Abstract: A hard disk drive assembly is electrically connected to a printed circuit board assembly motherboard using a connector on the hard disk drive assembly connected with a mating connector mounted on the motherboard. The hard disk drive assembly is secured to standoffs that allow sufficient space between the hard disk drive assembly and the motherboard for an integrated circuit package to be positioned between the hard disk drive assembly and the motherboard.

Abstract: A spacer (100 or 600/1000A/1000B) situated between a faceplate structure (301) and a backplate structure (302) of a flat panel display is configured to be self standing. In one implementation, a pair of spacer feet (111 or 113 and 112 or 114) are located over the same face surface, or over opposite face surfaces, of a spacer wall (101) near opposite ends of the wall. An edge electrode (121 or 122) is located over an edge surface of the spacer adjacent to the faceplate structure or the backplate structure. In another implementation, a spacer clip (1000A or 1000B) clamps opposite face surfaces of a spacer wall (600) largely at one end of the wall.

Abstract: An electronic device that protects an electronic component on a motherboard from vibration and impact. The device includes a spacer around the electronic component, and connected with rigid members on both sides of the board.

Abstract: An assembly of a printed circuit board mounted in a housing of a slim portable computer is described. The printed circuit board mounting assembly has a printed circuit board with penetration holes. A boss with a hole having a supporter formed around the circumference of the boss is installed in a housing of the portable computer and inserted into the penetration hole. A cap covering a top surface of the boss protrudes towards the upper side of the printed circuit board through the penetration hole and is in contact with the upper side, and a coupling member fastens to the boss through the cap to secure the printed circuit board to the housing.

Abstract: A printed circuit board mounting structure is disclosed wherein first and second printed circuit boards are mounted by mounting projections formed on a case. Since the mounting projections can be used in common for both first and second printed circuit boards, the printed circuit board mounting structure of the invention is simple in the mounting work, high in productivity and low in cost as compared with a conventional like structure wherein first and second printed circuit boards are mounted to different mounting projections.

Abstract: A network computer has a chassis with four wall-like frame members located at its rectangular perimeter. A motherboard having a variety of electronic components is mounted to the chassis within the rectangular perimeter. The chassis is mounted within a metallic enclosure with very small clearances between the components on the motherboard and the enclosure. The enclosure closely receives the chassis to eliminate excessive movement therebetween and to minimize the size of the computer. A strut extends between the frame members for enhancing the strength of the chassis and protecting the components. The strut has insulated stand-offs which are rigidly secured to and extend through the motherboard. The ends of the stand-offs are also very close to or in contact with sidewalls of the enclosure. The strut protects the components from being short circuited to the sidewalls by transmitting force on one of the sidewalls through the stand-offs to the other sidewall.

Abstract: A screw retaining spacer includes an outer rigid plastic core and a softer elastic inner core defining a through-hole. The inner core has a plurality of ridges that resiliently grasp the shaft of a screw inserted into the through-hole. Accordingly, screws assembled with these spacers remain assembled. The spacer can be standardized and inventoried in large quantities to meet a variety of screw sizes and tolerance.

Abstract: The present invention provides for an apparatus for grounding and supporting a circuit board such as a motherboard in the chassis of a computer. The apparatus enables use of either a specially manufactured motherboard or an off-the-shelf motherboard in a standardized chassis. Embodiments of the apparatus provided for use with specially manufactured motherboards allow for grounding and support of the motherboard without the use of conventional fasteners such as screws that require tools for installation and removal.

Abstract: An equipment control panel (1) is provided which is capable of preventing malfunction of a control unit (11) arranged in a casing (5) of an equipment or a failure in operation thereof due to discharge of static electricity. An insulating spacer (33) including a conductive shield layer (35) is arranged on a flexible circuit board (15) formed on a main section (15B) thereof with a circuit pattern including contact sections. An insulating cover sheet member (45) is laminated on the insulating spacer (33). The conductive shield layer (35) is arranged so as to be substantially opposite to a circuit pattern (21). The conductive shield layer (35) is so formed that an outer peripheral edge thereof is positioned inside an outer peripheral edge of each of a main section (33B) of the insulating spacer (33) and the insulating cover sheet member (45).

Abstract: A first plurality of metal bumps is formed on a semiconductor wafer containing a plurality of chips, each of the first plurality of bumps being in electrical contact with a contact pad on one of the chips. An encapsulant layer is deposited over the first plurality of metal bumps and then polished to expose a top surface on each of the metal bumps. A second plurality of metal bumps is formed on the exposed top surfaces of the first plurality of plurality of bumps, respectively. The wafer is then sawed to separate the individual chips, yielding semiconductor packages which have the same lateral dimensions as the chips. Alternatively, to facilitate the encapsulation process, the wafer can be sawed into rectangular, multi-chip segments before the encapsulant layer is deposited. After the encapsulant layer has been applied and polished and the second plurality of conductive bumps have been formed, the segments are then separated into individual chips.

Abstract: An enhanced heat dissipating Chip Scale Package (CSP) method and devices include preparing a heat dissipating base with a recess surrounded by a guarding wall. A chip with an integrated circuit (IC) layout is adhered the heat dissipating base in the recess. A substrate with a metallic circuit layer that is smaller size than the chip is then adhered to the chip. Then coupling the metallic circuit layer with the IC layout. A non-conductive resin is then filled in the recess within the guarding wall and covers the coupling portion. The resulting package device produced by means of BGA package process is small size and has enhanced heat dissipating property. The Package size/chip size ratio may be lower than 1.2 to meet the CSP requirements.

Abstract: In order to simplify handling and mounting of chips or chip-like structures/micro-blocks, a method and a device have been developed, by which, depending on the area of use, one or more chips can be assembled to act together and/or act together with other chip-like structures such as micromechanical building elements or microoptical elements. The actual retention of a micro-building-block (1) is achieved by micromechanical tongues (4) acting across holes or cavities (2) in a carrier material (3). Silicon tongues can, for example, be both flexible and sufficiently strong to retain a chip. In this manner, there is assured both precise vertical and horizontal positioning and mechanical retention. Electrical connection to the chip can be effected either by thin film technology or by more conventional wire-bonding.

Abstract: A transfer molded PC card standard or small form factor card electronic package includes a substrate that has an integrated circuit package thereon and an electrical connector along a side of the substrate. In addition, an upper cover extends over at least a portion of the substrate and the electrical connector. A lower cover extends over at least a portion of the substrate and the electrical connector and a transfer molded encapsulant covers the substrate and a portion of the upper cover and the lower cover. The portion of the upper cover and the lower cover are covered by the encapsulant and includes a first flange attached to a portion of a periphery of the upper cover and a second flange that is attached to a portion of the periphery of the lower cover.

Abstract: An assembly for attaching a printed circuit board to a chassis includes a mounting rail for engagement with the printed circuit board and a guide member for engagement with the chassis. In one embodiment, the mounting rail includes an elongated body member having a first side and a second side and a spacer formed in the first side. A lock member for engaging the printed circuit board is coupled to the spacer. The guide member defines a guide slot for slidably receiving the mounting rail.

Abstract: An IC card includes a card-like substrate, an IC module, and an adhesive. The substrate is made of synthetic resin and has in one surface a hole for fixing the IC module. The IC module has a circuit board on which an IC chip is mounted and sealed with resin. The back side of the circuit board is provided with external connecting terminals which are electrically connected to the IC chip and exposed from the card-like substrate. The IC module is fitted into the hole of the card-like substrate such that an IC chip mounting section of the IC module is located inside the IC card. Using the adhesive, the IC module is fixed onto part of the inner surface of the hole of the card-like substrate without causing the chip mounting section to contact the inner surface of the hole.

Abstract: A computer chassis includes a circuit board. A locating clip is mounted on the circuit board. The clip includes a first planar portion having a first fastener opening. A circuit board gripping leg extends from a terminal end of the first planar portion and is inserted into a receiver slot in the circuit board. A second portion of the clip is connected to extend from the first clip portion at an angular disposition. The second clip portion has a fastener portion including a second fastener opening. A fastener advanced through the first and second fastener openings, through the board and into the chassis, urges the first planar portion and the board to move relative to the second clip portion and the fastener.

Abstract: The bond between a flip chip integrated circuit and a substrate is subject to mechanical stress from thermal cycles. This problem is exaggerated when the substrate has a rate of thermal expansion which is appreciably different from that of silicon. This problem is further exaggerated when the IC has a large footprint because it will experience a larger absolute expansion. A solution is proposed to this problem which involves creating an anchoring point. The anchoring point can be in either the IC or the substrate and can be a through-hole or a surface indentation such as a groove or a cutout. The anchoring point is filled with the underfill material during the underfill process. The anchoring point thus provides additional mechanical strength to the bond between the IC and the substrate.

Abstract: A chip card has flexible housing parts which are secured on one another. When the housing parts are secured to one another, support elements of the housing parts form voids, in which a flexible printed circuit board is disposed along with its components. In order to ensure that the components will not be mechanically stressed, one lubricant film is disposed between each of the housing parts and the printed circuit board and the components. The printed circuit board or components slide on the film when the card is bent.

Abstract: A semifinished product for an electronic module includes an integrated circuit and a coil electrically connected with the circuit, the coil being disposed between two carrier layers and the integrated circuit being disposed in a specially provided cavity in the two carrier layers. To achieve plane surfaces of the semifinished product, the remaining cavity between the carrier layers and the integrated circuit is filled with a filling material in such a way that plane surfaces of the semifinished product result in the area of the cavity which are flush with the surfaces of the carrier layers.

Abstract: A method and apparatus for mounting a motherboard to a chassis of a personal computer using only a single screw. A number of standoffs snap into the base of the chassis, electrically contacting the chassis. Each standoff includes a projection. The motherboard includes apertures for accepting the projections such that when an ramp and shelf of each projection is aligned with the motherboard, the motherboard is positioned a fixed distance from the chassis. A mounting bracket also includes a number of projections. Apertures provided in the motherboard correspond to the projections of the mounting bracket. The surface of each side of the motherboard surrounding each aperture is plated with an electrically conductive material to form a conductive path between the motherboard and the standoffs and the bracket. The projections of the bracket are inserted into the corresponding apertures in the motherboard. A screw is inserted through a wall of the chassis and into a threaded hole in the bracket.

Abstract: A package for power converters in which a multilayers circuits board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portion of the bottom layer are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic elements to the footprint of the magnetic core. The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiment of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The baseplate has cutouts or cavities to accommodate the magnetic cores.

Abstract: A grounding member for installation between a surface acoustic wave filter package and a circuit board to which the filter package is mounted. The grounding member is formed from electrically conductive sheet stock material as a leaf spring which is deformed to maintain effective contact between the outer case of the filter package and a ground plane on the circuit board. In addition to providing an effective ground connection between the filter package and the ground plane, the grounding member also functions as an electromagnetic shield for radiating signals between the input signal post and the output signal post of the filter package.

Abstract: A mounting structure for mounting a printed circuit board on a frame of an electronic device. The mounting structure comprises a body, a lead, and a threaded portion. The threaded portion is formed on the body, and receives a screw. The printed circuit board is secured to a frame of an electronic device using the mounting structure. Specifically, the mounting structure is secured to the frame using the screw. The lead is soldered to lands on a mounting surface of the printed circuit board by a process for mounting electronic parts (e.g. an IC or LSI package) on the mounting surface of the electronic device.

Abstract: A housing for an electrical component which protects the electrical component sealed therein and reduces mechanical stress on the electrical component includes two housing sections which are connected to each other, a support for the electrical component located within the housing, and attachment connections for mounting the housing on a mounting point, e.g., of a motor vehicle chassis. To reduce the mechanical stress imposed upon the electrical component, and to obtain a good seal of the housing interior against dirt, etc., the two housing sections are connected to each other directly or via an intermediate piece. The housing interior is sealed by one or two seals, made from elastically or plastically deformable material, which are located between the faces of the support and the housing sections associated with them. The attachment connections are located on one of the two housing sections.

Abstract: A card guide assembly for isolating printed circuit boards from each other during insertion and removal from a mounting array. The assembly includes first and second isolation channels that are configured to permit the receipt of a variety of PC board sizes therein and a securement cap for receipt thereover. The cap may be adjustably positioned within the isolation channels for establishing a secured mounting for a variety of PC board sizes. A locking mechanism is provided between the cap and the channels for secured engagement therebetween. The channels are mounted on opposite sides of the PC board connector region permitting conventional mounting of the PC board into a mounting connector.

Abstract: A frameless IC card is provided, with front and rear support structures that each includes an electrical connector, with a sheet metal cover mounted on the front and rear board supports without requiring a separate plastic frame to tie the components together. The rear support structure includes at least one rear connector (11', 12', FIG. 3) fixed to the circuit board rear end (104') and an end cap (16') at the rear of the IC card. The end cap has upper and lower flanges (126T, 126B) that form a recess therebetween that closely receives the rear of the rear connector housing to fix their relative vertical positions. The rear end cap has forwardly-extending legs (47, 48) at opposite sides, with each leg having a lug (51, 52) forming a rearwardly-facing shoulder (150) that fits into a cutout (53) at a side of the circuit board, to prevent forward movement of the connector and circuit board out of the rear end cap.

Abstract: A method and apparatus for reducing warpage of an assembly substrate and providing registration between a surface mount technology (SMT) component and the assembly substrate. The SMT component includes mounting pins extending from the component and capable of engaging corresponding apertures in the assembly substrate. Each mounting pin is registrable with a corresponding aperture in the assembly substrate. The mounting pins are capable of providing an interference fit between the SMT component and the assembly substrate.

Abstract: An apparatus capable of housing PC cards including a PC card with a connector and PC card guide, a housing having an insertion opening for inserting the PC card and a circuit board mounted in the housing. The connecting direction between the PC card and the circuit board is perpendicular to the insertion direction of the PC card. The apparatus further includes guides arranged on the housing having two cam plates which are separated by spacers and supported by a shaft. Each cam plate has a continuously recessed guide path for guiding the PC card. The guide path has a guiding portion and a stop portion wherein the transition of the pivot pin from the guiding portion to the stop portion causes a defined rotation of the plug-in package about the pivot point wherein the plug-in package is rotatably arranged at the pivot point. This allows the PC card to make a pivot motion in order to accomplish the connection between the plug-in package and the circuit board.

Abstract: A circuit board locating device for fastening a circuit board to a frame, having two pairs of symmetrical flat legs that extend downward at an outward angle from a top surface of said device and are inserted through a crossed slot on the frame, and a hooked portion raised from a top side thereof and hooked in a retaining hole on the circuit board, each leg having two side boards extending perpendicularly outward from outer edges of a main body of each said leg, a bottom plate stopped at one side of the frame remote from the circuit board, and a space defined between the side boards and the bottom plate and engaged with the periphery of the cross slot of the frame.

Abstract: An electronic module is provided including a chip bonded to a flexible laminate, and an apparatus for establishing coplanarity of a surface of the module, the apparatus comprising (1) a stiffener having a recessed portion for receiving the chip mounted to the flexible laminate, the recessed portion including a first planar surface and a second planar surface with the two planar surfaces being substantially parallel to each other, and (2) an adhesive bond line along the second planar surface for attaching the flexible laminate to the stiffener, the adhesive bond line including a plurality of spacers embedded within the adhesive bond line.

Abstract: A chassis for containing a circuit board and a method of mounting a circuit board to a chassis.

Abstract: In a light scattering smoke sensor of the present invention, a first diaphragm portion is disposed just aheat of a light receiving device, and a second diaphragm portion is disposed ahead of the first diaphragm portion. A gap between the first and second diaphragm portion is a smoke introducing portion which introduces smoke to a smoke detecting space via a gap between labyrinth members and the second diaphragm portion.

Abstract: A circuit board locating device for fastening a circuit board to a frame, having two pairs of symmetrical flat legs at four sides inserted through a cross slot in a frame, a screw hole at the top connected to a circuit board by a screw, four pairs of side boards respectively raised from two opposite lateral sides of each leg and stopped at the top side of the frame, four horizontal bottom plates respectively outwardly extend from the legs at the bottom and stopped at the bottom side of the frame, and two inward projecting portions respectively raised from two opposite legs and stopped against the periphery of the screw to hold it in the screw hole.

Abstract: An electronic module includes a Printed Circuit Board (PCB) which contains a plurality of circuit elements. The electronic module is electrically connected to other electrical components in a vehicle by a connector. The PCB is contained within an electrically conductive housing which includes a box and a cover. A ground trace printed on the PCB extends to a mounting hole in the PCB and provides a ground path for the circuit elements. An electrically conductive metal ferrule which elevates the PCB above the box and the cover above the PCB, extends through the mounting hole in the PCB and contacts the cover and box when the cover is fitted onto the box. A mounting bolt extends through the cover inside the ferrule through the box and into a nut mounted into a metal portion of the vehicle.

Abstract: An IC card is provided which can be constructed at low cost and which allows adjustment of circuit board position. The circuit board (30, FIG. 2) has forward and rearward end portions (34, 36) which are mounted directly on forward and rearward connectors (12, 14), without a separate frame to mechanically hold them together. A cover (60) with upper and lower parts (66, 68), is mechanically mounted to the connectors and is coupled to the circuit board only in an electrical ground. Each connector is mounted to a circuit board end by pegs (90, 92) that lie on laterally opposite sides of the row of connector contacts (46), with each peg being received in a hole (100, 102) of the circuit board. The pegs can be separate parts (270, FIG. 12) that project through holes (254) in the board and into holes (250) in the connector, and washers (262) can lie between the board and each connector at locations adjacent to the pegs.

Abstract: An apparatus for containing and supporting electronic components includes a first housing portion having a first support, and a second housing portion having a second support. The apparatus further includes an elastomeric isolating member being secured between the first support and the second support so as to position the isolating member within the apparatus. Moreover, the apparatus further includes a base upon which electronic components are mounted, the base being attached to the elastomeric isolating member.

Abstract: A high impact high memory capacity flight data recorder, includes a plurality of planar parallel circuit cards and a plurality of planar parallel spacers stacked in alternating sequence to form a card stack. Each of the circuit cards includes a circuit board, plural integrated circuits mounted on the circuit board, plural connector pads on a periphery of the circuit board connected through the circuit board to output terminals of the integrated circuit memories, a foam layer covering the plural integrated circuit memories and an adjacent portion of the circuit board, the periphery of the circuit board being uncovered by the foam layer.

Abstract: An apparatus for receiving and holding a printed circuit board. The apparatus includes a cover having a bottom surface upon which an adhesive is deposited. The apparatus also includes a frame coupled to the cover for receiving the printed circuit board. The frame has a bonding surface that includes a plurality of adhesive thickness control bumps. Each of the plurality of adhesive thickness control bumps is of a predefined height such that the bondline thickness of the adhesive is limited when the bottom surface of the cover is bonded to the frame. For a second embodiment, the cover further includes a plurality of feet extending from the bottom surface of the cover, and the frame further includes a plurality of slots for receiving the plurality of feet. Each of the plurality of slots includes a lip and each of the plurality of feet has a latch tab formed therein such that positioning the feet in the slots causes the latch tabs to catch the lips of the slots such that the cover is locked to the frame.

Abstract: An electronic circuit equipment including a substantially box-shaped case body 30 for defining a sealed interior space therein and an electronic circuit board 11 having a plurality of electronic components 12 mounted thereon. The case body comprises a pair of cup-shaped sections 30a clamped together at their opposite ends, and sandwiching between them the circuit board, surrounded and sealingly enclosed by a gas-impermeable flexible sheet 32. A vent hole 20 is provided in one of the sections 30a such that the sheet 32 flexes to absorb pressure fluctuations, and prevents the circuit board from bending.

Abstract: An IC card is provided which can be constructed at low cost and which allows adjustment of circuit board position. The circuit board (32, FIG. 2) has forward and rearward end portions (34, 36) which are mounted directly on forward and rearward connectors (12, 14), without a separate frame to mechanically hold them together. A cover (60) with upper and lower parts (66, 68), is mechanically mounted to the connectors and is coupled to the circuit board only in an electrical ground. Each connector is mounted to a circuit board end by pegs (90, 92) of support parts (91, 93 and 95, 97) that lie on laterally opposite sides of the row of connector contacts (46), with each peg being received in a hole (100, 102) of the circuit board and with the circuit board resting on a board-receiving surface (150, FIG. 4) lying adjacent to the peg. The pegs can have two or more steps (140, 142, 144) to hold the circuit board at different heights.

Abstract: An IC card is described which has a housing that is of low cost and which provides very good shielding against ESD/EMI (electrostatic discharge and electromagnetic interference), while securely holding a circuit board assembly and providing good contact with a ground conductor of the board. The housing comprises lower and upper housing halves (22, 24, FIG. 2), each molded of an electrically conductive polymer. The lower housing, half includes a bottom cover portion (90) and a pair of upstanding flanges (92, 94) that each forms part of a side of the housing. The upper housing half forms a top cover portion (100) and a pair of downwardly extending flanges (102, 104). The circuit board has a ground conductor (70) at its periphery which is trapped between the upper and lower housing halves to securely hold the circuit board in place and to electrically ground its ground conductor. Each housing half has platform parts (114, 116, 120, 122) that engage corresponding surfaces of the circuit board.

Abstract: Interior circuit card supports and a method that facilitate fast and simple Assembly and disassembly of the circuit cards, and provide both interior and peripheral card support, are disclosed. A plurality of circuit cards 32a-32n, each having at least one interior hole 36, are positioned substantially parallel to each other with the holes of the various cards collinear. A plurality of grommets 38 are secured in the holes, with each grommet providing a first coupling. A rod 42 having a plurality of second couplings 44 is inserted through the grommets such that the second couplings mate with the grommets' first couplings to provide an interior support that maintains the spacing between the circuit cards. In the preferred embodiment the grommets are internally threaded with a groove that extends their entire length, and the rod has deformable inserts that form an interference fit with the grommets' threads. The rod is inserted and then rotated, causing the inserts to deform and grip the threads.

Abstract: An electronic device, such as a personal computer, has a rectangular main body including a bottom wall and a side wall which has an opening. A circuit board is arranged in the main body to oppose the bottom wall within a predetermined distance. The circuit board and the bottom wall define a mounting space therebetween. An expansion board is mounted in the mounting space and detachable through the bottom wall and the side wall. A connector is fixed to and electrically connected to the circuit board and located between the circuit board and the bottom wall. The connector has a connecting portion opposing the opening and allowing connection of the expansion board thereto. The connector also supports the circuit board. A restraining system is provided for restraining movement of the connector with respect to the bottom wall.

Abstract: The disclosure relates to electronic units formed by two printed circuit type boards that are electrically and mechanically coupled and that have a single plug for their connection. To facilitate the placing of these units between two pairs of grooves, the assembling the two boards comprise adjusting elements to adjust the distance between the two boards to two distinct values: one when the boards are inserted into the grooves and the other for an effect of locking the boards between the pairs of grooves. To this end, it is possible to use bars crossed by a screw that makes it possible, by screwing, to place two outside sections of the bar in a position of overthrust with respect to an inside section of the bar. The screwing is done after the electronic unit has been inserted into the grooves in order to lock the boards against the flanks of the grooves.

Abstract: An electronic component includes a substrate having chip parts. First lead terminals and second lead terminals are led out from one end of the substrate toward an outside. The first lead terminal has a holding portion at an intermediate portion. The second lead terminal has a connecting portion for connecting to the substrate and an inserting portion for inserting to the hole of an external circuit board. The connecting portion and the inserting portion of the second lead terminal is connected with an oblique portion. The holding portion of the first lead terminal is in a same plane perpendicular to the surface of the substrate with a boundary portion between the oblique portion and the inserting portion of the second lead terminal.

Abstract: A stiffening device for an electronic assembly which engages each circuit card assembly (CCA) in approximately its center of area. Each CCA which is positioned within an electronic enclosure has a collar which surrounds a hole through its center of area. A shaft is passed through the electronic enclosure and pins engage each of the collars. The shaft and pin assembly rigidly connects each of the CCA's to the body of the electronic enclosure. This has the effect of reducing the vibrational deflection and potential damage to each CCA, allowing the electronic enclosure to survive a much higher vibrational and shock environment.

Abstract: An electronic device assembly (100)includes a chassis (102), printed circuit boards (108 and 110), and a shield member (128). By placing the circuit boards (108 and 110) inside of chassis (102) and then engaging shield member (128), the printed circuits boards (108 and 110) are retained in place and shielded without the use of any other components. Shield member (128) includes a set of spring fingers (114) having tabs (116) which latch onto recesses (106) located on the side walls (132) of chassis (102). Upon the shield member (128) being engaged to chassis (102), the side walls (122) located on shield (128) press against printed circuit boards (108 and 110) and retain them in position without the use of additional fasteners.

Abstract: A control module having an integral fastening and locking case assembly whereby a support spacer frame for circuit boards and case members are assembled to create a single unit without the use of conventional fasteners. The structure of the housing and the support spacer frame provides an arrangement whereby the sectional equipment may securely snapped together to form a single unit without the use of conventional fasteners.

Abstract: A disk drive module adapted for use in a data processing system, the system including first and second disk drive module guide plates. The disk drive module comprises an elongated, generally rectangular frame. The top wall of the frame includes a fin slidably insertable into a groove formed on the second guide plate, and the bottom wall of the frame includes a T-bar slidably insertable into a channel formed on the first guide plate. The T-bar includes a detent which releasably engages a pawl formed in the channel for securing the T-bar within the channel. A 3.5 inch disk drive and a regulator card are mounted within the frame. The rear edge of the regulator card includes an edge connector which extends rearwardly beyond the frame a short distance. To ensure that the edge connector is properly guided into engagement with a corresponding electrical connector in the data processing system, the regulator card is mounted on the frame for movement in three directions.

Abstract: A housing for interconnecting an opto-electronic device with a ferrule includes a base and a cover cooperable with the base to define a chamber. The housing also includes an elastomeric board mount, with pylons supporting a substrate, disposed in a sealing relationship between the base and the cover when the same are conjoined and arranged to seal legs on the substrate that extend through the elastomeric board mount.