Abstract: A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line connecting the RF circuit parts provided on both sides is constructed by a via group including a periodical structure or a via having a coaxial structure perpendicular to faces of the multilayer dielectric substrate. As the multilayer dielectric substrate, a hard multilayer substrate using metallic layers as a microstrip line wiring layer, a DC/IF signal line layer, and grounding metal layers for shielding which are disposed on and under the DC/IF signal line is employed. By using the transmission line achieved by a through via having the periodical structure or the through via having the coaxial structure, an electromagnetic wave propagating in parallel between the grounding conductors is confined.

Abstract: A connection structure is provided, which can perform an electrical connection between high-frequency circuit substrates in a manner of high workability and productivity. A connection structure comprises: a high-frequency transmission line lead frame connecting a first high-frequency transmission line formed on a first high-frequency circuit substrate to a second high-frequency transmission line formed on a second high-frequency circuit substrate; a plurality of GND electrode lead frames disposed in parallel to the high-frequency transmission line lead frame on both sides thereof, and providing a connection between a first GND electrode of the first high-frequency circuit substrate and a second GND electrode of the second high-frequency circuit substrate; and a reinforcing substrate integrally securing the high-frequency transmission line lead frame and a plurality of GND electrode lead frames.

Abstract: A high-frequency circuit formed on a surface of a dielectric substrate includes: a signal strip formed on a first face of the dielectric substrate for transmitting a signal therethrough; a pair of ground strips formed on the first face astride the signal strip, with an interspace on each side of the signal strip; a ground conductor layer formed on a second face of the dielectric substrate, the second face being opposite to the first face; and a plurality of through-vias formed in the dielectric substrate astride the signal strip for electrically connecting the pair of ground strips to the ground conductor layer. First and second through-vias, which are a pair of opposing through-vias located closest to a terminating end of the signal strip, are disposed apart from each other by a distance smaller than a distance between any other pair of opposing through-vias.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A connected construction of a high-frequency package and a wiring board have an excellent high-frequency transmission characteristic without degradation of the transmission characteristic of even high-frequency signals in a wide band ranging from 20 GHz to 80 GHz in the case of connecting a high-frequency package to a wiring board. A distance between conductive vias and conductive vias to connect grounds formed on both main surfaces of a high-frequency transmission line substrate constituting the high-frequency package, and a distance between conductive vias and conductive vias to connect grounds formed on both main surfaces of the wiring board on which the high-frequency package is mounted, are set in consideration of the dielectric constant of the high-frequency transmission line substrate and the dielectric constant of the wiring board in order to improve the high-frequency transmission characteristic between the high-frequency transmission line substrate and the wiring board.

Abstract: A millimeter wave module includes a silicon substrate with first and second cavityes formed by anisotropic etching on the silicon substrate, and a glass substrate having a microstrip filter pattern and microbumps for connecting the glass substrate to the silicon substrate. A filter is provided using an air layer as a dielectric disposed in the first cavity. An MMIC is mounted by the flip chip method over the second air layer. A coplanar waveguide is on the silicon substrate for connecting the filter and MMIC. The filter having low loss is achieved because it has the microstrip structure using air as an insulating layer. Also change in characteristics of the MMIC during mounting is eliminated because the MMIC is protected by contacting air. Accordingly, the millimeter wave module has excellent characteristics and is made using a simple method.

Abstract: A high frequency line-waveguide converter comprises a high frequency line including a dielectric layer, a line conductor disposed on an upper surface of the dielectric layer, and a ground conductor layer disposed on the same surface so as to surround one end of the line conductor, a slot formed in the ground conductor layer so as to be substantially orthogonal to the one end of the line conductor and coupled to the line conductor, a shield conductor part disposed on a side of or in an inside of the dielectric layer so as to surround the one end of the line conductor and the slot, and a waveguide disposed at the lower side of the dielectric layer so that an opening is made opposite to the one end of the line conductor and the slot, and electrically connected to the shield conductor part.

Abstract: An RF package includes a multilayered dielectric substrate, a feed-through, and metal members. First and second dielectric substrates are formed on the multilayered dielectric substrate. The multilayered dielectric substrate has a cavity where a semiconductor element is to be mounted. The feed-through connects the inside and outside of the cavity and is comprised of a coplanar line formed on the first dielectric substrate and an inner layer line obtained by forming the second dielectric substrate on the coplanar line. The coplanar line and the inner layer line share a strip-like signal conductor. The metal members are formed at a connection interface between the coplanar line and the inner layer line on two sides of the signal conductor.

Abstract: A method and related configuration for attenuating high-frequency noise that may appear on power planes in printed circuit boards. In one embodiment, the noise attenuation means of the present invention involves applying a lower conductivity material between the conductive and dielectric layers within a printed circuit board. High-frequency noise is then attenuated by the skin effect. In another embodiment, the low conductivity material is applied between the power plane and dielectric layer within the printed circuit board. The low conductivity material may be a material, such as nickel or lead, having an electrical conductivity ranging between about 1×104 mhos/m and 5.8×107 mhos/m for layers having a thickness of about 2 mils.

Abstract: A semiconductor device includes a switching element, for example, a Schottky barrier diode, which controls transmission/cutoff of a signal transmitted between two portions of a transmission line. An anode electrode of the switching element is interposed between the two portions of the transmission line and the longitudinal direction of the anode electrode is aligned with the longitudinal direction of the transmission line. A cathode electrode of the switching element is disposed on at least one of the widthwise sides of the anode electrode, and is connected to ground.

Abstract: A broadband driver amplifier module is made using an arrangement of MMICS and microstrip to provide inline rf connectors for the input and output and a small package size. The input and output microstrips incorporate a microstrip portion which is at an angle to the axis of the input connector providing an offset from the axis of the input connector. There is provided at least one MMIC extending from the input microstrip at the offset across the input connector axis and having an output on the other side of the axis. This arrangement provides for an overall zigzag configuration which reduces the axial length of the package while maintaining inline input and output connectors. The invention further includes novel arrangements for MMIC mounting and d.c. blocks used in the amplifier.

Abstract: The present invention relates to a high frequency circuit module in which a two or more layer dielectric substrate is used. The dielectric substrate provided between a conductor line of a matching circuit on the input side or on the output side and a metal ground is composed of two or more layers. Since a required part can be increased in thickness without changing the thickness of the whole dielectric substrate, the transmission loss can be reduced and the miniaturization of the high frequency circuit module and the communication device using the same can be realized.

Abstract: The present invention consists of an electrical communications device including a three-dimensional substrate and a plurality of electrical devices attached thereto. The substrate is preferably a dielectric. The electrical device is preferably of the sort needed to conduct high frequency communications, such as a microwave antenna and photonic receivers and transmitters. The electrical devices are attached to the substrate at the connection points described by the intersection of a series vias and one of the substrate surfaces. The electrical devices are attached to the substrate in numerous ways, including solder, flipped chip ball bonds, wire bonds, or a gold stud assembly. In particular, the gold stud assembly is utilized to attach the antenna to the substrate, thereby providing a predetermined air gap therebetween.

Abstract: Device interconnects and methods of making the same are described. In one aspect, a device interconnect system includes a bonding pad portion and a transmission line portion. The bonding pad portion is disposed on a device substrate and is constructed and arranged for electrical connection to a bond wire. The transmission line portion is disposed on the device substrate and is constructed and arranged to electrically couple the bonding pad portion to a device formed on the device substrate. The transmission line portion has a width dimension that is substantially parallel to the device substrate and a height dimension that is substantially perpendicular to the device substrate. The width dimension and the height dimension of the transmission line portion both vary from the bonding pad portion to the device.

Abstract: The present invention relates to a waveguide structured package and a method of manufacturing the same. More particularly, there are provided a waveguide structured package capable of preventing generation of parasitic components due to bonding wires and reducing the processing time to reduce the production cost of the waveguide structured package by providing a probe, a microstrip-waveguide transition portion and a microstrip line within a semiconductor chip and thus making bonding wire unnecessary in manufacturing the waveguide structured package, and a method of manufacturing the waveguide structured package.

Abstract: Apparatus is described for capacitively signalling between different semiconductor chips and modules without the use of connectors, solder bumps, wire-bond interconnections or the like. Preferably, pairs of half-capacitor plates, one half located on each chip, module or substrate are used to capacitively couple signals from one chip, module or substrate to another. The use of plates relaxes the need for high precision alignment as well as reduces the area needed to effect signalling, and reduces or eliminates the requirements for exotic metallurgy.

Abstract: A semiconductor device package adapted for use with high frequency signals and/or coaxial connections. The package has an angled coaxial input shielded by a plurality of vias. In one embodiment the coaxial input is orthogonal to a leadframe, and the coaxial input is matched to a transmission line on the leadframe.

Abstract: Structures and methods are provided for dual referenced microstrip structures having low reference discontinuities between a microstrip trace referenced to a primary reference plane as compared to a microstrip trace referenced to a secondary reference plane.

Abstract: A multi-layer wiring board comprises an insulating substrate having, on a central part of its top surface, a semiconductor device mounting portion and having, on its under surface, an external electrode. The insulating substrate includes a multilayered wiring having a first group of parallel wiring lines; a second group of parallel wiring lines arranged orthogonal thereto; and a group of through conductors for providing electrical connection therebetween. Power is supplied from the external electrode to the semiconductor device through built-in capacitors formed therewithin. The built-in capacitors are connected in parallel that have different resonance frequencies within a range from an operating frequency band for the semiconductor device to a frequency band for a harmonic component, and at an anti-resonance frequency occurring between the different resonance frequencies, a composite impedance is equal to or below a predetermined value.

Abstract: In some embodiments, the invention includes system comprising a circuit board including a circuit board trace. This system includes a packaged chip supported by the circuit board including, the packaged chip having a package, wherein the circuit board trace is connected to the package in a circuit board breakout region, and wherein the circuit board trace includes a fan-out trace section having an impedance Zo1, a matching region trace section having an impedance Zo2, and a package trace compensation section having an impedance Zo3, wherein an effective impedance of the matching region trace section and the package trace compensation section is approximately equal to impedance Zo1, where Zo3<Zo1<Zo2.

Abstract: A high-frequency composite component can achieve reduction in size and weight, while providing high performance. A portable wireless device incorporates the high-frequency composite component, including a multi-layer substrate, with a low noise amplifier LNA and a band pass filter BPF constituting parts of a high-frequency circuit, with an input terminal, an output terminal, and control terminals on the substrate. The low noise amplifier LNA is constituted of transistors, an inductor, capacitors, and resistors. The band pass filter BPF is constituted of strip lines, an inductor, and capacitors. The low noise amplifier LNA and the band pass filter BPF are connected with each other within the substrate via a matching capacitor. The amplifier ground and filter ground are separated within the substrate and connected respectively to separate ground terminals on the substrate.

Abstract: A coupling element for an HF strip line structure on an HF substrate, implemented in thin-silicon layer technology as a finger coupler structure on a silicon support is described. The bonding to the strip line tracks of the HF strip line structure is effected via metallizations, in particular in the form of spacers.

Abstract: The electromagnetic wave absorber of the present invention is made of a sintered body that contains Fe and at least one element selected from Si, Mg, Zr, Ni, Al and Co, and an attenuation of electromagnetic wave is 2 dB or more at frequencies of 10 GHz and higher so as to provide good electromagnetic wave absorbing characteristic with no corrosive gas generated at all, and is easy to manufacture. The electromagnetic wave absorber is used mainly as a component of a high-frequency circuit package.

Abstract: Structures and methods are provided for dual referenced microstrip structures having low reference discontinuities between a microstrip trace referenced to a primary reference plane as compared to a microstrip trace referenced to a secondary reference plane.

Abstract: The present invention provides a method and apparatus, for integrated circuit or printed circuit board interconnections, which is able to minimize the reflections and ringing with minimal delay of signals which are propagated through transmission lines to destination points within the circuit or board. The invention utilizes interconnection lines which are designed to have a resistivity, line length, and line cross sectional area which produces a resistance of the interconnection line which will minimize the ringing and reflections with minimal delay of the signal propagated to the destination points to insure signal quality.

Abstract: A printed circuit architecture includes a relatively thick, stiffening base of thermally and electrically conductive material, and a laminate of conductive layers including a printed circuit structure, interleaved with dielectric layers, disposed atop the base. The patterned conductive layers contain an integrated circuit structure that is configured to provide RF signaling, microstrip shielding, and digital and analog control signal leads, and DC power. Low inductance electrical connectivity among the conductive layers and also between conductive layers and the base is provided by a plurality of conductive bores. Selected bores are counter-drilled at the RF signaling layer and filled with insulating plugs, which prevent shorting of the RF signal trace layer to ground, during solder reflow connection of leads of circuit components to the RF signaling layer.

Abstract: The invention relates to inductors in integrated circuits. Methods and apparatuses for semiconductor circuits and microcircuits that include on-chip inductive elements which may form general impedance blocks are disclosed.

Abstract: In an interconnect system for providing access to a common I/O terminal for multiple circuit devices such as drivers, receivers and electrostatic protection devices implemented on an IC, each such device is provided with a separate contact pad within the IC. The contact pads are linked to one another and to the IC I/O terminal though inductive conductors such as bond wires, metalization layer traces in the IC, or legs of a forked, lithographically-defined spring contact formed on the IC. The conductor inductance isolates the capacitance of the circuit devices from one another, thereby improving characteristics of the frequency response of the interconnect system. The inductances of the conductors and various capacitances of the interconnect system are also appropriately adjusted to optimize desired interconnect system frequency response characteristics.

Abstract: A high frequency semiconductor integrated circuit device having a semiconductor chip, a package for housing the semiconductor chip and a ground conductor, comprises a first package terminal for transferring a high frequency signal; a second package terminal which is either a package terminal for transferring a high frequency signal or a package terminal for supplying current to a node at which a high frequency signal is transferred or to a drain of a transistor; a third package terminal disposed between the first and second package terminals, for applying a bias voltage to a circuit element of the integrated circuit through a first resistor; and a first capacitor disposed in the package, and having one electrode connected between the third package terminal and the first resistor and the other electrode connected to the ground conductor. The integrated circuit device provides sufficient high frequency isolation between package terminals.

Abstract: A superconductor on-chip microstrip line (2, 4) to off-chip microstrip line (7) transition of low characteristic impedance (15, 20, 22) is realized that obtains a bandwidth of 200 GHz for MCM application while employing solder bump (15, 17) technology to connect the chips (3, 5) to the off-chip microstrip and substrate (6). Circular openings (20, 22) through the respective ground plane layers (10 & 16) of the off-chip and on-chip microstrips are provided in positions respectively underlying and overlying the solder bump (15) for the signal. The openings may be sized to provide a desired ratio of inductance to capacitance, the larger the size, the greater the ratio value. This technique may be used to match characteristic impedance to give broad bandwidth low impedance interconnections needed for direct SFQ chip-to-chip communication on a passive MCM.

Abstract: A high frequency receiver is provided with improved insertion loss and noise factor. The receiver uses a low loss input stage and interstage noise matching block. The input stage and interstage noise matching block utilize a suspended substrate matching circuit wherein the substrate is free space. The interstage noise matching block further uses a broadside suspended substrate coupler where the broadside coupler is suspended in a free space substrate. Singly and in combination, when used in a high frequency receiver arrangement, the suspended substrate input matching circuit and the suspended substrate interstage matching circuit with suspended substrate coupler minimize insertion loss and improve the high frequency receiver overall noise factor.

Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

Abstract: A source electrode, a gate electrode, and a drain electrode formed on a front face active region of a semiconductor substrate in a shape of teeth of a comb are covered with an insulating film such as polyimede etc., as well as all of the upper surface and the side surfaces of the insulating film are covered with a metal protective film. Via hole receiving pads connected to the source electrode, the gate electrode, and the drain electrode are respectively connected to bonding pads on a reveres face of the semiconductor substrate through via holes.

Abstract: The invention is a mounting structure of a high-frequency wiring board in which when a pitch between a conductive connecting member connected to a high-frequency signal electrode pad of a high-frequency wiring board and a conductive connecting member connected to a ground electrode pad adjacent thereto is denoted by A and a maximum diameter of these conductive connecting members in sections parallel to the lower face of the high-frequency wiring board is denoted by B, A/B≧2 is satisfied, and a space L1 between the lower face of the high-frequency wiring board and the upper face of the external electric circuit board is one sixteenth or less of a wavelength of high-frequency signals processed by a high-frequency semiconductor element.

Abstract: A microwave monolithic integrated circuit assembly includes a microwave monolithic integrated circuit having an MMIC circuit plane and having a first region of relatively high heat production and a second region of relatively low heat production. A heat-dissipating assembly is in thermal contact with the microwave monolithic integrated circuit. The heat-dissipating assembly has at least two pieces of pyrolytic graphite embedded within a casing. The pieces of pyrolytic graphite include a first piece of pyrolytic graphite underlying the first region and having a high-thermal-conductivity x-direction of the first piece lying within about 20 degrees of a perpendicular to the MMIC circuit plane, and a second piece of pyrolytic graphite underlying the second region and having a high-thermal-conductivity x-direction of the second piece lying within about 20 degrees of the MMIC circuit plane. The heat-dissipating assembly is preferably fabricated by hot isostatic pressing.

Abstract: A stacked radio-frequency module is formed by stacking packages each storing MMICs and mounting another package upside down which stores a control circuit for controlling MMICs. The MMICs and control circuits are each sealed by a metal sealing lid within the cavity of each of the packages which are spatially completely separated from each other. Each of the pads for wiring paths for radio-frequency signals and for power supply/control signals and ground pads are provided within each package and at opposing surfaces of packages to be stacked with corresponding pads joined by a gold bump.

Abstract: A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.

Abstract: An apparatus for processing high frequency signals comprises a circuit board has a trace. An electrical circuit is fabricated on a die, which is mounted on the circuit board. The die has a top portion and a contact point is positioned on the top portion. The circuit is configured to process a signal having a frequency in the range of about 20 GHz and higher. A capacitor is mounted on the circuit board and has a top portion and bottom portion. The bottom portion opposes the trace. A wire extends between the contact point on the top portion of the die and the top portion of the capacitor. The wire has a length in the range of about 2 mils to about 12 mils.

Abstract: In an interconnect system for providing access to a common I/O terminal for multiple circuit devices such as drivers, receivers and electrostatic discharge (ESD) protection devices implemented on an IC, each such device is provided with a separate contact pad within the IC. The contact pads are linked to one another and to the IC I/O terminal though inductive conductors such as bond wires, metalization layer traces in the IC, or legs of a forked, lithographically-defined spring contact formed on the IC. The conductor inductance isolates the capacitance of the circuit devices from one another, thereby improving characteristics of the frequency response of the interconnect system. Also the ESD protection function is distributed among multiple ESD devices interconnected by series inductors to provide a multi-pole filter at each IC terminal.

Abstract: A millimeter wave module includes a silicon substrate with first and second cavityes formed by anisotropic etching on the silicon substrate, and a glass substrate having a microstrip filter pattern and microbumps for connecting the glass substrate to the silicon substrate. A filter is provided using an air layer as a dielectric disposed in the first cavity. An MMIC is mounted by the flip chip method over the second air layer. A coplanar waveguide is on the silicon substrate for connecting the filter and MMIC. The filter having low loss is achieved because it has the microstrip structure using air as an insulating layer. Also change in characteristics of the MMIC during mounting is eliminated because the MMIC is protected by contacting air. Accordingly, the millimeter wave module has excellent characteristics and is made using a simple method.

Abstract: A high frequency package is arranged such that it comprises a dielectric substrate provided with an input terminal and an output terminal, a high frequency element mounted on the surface of the dielectric substrate, and a high frequency line formed on the dielectric substrate for connecting the high frequency element with the input terminal and with the output terminal, wherein a transmission characteristic from the input terminal to the output terminal has the property of cyclically varying in relation to frequency. The length of the high frequency line is regulated such that the frequency of signals transmitted along the high frequency line is located at a part of the cyclic variation curve of the transmission characteristic where transmittance is large. By arranging the structure in such a manner, loss of high frequency signals having frequencies of 10 GHz or more can be reduced.

Abstract: A microwave filter is disposed on a substrate. The microwave filter is adapted for connecting a first microwave transmission line to a second microwave transmission line, configured such that a signal propagates from the first to second microwave transmission lines. The microwave filter encompasses a highpass component of filter disposed in a symmetrical configuration with respect to a median plane placed perpendicular to the surface of the substrate, including the central axis of the first and second microwave transmission lines; and a lowpass component of filter connected parallel with the highpass component of filter, the lowpass component of filter being disposed in a symmetrical configuration with respect to the median plane.

Abstract: A microwave circuit connection method allows many coaxial cable connections between the outside world and microwave circuit components mounted on a carrier in a housing. A coaxial cable 32 extends through a sleeve 30, which is contained within the housing 1. A bore is provided through the carrier 2 for the coaxial cable 32 and is counterbored to form first and second bores 37 and 40 with different diameters. The dielectric 34 provided within the coaxial cable 32 extends through the first bore 37. The dielectric 34 is removed so that a center conductor 36 of the coaxial cable 32 extends through the second bore 40 to a point adjacent the MMIC 10 mounted to the carrier. An air dielectric section is thus formed in the second bore 40. The center conductor 36 of the coaxial cable 32 is attached, using a ribbon bonding cable 42, to an MMIC 10 mounted on the carrier 2.

Abstract: A radio frequency amplifier includes a waveguide filter positioned between a first and a second amplifier circuit, which reduces the distortion between the amplifier circuits. The waveguide includes a main body having a cavity.

Abstract: A microwave monolithic integrated circuit assembly includes a microwave monolithic integrated circuit having an MMIC circuit plane and having a first region of relatively high heat production and a second region of relatively low heat production. A heat-dissipating assembly is in thermal contact with the microwave monolithic integrated circuit. The heat-dissipating assembly has at least two pieces of pyrolytic graphite embedded within a casing. The pieces of pyrolytic graphite include a first piece of pyrolytic graphite underlying the first region and having a high-thermal-conductivity x-direction of the first piece lying within about 20 degrees of a perpendicular to the MMIC circuit plane, and a second piece of pyrolytic graphite underlying the second region and having a high-thermal-conductivity x-direction of the second piece lying within about 20 degrees of the MMIC circuit plane. The heat-dissipating assembly is preferably fabricated by hot isostatic pressing.

Abstract: A circuit configuration for introducing bias in balanced lines capable of high frequency operation includes top and bottom layers formed on a semiconductor substrate. The circuit includes two balanced metallized lines positioned on the substrate. Each metallized line has a serpentine line configuration connected thereto. The space between the lines is a virtual ground. The serpentine line configurations are congruent with the elements on the substrate layers to provide a completed circuit. The elements are coupled to a central metallic area, which in turn is coupled to a bias line through an open-line stub, which extends beyond the virtual ground and which provides equal capacitive coupling to the balanced lines on the top surface. In this manner, the balanced line configuration includes capacitors and inductors which are symmetrically distributed and which provide resonance at the designed operating frequency.

Abstract: A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Abstract: A surface mount package for a microwave circuit is disclosed. The package has a port for transferring a signal from the microwave circuit to a printed circuit board. The package includes a base made from a dielectric material which includes vias which contain a conductive material and are electrically coupled to the ground potential of the printed circuit board. Conductive material is placed on the topside of the base forming a transmission line for carrying the signal in a transmission line mode. To facilitate operation in a transmission line mode, the length of the transmission line is a substantial portion of the wavelength of the signal. The transmission line provides electrical contact with a terminal of the microwave circuit and is electrically coupled to the port. Additionally, the transmission line forms an electromagnetic wave guiding structure.

Abstract: AC-ground plane is for a semiconductor chip adapted to be mounted on a supporting member in a chip package, wherein said ground plane comprises at least one first capacitor plate provided within said chip, and at least one second capacitor plate provided on said supporting member, said first and second capacitor plate being separated by a dielectric layer and capacitively coupled to each other via this layer, and said ground plane comprising at least one first conducting member, said first conducting member being at least one electrically conducting via extending through said supporting member and electrically coupled in series with said second capacitor plate.

Abstract: The present invention provides a high-frequency module device having a distributed constant circuit formed therein, the device comprising: a base board (2) having a high-frequency element layer forming surface (3) formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board (6); and a high-frequency element layer part (5) having a passive element and a circuit element for receiving power or a signal supplied from the base board (2) via a dielectric insulating part made of a dielectric insulating material, on the high-frequency element layer forming surface (3) of the base board (2). The base board (2) has a distributed constant circuit (4) formed by pattern wiring.