductor member is recessed into the cavity. The compressible conductor protrudes from the far end of the female cavity allowing contact to a mating circuitry. The male connector component is assembled with the female component, the male center pin being brought into electrical contact with the compressible conductor member.